Sealed electronic equipment loading device

Abstract

The utility model discloses a sealed electronic equipment loading device, which relates to the technical field of electronic equipment and is small in size, compact in structure and convenient to mount and use. The uniform-temperature radiator is adopted as a heat guiding part, heat can be guided into the airflow channel and brought out of the box body under the effect of the fan, and the purpose of rapid and efficient cooling is achieved. Compared with a traditional aluminum or copper radiator, the uniform-temperature radiator is large in heat conductivity coefficient, solves the problem of large-power-consumption heat dissipation, meanwhile, meets the requirements for sealing performance, electromagnetic shielding performance and the like, and is worthy of large-area application and popularization.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, in particular to a sealed electronic equipment loading device adopting uniform temperature heat dissipation. Background Art

[0002] With the rapid development of electronic technology, the functionality and integration requirements of electronic devices are becoming increasingly demanding, leading to a sharp increase in the heat flux density of these devices. Special application requirements place even more stringent demands on the protection and electromagnetic shielding of electronic devices, so chassis are often designed as sealed structures. However, sealed structures also hinder the natural heat dissipation or air cooling of electronic devices.

[0003] There are three main categories of existing electronic equipment chassis: air-cooled chassis, conduction-cooled chassis, and liquid-cooled chassis. In order to ensure smooth airflow and ensure that the heat of the electronic boards is conducted out of the chassis by the air in the air duct, air-cooled chassis are often made into open structures, which greatly reduces the protection capability and electromagnetic shielding effectiveness of the electronic equipment. The conduction-cooled chassis can conduct the heat of the electronic boards to the surface of the chassis through its own structure and dissipate it naturally, but due to the size of the chassis, this type of chassis is often unable to achieve high-power heat dissipation. Although liquid-cooled chassis can achieve high-power heat dissipation and can achieve precise control, they require an external liquid cooling source to supply liquid, which limits their application scenarios and is expensive. Utility Model Content

[0004] In view of the above problems, the present invention provides a sealed electronic device loading device for overcoming the above problems or at least partially solving the above problems.

[0005] The utility model provides the following solutions:

[0006] A sealed electronic equipment loading device, comprising:

[0007] A box body having a cavity structure; the interior of the box body includes an air flow channel formed between a first end and a second end opposite to each other, and the first end is provided with a plurality of air inlets;

[0008] A heat sink comprising a heat sink having a first surface provided with a plurality of fins, and a second surface of the heat sink opposite to the first surface being configured to connect to an electronic board so that heat generated by a heating element of the electronic board is transferred to the plurality of fins;

[0009] a cooling fan connected to the second end so that the cooling fan is opposite to the air flow channel;

[0010] The temperature radiator is arranged inside the box in a flat and full-layer manner, so that a plurality of fins are exposed in the air flow channel and the electronic board is isolated from the air flow channel.

[0011] Preferably, at least one side of the box body is provided with an openable box cover; the electronic board is located between the box cover and the temperature radiator.

[0012] Preferably, the box body is formed by milling using aluminum alloy.

[0013] Preferably, the temperature averaging plate is connected to the box body by welding, so that the circumference of the temperature averaging plate is sealed with the box body.

[0014] Preferably, the temperature radiator includes two sets, and both sets of the temperature radiator are connected to the box and distributed on both sides of the air flow channel.

[0015] According to the specific embodiments provided by the present invention, the present invention discloses the following technical effects:

[0016] The embodiments of the present application provide a sealed electronic device loading device that is small in size, compact in structure, and easy to install and use. A heat sink is used as a heat-guiding component to direct heat into the airflow channel and, under the action of a fan, carry it out of the box, achieving rapid and efficient cooling. The heat sink has a higher thermal conductivity than traditional aluminum or copper heat sinks, solving the problem of high-power heat dissipation while also meeting requirements such as sealing and electromagnetic shielding, making it worthy of widespread promotion and use.

[0017] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be derived from these drawings without inventive effort.

[0019] Figure 1 This is a structural diagram of a sealed electronic equipment loading device provided by an embodiment of the present utility model;

[0020] Figure 2 This is a structural diagram of a sealed electronic equipment loading device provided by an embodiment of the present utility model after an electronic board is installed;

[0021] Figure 3This is a schematic diagram of the heat path provided by an embodiment of the present utility model.

[0022] In the figure: box 1, temperature radiator 2, temperature plate 21, fins 22, cooling fan 3, electronic board 4. DETAILED DESCRIPTION

[0023] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present invention.

[0024] See also Figure 1 、 Figure 2 、 Figure 3 , is a sealed electronic equipment loading device provided by an embodiment of the present utility model, such as Figure 1 、 Figure 2 、 Figure 3 As shown, the device may include:

[0025] A box body 1 having a cavity structure; the interior of the box body 1 includes an air flow channel formed between a first end and a second end opposite to each other, and the first end is provided with a plurality of air inlets;

[0026] A heat sink 2 includes a heat sink 21, a first surface of which is provided with a plurality of fins 22. A second surface of the heat sink 21, which is opposite to the first surface, is used to connect to the electronic board 4 so that the heat generated by the heating device of the electronic board 4 is transferred to the plurality of fins 22.

[0027] a cooling fan 3 connected to the second end so that the cooling fan 3 is opposite to the air flow channel;

[0028] The temperature radiator 2 is arranged in a flat layer inside the box 1 so that the fins 22 are exposed in the air flow channel and the electronic board 4 is isolated from the air flow channel.

[0029] The sealed electronic device loading device provided in the embodiment of the present application includes a heat radiator 2 that forms a partition within the housing 1 and can also serve as a mounting component for the electronic board. This not only isolates the electronic board from the airflow channel, thereby ensuring that the electronic board is in a completely sealed environment, but also improves the protection capability and electromagnetic shielding effectiveness of the electronic device. Heat generated by the heating components on the electronic board can also be transferred to the plurality of fins 22 via the heat radiator 21. Finally, under the action of the cooling fan 3, the heat from the plurality of fins 22 located in the airflow channel can be carried away by the airflow, thereby achieving the purpose of cooling the electronic board.

[0030] To enclose the electronic board, the embodiment of the present application may further provide an openable cover on at least one side of the box body 1; the electronic board 4 is located between the cover and the heat sink 2. After the electronic board is installed, the cover can be connected to the box body to form a sealed space between the cover and the heat sink, thereby protecting and shielding the electronic board.

[0031] In order to further improve the weather resistance of the box provided by the present application, the embodiment of the present application can also provide that the box 1 is formed by milling using aluminum alloy.

[0032] In order to further improve the sealing of the space where the electronic board is located, the embodiment of the present application can also provide that the temperature averaging plate 21 is connected to the box body 1 using a welding process, so that the circumference of the temperature averaging plate 21 is sealed to the box body 1.

[0033] The housing 1 is milled from aluminum alloy. The heat sink 2 consists of a heat plate 21 and fins 22. A cooling fan 3 accelerates heat flow through the heat sink fins 22. After the housing 1 and heat sink 2 are machined, they are welded together using a specialized welding process to achieve a sealed connection. The electronic board 4 is installed within the sealed cavity formed by the heat sink 2 and the housing 1, completely isolating the electronic board 4 from the air duct, providing excellent protection and electromagnetic shielding.

[0034] To improve the utilization of the housing, the embodiment of the present application may further provide two sets of the heat sinks 2, both connected to the housing 1 and located on either side of the airflow channel. Providing two sets of heat sinks, each capable of connecting to an electronic board 4, can achieve the goal of sealing the two electronic boards and providing efficient heat dissipation.

[0035] The heat sink, composed of a heat spreader and fins, provided in the embodiments of the present application can rapidly diffuse heat from the heat-generating chips (heat-generating components) of electronic boards horizontally and transfer it to the fins. Because the fins are fully exposed to the airflow path, the fan can quickly remove the heat from the fins.

[0036] Test data shows that the horizontal thermal conductivity of the heatsink can reach over 800W / mK, significantly higher than that of pure aluminum (237W / mK) and pure copper (401W / mK). The use of the heatsink in this chassis significantly improves its thermal conductivity and heat dissipation performance.

[0037] In summary, the sealed electronic device loading device provided by this application is small in size, compact in structure, and easy to install and use. Using a heat sink as a heat guide component, heat can be directed into the airflow channel and carried out of the box by the fan, achieving the purpose of rapid and efficient cooling. The heat sink has a higher thermal conductivity than traditional aluminum or copper heat sinks, solving the problem of high power dissipation while taking into account requirements such as sealing and electromagnetic shielding, and is worthy of large-scale promotion and use.

[0038] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0039] Through the description of the above embodiments, it can be seen that those skilled in the art can clearly understand that the present application can be implemented by means of software plus a necessary general hardware platform. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which can be stored in a storage medium such as ROM / RAM, a magnetic disk, an optical disk, etc., and includes a number of instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in various embodiments or certain parts of the embodiments of the present application.

[0040] Each embodiment in this specification is described in a progressive manner. The same or similar parts between the embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments. In particular, for system or system embodiments, since they are basically similar to method embodiments, the description is relatively simple. For relevant parts, refer to the partial description of the method embodiment. The system and system embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. A person of ordinary skill in the art can understand and implement it without expending creative work.

[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention are included in the scope of protection of the present invention.

Claims

1. A sealed electronic equipment loading device, characterized in that: include: A box body having a cavity structure; the interior of the box body includes an air flow channel formed between a first end and a second end opposite to each other, and the first end is provided with a plurality of air inlets; A heat sink comprising a heat sink having a first surface provided with a plurality of fins, and a second surface of the heat sink opposite to the first surface being configured to connect to an electronic board so that heat generated by a heating element of the electronic board is transferred to the plurality of fins; a cooling fan connected to the second end so that the cooling fan is opposite to the air flow channel; The temperature radiator is arranged inside the box in a flat and full-layer manner, so that a plurality of fins are exposed in the air flow channel and the electronic board is isolated from the air flow channel.

2. The sealed electronic device loading device according to claim 1, characterized in that: An openable box cover is provided on at least one side of the box body; the electronic board is located between the box cover and the temperature radiator.

3. The sealed electronic device loading device according to claim 1, characterized in that: The box body is formed by milling using aluminum alloy.

4. The sealed electronic device loading device according to claim 1, wherein: The temperature averaging plate is connected to the box body by welding so that the circumference of the temperature averaging plate is sealed with the box body.

5. The sealed electronic device loading device according to claim 1, characterized in that: The temperature radiator includes two sets, and both sets of the temperature radiator are connected to the box and distributed on both sides of the air flow channel.

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