Radiating fin with adjustable radiating area

Abstract

The utility model belongs to the technical field of heat dissipation structures, and particularly relates to a heat dissipation area-adjustable heat dissipation fin, which comprises a substrate assembly, a substrate main body, a connecting seat arranged at the top of the substrate main body and a connecting groove arranged in the middle of the connecting seat, and a fin assembly, comprising a fin body located at the top of the substrate body, a heat conducting piece arranged at the bottom of the fin body and connected with a connecting groove, a movable groove formed in the front surface of the fin body, and cooling fins arranged in the movable groove and sliding left and right along the movable groove. The first heat dissipation through holes are formed in the surfaces of the fin main bodies; the second heat dissipation through holes are formed in the surfaces of the heat dissipation fins; the radiator is reasonable in structure, the radiating area of the radiating fins can be conveniently adjusted in the using process, the application range is wide, and the flexibility is high.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation structures, in particular to a heat dissipation fin with adjustable heat dissipation area. Background Art

[0002] With the advancement of technology, various electronic components are being updated day by day, and the heat dissipation problem caused by electronic components is becoming more and more important. How to solve the heat dissipation and how to better dissipate heat has become an indispensable technical issue.

[0003] The heat sink is the most frequently used heat dissipation element. When the heat sink is in use, it is fixed in the machine equipment by installing it. When the machine equipment generates heat during operation, the base plate of the heat sink absorbs the heat and transfers it to several heat dissipation fins on the surface of the base plate. Finally, the heat on the heat dissipation fins is blown away by a fan. The heat dissipation area of the heat sink is controlled by the different number of heat dissipation fins on the heat sink. However, the heat dissipation fins on the above-mentioned heat sink are fixed, and machines and equipment of different sizes require heat dissipation areas of heat sinks to adapt to them. As a result, heat sinks of different sizes need to be prepared to adapt to machines and equipment of different sizes, which leads to insufficient practicality of the heat sink.

[0004] Based on the above problems, we propose a new type of heat sink with adjustable heat dissipation area. Utility Model Content

[0005] The purpose of this section is to summarize some aspects of the embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and in the abstract and title of the utility model to avoid obscuring the purpose of this section, the abstract and the title of the utility model, and such simplifications or omissions shall not be used to limit the scope of the present invention.

[0006] In view of the problems existing in the existing technology, the present utility model is proposed.

[0007] Therefore, the purpose of the present invention is to provide a heat sink with adjustable heat dissipation area, which can facilitate adjustment of the heat dissipation area of the heat sink during use, and has a wide range of applications and high flexibility.

[0008] In order to solve the above technical problems, according to one aspect of the present invention, the present invention provides the following technical solutions:

[0009] A heat sink with adjustable heat dissipation area, comprising:

[0010] The base plate assembly includes a base plate body, a connecting seat arranged on the top of the base plate body, and a connecting groove arranged in the middle of the connecting seat;

[0011] The fin assembly includes a fin body located on the top of the substrate body, a heat conducting plate arranged at the bottom of the fin body and connected to the connecting groove, a movable groove arranged on the front surface of the fin body, a heat dissipating fin arranged inside the movable groove and sliding left and right along the movable groove, a first heat dissipating through hole arranged on the surface of the fin body, and a second heat dissipating through hole arranged on the surface of the heat dissipating fin.

[0012] As a preferred solution of the heat sink with adjustable heat dissipation area described in the utility model, the base plate is hollow and communicated with the connecting groove.

[0013] As a preferred solution of the heat sink with adjustable heat dissipation area described in the present invention, mounting frames are provided at the four corners of the base plate, and matching mounting bolts and mounting screw holes are provided on the mounting frames.

[0014] As a preferred solution of the heat sink with adjustable heat dissipation area described in the utility model, sliders that match the movable grooves are provided on the top and bottom of the heat sink.

[0015] As a preferred solution of the heat sink with adjustable heat dissipation area described in the present invention, a positioning pin is provided on the top of the fin body, and a matching positioning hole is provided on the top of the heat dissipation fin.

[0016] As a preferred solution of the heat sink with adjustable heat dissipation area described in the present invention, when the heat dissipation fins are in the retracted state, the first heat dissipation through hole and the second heat dissipation through hole coincide with each other.

[0017] As a preferred solution of the heat sink with adjustable heat dissipation area described in the utility model, heat conduction holes are provided on the surface of the heat conducting plate.

[0018] Compared with the prior art, the beneficial effects of the present invention are:

[0019] By providing a connecting seat and a connecting groove on the top of the base body, the fin body is connected to the connecting groove through the heat conducting sheet, which is convenient for installation and disassembly, and convenient for adjusting the distance between the fin bodies;

[0020] By adjusting the position of the heat dissipation fins in the inner cavity of the movable slot and fixing the position of the heat dissipation fins through positioning pins and positioning holes, the overall heat dissipation area of the device can be changed, which has high flexibility and a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below in conjunction with the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without inventive labor. Among them:

[0022] Figure 1 This is a schematic diagram of the structure of the utility model;

[0023] Figure 2 This is a schematic structural diagram of the substrate assembly of the utility model;

[0024] Figure 3 This is a schematic diagram of the structure of the fin assembly of the utility model;

[0025] Figure 4 This is a structural diagram of the fin assembly of the utility model in the expanded state.

[0026] In the figure, 100 is a substrate assembly, 110 is a substrate body, 120 is a connection seat, 130 is a slot, 200 is a fin assembly, 210 is a fin body, 220 is a heat conducting sheet, 230 is a movable slot, 240 is a heat dissipating fin, 250 is a first heat dissipating through hole, and 260 is a second heat dissipating through hole. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0028] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0029] Next, the present invention is described in detail with reference to schematic diagrams. For ease of illustration, cross-sectional views of device structures may be partially enlarged and not to scale when describing the embodiments of the present invention. Furthermore, the schematic diagrams are merely illustrative and should not limit the scope of protection of the present invention. Furthermore, in actual production, three-dimensional dimensions, including length, width, and depth, should be included.

[0030] In order to make the purpose, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0031] The utility model provides the following technical solutions: a heat sink with adjustable heat dissipation area, which is convenient for adjusting the heat dissipation area of the heat sink during use, has a wide range of applications and high flexibility;

[0032] Figures 1 to 3 The figure shows a schematic structural diagram of an embodiment of a heat sink with adjustable heat dissipation area according to the present invention, wherein the main body thereof includes a base plate assembly 100 and a fin assembly 200;

[0033] The substrate assembly 100 includes a substrate body 110, a connecting base 120 installed on the top of the substrate body 110, and a connecting groove 130 installed in the middle of the connecting base 120. The substrate is hollow and connected to the connecting groove 130. The four corners of the substrate are installed with mounting brackets, and the mounting brackets are equipped with matching mounting bolts and mounting screw holes. Furthermore, the substrate body 110 is used to support the fin assembly 200, the connecting base 120 is used to support the connecting groove 130, and the connecting groove 130 is used to install the fin assembly 200.

[0034] The fin assembly 200 includes a fin body 210 located on the top of the substrate body 110, a heat conducting sheet 220 installed at the bottom of the fin body 210 and connected to the connecting groove 130, a movable groove 230 installed on the front surface of the fin body 210, a heat dissipating fin 240 installed inside the movable groove 230 and sliding left and right along the movable groove 230, a first heat dissipating through hole 250 opened on the surface of the fin body 210, and a second heat dissipating through hole 260 opened on the surface of the heat dissipating fin 240. Sliders that match the movable groove 230 are installed on the top and bottom of the heat dissipating fin 240. A positioning pin is installed on the top of the body 210, and a matching positioning hole is opened on the top of the heat dissipation fin 240. When the heat dissipation fin 240 is in the storage state, the first heat dissipation hole 250 coincides with the second heat dissipation hole 260, and a heat dissipation hole is opened on the surface of the thermal conductive sheet 220. Furthermore, the fin body 210 is used to support the movable groove 230, the thermal conductive sheet 220 is used to be connected to the connecting groove 130, the movable groove 230 is used to support the heat dissipation fin 240, the heat dissipation fin 240 is used to change the heat dissipation area, and the first heat dissipation hole 250 and the second heat dissipation hole 260 are used to improve the heat dissipation performance.

[0035] Combine Figure 1-Figure 3 , a heat sink with adjustable heat dissipation area in this embodiment, the specific principle is as follows: by providing a connecting seat 120 and a connecting groove 130 on the top of the substrate body 110, the fin body 210 is connected to the connecting groove 130 through the heat conducting sheet 220, which is convenient for installation and disassembly, and convenient for adjusting the spacing between the fin bodies 210. By adjusting the position of the heat dissipation fin 240 in the inner cavity of the movable groove 230, and fixing the position of the heat dissipation fin 240 through the positioning pin and the positioning hole, the overall heat dissipation area of the device can be changed, which has high flexibility and a wide range of applications.

[0036] While the present invention has been described above with reference to specific embodiments, various modifications may be made and equivalent components may be substituted without departing from the scope of the present invention. In particular, as long as no structural conflicts exist, the various features of the embodiments disclosed herein may be combined with one another in any manner, and the omission of an exhaustive description of these combinations in this specification is solely for the sake of space and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions within the scope of the claims.

Claims

1. A heat sink with adjustable heat dissipation area, characterized in that: include: A substrate assembly (100) comprises a substrate body (110), a connecting seat (120) arranged on the top of the substrate body (110), and a connecting groove (130) arranged in the middle of the connecting seat (120); The fin assembly (200) comprises a fin body (210) located on the top of a substrate body (110), a heat conducting plate (220) arranged at the bottom of the fin body (210) and connected to a connecting groove (130), a movable groove (230) arranged on the front surface of the fin body (210), a heat dissipation fin (240) arranged inside the movable groove (230) and sliding left and right along the movable groove (230), a first heat dissipation through hole (250) arranged on the surface of the fin body (210), and a second heat dissipation through hole (260) arranged on the surface of the heat dissipation fin (240).

2. The heat sink with adjustable heat dissipation area according to claim 1, characterized in that: The base plate is hollow and communicates with the connecting groove (130).

3. The heat sink with adjustable heat dissipation area according to claim 1, characterized in that: The four corners of the base plate are provided with mounting frames, and the mounting frames are provided with matching mounting bolts and mounting screw holes.

4. The heat sink with adjustable heat dissipation area according to claim 1, characterized in that: The top and bottom of the heat dissipation fin (240) are provided with sliding blocks that match the movable groove (230).

5. The heat sink with adjustable heat dissipation area according to claim 1, characterized in that: A positioning pin is provided on the top of the fin body (210), and a matching positioning hole is provided on the top of the heat dissipation fin (240).

6. The heat sink with adjustable heat dissipation area according to claim 1, characterized in that: When the heat dissipation fins (240) are in the stored state, the first heat dissipation through hole (250) and the second heat dissipation through hole (260) overlap.

7. The heat sink with adjustable heat dissipation area according to claim 1, characterized in that: The surface of the heat conducting plate (220) is provided with heat conducting through holes.

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