Electronic component and electronic equipment
By setting up a shielding structure in the packaging shell of the electronic components, the internal radiation interference and space occupation problems of electronic devices are solved, and the efficient radiation shielding effect is achieved, which improves the overall performance of electronic components.
Patent Information
- Application Number
- CN202422351008.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-09-25
AI Technical Summary
In the prior art, the radiation modes inside electronic devices will interfere with each other when implementing functions, affecting device performance, and common shielding solutions have problems such as insufficient shielding effect or excessive space occupied.
A shielding structure is provided in the packaging shell of the electronic components, and the radiation body is located in the shielding space surrounded by the shielding structure and the substrate. The radiation function is realized through the opening of the packaging shell, and the shielding structure is used to shield internally to avoid radiation interference.
It improves radiation efficiency, reduces radiation energy leakage, avoids space occupation, and prevents damage to the assembly of the entire machine by the shielding structure, enhancing the radiation shielding effect.
Smart Images
Figure CN223246947U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of electronic technology, and in particular to electronic components and electronic equipment. Background Art
[0002] Electronic devices require electromagnetic, radio frequency and other radiation methods to realize the device functions of corresponding electronic components. While realizing the functions, the above radiations will also interfere with each other and affect the performance of the devices.
[0003] Therefore, when using these electronic devices, metal shielding, shielding materials, or electromagnetic absorption materials are often used to reduce interference. However, these shielding solutions often suffer from insufficient shielding effectiveness or excessive space occupation during implementation. Utility Model Content
[0004] The present disclosure provides an electronic component and an electronic device to solve related technical problems.
[0005] A first aspect of the present disclosure provides an electronic component, comprising:
[0006] substrate;
[0007] a radiation body, disposed on the substrate;
[0008] A packaging shell is assembled on the substrate; a shielding structure is provided in the packaging shell, the packaging shell is provided with a first opening, and the shielding structure is provided with a second opening connected to the first opening; the radiating body is provided in a shielding space surrounded by the shielding structure and the substrate.
[0009] Optionally, the shielding structure is provided on the first inner wall of the packaging shell.
[0010] Optionally, the shielding structure includes at least one of a shielding film, a shielding coating, and a shielding plating.
[0011] Optionally, the packaging shell and the substrate enclose a packaging space, and the shielding structure is arranged in the packaging space.
[0012] Optionally, the shielding structure includes a structural member and a shielding layer provided on at least one side of the structural member; wherein the shielding layer includes at least one of a shielding film, a shielding coating, and a shielding plating.
[0013] Optionally, the electronic component further includes a receiving body; the receiving body is arranged on the substrate and is located in a shielding space surrounded by the shielding structure and the substrate; the packaging shell is provided with a third opening, and the shielding structure is provided with a fourth opening connected to the third opening.
[0014] Optionally, a retaining wall is further provided in the packaging shell, and the retaining wall separates the radiating body and the receiving body into different spaces in the packaging shell.
[0015] Optionally, the substrate is provided with an auxiliary circuit, and the auxiliary circuit is arranged in a shielding space enclosed by the shielding structure and the substrate.
[0016] Optionally, in the thickness direction of the electronic component, the first opening and the second opening are arranged in alignment; and an assembly gap is provided between the shielding structure and the radiation body.
[0017] According to a second aspect of the present disclosure, an electronic device is provided, comprising: any electronic component described in the first aspect.
[0018] The technical solution provided by the present disclosure can achieve at least the following beneficial effects:
[0019] The disclosed electronic component package includes a shielding structure within its enclosure. A radiating element is disposed within the shielded space enclosed by the shielding structure and the substrate, achieving radiation through a first opening and a second opening. This shielding structure shields the electronic component from radiation interference without affecting the component's radiation function, improving radiation efficiency while also minimizing space occupation by the radiating element.
[0020] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.
[0022] Figure 1 is a schematic cross-sectional structural diagram of an electronic component in an exemplary embodiment of the present disclosure;
[0023] Figure 2 is a schematic cross-sectional structural diagram of an electronic component in another exemplary embodiment of the present disclosure;
[0024] Figure 3 It is a schematic cross-sectional structure diagram of an electronic component in another exemplary embodiment of the present disclosure. DETAILED DESCRIPTION
[0025] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with this specification. Rather, they are merely examples of apparatus and methods consistent with certain aspects of this specification, as detailed in the appended claims.
[0026] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. Unless otherwise defined, technical or scientific terms used in this specification should have the same ordinary meaning as those understood by persons of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and similar terms used in this specification and the claims do not denote any order, quantity, or importance, but are simply used to distinguish one component from another. Similarly, terms such as "a" or "an" do not denote a limitation of quantity, but rather indicate the presence of one. "Multiple" or "several" means two or more. Unless otherwise indicated, terms such as "front," "rear," "lower," and / or "upper" are used for convenience only and are not intended to limit the scope of the disclosure to a specific location or spatial orientation. Terms such as "include" or "comprising" mean that the elements or objects listed before "include" or "comprising" include the elements or objects listed after "include" or "comprising" and their equivalents, and do not exclude other elements or objects. Terms such as "connected" or "connected" are not limited to physical or mechanical connections and can include electrical connections, whether direct or indirect.
[0027] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit the present disclosure. As used in this specification and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
[0028] Electronic devices rely on electromagnetic and radio frequency radiation to achieve their functions. While these radiations achieve their functions, they can also interfere with each other, affecting device performance. Therefore, when using these electronic components, metal shields, shielding materials, or electromagnetic absorption materials are often used to reduce interference. However, these shielding solutions often suffer from insufficient shielding effectiveness or excessive space usage.
[0029] The present disclosure provides an electronic component. Figure 1is a schematic cross-sectional view of an electronic component in an exemplary embodiment of the present disclosure, such as Figure 1 As shown, electronic component 1 includes a substrate 11, a radiating element 12, and an encapsulating shell 13. Radiating element 12 is mounted on substrate 11, and encapsulating shell 13 is assembled to substrate 11. Encapsulating shell 13 includes a shielding structure 14 disposed within it. Encapsulating shell 13 includes a first opening 131, and shielding structure 14 includes a second opening 144 communicating with first opening 131. Radiating element 12 is disposed within a shielded space 143 enclosed by shielding structure 14 and substrate 11.
[0030] Because the shielding structure 14 is provided within the package 13 of the electronic component 1, the radiating body 12 is disposed within the shielded space 143 enclosed by the shielding structure 14 and the substrate 11, achieving its radiation function through the first opening 131 and the second opening 144. The shielding structure 14 shields radiation interference within the electronic component 1 without affecting the radiation function of the electronic component 1. This not only helps reduce gap radiation energy and improve radiation efficiency, but also avoids space occupation caused by the radiating structure and prevents damage to the shielding structure 14 during device use or assembly, thereby enhancing the radiation shielding effect.
[0031] It should be noted that the electronic component 1 can be a dtof (direct time-of-flight) sensor or an itof (indirect time-of-flight) sensor, or can include other electronic components 1 with radiation and radio frequency functions. The radiating body 12 of the electronic component 1 is encapsulated in a housing 13 and then assembled on a circuit board to achieve the corresponding function. The shielding structure 14 can be configured in an appropriate manner according to the specific application scenario.
[0032] In some embodiments, as Figure 1 As shown, shielding structure 14 is disposed on first inner wall 111 of enclosure 13 to simplify the structure of electronic component 1 and reduce the size of electronic component 1 itself. Placing shielding structure 14 on first inner wall 111 also increases the shielding area of shielding structure 14, reduces exposure of peripheral circuitry surrounding radiating element 12, and minimizes copper leakage within electronic component 1. Shielding structure 14 can cover first inner wall 111 to ensure effective shielding.
[0033] When the electronic component 1 itself has a small size and the distance between the radiating body 12 and the packaging shell 13 is small, disposing the shielding structure 14 on the first inner wall 111 of the packaging shell 13 can avoid the shielding structure 14 occupying space of the electronic component 1 .
[0034] Among them, the shielding structure 14 includes at least one of a shielding film, a shielding coating, and a shielding plating. The material of the above-mentioned shielding structure 14 can be aluminum, steel, copper, ceramic or SiC and other materials. When the shielding structure 14 is a composite of steel and copper, it can be made into a three-layer structure in which steel, copper, and steel are stacked in sequence. When manufacturing the electronic component 1, the shielding structure 14 can be set on the first inner wall 111 of the packaging shell 13, and then the packaging shell 13 and the substrate 11 are assembled to achieve packaging. For example, when the shielding structure 14 is a shielding film, the shielding film can be attached to the first inner wall 111. When the shielding structure 14 is a shielding coating, the shielding material can be applied to the first inner wall 111. When the shielding structure 14 is a shielding plating, the shielding material can be plated on the first inner wall 111.
[0035] In other embodiments, Figure 2 As shown, the package shell 13 and the substrate 11 enclose a package space 133, and the shielding structure 14 can be disposed in the package space 133 to reduce processing difficulty. When manufacturing the electronic component 1, the radiating body 12 can be disposed on the substrate 11, the shielding structure 14 can be assembled, and then the package shell 13 can be used for packaging.
[0036] The shielding structure 14 may include a structural member 141 and a shielding layer 142 disposed on at least one side of the structural member 141. The structural member 141 may be made of a material with or without shielding effects. The shielding layer 142 may include at least one of a shielding film, a shielding coating, and a shielding plating. The structural member 141 serves as the substrate for the shielding layer 142. If the shielding structure 14 is a shielding film, the shielding film may be attached to the second inner wall 1411 or the outer wall 1412 of the structural member 141 facing the radiating body 12. If the shielding structure 14 is a shielding coating, the shielding material may be applied to the second inner wall 1411 or the outer wall 1412. If the shielding structure 14 is a shielding plating, the shielding material may be plated on the second inner wall 1411 or the outer wall 1412. The shielding structure 14 may cover the second inner wall 1411 or the outer wall 1412 to ensure shielding effectiveness.
[0037] Alternatively, the shielding structure 14 may be made of aluminum, steel, copper, ceramic, or SiC. When the shielding structure 14 is made of a composite of steel and copper, it may be made into a three-layer structure of steel, copper, and steel stacked in sequence.
[0038] In the above embodiment, the substrate 11 may be provided with an auxiliary circuit, which is arranged in the shielding space 143 surrounded by the shielding structure 14 and the substrate 11. The auxiliary circuit can be shielded by the shielding structure 14 to improve the utilization rate of the shielding structure 14.
[0039] In some embodiments, as Figure 1-Figure 3As shown, the electronic component 1 may further include a receiving body 17, which is disposed on the substrate 11 and located within a shielded space 143 enclosed by the shielding structure 14 and the substrate 11. The encapsulating shell 13 has a third opening 132, and the shielding structure 14 has a fourth opening 145 communicating with the third opening 132. Shielding the receiving body 17 of the electronic component 1 can provide overall shielding for the electronic component 1, including the radiating body 12 and the receiving body 17, thereby enhancing the shielding effect. The receiving body 17 can receive radiation through the third opening 132 and the fourth opening 145.
[0040] A retaining wall 16 may be provided within the enclosure 13 to separate the radiating element 12 and the receiving element 17 into different spaces within the enclosure 13 to prevent interference between emitted and received radiation. Furthermore, a shielding structure 14 may be provided on at least one side of the retaining wall 16 to enhance the shielding effect.
[0041] In some other embodiments, Figure 3 As shown, the shielding structure 14 can also be set on the outer wall of the radiating body 12 and the receiving body 17 to form a shielding effect at the radiation source or the receiving source, thereby improving the efficiency of transmitting and receiving radiation, while reducing the material used in the shielding structure 14 and reducing costs.
[0042] In the above embodiment, the first opening 131 and the second opening 144 can be aligned in the thickness direction of the electronic component 1, and the third opening 132 and the fourth opening 145 can be aligned to ensure that the function of the electronic component 1 is achieved. When the electronic component 1 is a TOF, the first opening 131 and the third opening 132 can be assembled with the lens 15.
[0043] In addition, an assembly gap may be provided between the shielding structure 14 and the radiating body 12 to avoid structural interference between the radiating structure and the radiating body 12 during assembly or use.
[0044] The present disclosure further provides an electronic device, which includes the electronic component 1 described above.
[0045] Because the shielding structure 14 is provided within the package 13 of the electronic component 1, the radiating body 12 is disposed within the shielded space 143 enclosed by the shielding structure 14 and the substrate 11, achieving its radiation function through the first opening 131 and the second opening 144. The shielding structure 14 shields radiation interference within the electronic component 1 without affecting the radiation function of the electronic component 1. This not only helps reduce gap radiation energy and improve radiation efficiency, but also avoids space occupation caused by the radiating structure and prevents damage to the shielding structure 14 during device use or assembly, thereby enhancing the radiation shielding effect.
[0046] The electronic component 1 can be assembled on a circuit board in an electronic device. Since the shielding structure 14 is arranged in the packaging shell 13 of the electronic component 1, it helps to reduce the occupied area of the circuit board layout.
[0047] It should be noted that the above-mentioned electronic devices can be mobile phones, tablet computers, wearable devices, vehicle-mounted terminals, medical terminals, etc.
[0048] The above description is merely a preferred embodiment of the present disclosure and does not constitute any form of limitation to the present disclosure. Although the present disclosure has been disclosed as a preferred embodiment as above, it is not intended to limit the present disclosure. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of the technical content disclosed above without departing from the scope of the technical solution of the present disclosure. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present disclosure without departing from the content of the technical solution of the present disclosure are still within the scope of the technical solution of the present disclosure.
Claims
1. An electronic component, characterized in that: include: substrate; a radiation body, disposed on the substrate; A packaging shell, assembled on the substrate; A shielding structure is provided in the packaging shell, the packaging shell is provided with a first opening, and the shielding structure is provided with a second opening communicated with the first opening; the radiating body is provided in a shielding space surrounded by the shielding structure and the substrate.
2. The electronic component according to claim 1, wherein: The shielding structure is arranged on the first inner wall of the packaging shell.
3. The electronic component according to claim 2, wherein: The shielding structure includes at least one of a shielding film, a shielding coating, and a shielding plating.
4. The electronic component according to claim 1, wherein: The packaging shell and the substrate form a packaging space, and the shielding structure is arranged in the packaging space.
5. The electronic component according to claim 4, characterized in that The shielding structure includes a structural member and a shielding layer provided on at least one side of the structural member; wherein the shielding layer includes at least one of a shielding film, a shielding coating, and a shielding plating layer.
6. The electronic component according to claim 1, wherein: The electronic component further includes a receiving body; the receiving body is arranged on the substrate and is located in a shielding space surrounded by the shielding structure and the substrate; the packaging shell is provided with a third opening, and the shielding structure is provided with a fourth opening connected to the third opening.
7. The electronic component according to claim 6, wherein: A retaining wall is further provided in the packaging shell, and the retaining wall separates the radiating body and the receiving body into different spaces in the packaging shell.
8. The electronic component according to claim 1, wherein: The substrate is provided with an auxiliary circuit, and the auxiliary circuit is arranged in a shielding space surrounded by the shielding structure and the substrate.
9. The electronic component according to claim 1, wherein: In the thickness direction of the electronic component, the first opening and the second opening are arranged in alignment; and an assembly gap is provided between the shielding structure and the radiation body.
10. An electronic device, characterized in that: include: The electronic component according to any one of claims 1 to 9.