Cooling constant-temperature device for chemical precursor
By designing a chemical precursor cooling constant temperature device, using a heat dissipation system and a thermal conductivity system, and combining a PID cooling temperature controller, the problem of low cooling efficiency of existing constant temperature equipment is solved, and multi-dimensional heat dissipation and high-efficiency temperature control are realized.
Patent Information
- Application Number
- CN202422397825.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-09-29
AI Technical Summary
Existing constant temperature equipment takes away heat from the surface of the object through air flow, and the cooling efficiency is low, making it difficult to achieve efficient three-dimensional heat dissipation.
A chemical precursor cooling constant temperature device is designed, using a heat dissipation system and a thermal conductivity system, including a heat dissipation fan, a heat sink, a semiconductor refrigeration sheet and a source bottle fixed cylinder, to realize multi-dimensional heat dissipation, and precise temperature control is carried out in combination with a PID cooling temperature controller.
It achieves better cooling effect and temperature control accuracy, has a simple structure and is suitable for multi-dimensional heat dissipation of chemical precursors.
Smart Images
Figure CN223249339U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of experimental production and detection, in particular to a chemical precursor cooling and constant temperature device. Background Art
[0002] Constant temperature equipment is widely used in solar cells, bioengineering, medicine, food, chemical engineering, semiconductor manufacturing and other fields. It produces a constant, uniform temperature source with controllable heating and cooling. It can be used for constant temperature testing or experiments on experimental samples and products, and can also be used to heat or cool gases or liquids to a specified temperature.
[0003] The prior art describes a thermostat device comprising a housing with a thermostat chamber on the upper layer and an electrical component on the lower layer. The inner wall of the thermostat chamber is insulated, and a baffle and temperature sensor are located within the chamber. The device also includes a heating / cooling assembly consisting of a semiconductor refrigeration plate, a radiator, and a fan, embedded in the center of the insulation layer on the bottom surface of the thermostat chamber. This method utilizes air as the thermostat medium, semiconductor refrigeration plates as the heating / cooling device, and air circulation as a means of temperature uniformity, achieving a constant temperature over a wide temperature range. However, this thermostat device relies on air flow to remove heat, typically only removing heat from the surface of the object, resulting in low cooling efficiency. Utility Model Content
[0004] In order to overcome the shortcomings and deficiencies in the prior art, the purpose of the present invention is to design a chemical precursor cooling and constant temperature device that can achieve multi-directional three-dimensional heat dissipation, has a better cooling effect, and has a simple structure and is easy to operate.
[0005] To achieve the above-mentioned purpose, the utility model provides a chemical precursor cooling and constant temperature device, including a control system, a heat dissipation system, a heat conduction system and a source bottle, the heat dissipation system is located directly below the heat conduction system, the heat conduction system includes a source bottle base and a semiconductor refrigeration plate, the source bottle base is arranged on the semiconductor refrigeration plate, the heat conduction system also includes a source bottle fixing tube, the source bottle fixing tube is located directly above the source bottle base, and the source bottle fixing tube surrounds at least a portion of the source bottle.
[0006] Furthermore, the source bottle is provided with a temperature measuring thermocouple.
[0007] Furthermore, the control system includes a control base and a switch and a display panel arranged on the base; the temperature measuring thermocouple is connected to the control system.
[0008] Furthermore, the heat dissipation system includes a heat dissipation fan and a heat sink. The heat dissipation system includes a heat dissipation fan and a heat sink. The heat sink is arranged directly above the heat dissipation fan, and the semiconductor refrigeration fin is arranged directly above the heat sink.
[0009] Furthermore, the chemical precursor cooling and constant temperature device also includes a support column and a fixing nut. The bottom of the heat dissipation fan is provided with a through hole, and the upper end of the support column is provided with a screw rod, which passes through the through hole and is screwed to the fixing nut.
[0010] Furthermore, the inner diameter of the source bottle fixing cylinder is greater than or equal to the outer diameter of the source bottle.
[0011] Furthermore, the position of the source bottle fixing cylinder surrounding the source bottle corresponds to the position of the chemical precursor in the source bottle, and the height of the source bottle fixing cylinder is greater than or equal to the filling height of the chemical precursor in the source bottle.
[0012] Furthermore, the entire bottom surface of the source bottle fixing cylinder contacts the top surface of the source bottle bottom support.
[0013] Furthermore, the entire bottom surface of the source bottle base is in contact with the semiconductor refrigeration plate.
[0014] Furthermore, the control system is a PID cooling temperature controller.
[0015] After adopting the above technical solution, the beneficial effects are:
[0016] The chemical precursor cooling and constant temperature device of the present invention surrounds the source bottle to be cooled with a source bottle fixing cylinder to cool and maintain a constant temperature, thereby realizing multi-directional three-dimensional heat dissipation, obviously achieving better cooling effect, and having a simple structure and being easy to operate. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a structural schematic diagram of the chemical precursor cooling and constant temperature device involved in the present utility model.
[0018] The accompanying drawings are marked as follows: 1. control base; 2. support column; 3. fixing nut; 4. cooling fan; 5. heat sink; 6. semiconductor refrigeration plate; 7. source bottle bottom support; 8. source bottle fixing tube; 9. source bottle; 10. temperature measuring thermocouple; 11. switch; 12. display panel. DETAILED DESCRIPTION
[0019] The following further describes the technical solution of the present invention through examples. Obviously, the described examples are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.
[0020] like Figure 1As shown, the present invention provides a chemical precursor cooling and constant temperature device, including a control system, a heat dissipation system, a heat conduction system and a source bottle 9. The heat dissipation system is located directly below the heat conduction system. The source bottle 9, which controls the temperature by heat conduction, is installed on the heat conduction system. The heat conduction system includes a source bottle base 7, a source bottle fixing cylinder 8 and a semiconductor refrigeration plate 6. The source bottle base 7 is provided on the semiconductor refrigeration plate 6, the source bottle fixing cylinder 8 is located directly above the source bottle base 7, and the source bottle fixing cylinder 8 surrounds at least a portion of the source bottle 9. Surrounded by the source bottle fixing cylinder 8, the source bottle 9 can be fixedly mounted on the source bottle base 7. In this embodiment, the source bottle fixing cylinder 8 surrounds the lower half of the source bottle 9, while in other embodiments, the source bottle fixing cylinder 8 can also surround other positions of the source bottle 9. For example, the source bottle fixing cylinder 8 is connected to the source bottle base 7 by a heat conduction rod so as to be suspended, and the source bottle fixing cylinder 8 surrounds the middle part of the source bottle 9.
[0021] The source bottle 9 is provided with a temperature measuring thermocouple 10, and the control system includes a control base 1 and a switch 11 and a display panel 12 provided on the base 1; the temperature measuring thermocouple 10 is connected to the control system, and the temperature measuring thermocouple 10 can detect the temperature of the reaction source at the bottom of the source bottle 9 in real time, and transmit the detected temperature data to the display panel 12, so that the user can monitor the temperature of the source bottle 9 in time. Among them, the control system of this embodiment is a PID cooling temperature controller, which controls the temperature through the PID algorithm and can achieve a temperature control accuracy of ±0.1 degrees Celsius.
[0022] The heat dissipation system includes a cooling fan 4 and a heat sink 5. The heat sink 5 is located directly above the cooling fan 4, and a semiconductor cooling sheet 6 is located directly above the heat sink 5. The heat of the source bottle 9 is transferred from the source bottle fixing tube 8 to the heat sink 5 through the semiconductor cooling sheet 6, and then the heat is blown away to the environment by the cooling fan 4.
[0023] Although the semiconductor refrigeration chip 6 is square in this embodiment, in other embodiments, the semiconductor refrigeration chip 6 may also be rectangular, circular, or other shapes. The entire bottom surface of the source bottle fixing tube 8 contacts the top surface of the source bottle base 7, and the entire bottom surface of the source bottle base 7 contacts the semiconductor refrigeration chip 6. This allows the heat from the source bottle 9 to be efficiently cooled through the semiconductor refrigeration chip 6 by heat conduction. In addition, this embodiment uses a 24V low-voltage semiconductor refrigeration chip 6, which is highly safe and reliable.
[0024] Among them, in this embodiment, the inner diameter of the source bottle fixing tube 8 is greater than or equal to the outer diameter of the source bottle 9, so that the source bottle fixing tube 8 can cover the bottle body of the source bottle 9. That is to say, when source bottles 9 of different diameters need to be cooled, source bottle fixing tubes 8 of corresponding diameters are used in conjunction with the source bottles 9.
[0025] The position of the source bottle fixing tube 8 surrounding the source bottle 9 corresponds to the position of the chemical precursor in the source bottle 9, and the height of the source bottle fixing tube 8 is greater than or equal to the filling height of the chemical precursor in the source bottle 9. The height of the source bottle fixing tube 8 can be 1 / 2, 1 / 3, or 1 / 4. Specifically, the appropriate source bottle fixing tube 8 can be selected according to the filling height of the chemical precursor to be cooled in the source bottle 9, so that the source bottle fixing tube 8 can completely surround the chemical precursor in the source bottle 9, realizing multi-directional three-dimensional heat dissipation, good cooling effect, and simple operation.
[0026] Preferably, the chemical precursor cooling and constant temperature device further includes a support column 2 and a fixing nut 3. A through-hole is provided at the bottom of the cooling fan 4, and a screw is provided at the upper end of the support column 2. The screw passes through the through-hole and is screwed to the fixing nut 3. The main body of the support column 2 is capable of supporting the cooling fan 4. The screw of the support column 2 passes through the through-hole and is screwed to the fixing nut 3, thereby securing the cooling fan 4. This ensures that the lower surface of the cooling fan 4 is in full contact with the air, thereby achieving effective heat dissipation.
[0027] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.
Claims
1. A chemical precursor cooling and constant temperature device, comprising a control system, a heat dissipation system, a heat conduction system, and a source bottle, wherein the heat dissipation system is located directly below the heat conduction system, the heat conduction system comprises a source bottle base and a semiconductor refrigeration plate, the source bottle base is arranged on the semiconductor refrigeration plate, and is characterized in that: The heat conduction system further includes a source bottle fixing cylinder, which is located directly above the source bottle base and surrounds at least a portion of the source bottle.
2. A chemical precursor cooling and constant temperature device according to claim 1, characterized in that: The source bottle is provided with a temperature measuring thermocouple.
3. The chemical precursor cooling and constant temperature device according to claim 2, characterized in that: The control system includes a control base and a switch and a display panel arranged on the base; the temperature measuring thermocouple is connected to the control system.
4. The chemical precursor cooling and constant temperature device according to claim 1, characterized in that: The heat dissipation system includes a heat dissipation fan and a heat sink. The heat sink is arranged directly above the heat dissipation fan, and the semiconductor refrigeration sheet is arranged directly above the heat sink.
5. The chemical precursor cooling and constant temperature device according to claim 4, characterized in that: It also includes a support column and a fixing nut. The bottom of the heat dissipation fan is provided with a through hole, and the upper end of the support column is provided with a screw rod. The screw rod passes through the through hole and is threadedly connected with the fixing nut.
6. The chemical precursor cooling and constant temperature device according to claim 1, characterized in that: The inner diameter of the source bottle fixing cylinder is greater than or equal to the outer diameter of the source bottle.
7. The chemical precursor cooling and constant temperature device according to claim 1, characterized in that: The position of the source bottle fixing cylinder surrounding the source bottle corresponds to the position of the chemical precursor in the source bottle, and the height of the source bottle fixing cylinder is greater than or equal to the filling height of the chemical precursor in the source bottle.
8. The chemical precursor cooling and constant temperature device according to claim 1, characterized in that: The entire bottom surface of the source bottle fixing cylinder contacts the top surface of the source bottle bottom support.
9. The chemical precursor cooling and constant temperature device according to claim 1, characterized in that: The entire bottom surface of the source bottle base is in contact with the semiconductor refrigeration plate.
10. The chemical precursor cooling and constant temperature device according to claim 1, characterized in that: The control system is a PID cooling temperature controller.