Wafer spraying arm cleaning device

Abstract

The utility model provides a wafer spraying arm cleaning device which comprises a spraying piece used for spraying downwards, the spraying piece is located above a wafer supporting mechanism of wafer spraying equipment, and the spraying range of the spraying piece does not exceed the working range of a liquid classification recycling and discharging mechanism below the wafer supporting mechanism. The wafer spraying arm cleaning device can clean the spraying arm, so that process liquid water mist attached to the surfaces of the spraying arm and the wafer spraying arm can be cleaned in time.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor cleaning, and in particular relates to a wafer spray arm cleaning device. Background Art

[0002] If the wafer is contaminated by dust particles or metal during the manufacturing process, it can easily damage the internal circuit function of the chip, causing short circuits or open circuits, leading to failure of the integrated circuit. Therefore, in addition to eliminating external sources of contamination, the wafer must be cleaned using wafer spray equipment before processes such as high-temperature diffusion and ion implantation.

[0003] When cleaning wafers, the clean water nozzle and process liquid nozzle on the spray arm spray clean water and process liquid onto the wafer respectively. The sprayed process liquid will splash and adhere to the spray arm. After multiple process accumulations, the process liquid on the spray arm will form droplets, and there is a risk of dripping. For example, during the clean water spraying stage, if droplets drip at this time, there is a risk of contamination, and crystals may form on the spray arm over time. The crystal particles may fall onto the wafer, affecting the wafer yield.

[0004] There is currently no corresponding device for cleaning the spray arms. Utility Model Content

[0005] Based on this, in order to solve the above technical problems, a wafer spray arm cleaning device is provided.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0007] A wafer spray arm cleaning device is characterized in that it includes a spray part for spraying downwards, wherein the spray part is located above the wafer support mechanism of the wafer spray equipment, and its spraying range does not exceed the working range of the liquid classification, recovery and discharge mechanism below the wafer support mechanism.

[0008] The wafer spray arm cleaning device of the utility model can clean the spray arm, thereby timely cleaning the process liquid mist attached to the surfaces of the two arms. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a schematic diagram of the bottom-up structure of the present invention;

[0010] Figure 2 This is a schematic diagram of the application environment of the present utility model. DETAILED DESCRIPTION

[0011] The following will illustrate the implementation of the present utility model in conjunction with the drawings in the specification. It should be noted that the implementation methods involved in this specification are not exhaustive and do not represent the only implementation methods of the present utility model. The following corresponding embodiments are only for the purpose of clearly illustrating the utility model content of the utility model patent and are not intended to limit its implementation methods. For ordinary technicians in this field, different forms of changes and modifications can be made on the basis of the description of this embodiment. All obvious changes or modifications that belong to the technical concept and utility model content of the present utility model are also within the scope of protection of the present utility model.

[0012] Figure 2 The application environment of the embodiment of the present application is shown. Among them, the wafer spraying equipment includes a wafer support mechanism (not shown in the figure), an FFU (Fan Filter Unit) fan filter unit 21, a liquid classification recovery and discharge mechanism 22, a spray arm 23 and a process arm 24. The wafer support mechanism is located in the process area, the FFU fan filter unit 21 is located above the wafer support mechanism and is used to provide clean air, the liquid classification recovery and discharge mechanism 22 is located below the wafer support mechanism and is used to classify, recover and discharge process waste liquid, the spray arm 23 has nozzles 23a (clean water nozzle and process liquid nozzle) on it, which are used to spray clean water and process liquid respectively onto the wafers on the wafer support mechanism, and the process arm 24 is used to implement other processes, which are not specifically limited here.

[0013] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides a wafer spray arm cleaning device, including a spray member 1210 for spraying downward, the spray member 1210 is located above the wafer support mechanism, and its spraying range does not exceed the working range of the liquid classification, recovery and discharge mechanism 22 below the wafer support mechanism.

[0014] The spraying element 1210 is formed by a horizontally coiled tube, and the lower side of the tube has a plurality of spray holes 1211 arranged evenly at intervals. Figure 1 .

[0015] In this embodiment, the tube body is fixed to the grid air outlet of the FFU fan filter unit 21 through the support frame 1220, see Figure 2 .

[0016] Specifically, if Figure 1 As shown, the support frame 1220 includes four horizontal support rods 1221.

[0017] One ends of the four support rods 1221 are connected to each other in a cross shape. The lower side of each support rod 1221 has a plurality of first grooves evenly spaced along its length, and the horizontally coiled tube body is fixed in the plurality of first grooves.

[0018] The lower side of the other end of each support rod 1221 has a second groove 1221a, and the second groove 1221a has a through hole in the up and down directions. The support frame 1220 is fixed to the grid air outlet by screws passing through the above-mentioned through holes.

[0019] After the wafer spraying is completed, the spray arm 23 remains above the wafer support mechanism, and the spray part 1210 sprays clean water to the spray arm 23 to clean it, remove the process liquid mist attached to it, and clean the falling waste liquid into the liquid classification recovery and discharge mechanism 22.

[0020] From the above, it can be seen that the wafer spray arm cleaning device provided in the embodiment of the present application can clean the spray arm, thereby timely cleaning off the process liquid mist attached to the surfaces of both.

[0021] Obviously, those skilled in the art should realize that the above embodiments are only used to illustrate the present invention and are not used to limit the present invention. As long as they are within the spirit of the present invention, any changes or modifications to the above embodiments will fall within the scope of the claims of the present invention.

Claims

1. A wafer spray arm cleaning device, characterized in that: It includes a spraying part for spraying downwards, which is located above the wafer supporting mechanism of the wafer spraying equipment, and its spraying range does not exceed the working range of the liquid classification, recovery and discharge mechanism below the wafer supporting mechanism.

2. A wafer spray arm cleaning device according to claim 1, characterized in that: The spraying element is formed by a horizontally coiled tube body, and the lower side circumference of the tube body is provided with a plurality of spraying holes arranged at even intervals.

3. The wafer spray arm cleaning device according to claim 2, characterized in that: The tube body is fixed to the grid air outlet of the FFU fan filter unit of the wafer spraying equipment through a support frame.

4. The wafer spray arm cleaning device according to claim 3, characterized in that: The support frame includes four horizontal support rods, one ends of which are connected to each other in a cross shape, the lower side of the support rod has a plurality of first grooves evenly spaced along its length, the horizontally coiled tube body is fixed in the plurality of first grooves, the support rod has through holes in the upper and lower directions, and the support frame is fixed to the grille air outlet by screws passing through the through holes.

5. The wafer spray arm cleaning device according to claim 4, characterized in that: The lower side of the other end of the support rod has a second groove, and the through hole is arranged in the second groove.

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