Heat dissipation structure and VR equipment
By using liquid water as the heat transfer medium in VR equipment and combining S-shaped heat conducting plates with the heat dissipation structure of the acceleration component, the problems of poor heat dissipation and short service life of VR equipment are solved, and efficient heat dissipation and convenient maintenance are achieved.
Patent Information
- Application Number
- CN202422506486.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-16
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2034-10-16
AI Technical Summary
The heat dissipation structure of existing VR devices is easily damaged after long-term use, resulting in poor heat dissipation effect and shortening the service life of the device.
The heat sink uses liquid water as the heat conducting medium, and is equipped with an S-shaped heat conducting sheet and an acceleration component inside, including a fan, an inner ring plate and an outer ring plate. Through the flow of the heat conducting medium and the cooperation of the acceleration component, it quickly absorbs and conducts heat, and is sealed and replaced using thermal conductive silicone seals and a removable cover structure.
The heat dissipation efficiency of VR equipment is improved, the service life of the equipment is extended, and the maintenance of the heat dissipation structure and the replacement of parts are facilitated.
Smart Images
Figure CN223364427U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of VR equipment, in particular to a heat dissipation structure and VR equipment. Background Art
[0002] In VR devices, heat dissipation is particularly critical due to the integration of high-performance processors, displays, and other components. The heat dissipation structure is an indispensable part of electronic devices. It is mainly used to effectively dissipate the heat generated inside the device to the external environment to ensure the normal operation of the device and extend its service life.
[0003] Existing heat dissipation structures and VR devices often have heat-conducting elements, such as graphite heat dissipation films or metal heat sinks, on the edges of the VR glasses. These absorb and conduct heat through close contact with the internal heating elements through thermal interface materials. Common direct contact easily reduces the contact surface of the VR device, making it prone to damage after long-term operation, resulting in poor heat dissipation effects and a reduced service life of the VR device.
[0004] To this end, the present invention proposes a heat dissipation structure and VR equipment to solve the above-mentioned problems. Utility Model Content
[0005] The purpose of the present invention is to provide a heat dissipation structure and VR equipment to solve the problems raised in the above background technology.
[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a heat dissipation structure, which includes: a heat dissipation box, a heat-conducting medium is placed inside the heat dissipation box, the heat-conducting medium is liquid water, a plurality of heat-conducting plates are installed inside the heat dissipation box, and the heat-conducting plates are evenly distributed in an S-shape inside the heat dissipation box. A placement groove is opened in the center of the heat-conducting plate, a fixing rod is installed in the inner center of the placement groove, a card slot is opened in the top center of the fixing rod, and an acceleration component is installed on the outer surface of the fixing rod.
[0007] Preferably, the acceleration component includes a fan, which is located on the outer surface of the fixed rod. An inner ring plate is movably mounted on the outer surface of the fan, and an outer ring plate is movably mounted on the outer surface of the inner ring plate.
[0008] Preferably, the side walls of the inner ring plate and the outer ring plate are provided with a plurality of holes and slots, which are of uniform size and are evenly distributed in an array on the outer surfaces of the inner ring plate and the outer ring plate.
[0009] Preferably, a heat sink is installed on the top of the heat sink, and a thermally conductive silica gel is installed on the bottom of the heat sink. The thermally conductive silica gel is S-shaped and fits the size of the thermal conductive sheet.
[0010] Preferably, a hole is provided at the top center of the heat dissipation plate, a cover plate is installed inside the hole, and a knob is installed through the top center of the cover plate.
[0011] Preferably, an insert block is installed on the bottom side wall of the knob, the insert blocks are symmetrically placed, and the insert blocks are located inside the card slot.
[0012] Preferably, a spring is installed at the bottom of the cover plate, and a clamping block is installed at the bottom of the spring. The clamping blocks are located on both sides of the inserting block and penetrate into the interior of the clamping slot.
[0013] A VR device comprises the heat dissipation structure.
[0014] Compared with the prior art, the beneficial effects of the present invention are:
[0015] The heat dissipation structure proposed by the utility model utilizes a heat conducting sheet, a heat conducting medium and an acceleration component to cooperate with each other. The heat conducting sheet increases the heat conducting surface and quickly absorbs and conducts the heat generated inside the VR device through the flowing heat conducting medium. The S-shaped heat conducting sheet facilitates the flow of the heat conducting medium, and the placement groove inside facilitates the placement and use of the acceleration component. The acceleration component facilitates the rapid flow of the heat conducting medium inside the heat dissipation box, thereby accelerating the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;
[0017] Figure 2 This is a schematic diagram of the three-dimensional structure of the heat dissipation box of the present utility model;
[0018] Figure 3 This is a schematic diagram of the three-dimensional structure of the heat dissipation plate of the present invention;
[0019] Figure 4 This is a schematic diagram of the three-dimensional structure of the acceleration component of the present utility model;
[0020] Figure 5 It is a schematic diagram of the three-dimensional structure of the cover plate of the present invention.
[0021] In the figure: 1. Heat sink; 2. Heat sink; 3. Thermal medium; 4. Fixing rod; 5. Thermal conductive sheet; 6. Placement slot; 7. Card slot; 8. Accelerator assembly; 9. Fan; 10. Inner ring plate; 11. Outer ring plate; 12. Hole slot; 13. Thermal conductive silicone; 14. Hole; 15. Cover; 16. Knob; 17. Insert block; 18. Spring; 19. Card block. DETAILED DESCRIPTION
[0022] In order to clearly and completely describe the purpose and technical solution of the present invention and make its advantages more clearly understood, the following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only part of the embodiments of the present invention, not all of them, and are only used to explain the embodiments of the present invention and are not intended to limit the embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0023] Example 1
[0024] See also Figure 1-Figure 5 The utility model provides a technical solution: a heat dissipation structure, comprising: a heat dissipation box 1, a heat conducting medium 3 is placed inside the heat dissipation box 1, the heat conducting medium 3 is liquid water, a plurality of heat conducting sheets 5 are installed inside the heat dissipation box 1, the heat conducting sheets 5 are evenly distributed in an S-shape inside the heat dissipation box 1, a placement groove 6 is opened in the center of the heat conducting sheet 5, a fixing rod 4 is installed in the center of the placement groove 6, a card slot 7 is opened in the top center of the fixing rod 4, and an acceleration component 8 is installed on the outer surface of the fixing rod 4;
[0025] When in use, the heat conducting sheet 5 inside the heat dissipation box 1 increases the heat conducting surface and the flowing heat conducting medium 3 is used to quickly absorb and conduct the heat generated inside the VR device. The S-shaped heat conducting sheet 5 facilitates the flow of the heat conducting medium 3, and the placement groove 6 facilitates the placement and use of the acceleration component 8. The acceleration component 8 facilitates the rapid flow of the heat conducting medium 3 inside the heat dissipation box 1, thereby accelerating the heat dissipation effect.
[0026] Example 2
[0027] On the basis of the first embodiment, in order to facilitate the acceleration component 8 to accelerate the rapid flow of the heat-conducting medium 3 inside the heat dissipation box 1 and accelerate the heat dissipation effect, the acceleration component 8 includes a fan 9, the fan 9 is located on the outer surface of the fixed rod 4, the outer surface of the fan 9 is movably mounted with an inner ring plate 10, the outer surface of the inner ring plate 10 is movably mounted with an outer ring plate 11, and the side walls of the inner ring plate 10 and the outer ring plate 11 are provided with a plurality of holes 12, the hole grooves 12 are of the same size and are evenly distributed in an array on the outer surfaces of the inner ring plate 10 and the outer ring plate 11;
[0028] During use, the rotation of the inner ring plate 10 and the outer ring plate 11 can change the size of the gap between the holes 12, so that when the fan 9 rotates, the circulation speed of the heat-conducting medium 3 can be controlled. When the holes 12 of the inner ring plate 10 and the outer ring plate 11 are closed, it is convenient to disassemble and replace the fan 9 while preventing the heat-conducting medium 3 from flowing out.
[0029] Example 3
[0030] On the basis of the second embodiment, in order to facilitate the sealing of the heat dissipation box 1 and the replacement of the internal structure of the heat dissipation box 1, a heat dissipation plate 2 is installed on the top of the heat dissipation box 1, and a thermally conductive silicone rubber 13 is installed on the bottom of the heat dissipation plate 2. The thermally conductive silicone rubber 13 is S-shaped and fits the size of the thermal conductive sheet 5. A hole 14 is opened at the top center of the heat dissipation plate 2, and a cover plate 15 is installed inside the hole 14. A knob 16 is installed through the top center of the cover plate 15, and an insert 17 is installed on the bottom side wall of the knob 16. The insert 17 is symmetrically placed and is located inside the card slot 7. A spring 18 is installed at the bottom of the cover plate 15, and a card block 19 is installed at the bottom of the spring 18. The card block 19 is located on both sides of the insert block 17 and penetrates into the interior of the card slot 7;
[0031] During use, the thermally conductive silicone 13 seals the thermally conductive medium 3 inside the thermally conductive sheet 5, and the cover 15 places the insert block 17 inside the card slot 7 through the knob 16. The knob 16 is turned to rotate the insert block 17 to the inside of the card slot 7. Under the action of the spring 18 providing a downward thrust to the card block 19, the card block 19 fixes the insert block 17.
[0032] In actual use, the heat conducting surface is increased by the heat conducting sheet 5 inside the heat dissipation box 1 and the heat conducting medium 3 is flowed to quickly absorb and conduct the heat generated inside the VR device. The S-shaped heat conducting sheet 5 facilitates the flow of the heat conducting medium 3. The placement groove 6 is convenient for the placement and use of the acceleration component 8. The acceleration component 8 facilitates the rapid flow of the heat conducting medium 3 inside the heat dissipation box 1. The size of the gap between the hole groove 12 can be changed by rotating the inner ring plate 10 and the outer ring plate 11, which is convenient for the fan 9 to rotate. The circulation speed of the heat conducting medium 3 can be controlled. When the inner ring plate 10 and the outer ring plate 11 are rotated, the heat conducting medium 3 can be controlled. When the hole slot 12 of the plate 11 is closed, it is convenient to disassemble and replace the fan 9 while preventing the heat-conducting medium 3 from flowing out. The thermal silica gel 13 seals the heat-conducting medium 3 inside the thermal conductive sheet 5. The cover plate 15 places the plug 17 inside the slot 7 through the knob 16. The knob 16 is turned to rotate the plug 17 to the inside of the slot 7. Under the action of the spring 18 providing a downward thrust to the block 19, the block 19 fixes the plug 17. The block 19 can be easily pushed out through the side wall of the block 17, making it easy to remove the cover plate 15 and facilitate the disassembly and replacement of internal parts.
[0033] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A heat dissipation structure, characterized in that: The heat dissipation structure comprises: a heat dissipation box (1), a heat conducting medium (3) is placed inside the heat dissipation box (1), the heat conducting medium (3) is liquid water, a plurality of heat conducting plates (5) are installed inside the heat dissipation box (1), the heat conducting plates (5) are evenly distributed in an S-shape inside the heat dissipation box (1), a placement groove (6) is opened at the center of the heat conducting plate (5), a fixing rod (4) is installed at the center of the placement groove (6), a clamping groove (7) is opened at the center of the top of the fixing rod (4), and an acceleration component (8) is installed on the outer surface of the fixing rod (4).
2. A heat dissipation structure according to claim 1, characterized in that: The acceleration component (8) includes a fan (9), which is located on the outer surface of the fixed rod (4), an inner ring plate (10) is movably mounted on the outer surface of the fan (9), and an outer ring plate (11) is movably mounted on the outer surface of the inner ring plate (10).
3. The heat dissipation structure according to claim 2, characterized in that: The side walls of the inner ring plate (10) and the outer ring plate (11) are provided with a plurality of holes (12), and the holes (12) are of uniform size and are evenly distributed in an array on the outer surfaces of the inner ring plate (10) and the outer ring plate (11).
4. The heat dissipation structure according to claim 1, wherein: A heat dissipation plate (2) is installed on the top of the heat dissipation box (1), and a heat-conducting silica gel (13) is installed on the bottom of the heat dissipation plate (2). The heat-conducting silica gel (13) is S-shaped and fits the size of the heat-conducting sheet (5).
5. The heat dissipation structure according to claim 4, characterized in that: A hole (14) is provided at the top center of the heat dissipation plate (2), a cover plate (15) is installed inside the hole (14), and a knob (16) is installed through the top center of the cover plate (15).
6. The heat dissipation structure according to claim 5, characterized in that: The bottom side wall of the knob (16) is provided with an inserting block (17), which is symmetrically placed and located inside the card slot (7).
7. The heat dissipation structure according to claim 5, characterized in that: A spring (18) is installed at the bottom of the cover plate (15), and a clamping block (19) is installed at the bottom of the spring (18). The clamping blocks (19) are located on both sides of the inserting block (17) and penetrate into the interior of the clamping slot (7).
8. A VR device, characterized in that: The heat dissipation structure comprises the heat dissipation structure described in any one of claims 1 to 7.