Device for cleaning spray nozzle

Abstract

Aiming at the problems of incomplete cleaning and lower efficiency of the existing cleaning device, the utility model provides a device for cleaning a spray nozzle, which comprises a liquid container with an open upper side, and a vertical partition plate is arranged in an inner cavity of the liquid container to form a nozzle cleaning inner groove and an overflow outer groove. The upper portion of the partition plate is provided with an overflow portion allowing liquid to overflow from the nozzle cleaning inner groove to the overflow outer groove, the nozzle cleaning inner groove is provided with a water inlet and a water outlet, the overflow outer groove is provided with an overflow water outlet, and flowing water (flowing purified water) is formed through the nozzle cleaning inner groove and the overflow outer groove. Process liquid water mist attached to the surface of the nozzle is cleaned by running water, the cleaning effect is good, and the efficiency is high.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor cleaning, and in particular relates to a device for cleaning a spray nozzle. Background Art

[0002] If the wafer is contaminated by dust particles or metal during the manufacturing process, it can easily damage the internal circuit function of the chip, causing short circuits or open circuits, leading to failure of the integrated circuit. Therefore, in addition to eliminating external sources of contamination, the wafer must be cleaned using wafer spray equipment before processes such as high-temperature diffusion and ion implantation.

[0003] When cleaning the wafer, the spray nozzles (clean water nozzle and process liquid nozzle) on the spray arm of the wafer spray equipment spray clean water and process liquid onto the wafer respectively. Among them, the process liquid nozzle is in the form of a spray, and a small amount of process liquid will splash and adhere to the two nozzles in a single spraying. This is not a problem in itself. The problem is that after the two nozzles have accumulated through multiple processes, the process liquid on them will form droplets, and there is a risk of dripping. For example, in the clean water spraying stage, if droplets drip at this time, there is a risk of contamination, and crystals may form on the nozzles over time. The crystal particles may fall onto the wafer, affecting the wafer yield.

[0004] At present, a cleaning device is often used to clean the spray nozzle. The existing cleaning device is only a container filled with clean water. During cleaning, the spray nozzle is immersed in the clean water in the container. Since the clean water in the container is stagnant water, the cleaning is not thorough. In order to improve the cleaning effect, the water needs to be changed frequently, which is inefficient. Utility Model Content

[0005] Based on this, in order to solve the above technical problems, a device for cleaning a spray nozzle is provided.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0007] A device for cleaning a spray nozzle comprises a liquid container with an open upper side, characterized in that the inner cavity of the liquid container has a vertical partition to form an inner nozzle cleaning tank and an outer overflow tank, the upper part of the partition has an overflow portion for liquid to overflow from the inner nozzle cleaning tank to the outer overflow tank, the inner nozzle cleaning tank has a water inlet and a drain outlet, and the overflow outer tank has an overflow drain outlet.

[0008] The utility model does not clean the nozzle by soaking in dead water as in the prior art, but forms live water (flowing clean water) through the nozzle cleaning inner tank and overflow outer tank, and uses the live water to clean the process liquid mist attached to the nozzle surface, with good cleaning effect and high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1It is a structural diagram of the utility model;

[0010] Figure 2 This is a schematic diagram of the application environment of the present utility model. DETAILED DESCRIPTION

[0011] The following will illustrate the implementation of the present utility model in conjunction with the drawings in the specification. It should be noted that the implementation methods involved in this specification are not exhaustive and do not represent the only implementation methods of the present utility model. The following corresponding embodiments are only for the purpose of clearly illustrating the utility model content of the utility model patent and are not intended to limit its implementation methods. For ordinary technicians in this field, different forms of changes and modifications can be made on the basis of the description of this embodiment. All obvious changes or modifications that belong to the technical concept and utility model content of the present utility model are also within the scope of protection of the present utility model.

[0012] Figure 2 The application environment of the embodiment of the present application is shown. Among them, the wafer spraying equipment includes a wafer support mechanism (not shown in the figure), an FFU (Fan Filter Unit) fan filter unit 21, a liquid classification recovery and discharge mechanism 22, a spray arm 23 and a process arm 24. The wafer support mechanism is located in the process area, the FFU fan filter unit 21 is located above the wafer support mechanism and is used to provide clean air, the liquid classification recovery and discharge mechanism 22 is located below the wafer support mechanism and is used to classify, recover and discharge process waste liquid, the spray arm 23 has a spray nozzle 23a (a clean water nozzle and a process liquid nozzle) for spraying clean water and process liquid onto the wafer on the wafer support mechanism, respectively, and the process arm 24 is used to implement other processes, which are not specifically limited here.

[0013] like Figure 1 As shown, an embodiment of the present application provides a device for cleaning a spray nozzle, comprising a liquid container 1110 with an open upper side.

[0014] like Figure 2 As shown, the liquid container 1110 is arranged outside the wafer spraying equipment, and its inner cavity has a vertical partition 1111. The inner cavity of the liquid container 1110 is divided by the partition 1111 to form a nozzle cleaning inner tank 1112 and an overflow outer tank 1113. Figure 1 .

[0015] The upper portion of the partition 1111 has an overflow portion for allowing liquid to overflow from the nozzle cleaning inner tank 1112 to the overflow outer tank 1113.

[0016] In this embodiment, the upper edge of the partition 1111 serves as an overflow portion, which is lower than the edge of the upper opening of the liquid container 1110. When the water level in the nozzle cleaning inner tank 1112 is higher than the upper edge of the partition 1111, the liquid in the nozzle cleaning inner tank 1112 naturally overflows into the overflow outer tank 1113. Of course, an opening in the partition 1111 can also serve as an overflow portion.

[0017] Among them, the upper edge of the partition 1111 forms a tooth-like structure 1111a, which can easily break the tension of water, accelerate the occurrence of overflow, and improve the cleaning effect. On the contrary, if the upper edge of the partition 1111 is flat, the water level needs to reach a higher height to break the tension.

[0018] The nozzle cleaning inner tank 1112 has a water inlet 1112a and a drain 1112b. To prevent incomplete drainage, the drain 1112b is located at the bottom of the nozzle cleaning inner tank 1112. In this embodiment, the lower portion of the nozzle cleaning inner tank 1112 forms a downwardly extending water inlet and outlet pipe 1114. The water inlet 1112a is located at the upper portion of the water inlet and outlet pipe 1114, and the drain 1112b is located at the lower end of the water inlet and outlet pipe 1114.

[0019] The bottom of the overflow outer tank 1113 has an overflow drain port 1113a.

[0020] When cleaning the spray nozzle 23a on the spray arm 23, close the drain outlet 1112b, and continuously supply clean water to the nozzle cleaning inner tank 1112 through the water inlet 1112a, so that the clean water continuously overflows to the overflow outer tank 1113, forming a flow of clean water. At the same time, the spray arm 23 moves the nozzle 23a to the slot of the nozzle cleaning inner tank 1112, so that the nozzle 23a is immersed in the clean water, and the flowing clean water removes the process liquid mist attached to the nozzle 23a.

[0021] The purified water in the overflow outer tank 1113 is discharged from the overflow drain port 1113a.

[0022] The liquid container 1110 has an upward extending splash shield 1115 on its peripheral surface. The nozzle 23a on the spray arm 23 will briefly spray liquid for a few seconds at the origin position (where the liquid container 1110 is located) before officially spraying liquid. The splash shield 1115 can prevent the process liquid from splashing into the process area of ​​the wafer spraying equipment.

[0023] From the above, it can be seen that the device for cleaning the spray nozzle provided in the embodiment of the present application does not clean the nozzle by immersing it in dead water as in the prior art, but forms living water (flowing clean water) through the nozzle cleaning inner tank and the overflow outer tank, and the living water washes away the process liquid mist attached to the nozzle surface, with good cleaning effect and high efficiency.

[0024] Obviously, those skilled in the art should realize that the above embodiments are only used to illustrate the present invention and are not used to limit the present invention. As long as they are within the spirit of the present invention, any changes or modifications to the above embodiments will fall within the scope of the claims of the present invention.

Claims

1. A device for cleaning a spray nozzle, comprising a liquid container with an open upper side, characterized in that: The inner cavity of the liquid container has a vertical partition, forming a nozzle cleaning inner tank and an overflow outer tank. The upper part of the partition has an overflow portion for liquid to overflow from the nozzle cleaning inner tank to the overflow outer tank. The nozzle cleaning inner tank has a water inlet and a drain outlet, and the overflow outer tank has an overflow drain outlet.

2. A device for cleaning a spray nozzle according to claim 1, characterized in that: The upper edge of the partition is the overflow portion, which is lower than the edge of the upper opening of the liquid container.

3. A device for cleaning a spray nozzle according to claim 2, characterized in that: The upper edge of the partition forms a tooth-like structure.

4. The device for cleaning a spray nozzle according to claim 1, characterized in that: The drain outlet is located at the bottom of the nozzle cleaning inner tank, and the overflow drain outlet is located at the bottom of the overflow outer tank.

5. A device for cleaning a spray nozzle according to claim 4, characterized in that: The lower part of the nozzle cleaning inner tank forms an inlet and outlet water pipe extending downward, and the water inlet and the drain are located on the inlet and outlet water pipe.

6. The device for cleaning a spray nozzle according to claim 5, characterized in that: The water inlet is located at the upper part of the water inlet and outlet pipes, and the drain outlet is located at the lower end of the water inlet and outlet pipes.

7. The device for cleaning a spray nozzle according to claim 1, characterized in that: The liquid container has an upwardly extending splash shield on its circumference.

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