Semiconductor workpiece cleaning equipment with air drying function

Abstract

The utility model relates to the technical field of semiconductor production, in particular to semiconductor workpiece cleaning equipment with an air drying function. A sound wave generating device is installed in the cleaning pool, a lifting driving cylinder is installed above the cleaning pool, a telescopic rod of the lifting driving cylinder is connected with a cleaning frame, a storage pool is arranged behind the cleaning pool, cleaning liquid is contained in the storage pool and the cleaning pool, a filtering device is connected between the storage pool and the cleaning pool, and a fixing table is arranged above the cleaning pool. The fixing table is located over the cleaning frame, a spraying device and an air drying device are arranged in the fixing table, a multiple liquid supply assembly is connected to the spraying device, and a sewage collecting device is arranged on the side of the cleaning pool. According to the cleaning device, cleaning liquid can be circularly filtered and used, so that the purity of the cleaning liquid is guaranteed; the cleaning equipment integrates multiple functions, the equipment cost is reduced, the semiconductor does not need to be transferred in the cleaning process, and the production efficiency is high.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to semiconductor workpiece cleaning equipment with an air drying function. Background Art

[0002] With the rapid development of the semiconductor industry, the requirements for cleaning processes are becoming increasingly stringent. Semiconductor workpieces are susceptible to contamination from particles, oil, and chemical residues during production and processing. These contaminants can significantly impact device performance and yield. Existing cleaning equipment requires multiple independent processes, resulting in high costs and low production efficiency due to the need for semiconductor transfer and handling. Furthermore, some production lines use manual wiping to remove moisture during semiconductor workpiece cleaning. The tiny surface irregularities of semiconductor workpieces make it easy for moisture to remain. Furthermore, dust particles or other impurities remaining on the workpiece surface or on the clean cloth during wiping can easily damage the workpiece. Utility Model Content

[0003] The purpose of the present invention is to provide a semiconductor workpiece cleaning device with a reasonably designed air-drying function to address the defects and shortcomings of the prior art, which can solve the above-mentioned defects.

[0004] To achieve the above-mentioned purpose, the utility model adopts the following technical solutions: it includes a cleaning pool, an acoustic wave generating device is installed in the cleaning pool, a lifting drive cylinder is installed above the cleaning pool, the telescopic rod of the lifting drive cylinder is connected to the cleaning frame, a storage tank is provided behind the cleaning pool, both the storage tank and the cleaning pool are filled with cleaning liquid, a filtering device is connected between the storage tank and the cleaning pool, a fixed platform is provided above the cleaning pool, the fixed platform is located directly above the cleaning frame, a spraying device and an air-drying device are provided in the fixed platform, multiple liquid supply components are connected to the spraying device, and a sewage collection device is provided on the side of the cleaning pool.

[0005] Preferably, the filtering device includes a filter arranged at the rear side of the cleaning pool, a sewage pump is provided at the rear side of the cleaning pool, a sewage pipe is connected to the bottom of the cleaning pool, the sewage pipe is connected to the inlet end of the filter after passing through the sewage pump, and the outlet end of the filter is connected to the storage tank through a water delivery pipe.

[0006] Preferably, the multiple liquid supply assembly includes an upper liquid pump installed on the storage tank, the water outlet end of the upper liquid pump is connected to the switching valve located behind the cleaning tank through the upper liquid pipe, the switching valve is a three-way ball valve, one water inlet end of the switching valve is connected to the upper liquid pipe, the other water inlet end of the switching valve is connected to a pure water pipe, the pure water pipe is connected to an external pure water supply equipment, and the water outlet end of the switching valve is connected to the spraying device through the front water supply pipe.

[0007] Preferably, the spray device includes an annular water supply pipe installed above the fixed platform, the front water supply pipe is connected to the annular water supply pipe, and a plurality of spray heads are evenly arranged at the bottom of the annular water supply pipe facing downward, and the spray heads are all arranged through the fixed platform.

[0008] Preferably, the air-drying device includes a plurality of air holes opened on a fixed platform, fans are installed above the air holes correspondingly, and a plurality of heating tubes are evenly installed in the air holes.

[0009] Preferably, the sewage collection device includes a fixed frame arranged on the side of the cleaning pool, on which several waste discharge drive cylinders are installed, the telescopic rods of the waste discharge drive cylinders are connected to a water receiving frame, and one side of the water receiving frame is connected to a wastewater pipe.

[0010] Preferably, liquid level gauges are installed in both the cleaning tank and the storage tank.

[0011] Preferably, a plurality of card strips are provided in the cleaning frame.

[0012] After adopting the above structure, the beneficial effects of the utility model are:

[0013] 1. This cleaning equipment uses fans and heating tubes to dry the cleaned semiconductors with hot air. The airflow can blow the water on the surface of the semiconductor and discharge it through the waste water pipe. The remaining water is then dried to ensure that the semiconductor workpiece is dry without causing damage to the workpiece.

[0014] 2. This cleaning equipment is equipped with a filtering device, multiple liquid supply components and a spraying device, which can filter and use the cleaning liquid in a circular manner, thereby ensuring the purity of the cleaning liquid. A certain amount of cleaning liquid is stored in the storage tank, which is used as a reserve to ensure that there is sufficient cleaning liquid in the cleaning tank.

[0015] 3. After using ultrasonic cleaning on the semiconductor, this cleaning equipment can also use cleaning liquid to spray the semiconductor to further remove attached pollutants, and then rinse with pure water and air-dry. It integrates multiple functions in one, reduces equipment costs, and there is no need to transfer the semiconductor during the cleaning process, so the production efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the front structure of the utility model;

[0017] Figure 2 yes Figure 1 Enlarged view of part A in the middle;

[0018] Figure 3 It is a schematic diagram of the rear structure of the utility model;

[0019] Figure 4 yes Figure 3Enlarged view of middle part B;

[0020] Figure 5 It is a schematic diagram of the bottom structure of the cleaning frame in the utility model.

[0021] Description of reference numerals:

[0022] 1. Cleaning tank; 2. Filter; 3. Storage tank; 4. Lifting drive cylinder; 5. Cleaning frame; 6. Clamping strip; 7. Fixed platform; 8. Liquid supply pump; 9. Liquid supply pipe; 10. Pure water pipe; 11. Switching valve; 12. Front water supply pipe; 13. Ring water supply pipe; 14. Sprinkler head; 15. Fan; 16. Air hole; 17. Heating pipe; 18. Sewage pipe; 19. Sewage pump; 20. Water delivery pipe; 21. Liquid level gauge; 22. Fixed frame; 23. Waste discharge drive cylinder; 24. Water receiving frame; 25. Wastewater pipe. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] See Figure 1-Figure 4 As shown, it includes a cleaning pool 1, in which an acoustic wave generating device is installed, a lifting drive cylinder 4 is installed above the cleaning pool 1, and the telescopic rod of the lifting drive cylinder 4 is connected to a cleaning frame 5. A storage pool 3 is provided at the rear of the cleaning pool 1, and both the storage pool 3 and the cleaning pool 1 are filled with cleaning liquid. A filtering device is connected between the storage pool 3 and the cleaning pool 1, and a fixed platform 7 is provided above the cleaning pool 1. The fixed platform 7 is located directly above the cleaning frame 5, and a spraying device and an air drying device are provided in the fixed platform 7. The spraying device is connected to multiple liquid supply components, and a sewage collection device is provided on the side of the cleaning pool 1.

[0025] See Figure 1-Figure 3 As shown, the filtering device includes a filter 2 arranged at the rear side of the cleaning tank 1, a sewage pump 19 is provided at the rear side of the cleaning tank 1, a sewage pipe 18 is connected to the bottom of the cleaning tank 1, the sewage pipe 18 is connected to the inlet end of the filter 2 through the sewage pump 19, and the outlet end of the filter 2 is connected to the storage tank 3 through the water delivery pipe 20.

[0026] As an optimization solution of the present invention, a sewage pump 19 is provided to extract the cleaning liquid containing pollutants from the bottom of the cleaning pool 1 through the sewage pipe 18, and then send it to the filter 2 for filtration. The filtered cleaning liquid is then sent from the water delivery pipe 20 to the storage pool 3 for storage.

[0027] See Figure 1-Figure 4 As shown, the multiple liquid supply assembly includes an upper liquid pump 8 installed on the storage tank 3. The water outlet of the upper liquid pump 8 is connected to the switching valve 11 provided at the rear of the cleaning tank 1 through the upper liquid pipe 9. The switching valve 11 is a three-way ball valve. One water inlet end of the switching valve 11 is connected to the upper liquid pipe 9, and the other water inlet end of the switching valve 11 is connected to a pure water pipe 10. The pure water pipe 10 is connected to an external pure water supply device. The water outlet of the switching valve 11 is connected to the spray device through the front water supply pipe 12.

[0028] As an optimization solution of the present invention, pure cleaning liquid can be drawn from the storage tank 3 through the upper liquid pump 8 and then sent into the upper liquid pipe 9. The switching valve 11 can control the pure water or cleaning liquid to enter the front water supply pipe 12 and the spraying device.

[0029] See Figure 1-Figure 5 As shown, the spraying device includes an annular water supply pipe 13 installed above the fixed platform 7, the front water supply pipe 12 is connected to the annular water supply pipe 13, and a number of spray heads 14 are evenly arranged at the bottom of the annular water supply pipe 13 facing downward, and the spray heads 14 are all set through the fixed platform 7.

[0030] As an optimized solution of the present invention, an annular water supply pipe 13 is provided to transport cleaning liquid or pure water, and delivers the cleaning liquid or pure water to the spray head 14 to spray downwards to spray and clean the semiconductor.

[0031] See Figure 1-Figure 5 As shown, the air drying device includes a plurality of air holes 16 opened on the fixing platform 7 , a fan 15 is installed above the air holes 16 , and a plurality of heating tubes 17 are evenly installed in the air holes 16 .

[0032] As an optimization solution of the present invention, a fan 15 is provided to blow air downward, and a heating tube 17 is used to heat the air, thereby achieving air drying of the semiconductor, and the air drying temperature can be controlled by power supply of the heating tube 17 .

[0033] See Figure 1-Figure 4 As shown, the sewage collection device includes a fixed frame 22 arranged on the side of the cleaning tank 1, and several waste discharge drive cylinders 23 are installed on the fixed frame 22. The telescopic rods of the waste discharge drive cylinders 23 are connected to the water receiving frame 24, and one side of the water receiving frame 24 is connected to the waste water pipe 25.

[0034] As an optimized solution of the present invention, the wastewater receiving frame 24 is extended by the wastewater driving cylinder 23 to receive the wastewater from the cleaning frame 5, or retracted so as not to affect the lifting of the cleaning frame 5, and the wastewater pipe 25 discharges the wastewater.

[0035] See Figure 1-Figure 4 As shown, liquid level meters 21 are installed in both the cleaning tank 1 and the storage tank 3 .

[0036] As an optimization solution of the present invention, a liquid level meter 21 is provided to facilitate the determination of the amount of cleaning liquid in the cleaning tank 1 and the storage tank 3 .

[0037] See Figure 1-Figure 2 As shown, a plurality of card strips 6 are provided in the cleaning frame 5 .

[0038] As an optimized solution of the present invention, the cleaning frame 5 is divided into a plurality of spaces by means of the clamping strips 6 , so that semiconductors can be placed in groups using dedicated containers without being scattered during the cleaning process.

[0039] The use process of this utility model:

[0040] During cleaning, first, the semiconductors are grouped into their respective dedicated containers, and then the containers are placed in the cleaning frame 5 in turn. The equipment can be started, and the lifting drive cylinder 4 is controlled to drive the cleaning frame 5 to descend, driving the semiconductors to be immersed in the cleaning liquid and cleaned by sound waves. After the preliminary cleaning, the cleaning frame 5 is controlled to rise, and then the upper liquid pump 8 is started to spray the pure cleaning liquid downward from the spray device to further rinse the semiconductor and reduce the residual pollutants. Then the switching valve 11 is operated to switch to the pure water pipe 10. At the same time, At this time, the waste discharge drive cylinder 23 extends, driving the water receiving frame 24 to move to the bottom of the cleaning frame 5, and pure water is sprayed out through the spray head 14 to rinse the semiconductor, flushing the residual cleaning liquid and pollutants. The generated mixed sewage is discharged through the water receiving frame 24 and the waste water pipe 25. After the rinsing is completed, the switching valve 11 is switched back to the end of the upper liquid pipe 9, and the upper liquid pump 8 is closed. The spray head 14 stops discharging water, the water receiving frame 24 is retracted, the fan 15 and the heating tube 17 are started, and the semiconductor is dried with hot air. Then the staff can take out the semiconductor;

[0041] The liquid level meter 21 can monitor the liquid level in real time to prevent the liquid level from being too low, and a certain amount of cleaning liquid is stored in the storage tank 3, which is used as a reserve to ensure the cleaning liquid reserves in the cleaning tank 1. When there are many pollutants in the cleaning liquid in the cleaning tank 1, the filtering device, multiple liquid supply components and spraying device can be started synchronously when the semiconductor is immersed in the cleaning liquid or the equipment is idle, and the cleaning liquid is circulated and filtered to ensure the purity of the cleaning liquid.

[0042] It should be understood that the above-described specific embodiments of the present invention are merely illustrative of or explanation of the principles of the present invention and do not constitute limitations of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention shall be included within the scope of protection of the present invention. In addition, the appended claims of the present invention are intended to cover all changes and modifications that fall within the scope and metes and bounds of the appended claims, or equivalents of such scope and metes and bounds.

Claims

1. A semiconductor workpiece cleaning device with an air drying function, comprising a cleaning pool (1), an acoustic wave generating device installed in the cleaning pool (1), a lifting drive cylinder (4) installed above the cleaning pool (1), a telescopic rod of the lifting drive cylinder (4) connected to a cleaning frame (5), characterized in that: A storage tank (3) is provided at the rear of the cleaning tank (1), and cleaning liquid is contained in both the storage tank (3) and the cleaning tank (1). A filtering device is connected between the storage tank (3) and the cleaning tank (1). A fixed platform (7) is provided above the cleaning tank (1), and the fixed platform (7) is located directly above the cleaning frame (5). A spray device and an air drying device are provided in the fixed platform (7), and multiple liquid supply components are connected to the spray device. A sewage collection device is provided on the side of the cleaning tank (1).

2. The semiconductor workpiece cleaning equipment with air drying function according to claim 1, characterized in that: The filtering device comprises a filter (2) arranged at the rear side of a cleaning tank (1), a sewage pump (19) being provided at the rear side of the cleaning tank (1), a sewage pipe (18) being connected to the bottom of the cleaning tank (1), the sewage pipe (18) being connected to the inlet end of the filter (2) through the sewage pump (19), and the outlet end of the filter (2) being connected to the storage tank (3) through a water delivery pipe (20).

3. The semiconductor workpiece cleaning equipment with air drying function according to claim 2, characterized in that: The multiple liquid supply assembly includes an upper liquid pump (8) installed on the storage tank (3), the water outlet of the upper liquid pump (8) is connected to a switching valve (11) provided at the rear of the cleaning tank (1) through an upper liquid pipe (9), the switching valve (11) is a three-way ball valve, one water inlet of the switching valve (11) is connected to the upper liquid pipe (9), the other water inlet of the switching valve (11) is connected to a pure water pipe (10), the pure water pipe (10) is connected to an external pure water supply device, and the water outlet of the switching valve (11) is connected to the spray device through a front water supply pipe (12).

4. The semiconductor workpiece cleaning equipment with air drying function according to claim 3, characterized in that: The spraying device includes an annular water supply pipe (13) installed above the fixed platform (7), the front water supply pipe (12) is connected to the annular water supply pipe (13), and a plurality of spray heads (14) are evenly arranged at the bottom of the annular water supply pipe (13) facing downward, and the spray heads (14) are all arranged through the fixed platform (7).

5. The semiconductor workpiece cleaning equipment with air drying function according to claim 4, characterized in that: The air drying device comprises a plurality of air holes (16) opened on a fixing platform (7), a fan (15) is correspondingly installed above the air holes (16), and a plurality of heating tubes (17) are evenly installed in the air holes (16).

6. The semiconductor workpiece cleaning equipment with air drying function according to claim 5, characterized in that: The sewage collection device comprises a fixed frame (22) arranged on the side of the cleaning tank (1), a plurality of waste discharge drive cylinders (23) are installed on the fixed frame (22), the telescopic rods of the waste discharge drive cylinders (23) are connected to a water receiving frame (24), and one side of the water receiving frame (24) is connected to a wastewater pipe (25).

7. The semiconductor workpiece cleaning equipment with air drying function according to claim 6, characterized in that: Liquid level gauges (21) are installed in both the cleaning tank (1) and the storage tank (3).

8. The semiconductor workpiece cleaning equipment with air drying function according to claim 7, characterized in that: A plurality of clips (6) are provided in the cleaning frame (5).

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