Wafer scrap cleaning shovel for drainage channel of thinning machine

Abstract

The utility model relates to the technical field of semiconductor finish machining, in particular to a wafer scrap cleaning shovel for a drainage channel of a thinning machine. The cleaning shovel comprises a shovel body, and the shovel body comprises a plurality of permeable through holes. According to the cleaning shovel, waste water and chippings in the drainage groove of the thinning machine are separated through the permeable through holes, flowing waste water is left in the drainage groove and discharged along with a waste water pipeline, the thinning machine is maintained more conveniently, and the cleaning, using and managing cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor finishing, in particular to a wafer debris cleaning shovel for a thinning machine drainage trough. Background Art

[0002] Wafer processing within the thinning machine generates wafer debris and wastewater, which collect in the machine's drainage trough. Wafer debris deposited at the bottom of the trough for extended periods can clump and adhere to the trough, necessitating regular maintenance of the machine's drainage trough.

[0003] Existing tools for cleaning wafer debris rely on electric vacuum cleaners. Before cleaning, the vacuum cleaner must be moved near the wafer thinning machine, powered on, and connected to a suction hose. During the cleaning process, the appropriate suction port is selected based on the narrowness of the space within the machine. Because wastewater constantly flows through the wafer thinning machine's drainage trough, dust and water stains can enter the vacuum cleaner's motor during use, causing damage and shortening its lifespan. Furthermore, the vacuum cleaner needs to be stored and cleaned, increasing both operational and maintenance costs.

[0004] In summary, how to provide a wafer debris cleaning tool for the drain trough of a thinning machine that can effectively clean wafer debris and is not easy to damage, easy to operate, easy to store and clean, and low in cost is an issue that urgently needs to be solved. Utility Model Content

[0005] In order to address the deficiencies of the prior art, the present invention provides a wafer chip cleaning shovel for a thinning machine drain trough. The cleaning shovel is used to clean wafer chips at the bottom of the drain trough of the thinning machine. The shoveled wafer chips inevitably carry some wastewater with them, which is discharged through the water-permeable through-holes, thereby separating the shoveled wastewater from the chips. The separated wastewater remains in the drain trough and is discharged through the wastewater pipe, while the chips are removed. This makes it easier to maintain the thinning machine and saves cleaning, usage, and management costs.

[0006] The utility model provides a wafer debris cleaning shovel for a thinning machine drainage trough. The cleaning shovel comprises a shovel body. The shovel body is provided with a plurality of water-permeable through holes.

[0007] In a specific embodiment, a portion of the edge of the shovel body is formed with a shovel blade; another portion is formed with a protruding blocking edge; and the cleaning shovel is a stainless steel shovel.

[0008] In a more specific embodiment, the water-permeable through hole is arranged away from the cutting edge.

[0009] In a more specific embodiment, the edge of the cutting edge is arranged in a straight line.

[0010] In a more specific embodiment, the cutting edge includes a main cutting surface and a base surface, and the angle θ between the main cutting surface and the base surface is less than or equal to 60°. For example, the angle θ can be 20-35°, 35-47°, or 47-60°.

[0011] In a specific embodiment, the aperture of the water-permeable through hole is smaller than or equal to the maximum particle size of the wafer debris.

[0012] In a specific embodiment, the diameter of the water-permeable through hole is 0.1 cm to 2.5 cm. For example, the diameter of the water-permeable through hole can be 0.1 cm to 0.5 cm, 0.5 cm to 1.0 cm, 1.0 cm to 1.5 cm, 1.5 cm to 2.0 cm, or 2.0 cm to 2.5 cm.

[0013] In a more specific embodiment, the diameter of the water-permeable through hole is 0.4 cm to 1.0 cm. For example, the diameter of the water-permeable through hole can be 0.4 cm, 0.5 cm, 0.6 cm, 0.7 cm, 0.8 cm, 0.9 cm, or 1.0 cm.

[0014] In a more specific embodiment, the cleaning shovel further includes a shovel handle, one end of the shovel handle is fixedly connected to the shovel body, and the other end of the shovel handle is a free end.

[0015] In a more specific embodiment, the shovel handle and the shovel blade are arranged opposite to each other, and the angle between the central axis of the shovel handle and the base surface is 0-90°.

[0016] In a more specific embodiment, the shovel handle is further provided with a through hole.

[0017] As described above, the wafer debris cleaning shovel for the drain trough of a thinning machine of the present invention has the following beneficial effects:

[0018] 1) In the present invention, when the cleaning shovel cleans the wafer debris at the bottom of the drain trough of the thinning machine, the shoveled wafer debris inevitably carries some waste water, and the waste water is discharged from the water-permeable through hole, thereby separating the shoveled waste water and the debris. The separated waste water remains in the drain trough and is discharged with the wastewater pipe, and the debris is removed, thereby achieving more convenient maintenance of the thinning machine and saving cleaning, use and management costs.

[0019] 2) The shovel blade of the cleaning shovel of the present invention is sharp, which makes it easier to shovel out wafer debris that is agglomerated or adhered to the bottom of the thinning machine drainage trough.

[0020] 3) The blocking edge of the cleaning shovel of the present invention prevents wafer debris from leaking out from the edge of the shovel body, thereby improving the efficiency of cleaning wafer debris.

[0021] 4) The cleaning shovel of the present invention has a through hole on its handle, which allows it to be hung on any raised area for convenient storage. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic structural diagram of the wafer debris cleaning shovel used in the drainage trough of the thinning machine described in the present invention.

[0023] Figure 2 It is a partially enlarged cross-sectional view of the shovel blade of the present invention.

[0024] Description of Reference Numerals

[0025] 10 shovel body, 11 water-permeable through hole, 12 shovel edge, 121 main cutting surface, 122 base surface, 13 blocking edge, 20 shovel handle, 21 through hole, angle θ: the angle between the main cutting surface and the base surface. DETAILED DESCRIPTION

[0026] The following describes the implementation of the present invention through specific embodiments. People familiar with this technology can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0027] See also Figures 1-2 . It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of this utility model. Therefore, they have no substantive technical significance. Any modification of the structure, change in the proportional relationship or adjustment of the size should still fall within the scope of the technical content disclosed by this utility model without affecting the efficacy and purpose that can be achieved by this utility model. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of this utility model. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of this utility model without substantially changing the technical content.

[0028] The utility model discloses a wafer chip cleaning shovel for a thinning machine drainage trough. Figure 1 As shown, the cleaning shovel includes a shovel body 10, which includes a plurality of water-permeable through-holes 11. The cleaning shovel is used to clean wafer debris at the bottom of the drain trough of the thinning machine. The shoveled wafer debris inevitably carries some wastewater, which is discharged through the water-permeable through-holes 11, thereby separating the scooped wastewater and the debris. The separated wastewater remains in the drain trough and is discharged through the wastewater pipe, while the debris is removed, making it easier to maintain the thinning machine and saving cleaning, use, and management costs.

[0029] In a specific embodiment, Figure 1 As shown, the shovel body 10 has a scraping edge 12 formed on one portion of its edge, and a protruding stopper 13 formed on the other portion. The cleaning shovel is made of stainless steel. The scraping edge 12 reduces the effort required to scoop up wafer debris that has clumped or stuck to the bottom of the thinner's drain trough. The stopper 13 prevents scooped wafer debris from escaping the edge of the shovel body, improving the efficiency of cleaning and separating wafer debris. Stainless steel shovels are easier to clean, corrosion-resistant, and possess moderate hardness and hydrophilicity, meeting the requirements of cleanroom laboratories.

[0030] In a more specific embodiment, Figure 1 As shown, the water-permeable hole 11 is positioned away from the shovel blade 12. In practice, the user tilts the shovel body 10 so that the end of the water-permeable hole 11 is lower than the end of the shovel blade 12, allowing wastewater in the shovel body 10 to escape through the water-permeable hole 11 while wafer chips remain on the receiving surface of the shovel body 10. Positioning the water-permeable hole 11 away from the shovel blade 12 increases the receiving surface area of ​​the shovel body 10 for wafer chips, facilitating the separation of wastewater and wafer chips.

[0031] In a more specific embodiment, Figure 1 As shown, the edge of the shovel edge 12 is arranged in a straight line.

[0032] In a more specific embodiment, Figure 2 As shown, the cutting edge 12 includes a main cutting surface 121 and a base surface 122. The angle between the main cutting surface 121 and the base surface 122 is θ, and the angle θ is less than or equal to 60°. Figure 1 As shown, the angle θ is 47°. This angle makes the scraping edge 12 sharper, thereby facilitating the scraping of wafer chips.

[0033] In a specific embodiment, Figure 1 As shown, the aperture of the water-permeable through hole 11 is smaller than or equal to the maximum particle size of the wafer debris. As long as the wafer debris and wastewater can be separated, it is good. Generally speaking, it is good if 80% of the wafer debris cannot pass through.

[0034] In a specific embodiment, Figure 1 As shown, the diameter of the water-permeable through hole 11 is 0.1 cm to 2.5 cm.

[0035] In a more specific embodiment, Figure 1As shown, the aperture of the water-permeable through hole 11 is 0.4 cm to 1.0 cm. Wafer debris generated during the use of the thinning machine is generally strip-shaped, with a size of 0.5 cm * 0.5 cm * 3.0 cm to 1 cm * 1 cm * 3.0 cm. Therefore, the water-permeable through hole 11 can block most of the wafer debris, preventing it from leaking out of the water-permeable through hole 11, achieving efficient cleaning.

[0036] Furthermore, in a Figure 1 In the specific embodiment shown, the diameter of the water-permeable through hole 11 is 0.5 cm.

[0037] In a more specific embodiment, Figure 1 As shown, the cleaning shovel further includes a shovel handle 20, one end of which is fixedly connected to the shovel body 10, and the other end of which is a free end. The shovel handle 20 makes it more convenient and accurate to control the operation of the cleaning shovel.

[0038] In a more specific embodiment, Figures 1-2 As shown, the shovel handle 20 and the shovel blade 12 are positioned relative to each other; the included angle between the central axis of the shovel handle 20 and the base surface 122 is 0 to 90 degrees. When the shovel blade 12 acts on wafer debris at the bottom of the thinner drain trough, the base surface 122 contacts or aligns with the bottom surface of the thinner drain trough. As a result, the force applied by the user to the shovel handle 20 can maximize the effect on the wafer debris to be scooped up, improving the efficiency of scooping up wafer debris that is clumped or stuck to the bottom of the thinner drain trough and saving effort.

[0039] Furthermore, the receiving surface can be a plane and / or a curved surface that is inclined or / or parallel to the base surface 122. Figure 1 In the illustrated embodiment, the receiving surface is a plane parallel to the base surface 122 .

[0040] In a more specific embodiment, Figure 1 As shown, the shovel handle 20 is further provided with a through hole 21. The through hole 21 enables the cleaning shovel to be hung on any protrusion for convenient storage.

[0041] In summary, the cleaning shovel described in the present invention separates the wastewater and debris in the drainage trough of the thinning machine through the water-permeable through hole 11, and the wafer debris remains on the receiving surface of the shovel body 10. At the same time, the wastewater leaks out from the water-permeable through hole 11, thereby separating the shoveled wastewater and debris. The separated wastewater remains in the drainage trough and is discharged with the wastewater pipe, and the debris is removed, making it more convenient to maintain the thinning machine and saving cleaning, use and management costs.

[0042] In summary, the present invention effectively overcomes various shortcomings of the prior art and has high industrial utilization value.

[0043] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and replacements can be made without departing from the technical principles of the present invention. These improvements and replacements should also be regarded as the scope of protection of the present invention.

Claims

1. A wafer debris cleaning shovel for a thinning machine drainage trough, characterized in that: The cleaning shovel comprises a shovel body (10), and a plurality of water-permeable through holes (11) are provided on the shovel body (10). The aperture of the water-permeable through holes (11) is smaller than or equal to the maximum particle size of wafer debris.

2. The cleaning shovel according to claim 1, characterized in that A portion of the edge of the shovel body (10) is formed with a shovel blade (12); the other portion is formed with a protruding blocking edge (13); And / or, the cleaning shovel is a stainless steel shovel.

3. The cleaning shovel according to claim 2, characterized in that: The water-permeable through hole (11) is arranged away from the scraping edge (12).

4. The cleaning shovel according to claim 2, characterized in that: The edge of the shovel blade (12) is arranged in a straight line; and / or the shovel blade (12) includes a main cutting surface (121) and a base surface (122), and the angle between the main cutting surface (121) and the base surface (122) is θ, and the angle θ is less than or equal to 60°.

5. The cleaning shovel according to claim 1, characterized in that: The diameter of the water-permeable through hole (11) is 0.1 cm to 2.5 cm.

6. The cleaning shovel according to claim 5, characterized in that: The diameter of the water-permeable through hole (11) is 0.4 cm to 1.0 cm.

7. The cleaning shovel according to claim 4, characterized in that: The cleaning shovel further comprises a shovel handle (20), one end of the shovel handle (20) is fixedly connected to the shovel body (10), and the other end of the shovel handle (20) is a free end.

8. The cleaning shovel according to claim 7, characterized in that: The shovel handle (20) and the shovel blade (12) are arranged opposite to each other; the angle between the central axis of the shovel handle (20) and the base surface (122) is 0-90 degrees.

9. The cleaning shovel according to claim 8, characterized in that The shovel handle (20) is also provided with a through hole (21).

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