Semi-automatic tin soldering device

The soldering device adjusted by threaded rods and springs solves the problem of unstable fixation of cables and terminals of different sizes, achieving wider applicability and operational convenience, and improving welding efficiency.

CN223250733UActive Publication Date: 2025-08-22CHONGQING RUIYUAN PLASTIC PROD CO LTD
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Patent Information

Application Number
CN202422674559.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-04
Publication Date
2025-08-22
Estimated Expiration
2034-11-04

AI Technical Summary

Technical Problem

The existing soldering devices have limited application scope when fixing cables and terminals of different sizes, resulting in inflexible use and affecting soldering efficiency.

Method used

A semi-automated soldering device is designed, which drives the pressing plate down through a threaded rod, and the sliding rod lowers accordingly. The height of the pressing plate is adjusted by spring deformation, so as to achieve stable fixation of cables and terminals of different sizes, and is equipped with a locking mechanism to prevent the placement plate from moving, improving operational convenience.

Benefits of technology

The scope of application of the device has been expanded, the fixing stability and flexibility of cables and terminals of different sizes have been improved, and the practicality and operational convenience of welding are enhanced.

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Abstract

The utility model discloses a semi-automatic tin soldering device which comprises a device base, a fixing mechanism is arranged on the top of the device base, and a locking mechanism is arranged on the device base. According to the semi-automatic tin soldering device, after a cable and a cable or a cable and a wiring terminal are fixed and correspondingly placed in a wire groove and a terminal groove, a threaded rod is rotated to drive a pressing plate to descend along with the pressing plate, and then a sliding rod is driven to descend along with the sliding rod, so that an extrusion block is tightly attached to the top of a placing plate; and the height of the pressing plate can be adjusted according to the different sizes of the cables or the wiring terminals at the corresponding positions, so that the first spring and the second spring are further deformed, and therefore, the fixation of the large-size cables and the terminals can be ensured, and meanwhile, the fixation of the large-size cables and the terminals can be ensured. And the small-size terminal and the cable are stably fixed, so that subsequent tin soldering operation is facilitated, the application range of the device is widened, and the practicability of the device is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of soldering, in particular to a semi-automatic soldering device. Background Art

[0002] Solder is a commonly used joining material, often used to connect and secure electronic components. Soldering involves heating the material until it melts, applying it to the components to be joined, and then allowing it to cool to form a secure connection. Solder comes in many different types and sizes, and choosing the right solder for your specific application is crucial.

[0003] For example, a Chinese utility model patent (CN217452512U) discloses a semi-automatic soldering device for cables, which records: "Through the combination of a tinning device, a concave placement space and a placement plate, semi-automatic tinning is achieved, reducing the shortcomings of all manual operations such as slow speed and low efficiency. The placement intervals provided in the placement plate help workers to quickly arrange the cables neatly, saving time and speeding up the tinning speed." It also records: "The above patent uses two carbon rod fixing sleeves and two conductive sleeves to tin the cable ends, which requires manual tinning work. Manual tinning has problems such as uncertainty, slow speed and low work efficiency." Technical problems.

[0004] In summary, it can be seen that in the prior art, fixed sleeves and placement spacers are used to fix cables for subsequent tinning operations. However, this method has the following technical problems: during the actual use of the device, due to the use of fixed sleeves for restriction, the cables processed in the same batch need to be of the same size to achieve a stable restriction effect. In the actual processing process, the same processing batch may involve cables of different sizes, so the scope of application of the device is limited. For this reason, the present application proposes a semi-automatic soldering device to provide a new technical solution to solve the technical problems mentioned in the above patents. Utility Model Content

[0005] Based on this, it is necessary to provide a semi-automatic soldering device to address the above technical problems. After the cables and cables or the cables and the terminals are fixed and placed in the wire trough and the terminal trough respectively, the threaded rod is rotated to drive the pressing plate to descend, and then the sliding rod is driven to descend, so that the extrusion block is close to the top of the placement plate to restrict the cables or the terminals. The height of the pressing plate can be adjusted according to the different sizes of the cables or terminals in the corresponding positions, so that the first spring and the second spring are further deformed. While ensuring that the larger cables and terminals are fixed, the smaller terminals and cables are also stably fixed to facilitate subsequent tinning operations, thereby improving the scope of application of the device and the practicality of the device. The device is suitable for fixing two combinations of cables and cables and cables and terminals, which improves the flexibility of the device and further improves the scope of application of the device.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0007] The invention discloses a semi-automatic soldering device, which is used for soldering between cables and between cables and connection terminals.

[0008] The semi-automatic soldering device specifically includes:

[0009] The device base is provided with a fixing mechanism on the top of the device base, a locking mechanism is provided on the device base, a hydraulic rod is fixedly connected to the inner wall of the device base, an automatic tinning device is fixedly connected to the output end of the hydraulic rod, and the automatic tinning device is slidably connected to the inner wall of the device base;

[0010] The fixing mechanism includes a pressing plate, a sliding rod, a limiting plate, an adjusting component, a fixing component, and a receiving component. The inner wall of the pressing plate is slidably connected to the sliding rod, the outer wall of the sliding rod is fixedly connected to the limiting plate, and the limiting plate is slidably connected to the inner wall of the pressing plate.

[0011] As a preferred embodiment of the semi-automatic soldering device provided by the present invention, the adjustment assembly includes a limiting rod, and the inner wall of the pressing plate is slidably connected to the limiting rod near the four corners. The bottoms of the four limiting rods are fixedly connected to the upper surface of the device base, and the top of the device base is rotatably connected to a threaded rod, which is threadedly connected to the inner wall of the pressing plate.

[0012] As a preferred embodiment of the semi-automatic soldering device provided by the utility model, the fixing assembly includes a first spring, the outer wall of the sliding rod and the first spring is sleeved inside the pressing plate, the upper and lower ends of the first spring are respectively fixedly connected to the inner wall of the pressing plate and the top of the limiting plate, the outer wall of the sliding rod is fixedly connected to the fixing plate, the outer wall of the sliding rod is provided with a limiting groove, the outer wall of the sliding rod is slidably connected to the extrusion block, the inner wall of the extrusion block is fixedly connected to the limiting block, the limiting block is slidably connected in the limiting groove, the outer wall of the sliding rod and the second spring is sleeved between the fixing plate and the extrusion block, the upper and lower ends of the second spring are respectively fixedly connected to the bottom of the fixing plate and the top of the extrusion block.

[0013] As a preferred embodiment of the semi-automatic soldering device provided by the present invention, the receiving component includes a placement plate, which is slidably connected to the inner wall of the device base, a wire groove is provided on the top of the placement plate, and a terminal groove is provided on the top of the placement plate.

[0014] As a preferred embodiment of the semi-automatic soldering device provided by the present invention, the locking mechanism includes a card column, the inner wall of the device base is slidably connected to the card column, the top of the card column is inserted into the placement plate, the outer wall of the card column is fixedly connected to the sliding plate inside the device base, the outer wall of the card column is provided with a third spring, and the upper and lower ends of the third spring are respectively fixedly connected to the bottom of the sliding plate and the inner wall of the device base.

[0015] As a preferred embodiment of the semi-automatic soldering device provided by the present invention, the locking mechanism also includes a rotating ring, the bottom end of the clamping column is rotatably connected to the rotating ring, and the bottom of the device base is fixedly connected to an L-shaped plate adapted to the rotating ring.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The semi-automatic soldering device provided by the present invention is that after the cables and cables or the cables and the wiring terminals are fixed and placed in the wire trough and the terminal trough respectively, the threaded rod is rotated to drive the pressing plate to descend, and then the sliding rod is driven to descend, so that the extrusion block is tightly attached to the top of the placement plate to restrict the cables or the wiring terminals, and the height of the pressing plate can be adjusted according to the different sizes of the cables or wiring terminals in the corresponding positions, so that the first spring and the second spring are further deformed, thereby ensuring that the larger cables and terminals are fixed while the smaller terminals and cables are also stably fixed to facilitate the subsequent tinning operation, thereby improving the scope of application of the device and the practicality of the device, and the device is suitable for fixing two combinations of cables and cables and cables and wiring terminals, which improves the flexibility of the device and further improves the scope of application of the device.

[0018] The semi-automatic soldering device provided by the present invention can fix the position of the placement plate by inserting the clamping column into the placement plate, thereby avoiding the position of the placement plate from moving due to accidental contact during the tinning operation, thereby affecting the accuracy of the tinning position, and by pulling the rotating ring, the rotating ring can be hung on the L-shaped plate as the rotating ring rotates, thereby allowing the device to continuously maintain a state of not restricting the placement plate, so as to facilitate the replacement of the placement plate and the cables and terminal blocks thereon, thereby improving the convenience of device operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the solutions in the present invention, a brief introduction will be given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 This is a schematic diagram of the overall structure of the semi-automatic soldering device provided by the utility model;

[0021] Figure 2 A schematic diagram of the internal structure of the pressing plate of the semi-automatic soldering device provided by the present invention;

[0022] Figure 3 The semi-automatic soldering device provided by the utility model Figure 2 A magnified view of middle A;

[0023] Figure 4 The semi-automatic soldering device provided by the utility model Figure 2 Enlarged view of middle B;

[0024] Figure 5An enlarged view of the fixing mechanism of the semi-automatic soldering device provided by the present invention;

[0025] Figure 6 This is a schematic diagram of the internal structure of the device base of the semi-automatic soldering device provided by the utility model.

[0026] The markings in the figure are as follows:

[0027] 1. Device base; 2. Hydraulic rod; 3. Automatic tinning equipment; 4. Fixing mechanism; 5. Locking mechanism; 6. Pressing plate; 7. Limiting rod; 8. Threaded rod; 9. Sliding rod; 10. First spring; 11. Limiting plate; 12. Fixing plate; 13. Extrusion block; 14. Second spring; 15. Limiting groove; 16. Limiting block; 17. Placement plate; 18. Wire trough; 19. Terminal groove; 20. L-shaped plate; 21. Clamping column; 22. Rotating ring; 23. Third spring; 24. Sliding plate. DETAILED DESCRIPTION

[0028] In order to help those skilled in the art better understand the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0029] As described in the background technology, during the actual use of the device, since a fixed sleeve is used for restriction, the cables processed in the same batch need to be of the same size to achieve a stable restriction effect. However, during the actual processing process, the same processing batch may involve cables of different sizes, so the scope of application of the device is limited.

[0030] In order to solve this technical problem, the utility model provides a semi-automatic soldering device, which is applied to the semi-automatic soldering device between cables and between cables and wiring terminals.

[0031] Specifically, please refer to Figure 1-Figure 3 , the semi-automatic soldering device specifically includes:

[0032] The device base 1 has a fixing mechanism 4 on the top and a locking mechanism 5 on the device base 1. The inner wall of the device base 1 is fixedly connected to a hydraulic rod 2. The output end of the hydraulic rod 2 is fixedly connected to an automatic tinning device 3. The automatic tinning device 3 is slidably connected to the inner wall of the device base 1.

[0033] The fixing mechanism 4 includes a pressing plate 6, a sliding rod 9, a limiting plate 11, an adjusting component, a fixing component, and a receiving component. The inner wall of the pressing plate 6 is slidingly connected to the sliding rod 9, and the outer wall of the sliding rod 9 is fixedly connected to the limiting plate 11. The limiting plate 11 is slidingly connected to the inner wall of the pressing plate 6.

[0034] In this device, the automatic tinning device 3 has the same principle and operation as the tinning device in the prior art CN217452512U in the background art.

[0035] The semi-automatic soldering device provided by the present invention is that after the cables and cables or the cables and the wiring terminals are fixed and placed in the wire groove 18 and the terminal groove 19 respectively, the threaded rod 8 is rotated to drive the pressing plate 6 to descend, and then the sliding rod 9 is driven to descend, so that the extrusion block 13 is tightly attached to the top of the placement plate 17 to restrict the cables or the wiring terminals, and the height of the pressing plate 6 can be adjusted according to the different sizes of the cables or wiring terminals in the corresponding positions, so that the first spring 10 and the second spring 14 are further deformed, thereby ensuring that the larger cables and terminals are fixed, and the smaller terminals and cables are also stably fixed to facilitate the subsequent tinning operation, thereby improving the scope of application of the device and the practicality of the device. The device is suitable for fixing two combinations of cables and cables and cables and wiring terminals, which improves the flexibility of the device and further improves the scope of application of the device.

[0036] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0037] Example 1:

[0038] Please refer to Figure 2-Figure 5 , a semi-automatic soldering device, comprising:

[0039] The adjustment assembly includes a limiting rod 7, and the inner wall of the pressing plate 6 is slidably connected to the limiting rod 7 near the four corners. The bottoms of the four limiting rods 7 are fixedly connected to the upper surface of the device base 1, and the top of the device base 1 is rotatably connected to a threaded rod 8. The top of the threaded rod 8 is fixedly connected to a handle for driving the threaded rod 8 to rotate. The threaded rod 8 is threadedly connected to the inner wall of the pressing plate 6.

[0040] The fixing assembly includes a first spring 10. The outer wall of the sliding rod 9 is sleeved with the first spring 10 inside the pressing plate 6. The upper and lower ends of the first spring 10 are respectively fixedly connected to the inner wall of the pressing plate 6 and the top of the limiting plate 11. The outer wall of the sliding rod 9 is fixedly connected to the fixing plate 12. The outer wall of the sliding rod 9 is provided with a limiting groove 15. The outer wall of the sliding rod 9 is slidably connected to the extrusion block 13. The bottom of the sliding rod 9 and the bottom groove of the extrusion block 13 are respectively fixedly connected with rubber pads to avoid damage to the cable during the process of restricting the cable, and the rubber pad can be produced during the pressing process according to the shape of the cable. The outer wall of the extrusion block 13 is fixedly connected with a limiting block 16, and the limiting block 16 is slidably connected to the limiting groove 15. The outer wall of the sliding rod 9 is located between the fixed plate 12 and the extrusion block 13 and is sleeved with a second spring 14. The upper and lower ends of the second spring 14 are respectively fixedly connected to the bottom of the fixed plate 12 and the top of the extrusion block 13.

[0041] The receiving component includes a placement plate 17, which is slidably connected to the inner wall of the device base 1. A wire groove 18 is provided on the top of the placement plate 17, and the wire groove 18 is used to place cables. A terminal groove 19 is provided on the top of the placement plate 17, and the terminal groove 19 is used to place wiring terminals, and the depth of the terminal groove 19 is less than the depth of the wire groove 18.

[0042] Through the above structural design, after the cables and the cables and the wiring terminals are fixed, they are placed in the wire groove 18 and the terminal groove 19. After placement, the placement plate 17 is pushed into the device base 1. After the position of the placement plate 17 is fixed by the locking mechanism 5, the threaded rod 8 is rotated, thereby driving the pressing plate 6 to smoothly descend under the restriction of the limiting rod 7, thereby causing the terminal groove 19 and the extrusion block 13 to descend accordingly. After the extrusion block 13 contacts the placement plate 17, the wiring terminal placed in the terminal groove 19 can be fixed. As the pressing plate 6 further descends, the sliding rod 9 can move relative to the extrusion block 13, causing the limiting block 16 to slide in the limiting groove 15, and the second spring 14 is compressed and deformed. At the same time, the sliding rod 9 slides inside the pressing plate 6, and the first spring 10 is compressed accordingly, so that the bottom end of the sliding rod 9 can press and fix the terminal or cable, and then the position of the tinning head on the automatic tinning device 3 can be adjusted, and then the hydraulic rod 2 can be controlled to drive the automatic tinning device 3 to move and perform the tinning operation.

[0043] Example 2:

[0044] The semi-automatic soldering device provided in Example 1 is further optimized, specifically, as Figure 6 As shown, the locking mechanism 5 includes a card column 21, the inner wall of the device base 1 is slidably connected to the card column 21, the top of the card column 21 is inserted into the placement plate 17, the outer wall of the card column 21 is located inside the device base 1 and is fixedly connected to the sliding plate 24, the outer wall of the card column 21 is provided with a third spring 23, the third spring 23 is always in a compressed state during the movement of the device, and the upper and lower ends of the third spring 23 are respectively fixedly connected to the bottom of the sliding plate 24 and the inner wall of the device base 1.

[0045] The locking mechanism 5 also includes a rotating ring 22, and the bottom end of the card column 21 is rotatably connected to the rotating ring 22. The rotating design of the rotating ring 22 allows the rotating ring 22 to be rotated after the card column 21 drops to a certain extent, so that the rotating ring 22 is hung on the L-shaped plate 20. The bottom of the device base 1 is fixedly connected to the L-shaped plate 20 that is compatible with the rotating ring 22.

[0046] With the above structural design, when the placement plate 17 is to be taken out, the rotating ring 22 is pulled to drive the clamping column 21 to slide inside the device base 1. During this process, the sliding plate 24 is further compressed until the top of the clamping column 21 leaves the inside of the placement plate 17. As the clamping column 21 descends, the rotating ring 22 can be rotated to hang the rotating ring 22 at the corresponding position on the L-shaped plate 20, and then the placement plate 17 can be pulled out. When the placement plate 17 needs to be installed, the placement plate 17 is pushed into the appropriate position on the device base 1, and then the rotating ring 22 is pulled and rotated to make the rotating ring 22 break away from the restriction of the L-shaped plate 20 and release the rotating ring 22. Under the action of the elastic force of the third spring 23, the clamping column 21 can be inserted into the placement plate 17 to limit the position of the placement plate 17.

Claims

1. A semi-automatic soldering device, comprising a device base (1), characterized in that: A fixing mechanism (4) is provided on the top of the device base (1), a locking mechanism (5) is provided on the device base (1), a hydraulic rod (2) is fixedly connected to the inner wall of the device base (1), an automatic tinning device (3) is fixedly connected to the output end of the hydraulic rod (2), and the automatic tinning device (3) is slidably connected to the inner wall of the device base (1); The fixing mechanism (4) comprises a pressing plate (6), a sliding rod (9), a limiting plate (11), an adjusting component, a fixing component, and a receiving component. The inner wall of the pressing plate (6) is slidably connected to the sliding rod (9), the outer wall of the sliding rod (9) is fixedly connected to the limiting plate (11), and the limiting plate (11) is slidably connected to the inner wall of the pressing plate (6).

2. The semi-automatic soldering device according to claim 1, characterized in that: The adjustment assembly includes a limiting rod (7), the inner wall of the pressing plate (6) is slidably connected to the limiting rod (7) near the four corners, the bottoms of the four limiting rods (7) are fixedly connected to the upper surface of the device base (1), and the top of the device base (1) is rotatably connected to a threaded rod (8), and the threaded rod (8) is threadedly connected to the inner wall of the pressing plate (6).

3. The semi-automatic soldering device according to claim 1, characterized in that: The fixing assembly includes a first spring (10), an outer wall of the sliding rod (9) and located inside the pressing plate (6) is provided with a first spring (10), the upper and lower ends of the first spring (10) are respectively fixedly connected to the inner wall of the pressing plate (6) and the top of the limiting plate (11), the outer wall of the sliding rod (9) is fixedly connected to the fixing plate (12), the outer wall of the sliding rod (9) is provided with a limiting groove (15), the outer wall of the sliding rod (9) is slidably connected to the extrusion block (13), the inner wall of the extrusion block (13) is fixedly connected to the limiting block (16), the limiting block (16) is slidably connected in the limiting groove (15), the outer wall of the sliding rod (9) and located between the fixing plate (12) and the extrusion block (13) is provided with a second spring (14), the upper and lower ends of the second spring (14) are respectively fixedly connected to the bottom of the fixing plate (12) and the top of the extrusion block (13).

4. The semi-automatic soldering device according to claim 1, characterized in that: The receiving assembly includes a placement plate (17), the placement plate (17) is slidably connected to the inner wall of the device base (1), a wire groove (18) is provided on the top of the placement plate (17), and a terminal groove (19) is provided on the top of the placement plate (17).

5. The semi-automatic soldering device according to claim 4, characterized in that: The locking mechanism (5) comprises a post (21), the inner wall of the device base (1) is slidably connected to the post (21), the top of the post (21) is inserted into the placement plate (17), the outer wall of the post (21) is fixedly connected to the sliding plate (24) located inside the device base (1), the outer wall of the post (21) is sleeved with a third spring (23), and the upper and lower ends of the third spring (23) are respectively fixedly connected to the bottom of the sliding plate (24) and the inner wall of the device base (1).

6. The semi-automatic soldering device according to claim 5, characterized in that: The locking mechanism (5) further comprises a rotating ring (22), the bottom end of the clamping column (21) is rotatably connected to the rotating ring (22), and the bottom of the device base (1) is fixedly connected to an L-shaped plate (20) adapted to the rotating ring (22).

Citation Information

Patent Citations

  • Semi-automatic tin soldering device for cable

    CN217452512U