Over-soldering support plate and soldering device

Abstract

The utility model provides an over-tin soldering carrier plate and a tin soldering device. The over-tin soldering carrier plate is used for clamping a workpiece and driving the workpiece to pass through the tin soldering device. A placing groove is formed in the over-soldering carrier plate, a hollow welding position is arranged at the end part of the placing groove, and a tin baffle plate is arranged between the welding position and the placing groove; the workpiece comprises a welding area and a non-welding area, and a clamping groove matched with the tin baffle is formed between the welding area and the non-welding area; when the non-welding area of the workpiece is placed in the placing groove, the welding area is located in the welding position. According to the tin-over-soldering carrier plate, the tin blocking strips are additionally arranged in the tin-over-soldering carrier plate, so that the phenomenon that tin liquid flows backwards in the welding process is avoided, the welding precision is improved, and the maintenance work after welding is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of soldering carrier boards, in particular to a soldering carrier board and a soldering device. Background Art

[0002] Pins are soldered to the ends of the test board to create a pin test board. Pin test boards are essential components for the electronics industry, and their production requires a wave soldering process using a soldering machine. The structure of the carrier board holding the pin test board during soldering directly affects the soldering process. The carrier board's structural factors can easily lead to loose solder joints or molten solder backflow into undesirable areas of the pin test board.

[0003] The conventional over-soldering carrier board used to load the pin detection board has the following drawbacks:

[0004] First, there is no over-tinning carrier specifically designed to address post-soldering defects on pin test boards. Existing over-tinning carriers for pin test boards cannot specifically address post-soldering defects such as cold welding and tin pouring. Defects after each soldering session can only be addressed by adjusting equipment parameters. However, these adjustable parameters are limited, making welding performance difficult to control. This makes production prone to defects, hindering mass production and failing to meet the goal of rapid mass production.

[0005] Secondly, existing soldering carriers place high demands on soldering equipment. To achieve satisfactory soldering results after wave soldering, existing pin test board soldering carriers place high demands on the soldering equipment. Furthermore, even a simple change in a single factor can cause soldering defects, increasing the failure rate and reducing the first-pass yield of the product.

[0006] Currently, defects caused by soldering during the production of pin detection boards can only be resolved through manual repair. This is not only time-consuming and labor-intensive, but can also shorten the product's lifespan and reduce the first-pass yield. Therefore, designing a soldering carrier that prevents cold soldering and tinning of pin detection boards, thereby improving the first-pass yield, is a significant technical challenge facing those skilled in the art. Utility Model Content

[0007] In order to overcome the problems existing in the related art, one of the purposes of the present invention is to provide a tin-through soldering carrier board. By adding a tin blocking bar in the tin-through soldering carrier board, the phenomenon of tin liquid backflow during the welding process is avoided, the welding accuracy is improved, and the maintenance work after welding is reduced.

[0008] A soldering carrier plate is used to clamp the workpiece and drive the workpiece through the soldering device;

[0009] The soldering carrier plate is provided with a placement groove, the end of the placement groove is provided with a hollow welding position, and a tin blocking plate is provided between the welding position and the placement groove;

[0010] The workpiece includes a welding area and a non-welding area, and a clamping groove adapted to the tin blocking plate is provided between the welding area and the non-welding area;

[0011] When the non-welding area of ​​the workpiece is placed in the placement groove, the welding area is located in the welding position.

[0012] The present application adds a tin blocking bar to the soldering carrier plate. The tin blocking bar can isolate the placement groove and the welding position, that is, it can isolate the welding area and the non-welding area in the workpiece. In this way, it can be ensured that when the soldering carrier plate drives the workpiece into the soldering device, the tin liquid can only fully contact the welding area and cannot flow back into the placement groove, that is, it cannot contact the non-welding area in the workpiece, thereby improving the welding accuracy of the welding area, reducing the difficulty of maintenance work after welding, and thus improving the welding efficiency.

[0013] In a preferred technical solution of the present invention, the upper surface of the placement groove is flush with the upper surface of the tin blocking plate.

[0014] The upper surface here refers to the upper surface relative to the bottom of the placement groove. Similarly, the upper surface of the tin-blocking plate refers to the upper surface relative to the bottom of the placement groove. This application defines the side of the soldering carrier plate provided with the placement groove as the front of the soldering carrier plate, and the other side as the back of the soldering carrier plate. Then the upper surface of the tin-blocking plate and the upper surface of the placement groove refer to the side of the front of the soldering carrier plate away from the back. The lower surface of the tin-blocking plate can be flush with the back of the soldering carrier plate, or it can be flush with the lower surface of the placement groove. It is only necessary to achieve isolation between the placement groove and the welding position. The upper surface of the tin-blocking plate is preferably flush with the upper surface of the placement groove; when the soldering carrier plate passes through the tin liquid, the back of the soldering carrier plate contacts the tin liquid. At this time, the upper surface of the tin-blocking plate is flush with the upper surface of the placement groove, which can better prevent the tin liquid on the back from flowing back into the placement groove, thereby preventing the tin liquid from contacting the non-welding area in the workpiece, and avoiding the defect of tin liquid backflow in the prior art.

[0015] In a preferred technical solution of the present invention, in a first direction, the size of the welding position is larger than the size of the welding area in the workpiece, and the first direction refers to a direction parallel to the extension direction of the tin stop plate.

[0016] The extension direction of the tin stop plate refers to the direction that is parallel to both the welding position and the placement groove. Widening the welding position and the tin stop plate in this direction can ensure that the width of the welding position is large, so that the tin liquid is in full contact with the welding area in the welding position, thereby improving the welding stability of the workpiece. If the size of the welding position is equal to the welding area, then when the welding area is located in the welding position, the tin liquid cannot contact the welding area from the side. The present application sets the width of the welding position to be greater than the width of the welding area, which can ensure that not only the bottom of the welding area is in contact with the tin liquid, but also that the side hollowed-out position of the welding area is in contact with the tin liquid, thereby improving the welding stability of the welding area.

[0017] In a preferred technical solution of the present invention, in the first direction, the size of the tin blocking plate is equal to the size of the welding position.

[0018] The extension direction of the tin stop plate refers to the direction that is parallel to the welding position and the placement groove. In this direction, the size of the tin stop plate is equal to the size of the welding position. This ensures that in the first direction, the tin stop plate can fully isolate the welding position and the placement groove, and prevent the tin liquid from flowing back into the placement groove from various positions of the welding position.

[0019] In a preferred technical solution of the present invention, in the second direction, the size of the welding position is larger than the size of the welding area in the workpiece, and the second direction refers to the direction located in the plane of the soldering carrier plate and perpendicular to the extension direction of the tin blocking plate.

[0020] The second direction refers to the direction located on the front side of the soldering carrier and perpendicular to the first direction. In this direction, the size of the hollowed-out welding position is larger than the size of the welding area in the workpiece. This ensures that the end of the welding area away from the non-welding area can fully contact the tin liquid, thereby improving the welding stability. At the same time, it also ensures that the entire welding area is placed in the welding position, further improving the welding stability.

[0021] In a preferred technical solution of the present invention, the soldering carrier plate includes a plurality of placement grooves, and the plurality of placement grooves are distributed in an array.

[0022] In actual operation, the workpiece is, for example, a pin detection board. In order to improve welding efficiency, multiple pin detection boards are usually loaded into a soldering carrier at one time. By soldering at one time, multiple pin detection boards or other workpieces can be welded, which helps to improve welding efficiency.

[0023] In a preferred technical solution of the present invention, the workpiece is a PCB board, and the PCB board includes a plurality of pin detection boards, and the plurality of pin detection boards are distributed in a matrix; adjacent pin detection boards are connected by connecting strips;

[0024] When the PCB board is placed in the soldering carrier, a plurality of pin detection boards are placed in a plurality of placement grooves in a one-to-one correspondence.

[0025] When the workpiece is a pin detection board, the preparation process of the pin detection board includes first welding the pins and placement through-holes, and then cutting and separating the welded pin detection board to form a single pin detection board. In order to improve the welding efficiency, the pin detection board can be welded in batches before it is cut and separated. At this time, several pin detection boards form a PCB board in a matrix shape, and adjacent pin detection boards are connected by connecting strips. In this application, the soldering carrier board is designed according to the formation and size of the pin detection board in the PCB board. Therefore, the placement grooves in the soldering carrier board correspond one-to-one to the pin detection board in the PCB board. At the same time, welding positions are provided between the placement grooves. It can be understood that each pin detection board corresponds one-to-one to a placement groove and a welding position at its end. A supporting protrusion corresponding to the connecting strip is provided between the welding position and the next placement position to correspond one-to-one with the connecting strip; in this way, the fixing and clamping of the PCB board as a whole can be achieved, thereby realizing batch welding of several pin detection boards on the PCB board.

[0026] In a preferred technical solution of the present invention, in the third direction, the size of the connecting strip is smaller than that of the pin detection board, and support protrusions adapted to the connecting strip are provided between adjacent placement grooves; the third direction refers to the direction perpendicular to the plane where the soldering carrier board is located.

[0027] The third direction refers to a direction that is perpendicular to both the first and second directions. In this direction, the size of the connecting strip is smaller than the size of the pin detection board. This means that in the PCB board, the thickness of the connecting strip is smaller than the thickness of the pin detection board. This is because the connecting strip needs to be removed during the final PCB board cutting process to form a separate pin detection board. Therefore, its thickness is designed to be smaller. This helps improve cutting efficiency on the one hand and avoids waste of PCB board material on the other. Correspondingly, when the PCB board is fixed as a whole in the soldering carrier board, the position corresponding to the connecting strip is a support protrusion relative to the placement groove protrusion. In other words, a support protrusion corresponding to the connecting strip is provided between the soldering position and the next placement position. This ensures that the shape and size of the soldering carrier board correspond to the PCB board.

[0028] In a preferred technical solution of the present invention, the upper surface of the placement groove is flush with the upper surface of the supporting protrusion; and the side of the supporting protrusion is provided with a buckle for fixing the PCB board.

[0029] In this application, the upper surface of the placement groove, the upper surface of the support protrusion, and the upper surface of the tin stop plate are flush, and the upper surface refers to the side of the front side of the soldering carrier board away from the back side. That is, on the front side of the soldering carrier board, the placement groove is a concave groove, and corresponds one-to-one with the non-welding area of ​​each pin detection board, and the welding position is a hollow structure, and corresponds one-to-one with the welding area of ​​each pin detection board; the upper surfaces of the support protrusion and the tin stop plate are flush with the upper surface of the placement groove, that is, the support protrusion and the tin stop plate extend from the back side of the soldering carrier board to a position flush with the upper surface of the placement groove, or extend from the bottom of the placement groove to a position flush with the upper surface of the placement groove; in this way, the hollow welding position needs to pass through the tin stop plate or the support protrusion to reach the placement groove position, and the support protrusion and the tin stop plate work together to better prevent the tin liquid from backflowing.

[0030] A second object of the present application is to provide a soldering device comprising the soldering carrier as described above.

[0031] The workpiece is driven to weld by the above-mentioned tin-passing soldering carrier plate, ensuring that the tin liquid can only fully contact the welding area during the welding process and cannot flow back into the placement groove, that is, it cannot contact the non-welding area of ​​the workpiece, thereby improving the welding accuracy of the welding area, reducing the difficulty of maintenance work after welding, and thus improving the welding efficiency.

[0032] The beneficial effects of the utility model are:

[0033] The utility model provides a soldering carrier plate for clamping a workpiece and driving the workpiece through a soldering device; specifically, a placement groove is provided in the soldering carrier plate, a hollow welding position is provided at the end of the placement groove, and a tin blocking plate is provided between the welding position and the placement groove; correspondingly, the workpiece includes a welding area and a non-welding area, and a groove adapted to the tin blocking plate is provided between the welding area and the non-welding area; when the non-welding area of ​​the workpiece is placed in the placement groove, the welding area is located in the welding position. The present application adds a tin blocking bar to the soldering carrier plate, which can isolate the placement groove and the welding position, that is, it can isolate the welding area and the non-welding area in the workpiece. In this way, it can be ensured that when the soldering carrier plate drives the workpiece into the soldering device, the tin liquid can only fully contact the welding area and cannot flow back into the placement groove, that is, it cannot contact the non-welding area in the workpiece, thereby improving the welding accuracy of the welding area, reducing the difficulty of maintenance work after welding, and thus improving welding efficiency.

[0034] The present application also provides a soldering device including the above-mentioned soldering carrier plate, which drives the workpiece for welding through the above-mentioned soldering carrier plate, ensuring that the tin liquid can only fully contact the welding area during the welding process and cannot flow back into the placement groove, that is, it cannot contact the non-welding area of ​​the workpiece, thereby improving the welding accuracy of the welding area, reducing the difficulty of maintenance work after welding, and thus improving the welding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is a schematic diagram of the front structure of the soldered carrier board in this application;

[0036] Figure 2 This is a schematic diagram of the pin detection board of this application placed in the soldered carrier board;

[0037] Figure 3 for Figure 2 Sectional view of the AA plane;

[0038] Figure 4 This is a schematic diagram of the structure of the pin detection board of this application;

[0039] Figure 5 This is a side view of the pin detection board;

[0040] Figure 6 This is a structural diagram of the PCB board.

[0041] Reference numerals:

[0042] 11. Welding position; 12. Snap-on; 13. Placement groove; 14. Tin stop plate; 15. Support protrusion; 21. Pin detection board; 211. Welding area; 212. Non-welding area; 213. Placement through hole; 214. Pin; 22. Snap-on groove; 23. Connecting strip. DETAILED DESCRIPTION

[0043] The following describes preferred embodiments of the present invention in more detail with reference to the accompanying drawings. Although preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0044] The terms used in this utility model are for the purpose of describing specific embodiments only and are not intended to limit the utility model. As used in this utility model and the appended claims, the singular forms "a," "the," and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0045] It should be understood that although the terms "first", "second", "third", etc. may be used in the present invention to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of the present invention, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, features defined as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0046] Example 1

[0047] like Figures 1-6 As shown, the present application provides a soldering carrier plate, which is used to clamp the workpiece and drive the workpiece through the soldering device;

[0048] The soldering carrier plate is provided with a placement groove 13, the end of the placement groove 13 is provided with a hollow welding position 11, and a tin blocking plate 14 is provided between the welding position 11 and the placement groove 13;

[0049] The workpiece includes a welding area 211 and a non-welding area 212, and a clamping groove 22 adapted to the tin blocking plate 14 is provided between the welding area 211 and the non-welding area 212;

[0050] When the non-welding area 212 of the workpiece is placed in the placement groove 13 , the welding area 211 is located in the welding position 11 .

[0051] The present application adds a tin blocking bar to the soldering carrier, which can isolate the placement groove 13 and the welding position 11, that is, it can isolate the welding area 211 and the non-welding area 212 in the workpiece. In this way, it can be ensured that when the soldering carrier drives the workpiece into the soldering device, the tin liquid can only fully contact the welding area 211 and cannot flow back into the placement groove 13, that is, it cannot contact the non-welding area 212 in the workpiece, thereby improving the welding accuracy of the welding area 211, reducing the difficulty of maintenance work after welding, and thus improving the welding efficiency.

[0052] The soldering device in the present application can specifically be a device for implementing wave soldering. In the soldering device, a soldering carrier drives the workpiece through the tin liquid, and the bottom of the soldering carrier contacts the tin liquid. The workpiece is placed on the upper surface of the soldering carrier, and the soldering area 211 and the non-soldering area 212 in the workpiece are isolated by the tin blocking plate 14, so that the soldering area 211 can contact the tin liquid, while the non-soldering area 212 placed in the groove 13 does not contact the tin liquid.

[0053] In the present application, the workpiece may specifically be a PCB board, in which a welding area 211 and a non-welding area 212 are provided, and welding of the PCB board is achieved in the welding area 211 .

[0054] In this application, the workpiece may specifically be a pin detection board 21. Pin detection board 21 has placement holes 213 at its ends, into which pins 214 are placed. A soldering device is used to solder pins 214 and placement holes 213 together, thereby connecting the detection board to another electrical device. In pin detection board 21, welding area 211 refers to the pins 214 and the placement holes 213 corresponding to the pins 214. The remaining area is a non-welding area 212.

[0055] Example 2

[0056] like Figures 1-6 As shown, the present application provides a soldering carrier plate, which is used to clamp the workpiece and drive the workpiece through the soldering device;

[0057] The soldering carrier plate is provided with a placement groove 13, the end of the placement groove 13 is provided with a hollow welding position 11, and a tin blocking plate 14 is provided between the welding position 11 and the placement groove 13;

[0058] The workpiece includes a welding area 211 and a non-welding area 212, and a clamping groove 22 adapted to the tin blocking plate 14 is provided between the welding area 211 and the non-welding area 212;

[0059] When the non-welding area 212 of the workpiece is placed in the placement groove 13 , the welding area 211 is located in the welding position 11 .

[0060] Specifically, the upper surface of the placement groove 13 described in the present application is flush with the upper surface of the tin blocking plate 14 .

[0061] The upper surface here refers to the upper surface relative to the bottom of the placement groove 13. Similarly, the upper surface of the tin-blocking plate 14 refers to the upper surface relative to the bottom of the placement groove 13. This application defines the side of the soldering carrier plate provided with the placement groove 13 as the front of the soldering carrier plate, and the other side as the back of the soldering carrier plate. Then the upper surface of the tin-blocking plate 14 and the upper surface of the placement groove 13 refer to the side of the front of the soldering carrier plate away from the back. The lower surface of the tin-blocking plate 14 can be flush with the back of the soldering carrier plate, or it can be flush with the lower surface of the placement groove 13. It is only necessary to achieve isolation between the placement groove 13 and the welding position 11. The upper surface of the tin blocking plate 14 is preferably flush with the upper surface of the placement groove 13; when the soldering carrier passes through the tin liquid, the back of the soldering carrier contacts the tin liquid. At this time, the upper surface of the tin blocking plate 14 is flush with the upper surface of the placement groove 13, which can better prevent the tin liquid on the back from flowing back into the placement groove 13, and thus prevent the tin liquid from contacting the non-welding area 212 in the workpiece, thereby avoiding the defect of tin liquid backflow in the prior art.

[0062] Specifically, in a first direction, the size of the welding position 11 is larger than the size of the welding area 211 in the workpiece. The first direction refers to a direction parallel to the extending direction of the tin stop plate 14 .

[0063] The extension direction of the tin stop plate 14 refers to a direction that is parallel to both the welding position 11 and the placement groove 13. By widening the welding position 11 and the tin stop plate 14 in this direction, it is possible to ensure that the width of the welding position 11 is relatively large, so that the tin liquid is in full contact with the welding area 211 in the welding position 11, thereby improving the welding stability of the workpiece. If the size of the welding position 11 is equal to the welding area 211, then when the welding area 211 is located in the welding position 11, the tin liquid cannot contact the welding area 211 from the side. The present application sets the width of the welding position 11 to be greater than the width of the welding area 211, which can ensure that not only the bottom of the welding area 211 is in contact with the tin liquid, but also that the side hollowed-out position of the welding area 211 is in contact with the tin liquid, thereby improving the welding stability of the welding area 211.

[0064] Specifically, in the first direction, the size of the tin blocking plate 14 is equal to the size of the welding position 11 .

[0065] The extension direction of the tin blocking plate 14 refers to a direction that is parallel to both the welding position 11 and the placement groove 13. In this direction, the size of the tin blocking plate 14 is equal to the size of the welding position 11. This ensures that in the first direction, the tin blocking plate 14 can fully isolate the welding position 11 and the placement groove 13, preventing the tin liquid from flowing back into the placement groove 13 from various positions of the welding position 11.

[0066] Specifically, in the second direction, the size of the welding position 11 is larger than the size of the welding area 211 in the workpiece. The second direction refers to a direction located in the plane of the soldering carrier plate and perpendicular to the extension direction of the solder blocking plate 14.

[0067] The second direction refers to the direction located on the front side of the soldering carrier and perpendicular to the first direction. In this direction, the size of the hollowed-out welding position 11 is larger than the size of the welding area 211 in the workpiece. This ensures that the end of the welding area 211 away from the non-welding area 212 can fully contact the tin liquid, thereby improving the welding stability. At the same time, it also ensures that the welding area 211 is completely placed in the welding position 11, further improving the welding stability.

[0068] Specifically, the soldering carrier board includes a plurality of placement grooves 13, and the plurality of placement grooves 13 are distributed in an array.

[0069] In actual operation, the workpiece is, for example, a pin detection board 21. In order to improve welding efficiency, multiple pin detection boards 21 are usually loaded into a soldering carrier at one time. By soldering at one time, welding of multiple pin detection boards 21 or other workpieces can be achieved, which helps to improve welding efficiency.

[0070] Specifically, the workpiece is a PCB board, which includes several pin detection boards 21, and the several pin detection boards 21 are distributed in a matrix; adjacent pin detection boards 21 are connected by connecting strips 23; when the PCB board is placed in a soldering carrier, the several pin detection boards 21 are placed one by one in several placement grooves 13.

[0071] When the workpiece is a pin detection board 21, the preparation process for the pin detection board 21 includes first soldering the pins 214 and the placement holes 213. The soldered pin detection board 21 is then cut and separated to form individual pin detection boards 21. To improve soldering efficiency, the pin detection boards 21 can be soldered in batches before being cut and separated. In this case, several pin detection boards 21 are arranged in a matrix to form a PCB, with adjacent pin detection boards 21 connected by connecting bars 23. The soldering carrier in this application is designed according to the formation and size of the pin detection board 21 in the PCB board. Therefore, the placement grooves 13 in the soldering carrier correspond one-to-one to the pin detection board 21 in the PCB board. At the same time, welding positions 11 are provided between the placement grooves 13. It can be understood that each pin detection board 21 corresponds one-to-one to a placement groove 13 and the welding position 11 at its end. A supporting protrusion 15 corresponding to the connecting bar 23 is provided between the welding position 11 and the next placement position to correspond one-to-one to the connecting bar 23; in this way, the overall fixation and clamping of the PCB board can be achieved, and then batch welding of several pin detection boards 21 on the PCB board can be achieved.

[0072] Specifically, in the third direction, the size of the connecting strip 23 is smaller than that of the pin detection board 21, and support protrusions 15 adapted to the connecting strip 23 are provided between adjacent placement grooves 13; the third direction refers to the direction perpendicular to the plane where the soldering carrier board is located.

[0073] The third direction refers to a direction perpendicular to both the first and second directions. In this direction, the size of the connecting strip 23 is smaller than the size of the pin detection plate 21. This means that, in the PCB, the thickness of the connecting strip 23 is smaller than the thickness of the pin detection plate 21. This is because the connecting strip 23 needs to be removed during the final PCB cutting process to form a separate pin detection plate 21. Therefore, its thickness is designed to be smaller, which not only helps improve cutting efficiency but also avoids waste of PCB material. Correspondingly, when the PCB is fixed as a whole in the soldering carrier, the position corresponding to the connecting strip 23 is a support protrusion 15 that protrudes relative to the placement groove 13. In other words, a support protrusion 15 corresponding to the connecting strip 23 is provided between the soldering position 11 and the next placement position. This ensures that the shape and size of the soldering carrier correspond to the PCB.

[0074] Specifically, the upper surface of the placement groove 13 is flush with the upper surface of the supporting protrusion 15 ; and a buckle 12 for fixing the PCB board is provided on the side of the supporting protrusion 15 .

[0075] In the present application, the upper surface of the placement groove 13, the upper surface of the support protrusion 15 and the upper surface of the tin blocking plate 14 are flush, and the upper surface refers to the side of the front side of the tin-soldered carrier away from the back side. That is to say, on the front side of the soldering carrier board, the placement groove 13 is a concave groove, and corresponds one-to-one to the non-welding area 212 in each pin detection board 21, and the welding position 11 is a hollow structure, and corresponds one-to-one to the welding area 211 in each pin detection board 21; the upper surfaces of the supporting protrusion 15 and the tin blocking plate 14 are flush with the upper surface of the placement groove 13, that is, the supporting protrusion 15 and the tin blocking plate 14 extend from the back side of the soldering carrier board to a position flush with the upper surface of the placement groove 13, or extend from the bottom of the placement groove 13 to a position flush with the upper surface of the placement groove 13; in this way, the hollow welding position 11 needs to pass through the tin blocking plate 14 or the supporting protrusion 15 to reach the position of the placement groove 13, and the supporting protrusion 15 and the tin blocking plate 14 work together to better realize the tin liquid backflow phenomenon.

[0076] Example 3

[0077] like Figures 1-6 As shown, the present application provides a soldering carrier plate, which is used to clamp the workpiece and drive the workpiece through the soldering device;

[0078] The soldering carrier plate is provided with a placement groove 13, the end of the placement groove 13 is provided with a hollow welding position 11, and a tin blocking plate 14 is provided between the welding position 11 and the placement groove 13;

[0079] The workpiece includes a welding area 211 and a non-welding area 212, and a clamping groove 22 adapted to the tin blocking plate 14 is provided between the welding area 211 and the non-welding area 212;

[0080] When the non-welding area 212 of the workpiece is placed in the placement groove 13 , the welding area 211 is located in the welding position 11 .

[0081] The soldering carrier board of the present application can accommodate one pin detection board 21, and can also accommodate multiple pin detection boards 21 at the same time. This embodiment is described by taking the accommodation of one pin detection board 21 as an example.

[0082] like Figure 4 and Figure 5 As shown, in this embodiment, the workpiece is a pin detection board 21, and the pin detection board 21 includes a welding area 211 and a non-welding area 212. The welding area 211 is located at the end of the non-welding area 212, and a placement through hole 213 is provided in the welding area 211. A stop bar with a cross-sectional size larger than the cross-sectional size of the placement through hole 213 is provided in the middle position of the pin 214. When the pin 214 is placed in the placement through hole 213, the stop bar is located on the front side of the pin detection board 21, and the bottom of the pin 214 passes through the placement through hole 213 and extends to the back side of the pin detection board 21, and comes into contact with the tin liquid during wave soldering.

[0083] The purpose of this embodiment is to fix the pin detection board 21 in the soldering carrier so that the non-welding area 212 is located in the placement groove 13, the welding area 211 is located in the hollow welding position 11, and the pin 214 is placed in the placement through-hole 213 of the welding area 211. When the pin detection board 21 follows the soldering carrier through the soldering device, the bottom of the pin 214 contacts the tin liquid, so that the pin 214 is welded and fixed to the placement through-hole 213.

[0084] The pin detection board 21 is a rectangular parallelepiped structure, with both the soldering area 211 and the non-soldering area 212 being rectangular parallelepiped structures. The placement groove 13 is a rectangular parallelepiped that fits within the soldering area 211. This application defines the side of the soldering carrier board where the placement groove 13 is located as the front side of the soldering carrier board, and the other side as the back side of the soldering carrier board.

[0085] In this embodiment, the upper surface of the placement groove 13 is flush with the upper surface of the tin-blocking plate 14; the tin-blocking plate 14 is located on one side of the placement groove 13, and the other three sides of the placement groove 13 are provided with support protrusions 15. In this way, the upper surface of the placement groove 13, the upper surface of the support protrusion 15, and the upper surface of the tin-blocking plate 14 are flush, and the upper surface refers to the side of the front of the soldering carrier away from the back. In other words, on the front of the soldering carrier, the placement groove 13 is a concave groove, and the four sides of the placement groove 13 are respectively provided with the tin-blocking plate 14 and the support protrusion 15. The tin-blocking plate 14 and the support protrusion 15 cooperate with each other to prevent the tin liquid from flowing back into the placement groove 13 and contacting the non-soldering area 212.

[0086] Correspondingly, in this embodiment, a snap-in groove 22 adapted to the tin-blocking plate 14 is provided between the welding area 211 and the non-welding area 212 of the plug-in detection board to ensure that when the non-welding area 212 is placed in the placement groove 13 and the welding area 211 is placed in the placement position, the snap-in groove 22 is adapted to snap-in with the tin-blocking bar.

[0087] In this embodiment, the side edges of the support protrusions 15 are provided with latches 12 for securing the non-welding area 212. The latches 12 are rotatable. When the non-welding area 212 of the plug-in inspection board is placed within the placement groove 13, the latches 12 rotate to the non-welding area 212, securing the pin-insertion inspection board 21 to the soldering carrier. This ensures that the pin-insertion inspection board 21 does not shift during soldering, thus ensuring soldering stability.

[0088] Furthermore, in the first direction, the size of the welding position 11 is larger than the size of the welding area 211 in the workpiece, and the size of the tin stopper 14 is equal to the size of the welding position 11. The first direction refers to a direction parallel to the extension direction of the tin stopper 14.

[0089] Widening the welding position 11 and the tin stop plate 14 in the first direction ensures a larger width for the welding position 11, allowing for sufficient contact between the molten tin and the welding area 211 in the welding position 11, thereby improving the welding stability of the workpiece. The tin stop plate 14 is equal in size to the welding position 11. This ensures that the tin stop plate 14 can fully isolate the welding position 11 from the placement groove 13 in the first direction, preventing the molten tin from flowing back into the placement groove 13 from various locations on the welding position 11.

[0090] Furthermore, in the second direction, the size of the welding position 11 is larger than the size of the welding area 211 in the workpiece. The second direction refers to a direction located in the plane of the soldering carrier plate and perpendicular to the extension direction of the solder blocking plate 14.

[0091] In the second direction, the size of the hollow welding position 11 is larger than the size of the welding area 211 in the workpiece. This ensures that the end of the welding area 211 away from the non-welding area 212 can fully contact the tin liquid, thereby improving the welding stability. At the same time, it can also ensure that the welding area 211 is completely placed in the welding position 11, further improving the welding stability.

[0092] Example 4

[0093] like Figures 1-6 As shown, the present application provides a soldering carrier plate, which is used to clamp the workpiece and drive the workpiece through the soldering device;

[0094] The soldering carrier plate is provided with a placement groove 13, the end of the placement groove 13 is provided with a hollow welding position 11, and a tin blocking plate 14 is provided between the welding position 11 and the placement groove 13;

[0095] The workpiece includes a welding area 211 and a non-welding area 212, and a clamping groove 22 adapted to the tin blocking plate 14 is provided between the welding area 211 and the non-welding area 212;

[0096] When the non-welding area 212 of the workpiece is placed in the placement groove 13 , the welding area 211 is located in the welding position 11 .

[0097] The soldering carrier of the present application can accommodate a PCB board, and each PCB board includes several plug-in detection boards, such as Figure 6 The diagram only shows the four pin detection boards. Figure 2 The 16 pin detection plates 21 are arranged in a matrix of two columns and eight rows, with connecting bars 23 positioned between each pin detection plate 21. The thickness of the connecting bars 23 is smaller than that of the pin detection plates 21 on the PCB board. This is because the connecting bars 23 need to be removed during the final cutting process to form the individual pin detection plates 21. Therefore, their smaller thickness helps improve cutting efficiency and avoids wasting PCB material.

[0098] At the same time, each pin detection board 21 in this embodiment can be used independently, or can be cut into four or more small pin detection boards 21 for separate use. The specific cutting position can be cutting along the first direction of the solder carrier board.

[0099] For the convenience of description, the present embodiment describes the pin detection board 21 placed in the same placement groove 13 as a whole.

[0100] like Figure 4-Figure 6As shown, in this embodiment, the pin detection board 21 includes a welding area 211 and a non-welding area 212. The welding area 211 is located at the end of the non-welding area 212, and a placement through hole 213 is provided in the welding area 211. A stop bar with a cross-sectional size larger than the cross-sectional size of the placement through hole 213 is provided in the middle position of the pin 214. When the pin 214 is placed in the placement through hole 213, the stop bar is located on the front side of the pin detection board 21, and the bottom of the pin 214 passes through the placement through hole 213 and extends to the back side of the pin detection board 21, and comes into contact with the tin liquid during wave soldering.

[0101] The purpose of this embodiment is to fix the pin detection boards 21 in the same PCB board in batches in a soldering carrier, so that the non-soldering area 212 is located in the placement groove 13, the soldering area 211 is located in the hollow soldering position 11, and the pins 214 are placed in the placement through-holes 213 of the soldering area 211. When the pin detection board 21 follows the soldering carrier through the soldering device, the bottom of the pin 214 contacts the tin liquid, so that the pin 214 is soldered and fixed together with the placement through-hole 213.

[0102] The pin detection board 21 is a rectangular parallelepiped structure, with both the soldering area 211 and the non-soldering area 212 being rectangular parallelepiped structures. The placement groove 13 is a rectangular parallelepiped that fits within the soldering area 211. This application defines the side of the soldering carrier board where the placement groove 13 is located as the front side of the soldering carrier board, and the other side as the back side of the soldering carrier board.

[0103] The PCB includes sixteen pin detection boards 21 arranged in a matrix of two columns and eight rows. Adjacent pin detection boards 21 in the same column are connected by connecting strips 23. Adjacent pin detection boards 21 in the same row are also connected by connecting strips 23. When the PCB is placed in the soldering fixture, the sixteen pin detection boards 21 are placed one-to-one in the sixteen placement grooves 13.

[0104] The placement grooves 13 in the soldering carrier board correspond one-to-one to the pin detection boards 21 in the PCB board. At the same time, welding positions 11 are set between the placement grooves 13. It can be understood that each pin detection board 21 corresponds one-to-one to a placement groove 13 and the welding position 11 at its end. A supporting protrusion 15 corresponding to the connecting strip 23 is set between the welding position 11 and the next placement position to correspond one-to-one to the connecting strip 23; in this way, the overall fixation and clamping of the PCB board can be achieved, and then batch welding of several pin detection boards 21 on the PCB board can be achieved.

[0105] The third direction refers to a direction perpendicular to both the first and second directions. In this direction, the size of the connecting strip 23 is smaller than the size of the pin detection plate 21. This means that, in the PCB, the thickness of the connecting strip 23 is smaller than the thickness of the pin detection plate 21. This is because the connecting strip 23 needs to be removed during the final PCB cutting process to form a separate pin detection plate 21. Therefore, its thickness is designed to be smaller, which not only helps improve cutting efficiency but also avoids waste of PCB material. Correspondingly, when the PCB is fixed as a whole in the soldering carrier, the position corresponding to the connecting strip 23 is a support protrusion 15 that protrudes relative to the placement groove 13. In other words, a support protrusion 15 corresponding to the connecting strip 23 is provided between the soldering position 11 and the next placement position. This ensures that the shape and size of the soldering carrier correspond to the PCB.

[0106] In this embodiment, the upper surface of the placement groove 13, the upper surface of the supporting protrusion 15 and the upper surface of the tin blocking plate 14 are flush, and the upper surface refers to the side of the front side of the tin-soldered carrier away from the back side. That is to say, on the front side of the soldering carrier board, the placement groove 13 is a concave groove, and corresponds one-to-one to the non-welding area 212 in each pin detection board 21, and the welding position 11 is a hollow structure, and corresponds one-to-one to the welding area 211 in each pin detection board 21; the upper surfaces of the supporting protrusion 15 and the tin blocking plate 14 are flush with the upper surface of the placement groove 13, that is, the supporting protrusion 15 and the tin blocking plate 14 extend from the back side of the soldering carrier board to a position flush with the upper surface of the placement groove 13, or extend from the bottom of the placement groove 13 to a position flush with the upper surface of the placement groove 13; in this way, the hollow welding position 11 needs to pass through the tin blocking plate 14 or the supporting protrusion 15 to reach the position of the placement groove 13, and the supporting protrusion 15 and the tin blocking plate 14 work together to better realize the tin liquid backflow phenomenon.

[0107] A buckle 12 is provided in the support protrusion 15. The buckle 12 can rotate. When the non-welding area 212 in the plug-in detection board is placed in the placement groove 13, the buckle 12 rotates to the position of the non-welding area 212, so that the pin detection board 21 is fixed together with the soldering carrier, ensuring that the position of the pin detection board 21 will not shift when passing through the soldering device, thereby ensuring the stability of welding. Since the pin detection boards 21 are connected to form a unified PCB board through the connecting strip 23, it is only necessary to set three buckles 12 at the top, middle and bottom of each column of pin detection boards 21, and the buckles 12 between the two columns of pin detection boards 21 can be shared, forming a Figure 1 The buckles 12 are shown in their distribution.

[0108] For each placement groove 13, the upper surface of the placement groove 13 is flush with the upper surface of the tin blocking plate 14; the tin blocking plate 14 is located on one side of the placement groove 13, and the other three sides of the placement groove 13 are provided with support protrusions 15. In the first direction, the size of the welding position 11 is larger than the size of the welding area 211 in the workpiece, and the size of the tin blocking plate 14 is equal to the size of the welding position 11. The first direction refers to the direction parallel to the extension direction of the tin blocking plate 14. Widening the welding position 11 and the tin blocking plate 14 in the first direction can ensure that the width of the welding position 11 is larger, so that the tin liquid is in full contact with the welding area 211 in the welding position 11, thereby improving the welding stability of the workpiece. The size of the tin blocking plate 14 is equal to the size of the welding position 11, which can ensure that in the first direction, the tin blocking plate 14 can fully isolate the welding position 11 and the placement groove 13, and prevent the tin liquid from flowing back from various positions of the welding position 11 into the placement groove 13.

[0109] Furthermore, in the second direction, the size of the welding position 11 is larger than the size of the welding area 211 in the workpiece. The second direction refers to the direction located within the plane of the solder carrier and perpendicular to the extension direction of the tin stop plate 14. In the second direction, the size of the hollow welding position 11 is larger than the size of the welding area 211 in the workpiece. This ensures that the end of the welding area 211 away from the non-welding area 212 can fully contact the tin liquid, improving welding stability. At the same time, it also ensures that the welding area 211 is completely placed in the welding position 11, further improving welding stability.

[0110] The present application also provides a soldering device including the soldering carrier plate in Examples 1 to 4, which drives the workpiece for welding through the above-mentioned soldering carrier plate, ensuring that the tin liquid can only fully contact the welding area 211 during the welding process, and cannot flow back into the placement groove 13, that is, it cannot contact the non-welding area 212 in the workpiece, thereby improving the welding accuracy of the welding area 211, reducing the difficulty of maintenance work after welding, and thereby improving the welding efficiency.

[0111] Unless otherwise specifically stated, the relative arrangement of the parts and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to actual proportional relationships. The techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values ​​should be interpreted as being merely exemplary and not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures. In the description of this application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of this application; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0112] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0113] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0114] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A soldering carrier plate for clamping a workpiece and driving the workpiece through a soldering device; characterized in that: A placement groove (13) is provided in the soldering carrier plate, a hollowed-out welding position (11) is provided at the end of the placement groove (13), and a tin blocking plate (14) is provided between the welding position (11) and the placement groove (13); The workpiece comprises a welding area (211) and a non-welding area (212), and a clamping groove (22) adapted to the tin blocking plate (14) is provided between the welding area (211) and the non-welding area (212); When the non-welding area (212) of the workpiece is placed in the placement groove (13), the welding area (211) is located in the welding position (11).

2. The soldering carrier according to claim 1, characterized in that: The upper surface of the placement groove (13) is flush with the upper surface of the tin blocking plate (14).

3. The soldering carrier according to claim 1, characterized in that: In a first direction, the size of the welding position (11) is larger than the size of the welding area (211) in the workpiece, and the first direction refers to a direction parallel to the extension direction of the tin blocking plate (14).

4. The soldering carrier according to claim 3, characterized in that: In the first direction, the size of the tin blocking plate (14) is equal to the size of the welding position (11).

5. The soldering carrier according to claim 3, characterized in that: In the second direction, the size of the welding position (11) is larger than the size of the welding area (211) in the workpiece, and the second direction refers to a direction located in the plane of the soldering carrier plate and perpendicular to the extension direction of the tin blocking plate (14).

6. The soldering carrier according to claim 1, characterized in that: The soldering carrier plate comprises a plurality of placement grooves (13), and the plurality of placement grooves (13) are distributed in an array.

7. The soldering carrier according to claim 6, characterized in that: The workpiece is a PCB board, the PCB board includes a plurality of pin detection boards (21), and the plurality of pin detection boards (21) are distributed in a matrix; adjacent pin detection boards (21) are connected by a connecting strip (23); When the PCB board is placed in the soldering carrier, a plurality of pin detection boards (21) are placed in a plurality of placement grooves (13) in a one-to-one correspondence.

8. The soldering carrier according to claim 7, characterized in that: In the third direction, the size of the connecting strip (23) is smaller than the size of the pin detection plate (21), and a supporting protrusion (15) adapted to the connecting strip (23) is provided between adjacent placement grooves (13); the third direction refers to a direction perpendicular to the plane where the soldering carrier plate is located.

9. The soldering carrier according to claim 8, characterized in that: The upper surface of the placement groove (13) is flush with the upper surface of the support protrusion (15); and a buckle (12) for fixing the PCB board is provided on the side of the support protrusion (15).

10. A soldering device, characterized in that: The invention comprises a soldering carrier board as described in any one of claims 1 to 9.

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