Material lifting and spraying structure with adjustable spraying angle and silicon wafer cutting device

Abstract

The utility model discloses a material lifting and spraying structure with an adjustable spraying angle and a silicon wafer cutting device. The material lifting and spraying structure comprises a spraying pipe, a spraying adjusting support and two fixing supports, a plurality of spraying heads are arranged on the spraying adjusting support, the spraying heads are communicated with the spraying pipe through water inlet pipes, the two ends of the spraying adjusting support are installed on the two fixing supports respectively, and the two ends of the spraying adjusting support are communicated with the spraying pipe through water outlet pipes. Rotating holes and movable holes are formed in the two fixed supports, rotating ends and adjusting ends are arranged at the two ends of the spraying adjusting support, the rotating ends are rotationally connected into the rotating holes, the adjusting ends are movably connected into the movable holes, and the adjusting ends can move in the movable holes; the silicon wafer cutting device comprises the material lifting and spraying structure. The silicon wafer cutting device is applied to the technical field of silicon wafer cutting.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon slice cutting, in particular to a material lifting and spraying structure with adjustable spraying angle and a silicon slice cutting device. Background Art

[0002] In the field of photovoltaic monocrystalline silicon wafer production, after the silicon wafer is cut, it needs to be lifted. During this process, quality problems such as silicon wafer scratches and line marks and wire hanging problems may occur, resulting in product loss, steel wire loss, efficiency loss, etc. Therefore, the industry currently needs to spray the silicon wafers when cutting and lifting them to avoid the above problems. The specific operations include the following:

[0003] 1. Manual handheld shower for rinsing. During the material handling process, the cut silicon wafers are rinsed with a handheld shower. However, this method is simple and direct, but the cleaning speed is slow, the effect is not guaranteed, the rinsing range is limited, and it cannot fully cover both sides of the silicon rod. The labor input cost in industrial production greatly affects production efficiency;

[0004] 2. A spray pipe is fixed on the mortar pipe for flushing, and a stainless steel pipe is welded to the mortar pipe. Multiple nozzles are installed on the stainless steel pipe, and the nozzles supply water to flush the cut silicon wafers. However, the spray pipe is fixed on the mortar pipe, which makes it difficult to adjust the spray angle of the spray pipe. The spray position is limited and cannot be adjusted according to changes in product specifications and process requirements. Utility Model Content

[0005] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art. The first purpose is to provide a material lifting and spraying structure with an adjustable spraying angle.

[0006] The second purpose of the utility model is to provide a silicon wafer cutting device.

[0007] The technical solution adopted by the present utility model is: the material lifting and spraying structure includes a spray pipe, a spray adjusting bracket and two fixed brackets, a plurality of spray heads are provided on the spray adjusting bracket, and the plurality of spray heads are connected to the spray pipe through a water inlet pipe, and the two ends of the spray adjusting bracket are respectively installed on the two fixed brackets, and the two fixed brackets are provided with a rotating hole and a movable hole, and the two ends of the spray adjusting bracket are provided with a rotating end and an adjusting end, the rotating end is rotatably connected to the rotating hole, the adjusting end is movably connected to the movable hole, and the adjusting end can move in the movable hole.

[0008] Furthermore, the material lifting and spraying structure is arranged on the mortar pipe.

[0009] Furthermore, the movable hole is an arc-shaped waist hole.

[0010] Furthermore, the rotating hole is located above the movable hole.

[0011] Furthermore, the rotating end and the adjusting end are both shafts.

[0012] Furthermore, the nozzle is a fan-shaped nozzle.

[0013] Furthermore, the angle between the nozzle and the horizontal plane ranges from 5 degrees to 45 degrees.

[0014] Furthermore, one end of the water inlet pipe is connected to the nozzle through a first threaded quick connector, and the other end is connected to the spray pipe through a second threaded quick connector.

[0015] Furthermore, the water inlet pipe is a PU pipe.

[0016] In addition, the utility model also provides a silicon wafer cutting device, which includes the material lifting and spraying structure.

[0017] The beneficial effects of the utility model are:

[0018] With respect to the deficiencies of the prior art, in the present invention, when the silicon wafer is cut and lifted, by adjusting the spray angle of the nozzle, the surface of the silicon wafer can be sprayed during the initial 0-50mm period of lifting. Moreover, the rotation angle of the spray adjustment bracket can be easily adjusted by pushing the adjustment end, thereby facilitating the adjustment of the spray angle of the nozzle. Therefore, the lifting and spraying structure can adjust the spray angle according to different process requirements and product specifications, and can avoid the need to process the wire network after lifting and hanging the material, further avoiding the waste of manpower and reducing production efficiency, thereby improving the product production capacity of single crystal silicon wafers and reducing quality problems such as silicon wafer scratches. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0020] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model Figure 1 ;

[0021] Figure 2 This is a schematic diagram of the three-dimensional structure of the utility model Figure 2 ;

[0022] Figure 3 yes Figure 2 A partial enlarged schematic diagram of part A;

[0023] Figure 4 It is a three-dimensional structural schematic diagram of the fixing bracket of the utility model.

[0024] The reference numerals are as follows:

[0025] 1. Spray pipe; 2. Spray adjustment bracket; 3. Fixed bracket; 5. Spray head; 6. Water inlet pipe; 7. Rotation hole; 8. Movable hole; 9. Rotation end; 10. Adjustment end; 11. Mortar pipe; 12. First threaded quick connector; 13. Second threaded quick connector.

[0026] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0027] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] It should be noted that all directional indications in the embodiments of the present invention, such as up, down, left, right, front, back, clockwise, counterclockwise, etc., are only used to explain the relative position relationship and movement status of the various components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0029] In addition, the descriptions of "first," "second," etc. in this utility model are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0030] like Figures 1 to 4As shown, in this embodiment, the material feeding and spraying structure includes a spray pipe 1, a spray adjustment bracket 2, and two fixed brackets 3. The spray adjustment bracket 2 is provided with multiple nozzles 5, and the multiple nozzles 5 are connected to the spray pipe 1 through a water inlet pipe 6. The two ends of the spray adjustment bracket 2 are respectively mounted on the two fixed brackets 3. Both fixed brackets 3 are provided with a rotation hole 7 and a movable hole 8. The two ends of the spray adjustment bracket 2 are provided with a rotating end 9 and an adjustment end 10. The rotating end 9 is rotatably connected to the rotating hole 7, and the adjustment end 10 is movably connected to the movable hole 8. The adjustment end 10 can move in the movable hole 8. Specifically, the water in the spray pipe 1 is connected between the nozzle 5 and the spray pipe 1, so that water can enter the nozzle 5 and spray the silicon wafers.

[0031] When the spraying angle of the nozzle 5 needs to be adjusted, the adjusting end 10 is pushed so that the adjusting end 10 can move in the movable hole 8, and the rotating end 9 rotates in the rotating hole 7. At this time, the adjusting end 10 can rotate relative to the rotating end 9, so that the spray adjustment bracket 2 can also rotate, thereby adjusting the spraying angles of multiple nozzles 5.

[0032] With respect to the deficiencies of the prior art, in the present invention, when the silicon wafer is cut and lifted, by adjusting the spray angle of the nozzle 5, the surface of the silicon wafer can be sprayed during the initial 0-50mm period of lifting. Moreover, by pushing the adjustment end 10, the rotation angle of the spray adjustment bracket 2 can be easily adjusted, thereby facilitating the adjustment of the spray angle of the nozzle 5. Therefore, the lifting and spraying structure can adjust the spray angle according to different process requirements and product specifications, and can avoid the need to process the wire network after the material is lifted and hung on the line, further avoiding the waste of manpower and the reduction of production efficiency, thereby improving the product production capacity of single crystal silicon wafers and reducing quality problems such as silicon wafer scratches.

[0033] In some embodiments, the material raising and spraying structure is disposed on the mortar pipe 11. Specifically, by disposing the material raising and spraying structure on the mortar pipe 11, the material raising and spraying structure can be close to the silicon wafer and will not be pressed down by the feed table. In addition, by adjusting the spraying angle of the nozzle 5, the height of the spraying position of the nozzle 5 relative to the flushing position of the mortar pipe 11 can be controlled, thereby flexibly adjusting according to product specifications and process requirements.

[0034] In certain embodiments, the movable hole 8 is an arc-shaped waist hole; the rotating hole 7 is located above the movable hole 8; the rotating end 9 and the adjusting end 10 are both shafts; the spray head 5 is a fan-shaped spray head; and the angle between the spray head 5 and the horizontal plane ranges from 5 degrees to 45 degrees. Specifically, the spray angle of the spray head 5 is adjusted by moving the adjusting end 10 within the movable hole 8, which is an arc-shaped waist hole. Furthermore, the fan-shaped spray head 5 provides a uniform, high-impact spray effect.

[0035] In some embodiments, one end of the water inlet pipe 6 is connected to the nozzle 5 through a first threaded quick connector 12, and the other end is connected to the spray pipe 1 through a second threaded quick connector 13; the water inlet pipe 6 is a PU pipe.

[0036] In addition, the present invention also provides a silicon wafer cutting device, which includes the aforementioned material lifting and spraying structure. Specifically, the specific structure of the aforementioned material lifting and spraying structure refers to the aforementioned embodiment. Since the aforementioned material lifting and spraying structure adopts all the technical solutions of all the aforementioned embodiments, it at least has all the beneficial effects brought about by the technical solutions of the aforementioned embodiments, and no further description is given here.

[0037] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A material lifting and spraying structure with adjustable spraying angle, characterized in that: The invention comprises a spray pipe (1), a spray adjustment bracket (2) and two fixed brackets (3); a plurality of spray heads (5) are provided on the spray adjustment bracket (2); the plurality of spray heads (5) are connected to the spray pipe (1) through a water inlet pipe (6); the two ends of the spray adjustment bracket (2) are respectively mounted on the two fixed brackets (3); the two fixed brackets (3) are each provided with a rotating hole (7) and a movable hole (8); the two ends of the spray adjustment bracket (2) are each provided with a rotating end (9) and an adjusting end (10); the rotating end (9) is rotatably connected to the rotating hole (7); the adjusting end (10) is movably connected to the movable hole (8); and the adjusting end (10) can move in the movable hole (8).

2. The material lifting and spraying structure with adjustable spraying angle according to claim 1 is characterized in that: The material raising and spraying structure is arranged on the mortar pipe (11).

3. The material lifting and spraying structure with adjustable spraying angle according to claim 1 or 2, characterized in that: The movable hole (8) is an arc-shaped waist hole.

4. The material lifting and spraying structure with adjustable spraying angle according to claim 3 is characterized in that: The rotating hole (7) is located above the movable hole (8).

5. The material lifting and spraying structure with adjustable spraying angle according to claim 1 is characterized in that: The rotating end (9) and the adjusting end (10) are both shaft bodies.

6. The material lifting and spraying structure with adjustable spraying angle according to claim 1, characterized in that: The nozzle (5) is a fan-shaped nozzle.

7. The material lifting and spraying structure with adjustable spraying angle according to claim 6, characterized in that: The angle between the nozzle (5) and the horizontal plane ranges from 5 degrees to 45 degrees.

8. The material lifting and spraying structure with adjustable spraying angle according to claim 1, characterized in that: One end of the water inlet pipe (6) is connected to the spray head (5) via a first threaded quick connector (12), and the other end is connected to the spray pipe (1) via a second threaded quick connector (13).

9. The material lifting and spraying structure with adjustable spraying angle according to claim 8, characterized in that: The water inlet pipe (6) is a PU pipe.

10. A silicon wafer cutting device, characterized in that: The invention comprises the material lifting and spraying structure as described in any one of claims 1 to 9.

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