Signal detection and conversion module

Abstract

The utility model discloses a signal detection and conversion module, which relates to the technical field of signal control and detection of small household appliances and comprises a PCB (printed circuit board), a water level detection component, a temperature detection component, a coupling control switch and an integrated signal processing component. The water level detection assembly, the temperature detection assembly and the integrated signal processing assembly are all arranged on the PCB, the water level detection assembly induces weak current changes of liquid in an insulating vessel to judge whether the liquid exists or not and the height of the liquid, the temperature detection assembly is used for detecting the temperature of the vessel, and the coupling control switch is arranged between the temperature detection assembly and the PCB; wherein the temperature detection assembly is pressed to drive the coupling control switch to move, so that the coupling control switch and the integrated signal processing assembly are connected or disconnected. The signal detection and conversion module can directly detect the water level and the water temperature of the insulating vessel and judge whether the vessel exists or not according to the connection or disconnection condition of the coupling control switch and the integrated signal processing assembly.

Description

Technical Field

[0001] The utility model relates to the technical field of signal control and detection of small household appliances, in particular to a signal detection conversion module. Background Art

[0002] As living standards improve in modern society, people are increasingly concerned about health and wellness. Pure glassware has become widely used due to its harmless properties. In contrast, the stainless steel or metal utensils commonly used in traditional small appliances are prone to scale formation during heating. As a result, these appliances are gradually turning to pure glassware.

[0003] However, during the manufacturing process of pure glassware, such as blowing, molding, and extrusion, it is difficult to drill holes in the vessel or assemble structural functional parts. As a result, pure glassware usually exists as an independent entity, completely separated from components that require power. To improve the safety of the equipment and the user experience, it is usually necessary to detect whether a vessel is placed on the device and to detect the water temperature and water level in the vessel. Only when the presence of a vessel is detected can the subsequent heating process be carried out; detecting the water temperature can ensure that the heated liquid reaches the ideal temperature; and detecting the water level can effectively prevent the occurrence of dry boiling.

[0004] In insulating containers such as pure glass, traditional pressure sensors, temperature sensors, and water level sensors cannot be directly applied to existing insulating containers due to their limitations. Therefore, new sensor technologies are needed to meet the application requirements of insulating containers in small household appliances. Utility Model Content

[0005] The main purpose of the utility model is to provide a signal detection conversion module, which is intended to detect whether there is an insulating container, and the water temperature and water level of the insulating container.

[0006] To achieve the above objectives, the present invention provides a signal detection and conversion module, which includes a PCB circuit substrate, a water level detection component, a temperature detection component, a coupling control switch, and an integrated signal processing component. The water level detection component is disposed on the PCB circuit substrate and is used to detect the presence and height of liquid in a vessel; the temperature detection component is movably disposed on the PCB circuit substrate and is used to detect the temperature of the vessel; the coupling control switch is disposed between the temperature detection component and the PCB circuit substrate; the integrated signal processing component is disposed on the PCB circuit substrate and is circuit-connected to the water level detection component.

[0007] The temperature detection component is pressurized, driving the coupling control switch to move relative to the PCB circuit substrate to form a first position and a second position;

[0008] In the first position, the coupling control switch is in communication with the integrated signal processing assembly;

[0009] In the second position, the coupling control switch is disconnected from the integrated signal processing component.

[0010] In one embodiment, the PCB circuit substrate is provided with a bracket, and the bracket and the PCB circuit substrate are enclosed to form a movement space; the PCB circuit substrate is provided with a first through hole, and the bracket is provided with a second through hole corresponding to the first through hole, and the temperature detection component is movably inserted into the first through hole and the second through hole; the coupling control switch is sleeved on the outside of the temperature detection component and is located in the movement space, and the signal detection conversion module also includes an elastic member, and the two ends of the elastic member are elastically connected to the coupling control switch and the bracket respectively.

[0011] In one embodiment, the temperature detection assembly includes a sensing tube and a temperature detection body, the sensing tube is movably inserted into the first through hole and the second through hole, the coupling control switch is sleeved on the outside of the sensing tube, and the sensing tube is provided with a accommodating cavity; the temperature detection body is disposed in the accommodating cavity and abuts against an end of the sensing tube away from the opening.

[0012] In one embodiment, the sensing tube includes a column and a sensing portion, the column is formed with a third through hole passing through the column; the sensing portion is connected to one end of the column to close one end of the third through hole, the column and the sensing portion are arranged to form the accommodating cavity, and the temperature detection body abuts against the sensing portion.

[0013] In one embodiment, the temperature detection body includes a thermistor and a wiring harness. The thermistor is disposed in the accommodating cavity and abuts against the sensing portion. One end of the wiring harness is connected to the thermistor.

[0014] In one embodiment, the coupling control switch includes a coupling block and a connecting block, the coupling block is connected to the temperature detection assembly, and a mounting groove is provided on a side of the coupling block facing the PCB circuit substrate; the connecting block is disposed in the mounting groove;

[0015] The temperature detection component drives the coupling block and the communication block to move, so that the communication block is connected to or disconnected from the integrated signal processing component.

[0016] In one embodiment, the coupling block includes a first coupling portion and a second coupling portion, the first coupling portion is connected to the temperature detection component, and the first coupling portion is provided with a limiting groove, and one end of the elastic member is inserted into the limiting groove; the second coupling portion is connected to the first coupling portion, and the mounting groove is formed on the side of the second coupling portion facing away from the first coupling portion.

[0017] In one embodiment, the first coupling portion and the second coupling portion are both cylindrical, and the radius of the first coupling portion is smaller than the radius of the second coupling portion. The first coupling portion and the second coupling portion are coaxially arranged, and the temperature detection component passes through the first coupling portion and the second coupling portion.

[0018] In one embodiment, the water level detection component includes an insulating shell and a water level detection rod, the insulating shell is arranged on the PCB circuit substrate, and the insulating shell and the PCB circuit substrate form an insulating cavity; the water level detection rod is arranged on the PCB circuit substrate, and part of the water level detection rod is located in the insulating cavity, and the water level detection rod is connected to the integrated signal processing component.

[0019] In one embodiment, the PCB circuit substrate is further provided with a power port and an output port, and the integrated signal processing component is respectively connected to the power port and the output port circuits.

[0020] The technical solution of this utility model uses a water level detection component to detect the presence and height of liquid in an insulating container. The temperature detection component not only detects the temperature of the insulating container but also moves under the influence of the gravity or structural extrusion tension of the insulating container, thereby driving the movement of the coupling control switch to connect or disconnect the coupling control switch with the integrated signal processing component. The integrated signal processing component determines the presence of an insulating container based on the connected or disconnected circuit signal, thus resolving the issue of the signal detection conversion module detecting invalid temperatures when it is not in contact with the insulating container. Secondly, the integrated signal processing component can also process the collected signals and issue instructions to control small household appliances to complete various tasks, thereby realizing an artificially intelligent home. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0022] Figure 1 A schematic structural diagram of an embodiment of a signal detection and conversion module provided by the present invention;

[0023] Figure 2 for Figure 1 A structural diagram of the signal detection and conversion module from another perspective;

[0024] Figure 3 for Figure 2 Schematic diagram of the structure of the AA section;

[0025] Figure 4 for Figure 1 Exploded view of the signal detection conversion module.

[0026] Description of Figure Numbers:

[0027] 100. Signal detection conversion module; 1. PCB circuit substrate; 11. Bracket; 112. Second through hole; 12. First through hole; 13. Movement space; 14. Judgment circuit; 141. Contact terminal; 15. Water level circuit; 16. Power port; 17. Output port; 2. Water level detection component; 21. Insulation shell; 211. Isolation cavity; 22. Water level detection rod; 3. Temperature detection component; 31. Sensing tube; 311. Accommodating cavity; 312. Column; 3121. Third through hole; 313. Sensing part; 32. Temperature detection body; 321. Thermistor; 322. Wiring harness; 4. Coupling control switch; 41. Connecting block; 42. Coupling block; 421. First coupling part; 4211. Limiting groove; 422. Second coupling part; 4221. Mounting groove; 5. Integrated signal processing component; 6. Elastic member.

[0028] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0030] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0031] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0032] As living standards improve in modern society, people are increasingly concerned about health and wellness. Pure glassware has gained widespread use due to its harmless properties. In contrast, the stainless steel or metal utensils commonly used in traditional small household appliances are prone to scale formation during heating, potentially releasing harmful heavy metals. These issues are common in appliances such as health pots, coffee makers, electric kettles, and hot pots. Consequently, these appliances are increasingly turning to pure glassware.

[0033] However, during the manufacturing process of pure glassware, such as blowing, molding, and extrusion, it is difficult to drill holes in the vessel or assemble structural functional parts. As a result, pure glassware usually exists as an independent entity, completely separated from components that require power. To improve the safety of the equipment and the user experience, it is usually necessary to detect whether a vessel is placed on the device and to detect the water temperature and water level in the vessel. Only when the presence of a vessel is detected can the subsequent heating process be carried out; detecting the water temperature can ensure that the heated liquid reaches the ideal temperature; and detecting the water level can effectively prevent the occurrence of dry boiling.

[0034] In insulating containers such as pure glass, traditional pressure sensors, temperature sensors, and water level sensors cannot be directly applied to existing insulating containers due to their limitations. Therefore, new sensor technologies are needed to meet the application requirements of insulating containers in small household appliances.

[0035] The present invention provides a signal detection and conversion module 100, which is intended to detect the presence of an insulating container, and the water temperature and water level of the insulating container.

[0036] See also Figures 1 to 4In one embodiment of the present invention, the signal detection and conversion module 100 includes a PCB circuit substrate 1, a water level detection component 2, a temperature detection component 3, a coupling control switch 4, and an integrated signal processing component 5. The water level detection component 2 is disposed on the PCB circuit substrate 1 and is used to detect the presence of liquid and the height of the liquid in the container; the temperature detection component 3 is movably disposed on the PCB circuit substrate 1 and is used to detect the temperature of the container; the coupling control switch 4 is disposed between the temperature detection component 3 and the PCB circuit substrate 1; and the integrated signal processing component 5 is disposed on the PCB circuit substrate 1 and is circuit-connected to the water level detection component 2. The temperature detection component 3 is pressurized, driving the coupling control switch 4 to move relative to the PCB circuit substrate 1 to form a first position and a second position. In the first position, the coupling control switch 4 is connected to the integrated signal processing component 5; in the second position, the coupling control switch 4 is disconnected from the integrated signal processing component 5.

[0037] The signal detection and conversion module 100 comprises a PCB circuit substrate 1, a water level detection assembly 2, a temperature detection assembly 3, a coupling control switch 4, and an integrated signal processing assembly 5. The water level detection assembly 2 is mounted on the PCB circuit substrate 1. The integrated signal processing assembly 5 uses the water level detection assembly 2 to sense the slight current changes caused by the conductive minerals in the liquid within the insulating container, thereby determining the presence and height of the liquid. The temperature detection assembly 3 not only detects the temperature of the insulating container but also moves relative to the PCB circuit substrate 1, using the gravity of the insulating container or the compressive tension of its structure as a trigger to connect or disconnect the coupling control switch 4 with the integrated signal processing assembly 5. The integrated signal processing assembly 5 converts the circuit connection or disconnection signal into a container presence signal, thereby intelligently determining whether the signal detection and conversion module 100 is in contact with the insulating container. The temperature detected by the temperature detection assembly 3 is only considered valid when the signal detection and conversion module 100 is in contact with the insulating container, thus resolving the issue of invalid temperature detection when the signal detection and conversion module 100 is not in contact with the insulating container. Secondly, the integrated signal processing component 5 processes the collected signals and then issues instructions to control small household appliances to complete various simulation states, such as: zero-power standby, automatic water addition, automatic tea brewing, automatic recovery of memory programs, automatic constant temperature and other simulation scene functions, thereby realizing artificial intelligence home.

[0038] In one embodiment, see Figures 2 to 4The PCB circuit substrate 1 is provided with a bracket 11, and the bracket 11 and the PCB circuit substrate 1 are enclosed to form a movement space 13; the PCB circuit substrate 1 is provided with a first through hole 12, and the bracket 11 is provided with a second through hole 112 corresponding to the first through hole 12, and the temperature detection component 3 is movably inserted into the first through hole 12 and the second through hole 112; the coupling control switch 4 is sleeved on the outside of the temperature detection component 3 and is located in the movement space 13, and the signal detection conversion module 100 also includes an elastic member 6, and the two ends of the elastic member 6 are elastically connected to the coupling control switch 4 and the bracket 11 respectively.

[0039] In this embodiment, the PCB circuit substrate 1 not only serves as the structural foundation for the entire signal detection and conversion module 100, but also includes contact terminals 141. These terminals are connected to the integrated signal processing component 5 via a judgment circuit 14 to determine the presence of a container. A temperature detection component 3 is movably mounted on the PCB circuit substrate 1, directly contacting the insulating container. When pressure is applied to the temperature detection component 3, it can move along its axis. A coupling control switch 4 is sleeved onto the exterior of the temperature detection component 3. When the temperature detection component 3 is not under pressure, the coupling control switch 4 remains connected to the contact terminals 141 under the support of the elastic member 6. The judgment circuit 14 is in a connected state, and the coupling control switch 4 is in the first position. At this point, the signal detection and conversion module 100 is in a standby state, ready to respond to an upcoming detection task. Once an insulating container is placed on the signal detection and conversion module 100, the temperature detection component 3 is compressed and moves along its axis, driving the coupling control switch 4 and the elastic member 6 to move until they reach the second position. In the second position, the elastic member 6 is in a compressed state due to being compressed, and the connection between the coupling control switch 4 and the contact terminal 141 is disconnected. The integrated signal processing component 5 can judge that a vessel is placed in the signal detection conversion module 100 at this time through the disconnection signal sent by the judgment circuit 14. In this way, the detection of whether there is a vessel is achieved by changing the on-off state of the judgment circuit 14. Among them, the elastic member 6 can be a spring, a shrapnel or rubber and other elastic materials. The elastic member 6 can withstand large deformation and quickly return to its original state after the external force is removed. When the temperature detection component 3 is subjected to an external force, the elastic member 6 can ensure that the coupling control switch 4 moves smoothly to disconnect the judgment circuit 14; when the external force is removed, the elastic member 6 releases its elastic potential energy, returns to its original state, and presses the coupling control switch 4 against the PCB circuit substrate 1, thereby ensuring that the judgment circuit 14 is connected.

[0040] A bracket 11 is provided on the PCB circuit substrate 1 and is mounted on the PCB circuit substrate 1 via rivets. The PCB circuit substrate 1 is provided with a first through-hole 12, and the bracket 11 is correspondingly provided with a second through-hole 112. The temperature detection assembly 3 is movably inserted through the first through-hole 12 and the second through-hole 112 and is movable along the axis of the first through-hole 12 and the second through-hole 112. A motion space 13 is formed between the PCB circuit substrate 1 and the bracket 11. The coupling control switch 4 and the elastic member 6 are disposed within the motion space 13. The two ends of the elastic member 6 respectively abut the PCB circuit substrate 1 and the bracket 11, thereby enabling the coupling control switch 4 to move smoothly along the axis of the temperature detection assembly 3 within the motion space 13.

[0041] In one embodiment, see Figures 2 to 4 The temperature detection assembly 3 includes a sensing tube 31 and a temperature detection body 32. The sensing tube 31 is movably inserted into the first through hole 12 and the second through hole 112. The coupling control switch 4 is sleeved on the outside of the sensing tube 31. The sensing tube 31 is provided with a receiving cavity 311. The temperature detection body 32 is disposed in the receiving cavity 311 and abuts against the end of the sensing tube 31 away from the opening.

[0042] In this embodiment, the temperature detection component 3 is provided with a sensing tube 31, and a accommodating cavity 311 is provided inside the sensing tube 31. The accommodating cavity 311 not only provides an installation environment for the temperature detection component 3, but also ensures the accuracy of temperature detection and prevents the temperature detection component 3 from external interference.

[0043] In one embodiment, see Figures 2 to 4 The sensing tube 31 includes a column 312 and a sensing portion 313. The column 312 is formed with a third through hole 3121 passing through the column 312. The sensing portion 313 is connected to one end of the column 312 to close one end of the third through hole 3121. The column 312 and the sensing portion 313 are arranged to form an accommodating cavity 311. The temperature detection body 32 is in contact with the sensing portion 313.

[0044] As will be appreciated, the temperature sensing body 32 is disposed within the accommodating cavity 311 and is capable of contacting one side of the sensing portion 313. When the other side of the sensing portion 313 contacts the insulating container, the sensing portion 313 transfers heat, enabling the temperature sensing body 32 to detect the temperature of the insulating container. A spherical protrusion is provided on the side of the sensing portion 313 that contacts the insulating container. This spherical protrusion not only increases the contact area between the sensing portion 313 and the insulating container, improving the efficiency of heat transfer, but also, through its spherical shape, reduces friction with the surface of the insulating container, thereby extending the service life of the sensing tube 31.

[0045] In one embodiment, see Figures 2 to 4The temperature detection body 32 includes a thermistor 321 and a wiring harness 322. The thermistor 321 is disposed in the accommodating cavity 311 and abuts against the sensing portion 313. One end of the wiring harness 322 is connected to the thermistor 321.

[0046] In this embodiment, a thermistor 321 is disposed within the housing cavity 311 and is used to receive heat transferred from the sensing portion 313, thereby measuring the temperature of the container. The thermistor 321 has the characteristic of significantly changing its resistance value with changes in temperature, allowing the thermistor 321 to convert temperature changes into changes in resistance value, and then into a readable electrical signal. A wiring harness 322 is connected to the thermistor 321 and is connected to other circuit systems. When the thermistor 321 adjusts its resistance value with changes in temperature, the wiring harness 322 transmits this signal to the circuit system, which then uses the signal to determine the current temperature of the insulating container.

[0047] In one embodiment, see Figures 2 to 4 The coupling control switch 4 includes a coupling block 42 and a connecting block 41. The coupling block 42 is connected to the temperature detection assembly 3, and a mounting groove 4221 is defined on the side of the coupling block 42 facing the PCB circuit substrate 1. The connecting block 41 is positioned within the mounting groove 4221. The temperature detection assembly 3 drives the coupling block 42 and connecting block 41 to move, thereby connecting or disconnecting the connecting block 41 from the integrated signal processing assembly 5.

[0048] In this embodiment, the coupling block 42 is directly connected to the sensing tube 31. A mounting slot 4221 for the communication block 41 is provided on the side of the coupling block 42 facing the PCB circuit substrate 1, ensuring that the communication block 41 can move stably with the coupling block 42. Driven by the sensing tube 31, the communication block 41 can move relative to the contact terminals 141 of the determination circuit 14 to connect or disconnect the two contact terminals 141. Generally, the communication block 41 is made of metal and is used to connect the two contact terminals 141.

[0049] In one embodiment, see Figures 2 to 4 The coupling block 42 includes a first coupling portion 421 and a second coupling portion 422. The first coupling portion 421 is connected to the temperature detection assembly 3 and has a retaining groove 4211 formed therein. One end of the elastic member 6 is inserted into the retaining groove 4211. The second coupling portion 422 is connected to the first coupling portion 421 and has a mounting groove 4221 formed on the side of the second coupling portion 422 facing away from the first coupling portion 421.

[0050] In this embodiment, a limiting groove 4211 is provided on the side of the first coupling portion 421 facing the elastic member 6. The limiting groove 4211 not only provides a movement space 13 for the elastic member 6, but also ensures that the elastic member 6 can deform along the extension direction of the limiting groove 4211 when subjected to force, thereby ensuring the stability of the coupling block 42 during movement. The mounting groove 4221 is provided on the side of the second coupling portion 422 facing the PCB circuit substrate 1 to ensure that the connecting block 41 can connect or disconnect with the two contact terminals 141 during movement.

[0051] In one embodiment, see Figures 2 to 4 The first coupling part 421 and the second coupling part 422 are both cylindrical, and the radius of the first coupling part 421 is smaller than the radius of the second coupling part 422. The first coupling part 421 and the second coupling part 422 are coaxially arranged, and the temperature detection component 3 passes through the first coupling part 421 and the second coupling part 422.

[0052] In this embodiment, the first coupling portion 421 and the second coupling portion 422 are both cylindrical and coaxially arranged. The sensing tube 31 extends through the central axis of the first and second coupling portions 421, 422, ensuring balanced force during movement of the coupling block 42. The radius of the first coupling portion 421 is smaller than that of the second coupling portion 422, which not only gives the coupling block 42 a sense of structure but also the larger radius of the second coupling portion 422 provides more stable support, ensuring stable connection between the connection block 41 and the contact terminal 141.

[0053] In one embodiment, see Figures 2 to 4 The water level detection assembly 2 includes an insulating housing 21 and a water level detection rod 22. The insulating housing 21 is disposed on the PCB circuit substrate 1, and the insulating housing 21 and the PCB circuit substrate 1 enclose an insulating cavity 211. The water level detection rod 22 is disposed on the PCB circuit substrate 1, with a portion of the water level detection rod 22 located within the insulating cavity 211. The water level detection rod 22 is connected to the integrated signal processing assembly 5.

[0054] In this embodiment, a water level probe 22 is also provided on the PCB circuit substrate 1. The water level probe 22 determines the presence of liquid and the height of the liquid by sensing the slight current change caused by the conductive minerals in the liquid in the insulating container. The integrated signal processing component 5 is connected to the water level probe 22 through the water level circuit 15. When the liquid level in the water level probe 22 is lower than the preset safety height, the water level probe 22 cannot detect the liquid. The integrated signal processing component 5 controls the alarm and automatically cuts off the power to ensure the safe operation of the device. Optionally, an insulating shell 21 is provided outside the water level probe 22 to prevent users or other objects from directly contacting the water level probe 22, thereby avoiding safety hazards such as electric shock.

[0055] In one embodiment, see Figures 2 to 4 The PCB circuit substrate 1 is further provided with a power port 16 and an output port 17 , and the integrated signal processing component 5 is circuit-connected to the power port 16 and the output port 17 respectively.

[0056] In this embodiment, the integrated signal processing component 5 is used to receive and process the conductive signal from the water level circuit 15, and to perform the logical judgment task in the judgment circuit 14. In particular, the integrated signal processing component 5 is a touch chip, which can not only monitor the water level of the liquid in the container in real time and perform corresponding operations according to the preset logical judgment rules, but also interact with the user through touch operations, thereby improving the practicality of the device and user experience. A power port 16 and an output port 17 connected to the integrated signal processing component 5 circuit are also provided on both sides of the integrated signal processing component 5. The power port 16 can be connected to a standard power plug or battery pack to provide a stable power supply for the integrated signal processing component 5. When the integrated signal processing component 5 has processed the signals of the water level circuit 15 and the judgment circuit 14, it will immediately transmit the results to the external device through the output port 17 for the user to view or perform corresponding operations.

[0057] The detection process of the signal detection conversion module 100 of the present invention is as follows:

[0058] The insulating container is placed on the signal detection conversion module 100. The insulating container generates pressure on the sensing portion 313, and the sensing tube 31 moves accordingly, thereby disconnecting the connecting block 41 from the judgment circuit 14. The signal detection conversion module 100 detects the placement of the insulating container. The temperature detection body 32 located in the accommodating cavity 311 detects the temperature of the insulating container through heat transfer from the sensing portion 313. The water level detection rod 22 located on the PCB circuit substrate 1 detects whether the liquid level in the insulating container is higher than the safe level based on the weak current changes of the conductive minerals in the liquid. Once the liquid level is lower than the safe level, an alarm is issued and heating is stopped. After the insulating container is removed, the elastic member 6 is reset, so that the connecting block 41 is reconnected to the judgment circuit 14.

[0059] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A signal detection and conversion module, characterized in that: The signal detection conversion module includes a PCB circuit substrate, a water level detection component, a temperature detection component, a coupling control switch, and an integrated signal processing component. The water level detection component is disposed on the PCB circuit substrate and is used to detect the presence of liquid and the height of the liquid in the vessel. The temperature detection component is movably disposed on the PCB circuit substrate and is used to detect the temperature of the vessel. The coupling control switch is disposed between the temperature detection component and the PCB circuit substrate. The integrated signal processing component is disposed on the PCB circuit substrate and is circuit-connected to the water level detection component. The temperature detection component is pressurized, driving the coupling control switch to move relative to the PCB circuit substrate to form a first position and a second position; In the first position, the coupling control switch is in communication with the integrated signal processing assembly; In the second position, the coupling control switch is disconnected from the integrated signal processing component.

2. The signal detection conversion module according to claim 1, wherein: The PCB circuit substrate is provided with a bracket, and the bracket and the PCB circuit substrate are enclosed to form a movement space; the PCB circuit substrate is provided with a first through hole, and the bracket is provided with a second through hole corresponding to the first through hole, and the temperature detection component is movably inserted into the first through hole and the second through hole; the coupling control switch is sleeved on the outside of the temperature detection component and is located in the movement space, and the signal detection conversion module also includes an elastic member, and the two ends of the elastic member are elastically connected to the coupling control switch and the bracket respectively.

3. The signal detection conversion module according to claim 2, wherein: The temperature detection assembly includes a sensing tube and a temperature detection body. The sensing tube is movably inserted into the first through hole and the second through hole. The coupling control switch is sleeved on the outside of the sensing tube. The sensing tube is provided with an accommodating cavity. The temperature detection body is disposed in the accommodating cavity and abuts against an end of the sensing tube away from the opening.

4. The signal detection conversion module according to claim 3, wherein: The sensing tube includes a column and a sensing portion, the column is formed with a third through hole penetrating the column; the sensing portion is connected to one end of the column to close one end of the third through hole, the column and the sensing portion are arranged to form the accommodating cavity, and the temperature detection body abuts against the sensing portion.

5. The signal detection conversion module according to claim 4, wherein: The temperature detection body includes a thermistor and a wiring harness. The thermistor is arranged in the accommodating cavity and abuts against the sensing portion. One end of the wiring harness is connected to the thermistor.

6. The signal detection conversion module according to claim 2, wherein: The coupling control switch includes a coupling block and a connecting block, wherein the coupling block is connected to the temperature detection component, and a mounting groove is provided on a side of the coupling block facing the PCB circuit substrate; the connecting block is arranged in the mounting groove; The temperature detection component drives the coupling block and the communication block to move, so that the communication block is connected to or disconnected from the integrated signal processing component.

7. The signal detection conversion module according to claim 6, wherein: The coupling block includes: a first coupling part and a second coupling part, the first coupling part is connected to the temperature detection component, and the first coupling part is provided with a limiting groove, one end of the elastic member is inserted into the limiting groove; the second coupling part is connected to the first coupling part, and the mounting groove is formed on the side of the second coupling part away from the first coupling part.

8. The signal detection conversion module according to claim 7, wherein: The first coupling portion and the second coupling portion are both cylindrical, and the radius of the first coupling portion is smaller than the radius of the second coupling portion. The first coupling portion and the second coupling portion are coaxially arranged, and the temperature detection component passes through the first coupling portion and the second coupling portion.

9. The signal detection conversion module according to any one of claims 2 to 8, characterized in that: The water level detection component includes an insulating shell and a water level detection rod. The insulating shell is arranged on the PCB circuit substrate, and the insulating shell and the PCB circuit substrate form an insulating cavity; the water level detection rod is arranged on the PCB circuit substrate, and part of the water level detection rod is located in the insulating cavity. The water level detection rod is connected to the integrated signal processing component.

10. The signal detection conversion module according to claim 9, wherein: The PCB circuit substrate is also provided with a power port and an output port, and the integrated signal processing component is respectively connected to the power port and the output port circuits.

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