Ceramic piezoresistive sensor core structure

Abstract

The utility model relates to the technical field of ceramic piezoresistive sensors, in particular to a core structure of a ceramic piezoresistive sensor, which comprises a bottom plate, a casing and radiating fins, the casing is movably connected above the bottom plate, the radiating fins are fixedly mounted at the front end of the outer wall of the casing, casing detachable structures are arranged on two sides above the bottom plate, and the casing detachable structures are arranged on the bottom plate. And a ceramic piezoresistive sensor core body structure is arranged on the inner side of the upper part of the bottom plate. According to the core structure of the ceramic piezoresistive sensor, when the shell is installed, the inner wall of the shell can push the clamping block to bend backwards until the front end position of the clamping block is opposite to the installation hole, at the moment, the clamping block is pushed outwards through elasticity provided by contraction of the compression spring, the clamping block is inserted into the inner side of the installation hole, and then connection and fixation of the shell and the bottom plate below can be achieved; according to the ceramic piezoresistive sensor core structure, the convenient shell mounting structure is utilized, so that when the pressure chip goes wrong, the pressure chip can be dismounted and repaired in time, and the use convenience of the ceramic piezoresistive sensor core structure is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of ceramic piezoresistive sensors, in particular to a core structure of a ceramic piezoresistive sensor. Background Art

[0002] Ceramic pressure sensors are made of ceramic materials and are characterized by high elasticity, corrosion resistance, wear resistance, shock resistance, and vibration resistance. The sensor operates based on the piezoresistive effect. When pressure is applied directly to the front surface of a ceramic diaphragm, the diaphragm undergoes slight deformation. This deformation causes a Wheatstone bridge circuit (thick-film resistors printed on the back of the diaphragm) to generate a voltage signal proportional to the pressure.

[0003] For example, the authorization announcement number "CN216483617U" is named as a new type of ceramic pressure sensor core. The epoxy resin coating is attached to the surface of the shell to block the shell from contacting the outside world and prevent the shell from rusting, thereby realizing the anti-corrosion and water-proof function of the device, preventing the surface of the device from being corroded by long-term contact with water vapor, and extending the service life of the device. However, the existing new type of ceramic pressure sensor core uses a structure that can be quickly installed at a designated location to use a ceramic pressure sensor, but the current ceramic pressure sensor still has an external shell and a lower end bottom plate fixed to form an integrated structure, so that the internal pressure chip and other structures are completely hidden inside the shell. Whenever the pressure chip fails or malfunctions, it cannot be disassembled in time for inspection, affecting the ease of use of the new type of ceramic pressure sensor core.

[0004] At the same time, the existing new ceramic pressure sensor core is fixed by the extrusion force provided by the deformation of the rubber sleeve when the vertical pressure rod is dropped. In this way, the fixation of the rod is not firm, and the rod can also move up and down manually. At the same time, the bottom plate pressed down by the rod will also move and loosen. As the ceramic pressure sensor is used for a longer time, the looseness will become more and more serious, and finally affect the installation firmness of the new ceramic pressure sensor core. Utility Model Content

[0005] The utility model aims to solve the problems of inconvenient use and loose installation of existing new ceramic pressure sensor cores, and proposes a ceramic piezoresistive sensor core structure.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A ceramic piezoresistive sensor core structure is designed, including a base plate, a shell and a heat sink. The shell is movably connected above the base plate, and multiple heat sinks are fixedly installed on the front end of the outer wall of the shell. Removable shell structures are provided on both sides above the base plate, a ceramic piezoresistive sensor core structure is provided on the inner side above the base plate, and a reinforced mounting structure is provided on the outer side of the base plate.

[0008] Preferably, the detachable structure of the shell includes a support block and a mounting hole, the two support blocks are fixedly mounted on both sides above the base plate, the top ends of the two support blocks are fixedly connected to a movable plate, the outer wall of the movable plate is fixedly connected to a clamping block, the rear sides of the outer walls of the two clamping blocks are fixedly connected to a compression spring, the other ends of the two compression springs are fixedly connected to the top side wall of the support block, the two mounting holes are fixedly opened on the outer wall of the shell, and the inner sides of the two mounting holes are movably connected to the clamping block.

[0009] Preferably, the core structure of the ceramic piezoresistive sensor includes a pressure chip and a heat dissipation structure, the heat dissipation structure is fixedly installed above the base plate, the outer wall of the heat dissipation structure is fixedly connected to the inner side of the heat sink, the upper end of the heat dissipation structure is fixedly installed with a pressure chip, the top of the pressure chip is fixedly connected with a connecting column, and auxiliary reinforcement frames are fixedly connected to both sides of the inner wall of the shell.

[0010] Preferably, the top end of the connecting column is movably connected to a diaphragm, and the diaphragm is fixedly embedded in the inner side of the top end of the shell.

[0011] Preferably, the reinforced mounting structure includes a mounting seat and a fixing plate, and multiple mounting seats are fixedly mounted on both ends of the outer wall of the base plate. The fixing plate is movably connected to the outer side of the mounting seat, and the top end of the fixing plate is fixedly connected to a limiting hoop, and a groove is fixedly provided on the inner side of the limiting hoop, and the inner side of the groove is movably connected to the top end of the mounting seat, and the internal thread of the fixing plate is connected with multiple mounting screws.

[0012] Preferably, two pins are fixedly mounted on the lower end of the base plate.

[0013] The utility model proposes a ceramic piezoresistive sensor core structure, which has the following beneficial effects: the support blocks are welded on both sides above the base plate, the size of the card block is consistent with the inner diameter of the mounting hole, the rear side of the compression spring will push the card block forward vertically under the push of the support block, and when the shell is installed, the inner wall of the shell can push the card block to bend backward until the front end of the card block is opposite to the mounting hole. At this time, the elasticity provided by the contraction of the compression spring will push the card block outward, and the card block is inserted into the inside of the mounting hole to realize the connection and fixation between the shell and the base plate below. The convenient shell installation structure is used, so that the pressure chip can be disassembled and repaired in time when problems occur, thereby improving the ease of use of the ceramic piezoresistive sensor core structure.

[0014] The mounting base is used to be connected to the fixing plate. The mounting base is made of a trapezoidal metal stainless steel block. The mounting base is welded to the left and right sides of the base plate. One side of the limiting hoop is welded and fixed to the fixing plate. The groove on the inside of the limiting hoop is buckled on the top protruding head of the mounting base. At this time, you only need to lift and set the fixing plate in the specified position, and use the mounting screws above to rotate and fix it to the installation position. In this way, the limiting hoop can press down the mounting base and lock it firmly in the position where it needs to be installed. By fixing the mounting base in a more secure downward pressure, the loosening of the base plate can be reduced, and the installation firmness of the ceramic piezoresistive sensor core structure can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional schematic diagram of the utility model;

[0016] Figure 2 for Figure 1 A front cross-sectional schematic diagram of ;

[0017] Figure 3 for Figure 1 Schematic diagram of the top surface;

[0018] Figure 4 for Figure 2 Enlarged cross-sectional view of part A in the middle;

[0019] Figure 5 for Figure 2 Enlarged cross-sectional view of part B in the middle;

[0020] Figure 6 for Figure 2 Enlarged cross-sectional view of part C in the middle.

[0021] In the figure: 1. Base plate, 2. Shell, 3. Diaphragm, 4. Heat sink, 5. Pin, 6. Removable shell structure, 61. Support block, 62. Compression spring, 63. Movable plate, 64. Block, 65. Mounting hole, 7. Ceramic piezoresistive sensor core structure, 71. Pressure chip, 72. Heat dissipation structure, 73. Connecting column, 74. Auxiliary reinforcement frame, 8. Reinforced mounting structure, 81. Mounting seat, 82. Limiting hoop, 83. Groove, 84. Fixing plate, 85. Mounting screws. DETAILED DESCRIPTION

[0022] The present invention will be further described below with reference to the accompanying drawings:

[0023] Example 1:

[0024] See also Figure 1-6In this embodiment, a ceramic piezoresistive sensor core structure includes a base plate 1, a shell 2 and a heat sink 4. The shell 2 is movably connected to the top of the base plate 1, and multiple heat sinks 4 are fixedly installed on the front end of the outer wall of the shell 2. The heat sink 4 is made of metal copper tubes. Metal copper has good conductivity. The heat sink 4 made of metal copper can conduct the heat of the pressure chip 71 inside the shell 2 during operation to the outside for dissipation. A shell detachable structure 6 is provided on both sides above the base plate 1, a ceramic piezoresistive sensor core structure 7 is provided on the inner side of the top of the base plate 1, and a reinforced mounting structure 8 is provided on the outer side of the base plate 1.

[0025] The detachable structure 6 of the shell includes a support block 61 and a mounting hole 65. The two support blocks 61 are fixedly installed on both sides above the base plate 1. The top ends of the two support blocks 61 are fixedly connected with a movable plate 63. The support blocks 61 are welded on both sides above the base plate 1. The outer wall of the movable plate 63 is fixedly connected with a clamping block 64. The size of the clamping block 64 matches the inner diameter of the mounting hole 65. The rear side of the compression spring 62 will push the clamping block 64 forward vertically under the push of the support block 61. When the shell 2 is installed, the shell 2 is directly pressed vertically downward to fall above the base plate 1.

[0026] At this time, the inner wall of the shell 2 can push the block 64 to bend backward until the front end of the block 64 is opposite to the mounting hole 65. At this time, the elasticity provided by the contraction of the compression spring 62 will push the block 64 outward, and the block 64 is inserted into the inner side of the mounting hole 65, so that the connection and fixation between the shell 2 and the lower base plate 1 can be achieved. Conversely, when it is necessary to disassemble the shell 2 to inspect the pressure chip 71, the block 64 can be pressed in the reverse direction to retract it from the position of the mounting hole 65. The rear side of the outer wall of the two blocks 64 is fixedly connected to the compression spring 62, and the other end of the two compression springs 62 is fixedly connected to the top side wall of the support block 61. The two mounting holes 65 are fixedly opened on the outer wall of the shell 2, and the inner sides of the two mounting holes 65 are movably connected to the block 64.

[0027] The support blocks 61 are welded to the upper two sides of the bottom plate 1, and the size of the block 64 matches the inner diameter of the mounting hole 65. The rear side of the compression spring 62 will push the block 64 forward vertically under the push of the support block 61. When the shell 2 is installed, the shell 2 is directly pressed vertically downward to fall on the bottom plate 1. At this time, the inner wall of the shell 2 can push the block 64 to bend backward until the front end of the block 64 is opposite to the mounting hole 65. At this time, the elasticity provided by the compression spring 62 contraction will push the block 64 outward, and the block 64 is inserted into the inner side of the mounting hole 65, thereby realizing the connection and fixation between the shell 2 and the bottom plate 1 below. On the contrary, when the shell 2 needs to be disassembled to inspect the pressure chip 71, the block 64 can be pressed in the reverse direction to retract it away from the mounting hole 65. The convenient shell mounting structure allows the pressure chip to be disassembled and repaired in time when problems occur, thereby improving the ease of use of the ceramic piezoresistive sensor core structure.

[0028] The reinforced mounting structure 8 includes a mounting seat 81 and a fixing plate 84. Multiple mounting seats 81 are fixedly mounted on both ends of the outer wall of the base plate 1. The fixing plate 84 is movably connected to the outside of the mounting seat 81. The mounting seat 81 is used to be connected to the fixing plate 84. The mounting seat 81 is made of a trapezoidal metal stainless steel block. The mounting seat 81 is welded to the left and right sides of the base plate 1. The top of the fixing plate 84 is fixedly connected to the limiting hoop 82, and one side of the limiting hoop 82 is welded to the fixing plate 84.

[0029] The groove 83 on the inner side of the limiting hoop 82 is buckled on the top protruding head of the mounting seat 81. At this time, you only need to lift and set the fixing plate 84 to the specified position, and use the mounting screws 85 on the top to rotate and screw it to fix it in the mounting position. In this way, the limiting hoop 82 can press down the mounting seat 81 and lock it firmly in the required installation position. The inner side of the limiting hoop 82 is fixed with a groove 83, and the inner side of the groove 83 is movably connected to the top of the mounting seat 81. The internal thread of the fixing plate 84 is connected with multiple mounting screws 85;

[0030] The mounting seat 81 is used to be connected to the fixing plate 84. The mounting seat 81 is made of a trapezoidal metal stainless steel block. The mounting seat 81 is welded to the left and right sides of the base plate 1. One side of the limiting hoop 82 is welded and fixed to the fixing plate 84. The groove 83 on the inner side of the limiting hoop 82 is buckled on the top protruding head of the mounting seat 81.

[0031] At this time, you only need to lift and set the fixing plate 84 in the specified position, and use the mounting screws 85 above to rotate and screw it to fix it in the installation position. In this way, the limiting hoop 82 can press down the mounting seat 81 and lock it firmly in the position where it needs to be installed. By fixing the mounting seat 81 in a more firm downward pressure, the loosening of the base plate 1 can be reduced, and the installation firmness of the ceramic piezoresistive sensor core structure can be improved.

[0032] Working principle:

[0033] The core structure of a ceramic piezoresistive sensor is based on the piezoresistive effect. When pressure acts directly on the front surface of the ceramic diaphragm, the diaphragm will produce a slight deformation. This deformation causes the Wheatstone bridge of thick-film resistors printed on the back of the ceramic diaphragm to generate a voltage signal proportional to the pressure. Ceramic pressure sensors are commonly used to measure the pressure of liquids or gases in pipes, containers, and other equipment. They have the advantages of high precision, high sensitivity, corrosion resistance, and long life. The sensor is activated by the electrical signal generated by the pressure deformation of the diaphragm 3 at the top of the housing 2.

[0034] Shell disassembly structure of ceramic piezoresistive sensor core structure:

[0035] The support blocks 61 are welded to the upper two sides of the bottom plate 1, and the size of the block 64 matches the inner diameter of the mounting hole 65. The rear side of the compression spring 62 will push the block 64 forward vertically under the push of the support block 61. When the shell 2 is installed, the shell 2 is directly pressed vertically downward to fall on the bottom plate 1. At this time, the inner wall of the shell 2 can push the block 64 to bend backward until the front end of the block 64 is opposite to the mounting hole 65. At this time, the elasticity provided by the compression spring 62 contraction will push the block 64 outward, and the block 64 is inserted into the inner side of the mounting hole 65, thereby realizing the connection and fixation between the shell 2 and the bottom plate 1 below. On the contrary, when the shell 2 needs to be disassembled to inspect the pressure chip 71, the block 64 can be pressed in the reverse direction to retract it away from the mounting hole 65.

[0036] Firm installation structure of ceramic piezoresistive sensor core structure;

[0037] The mounting base 81 is used to be connected to the fixing plate 84. The mounting base 81 is made of a trapezoidal metal stainless steel block. The mounting base 81 is welded to the left and right sides of the base plate 1. One side of the limiting hoop 82 is welded and fixed to the fixing plate 84. The groove 83 on the inner side of the limiting hoop 82 is buckled on the top protruding head of the mounting base 81. At this time, you only need to lift and set the fixing plate 84 in the specified position, and use the mounting screw 85 above to rotate and screw it to fix it in the installation position. In this way, the limiting hoop 82 can press down the mounting base 81 and lock it firmly in the position where it needs to be installed. Fixing the mounting base 81 by pressing down more firmly can reduce the loosening of the base plate 1.

[0038] Example 2:

[0039] See also Figure 1-6 In this embodiment, a ceramic piezoresistive sensor core structure includes a ceramic piezoresistive sensor core structure 7, including a pressure chip 71 and a heat dissipation structure 72. The heat dissipation structure 72 is fixedly installed above the base plate 1, and the outer wall of the heat dissipation structure 72 is fixedly connected to the inner side of the heat sink 4. The heat dissipation structure 72 has the same working structure as the comparative document, and is composed of a heat conduction plate, a silicone grease layer, a connecting plate and a fin. The working method is that the silicone grease layer is applied to the bottom of the pressure chip to accelerate the heat transfer from the pressure chip to the heat conduction plate, and then the heat conduction plate transfers the heat to the inside of the connecting plates on both sides.

[0040] The fins are used to increase the heat dissipation area of ​​the connecting plate, and the heat transfer from the connecting plate to the outside is accelerated. A pressure chip 71 is fixedly installed on the upper end of the heat dissipation structure 72, and a connecting column 73 is fixedly connected to the top of the pressure chip 71. The pressure chip 71 belongs to the existing technology disclosed in the comparative document with the publication number "CN216483617U" and is named a new type of ceramic pressure sensor core. The pressure chip 71 can receive and process the electrical signal generated by the compressive deformation of the top diaphragm 3. Auxiliary reinforcement frames 74 are fixedly connected on both sides of the inner wall of the shell 2. The auxiliary reinforcement frame 74 is made of lighter metal aluminum material. The auxiliary reinforcement frame 74 is a triangular stable structure, and the pressure resistance of the inner side of the shell 2 can be improved by the auxiliary reinforcement frame 74. The top of the connecting column 73 is movably connected to the diaphragm 3, and the diaphragm 3 is fixedly embedded in the inner side of the top of the shell 2. Two pins 5 are fixedly installed on the lower end of the bottom plate 1. The pin 5 can use a device with the same functional structure as the comparative document, and the interface provided to the outside by the hardware chip is a pin-type interface, so the pin 5 can be welded and fixed to the circuit board.

[0041] Working principle:

[0042] The heat dissipation structure 72 has the same working principle as the structure in the comparative document, and is composed of a heat conducting plate, a silicone grease layer, a connecting plate and fins. The working method is that the silicone grease layer is applied to the bottom of the pressure chip to accelerate the pressure chip to transfer heat to the heat conducting plate, and then the heat conducting plate transfers the heat to the inside of the connecting plates on both sides, and the heat dissipation area of ​​the connecting plates is increased through the fins, which accelerates the connection plates to transfer heat to the outside world. The pressure chip 71 can receive and process the electrical signal generated by the compressive deformation of the top diaphragm 3. The auxiliary reinforcement frame 74 is made of lighter metal aluminum material. The auxiliary reinforcement frame 74 is a triangular stable structure, and the auxiliary reinforcement frame 74 can be used to improve the pressure resistance of the inner side of the shell 2.

[0043] While the present invention has been shown and described with reference to preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein within the scope of the claims.

Claims

1. A ceramic piezoresistive sensor core structure, comprising a base plate (1), a shell (2) and a heat sink (4), wherein the shell (2) is movably connected above the base plate (1), and a plurality of heat sinks (4) are fixedly mounted on the front end of the outer wall of the shell (2), characterized in that: A detachable shell structure (6) is provided on both sides above the base plate (1), a ceramic piezoresistive sensor core structure (7) is provided on the inner side above the base plate (1), and a reinforced mounting structure (8) is provided on the outer side of the base plate (1).

2. The ceramic piezoresistive sensor core structure according to claim 1, characterized in that: The shell detachable structure (6) includes a support block (61) and a mounting hole (65), the two support blocks (61) are fixedly mounted on both sides above the bottom plate (1), the top ends of the two support blocks (61) are fixedly connected to a movable plate (63), the outer wall of the movable plate (63) is fixedly connected to a clamping block (64), the rear side of the outer wall of the two clamping blocks (64) is fixedly connected to a compression spring (62), the other ends of the two compression springs (62) are fixedly connected to the top side wall of the support block (61), the two mounting holes (65) are fixedly opened on the outer wall of the shell (2), and the inner sides of the two mounting holes (65) are movably connected to the clamping block (64).

3. The ceramic piezoresistive sensor core structure according to claim 1, characterized in that: The ceramic piezoresistive sensor core structure (7) includes a pressure chip (71) and a heat dissipation structure (72), wherein the heat dissipation structure (72) is fixedly mounted above the base plate (1), and the outer wall of the heat dissipation structure (72) is fixedly connected to the inner side of the heat sink (4), and the pressure chip (71) is fixedly mounted on the upper end of the heat dissipation structure (72), and the top end of the pressure chip (71) is fixedly connected to a connecting column (73), and auxiliary reinforcement frames (74) are fixedly connected to both sides of the inner wall of the housing (2).

4. The ceramic piezoresistive sensor core structure according to claim 3, characterized in that: The top end of the connecting column (73) is movably connected to a diaphragm (3), and the diaphragm (3) is fixedly embedded in the inner side of the top end of the housing (2).

5. The ceramic piezoresistive sensor core structure according to claim 1, characterized in that: The reinforced mounting structure (8) includes a mounting seat (81) and a fixing plate (84), wherein a plurality of the mounting seats (81) are fixedly mounted on both ends of the outer wall of the base plate (1), and the fixing plate (84) is movably connected to the outer side of the mounting seat (81). The top end of the fixing plate (84) is fixedly connected to a limiting hoop (82), and a groove (83) is fixedly provided on the inner side of the limiting hoop (82). The inner side of the groove (83) is movably connected to the top end of the mounting seat (81), and the inner thread of the fixing plate (84) is connected to a plurality of mounting screws (85).

6. The ceramic piezoresistive sensor core structure according to claim 1, characterized in that: Two pins (5) are fixedly mounted on the lower end of the base plate (1).

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