Simulation heat source circuit and simulation heat source device

Abstract

The utility model discloses a simulation heat source circuit and a simulation heat source device, and relates to the field of heat testing, a plurality of heat production modules can be arranged at different positions of a circuit board, and the heat production conditions of an electronic chip to be tested at different positions in the working process are simulated through the plurality of heat production modules arranged on the circuit board. The power supplies are connected with the heat production modules in a one-to-one correspondence manner, and the voltage output condition of each power supply can be flexibly adjusted according to the actual application condition of the electronic chip in the test process, so that the heat production power of each heat production module is adjusted, and the power consumption of different areas in the simulated heat source circuit can be independently controlled; by independently controlling the heat production amount of each heat production module, the heat production conditions of different types of actual electronic chips such as uniform heat flux chips or non-uniform heat flux chips in the working process can be simulated more accurately, the flexibility is high, and the application range is wide.

Description

Technical Field

[0001] The utility model relates to the field of thermal testing, in particular to a simulated heat source circuit and a simulated heat source device. Background Art

[0002] With the rapid increase in electronic packaging integration, the continuous reduction in microelectronic chip structure size, the continuous increase in chip power, and the continued increase in power density, the heat flux density generated by electronic chips during operation is becoming increasingly higher. The heat dissipation methods for electronic chips are also constantly evolving, from solid air-cooled heat sinks to VC (vapor chamber) + heat pipe air-cooled heat sink modules, water-cooled plates, immersion heat sinks, and other methods. During the research and development and design process, different types of heat sinks, such as air-cooled and liquid-cooled, require testing to verify the heat transfer performance and ensure the heat dissipation effect during application. During the heat sink thermal testing process, it is necessary to set up a simulated heat source circuit to simulate the chip's heat generation process.

[0003] In the process of realizing the present invention, the inventors discovered that the prior art has at least the following problems:

[0004] At present, simulated heat sources such as heating rods combined with copper blocks or heating wires combined with ceramics are usually used to simulate the heat generation process of chips. This type of simulated heat source can only provide uniform heat flux density, but most chips are in the form of uneven heat sources. Therefore, this type of simulated heat source cannot accurately simulate the heat generation of chips in the form of uneven heat sources.

[0005] Therefore, how to set up a simulated heat source circuit so that it can accurately simulate the heat generation of an actual chip is a technical problem that urgently needs to be solved. Utility Model Content

[0006] The purpose of the utility model is to provide a simulated heat source circuit and a simulated heat source device, which can more accurately simulate the heat generation of an actual chip.

[0007] In order to solve the above technical problems, the present invention provides a simulated heat source circuit, comprising:

[0008] circuit boards;

[0009] a plurality of heat generating modules arranged on the circuit board;

[0010] Several power supplies are connected one-to-one with the heat generating modules, with the positive pole of the power supply connected to the positive power supply terminal of the corresponding heat generating module, and the negative pole is connected to the negative power supply terminal of the corresponding heat generating module, and are used to output voltages of different sizes to the corresponding heat generating module according to test requirements to control the heat generation of the heat generating module.

[0011] Optionally, the heat generating module includes a first packaging shell, a first heat generating chip, a second heat generating chip, and a third heat generating chip, wherein the first packaging shell is rectangular, and the first heat generating chip, the second heat generating chip, and the third heat generating chip are arranged in a herringbone shape in the first packaging shell;

[0012] The positive power supply terminal of the first heat generating chip, the positive power supply terminal of the second heat generating chip, and the positive power supply terminal of the third heat generating chip are all connected to the positive electrode of the corresponding power supply, and the negative power supply terminal of the first heat generating chip, the negative power supply terminal of the second heat generating chip, and the negative power supply terminal of the third heat generating chip are all connected to the negative electrode of the corresponding power supply.

[0013] Optionally, the heat generating module includes a second packaging shell, a fourth heat generating chip and a fifth heat generating chip, the second packaging shell is rectangular, and the fourth heat generating chip and the fifth heat generating chip are arranged diagonally in the second packaging shell;

[0014] The positive power supply terminal of the fourth heat generating chip and the positive power supply terminal of the fifth heat generating chip are both connected to the positive pole of the corresponding power supply, and the negative power supply terminal of the fourth heat generating chip and the negative power supply terminal of the fifth heat generating chip are both connected to the negative pole of the corresponding power supply.

[0015] Optionally, the heat generating module is a single heat generating chip.

[0016] Optionally, the heat generating chip in the heat generating module includes a packaging substrate and several heating resistors evenly arranged on the packaging substrate, the positive pole of the heating resistor serves as the positive power supply terminal of the heat generating module, and the negative pole of the heating resistor serves as the negative power supply terminal of the heat generating module.

[0017] Optionally, the heat generating chip is arranged on the circuit board by wire bonding packaging.

[0018] Optionally, the heat generating chip is provided on the circuit board by flip-chip packaging.

[0019] Optionally, also include:

[0020] A plurality of temperature acquisition modules are connected to the heat generating modules in a one-to-one correspondence, and the input ends are connected to the corresponding heat generating modules for acquiring the temperatures of the corresponding heat generating modules.

[0021] Optionally, the temperature acquisition module includes:

[0022] Temperature measurement power supply;

[0023] A temperature measuring diode is provided on the packaging substrate of any heat generating chip in the corresponding heat generating module, wherein the positive electrode of the temperature measuring diode is connected to the output end of the temperature measuring power supply and the negative electrode is grounded;

[0024] The temperature reading module has an input end connected to the positive electrode of the temperature measuring diode and is used to convert the voltage across the temperature measuring diode into a corresponding temperature value.

[0025] In order to solve the above technical problems, the present invention further provides a simulated heat source device, comprising a housing and the simulated heat source circuit as described above, wherein the heat generating module in the simulated heat source circuit is arranged in the housing;

[0026] The circuit board in the simulated heat source circuit also includes a plurality of first power reserved ports corresponding one-to-one to the heat generating modules and a plurality of second power reserved ports corresponding one-to-one to the heat generating modules. The first power reserved port is connected to the positive power supply terminal of the corresponding heat generating module, and the second power reserved port is connected to the negative power supply terminal of the corresponding heat generating module. The power supply in the simulated heat source circuit is connected to the heat generating module through the corresponding first power reserved port and the second power reserved port.

[0027] Compared with the existing technology, the technical solution provided by the utility model has at least the following beneficial effects:

[0028] The utility model provides a simulated heat source circuit, comprising a circuit board, a plurality of heat generating modules arranged on the circuit board, and a plurality of power supplies connected to the heat generating modules in a one-to-one correspondence. The heat generating modules can be arranged at different positions of the circuit board. The heat generating conditions of different positions of an electronic chip to be tested during operation are simulated by means of the plurality of heat generating modules arranged on the circuit board. The power supplies are connected to the heat generating modules in a one-to-one correspondence. During the test, the voltage output conditions of the various power supplies can be flexibly adjusted according to the actual application conditions of the electronic chip, thereby adjusting the heat generating power of the various heat generating modules, thereby making it possible to achieve individually controllable power consumption in different areas of the simulated heat source circuit. By independently controlling the heat generation of the various heat generating modules, it is possible to achieve a more accurate simulation of the heat generation conditions of different types of actual electronic chips during operation, such as chips with uniform heat flux density or chips with non-uniform heat flux density. The utility model has strong flexibility and a wide range of applications.

[0029] In summary, the simulated heat source circuit provided by the present invention can more accurately simulate the heat generation of an actual chip.

[0030] The simulated heat source device provided by the present invention includes the simulated heat source circuit described above, and thus has the same beneficial effects as the simulated heat source circuit described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the prior art and the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 This is a schematic structural diagram of a simulated heat source circuit provided by the utility model;

[0033] Figure 2 This is a schematic diagram of the structure of a heat source circuit that simulates heat generation when a heat generation chip is directly used to implement a heat generation module provided by the present invention;

[0034] Figure 3 A schematic diagram of the arrangement of a simulated heat source circuit provided by the utility model;

[0035] Figure 4 A schematic diagram of another arrangement of a simulated heat source circuit provided by the present invention;

[0036] Figure 5 This is a structural diagram of a heat generation module provided by the utility model;

[0037] Figure 6 This is a schematic structural diagram of another heat generating module provided by the present invention;

[0038] Figure 7 A schematic diagram of the internal structure of a heat generating chip provided by the present invention;

[0039] Figure 8 A schematic diagram of a packaging method for a heat-generating chip provided by the present invention;

[0040] Figure 9 This is a schematic diagram of another packaging method for a heat-generating chip provided by the present invention. DETAILED DESCRIPTION

[0041] The core of the present utility model is to provide a simulated heat source circuit and a simulated heat source device. The power consumption of different areas in the simulated heat source circuit can be individually controlled. By independently controlling the heat generation of each heat generation module, it is possible to achieve a more accurate simulation of the heat generation conditions of different types of actual electronic chips during operation, such as uniform heat flux density chips or non-uniform heat flux density chips. It has strong flexibility and a wide range of applications.

[0042] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0043] Please refer to Figure 1 , Figure 1 The present invention provides a schematic structural diagram of a simulated heat source circuit. To solve the above technical problems, the present invention provides a simulated heat source circuit, comprising:

[0044] circuit boards;

[0045] A plurality of heat generating modules 1 are arranged on the circuit board;

[0046] Several power supplies 2 are connected one-to-one with the heat generating modules 1, and the positive pole of the power supply 2 is connected to the positive power supply terminal of the corresponding heat generating module 1, and the negative pole is connected to the negative power supply terminal of the corresponding heat generating module 1. It is used to output voltages of different sizes to the corresponding heat generating module 1 according to test requirements to control the heat generation of the heat generating module 1.

[0047] It is understandable that in order to simulate the heat generation layout of an actual chip, this application integrates the heat generation module 1 on the circuit board to simulate the form of the chip's own integrated circuit. At the same time, a number of heat generation modules 1 are set in the simulated heat source circuit, and each heat generation module 1 is distributed at different positions on the circuit board, thereby simulating the heat generation of different positions of the chip during actual operation. The heat generation of the heat generation module 1 requires power supply 2 to achieve power supply. The power supply 2 supplies power to the heat generation module 1. When the power supply 2 outputs voltage to the heat generation module 1, the heat generation module 1 generates heat after being powered on, and its heat generation power is linearly related to the magnitude of the received voltage. Generally, the greater the voltage provided by the power supply 2, the greater the heat generation power of the heat generation module 1, and the more heat the heat generation module 1 generates.

[0048] Taking into account that the heat generation of the chip in current practical applications may be a situation where the entire integrated circuit generates heat uniformly, or the heat generation may be uneven due to factors such as component layout, in order to simulate the heat generation of different types of chips, each heat generation module 1 in the simulated heat source circuit provided in the present application is separately configured with a power supply 2. When testing the radiator, each power supply 2 can be controlled separately according to the test requirements of the radiator. Each power supply 2 can independently output voltages of different sizes to each heat generation module 1 on the circuit board. By adjusting the output voltage of each power supply 2, a uniform or unevenly distributed heat source form can be provided; the heat generation of each heat generation module 1 can be adjusted separately, that is, the heat generation of different positions on the circuit board can be simulated and controlled separately, thereby simulating the heat generation of different types of chips in the actual working process, and can more accurately control the size of the heat source area and power consumption. The power consumption of different areas can be individually controlled, thereby more accurately simulating the heat generation of the actual chip.

[0049] It should be noted that the specific shape and size of the circuit board are not specifically limited in this application. These can be adjusted based on the dimensional parameters of the chip to be simulated during the test. There are also various options for the material and other parameters of the circuit board, and a PCB (Printed Circuit Board) is generally used for implementation, and this is not specifically limited in this application. There are also various options for the number, spacing, and arrangement of the heat generating modules 1, and this is not specifically limited in this application. To improve simulation accuracy, the heat generating modules 1 can be evenly arranged on the circuit board using an array arrangement. By adjusting the shape, size, arrangement, number, and spacing of the circuit board, simulation of chips of different types and sizes can be achieved. This approach is highly versatile and applicable to testing various heat sinks. Generally, chips are designed to be rectangular for application, so the circuit board can also be rectangular. The size only needs to cover the chip to be simulated, i.e., be no smaller than the circuit area of ​​the chip to be simulated. In this case, the heat generating modules 1 can be evenly arranged on the circuit board using a rectangular array arrangement. The entire simulated heat source circuit has a wide range of achievable areas, is highly flexible, and has strong versatility. It can simulate dispersed non-uniform heat sources and uniform heat sources with small granularity.

[0050] Furthermore, this application does not make any special restrictions on the specific types and implementation methods of the heat generation module 1 and the power supply 2. The heat generation module 1 can be directly implemented by heating components such as heating resistors and heating rods, or by integrated circuits including heating components; the power supply 2 can be directly implemented by a DC power supply such as a battery, or by setting a conversion circuit. The control method for the output voltage of the power supply 2 also needs to be adjusted accordingly according to the specific type of the power supply 2; each power supply 2 and each heat generation module 1 can be implemented in the same way or in different ways. As a preferred embodiment, each power supply 2 and each heat generation module 1 is preferably implemented in exactly the same way to ensure the accuracy of the simulation.

[0051] It is understandable that the test of the radiator is mainly aimed at two aspects. One is to test the size parameters and heat flux density of existing chips. The second is to conduct preliminary research and testing on the heat dissipation direction for chips that may appear in the future. The simulated heat source circuit provided in this application is a circuit device for simulating the heat generation of a chip in an actual working process. The design parameters of the simulated heat source circuit can be adjusted to simulate existing chips or possible future chips, thereby achieving a full test of the radiator. After the simulated heat source circuit is designed and completed according to the test requirements, the radiator can be installed on the simulated heat source circuit to perform the test process of the radiator to determine whether it can effectively dissipate the heat generated by the simulated heat source circuit. The test requirements include the chip type and size parameters that need to be applied to the radiator to be tested, and the simulated heat source circuit can also be adjusted to simulate a variety of different types of chips to test the heat dissipation effect of the radiator on various types of chips.

[0052] It is not difficult to understand that the current development of chips is moving towards high heat flux density, multiple heat sources, and non-uniform heat flux density, and the internal silicon wafers of different types of chips are laid out differently. Based on this, the present application provides a simulated heat source circuit to realize a simulated chip heat source that can control the size and power consumption of the heat source area, the power consumption of different areas can be independently controlled, and a high heat flux density is provided. A simulated chip heat source device is provided for the thermal testing process of the radiator, which can be widely used in the thermal testing of data center immersion cooling, cold plates, air-cooled radiators, and other processes.

[0053] As a specific embodiment, please refer to Figure 2 , Figure 2 This is a schematic diagram of the structure of a heat source circuit that simulates the heat generation module when directly using a heat generation chip provided by the present invention; please refer to Figure 3 , Figure 3This is a schematic diagram of the layout of a simulated heat source circuit provided by the present invention; a single heat generating chip can be used to implement the heat generating module 1. The heat generating chip is a 1mm*1mm silicon-based chip. The circuit board adopts a rectangular circuit board. 4*3=12 heat generating chips are arranged in a rectangular array on the circuit board. At the same time, corresponding 12 power supplies 2, from the first power supply to the twelfth power supply, are configured. The 12 heat generating chips are integrated and packaged into a simulated heat source device through a packaging shell for protection. Figure 2 As shown, a chip cluster consisting of several 1mm*1mm silicon chips is arranged in a matrix array. The spacing between each 1mm*1mm silicon chip can be controlled to 100μm based on process requirements. The chip cluster's area can cover the area of ​​the GPU (graphics processing unit), CPU (central processing unit), and ASIC (application-specific integrated circuit) chips to be simulated. The entire chip cluster can be further encapsulated and protected with epoxy resin or nickel-plated copper. Each 1mm*1mm silicon chip in the chip cluster is independently powered, and the power consumption and heat generation of each 1mm*1mm silicon chip are controlled by controlling the input voltage. Each chip also has a separate temperature measurement point. Therefore, by activating different numbers and / or positions of 1mm*1mm silicon chips, chips of different sizes can be simulated. By controlling the voltage output to 1mm*1mm silicon chips at different locations, the power consumption or heat generation of each 1mm*1mm silicon chip can be controlled to simulate chips with uniform or non-uniform heat flux. For example, a chip cluster with n rows and m columns requires n*m power supplies to simulate chip heat sources.

[0054] It can be seen that the simulated heat source circuit provided by the present invention includes a circuit board, a plurality of heat generating modules 1 arranged on the circuit board, and a plurality of power supplies 2 connected one-to-one with the heat generating modules 1. Each heat generating module 1 can be arranged at a different position of the circuit board. The heat generation conditions of different positions of the electronic chip to be tested during operation are simulated by setting a plurality of heat generating modules 1 on the circuit board. The power supplies 2 are connected one-to-one with the heat generating modules 1. During the test, the voltage output conditions of each power supply 2 can be flexibly adjusted according to the actual application conditions of the electronic chip, thereby adjusting the heat generation power of each heat generating module 1, and thus the power consumption of different areas in the simulated heat source circuit can be individually controlled. By independently controlling the heat generation of each heat generating module 1, a more accurate simulation of the heat generation conditions of different types of actual electronic chips during operation, such as uniform heat flux density chips or non-uniform heat flux density chips, can be achieved. It has strong flexibility and a wide range of applications. In summary, the simulated heat source circuit provided by the present invention can more accurately simulate the heat generation conditions of actual chips.

[0055] Based on the above embodiment:

[0056] Please refer to Figure 4 , Figure 4 This is a schematic diagram of another arrangement of a simulated heat source circuit provided by the present invention; please refer to Figure 5 , Figure 5 This is a schematic structural diagram of a heat generating module provided by the present invention; as an optional embodiment, the heat generating module 1 includes a first packaging shell, a first heat generating chip, a second heat generating chip, and a third heat generating chip. The first packaging shell is rectangular, and the first heat generating chip, the second heat generating chip, and the third heat generating chip are arranged in a herringbone shape within the first packaging shell.

[0057] The positive power supply terminal of the first heat generating chip, the positive power supply terminal of the second heat generating chip and the positive power supply terminal of the third heat generating chip are all connected to the positive pole of the corresponding power supply 2, and the negative power supply terminal of the first heat generating chip, the negative power supply terminal of the second heat generating chip and the negative power supply terminal of the third heat generating chip are all connected to the negative pole of the corresponding power supply 2.

[0058] It is easy to understand that the heat generating module 1 can also be implemented by using a packaged chip consisting of multiple heat generating chips. The first heat generating chip, the second heat generating chip and the third heat generating chip can be in the form of Figure 5The triangular arrangement shown, i.e., the arrangement is arranged in a triangle shape within the rectangular first packaging shell. In this case, the area of ​​the heat generation module 1 implemented by the packaged chip after packaging will be larger than that of a single heat generation chip. For example, when the heat generation chip is a 1mm*1mm silicon-based chip, the packaged chip can be a 4mm*4mm packaged chip. At this time, for an actual chip to be simulated, compared to a single heat generation chip implementing the simulated heat source circuit of the heat generation module 1, under the same simulation area, the number of heat generation chips required to implement the simulated heat source circuit of the heat generation module 1 using packaged chips is smaller. At the same time, the triangle arrangement can also achieve a higher heat flux density on the surface of the packaged chip. This application does not specifically limit the specific types and implementation methods of the first, second, and third heat generation chips. There are many options for the material, shape, and size of the first packaging shell, which are not specifically limited in this application. Epoxy resin and other methods can be used for packaging. The first heat generating chip, the second heat generating chip and the third heat generating chip all need to generate heat during the test process. Therefore, the positive power supply terminal of each heat generating chip needs to be connected to the positive terminal of the corresponding power supply 2, and the negative power supply terminal needs to be connected to the negative terminal of the corresponding power supply 2. Take the packaged chip as an example, which is a 4mm*4mm epoxy resin packaged chip. Figure 4 As shown, the spacing between packaged chips can be controlled at 1.5 mm according to process requirements during arrangement.

[0059] Specifically, multiple heat-generating chips are integrated into a packaged chip, and then the packaged chip is used to realize the heat-generating module 1. The coverage area of ​​the packaged chip is larger than that of a single heat-generating chip, and it is not necessary to completely cover the heat-generating chips. Only some heat-generating chips need to be set to ensure the heat-generating efficiency of the entire heat-generating chip, thereby reducing the number of heat-generating chips in the entire analog heat source circuit and reducing the cost of the entire analog heat source circuit; the herringbone arrangement can also achieve a higher heat flux density on the package surface, ensuring the heat-generating efficiency of the packaged chip, and can greatly reduce the number of heat-generating chips under the same area, saving costs and reducing system complexity.

[0060] Please refer to Figure 6 , Figure 6 This is a schematic structural diagram of another heat generating module provided by the present invention; as an optional embodiment, the heat generating module 1 includes a second packaging shell, a fourth heat generating chip, and a fifth heat generating chip. The second packaging shell is rectangular, and the fourth heat generating chip and the fifth heat generating chip are arranged diagonally in the second packaging shell.

[0061] The positive power supply terminal of the fourth heat generating chip and the positive power supply terminal of the fifth heat generating chip are both connected to the positive pole of the corresponding power supply 2, and the negative power supply terminal of the fourth heat generating chip and the negative power supply terminal of the fifth heat generating chip are both connected to the negative pole of the corresponding power supply 2.

[0062] It is understandable that, in addition to the herringbone arrangement, the heat generating chips in the packaged chips can also be arranged diagonally. The diagonal arrangement can ensure uniform heat generation on the surface of the packaged chips while further reducing the number of heat generating chips used. The fourth heat generating chip and the fifth heat generating chip can be arranged as follows: Figure 6 The diagonal arrangement shown is that they are arranged at both ends of any diagonal of the rectangular second packaging shell. This application does not make any special restrictions on the specific types and implementation methods of the fourth heat-generating chip and the fifth heat-generating chip. There are many options for the material, shape and size of the second packaging shell, and this application does not make any special restrictions here. Epoxy resin and other methods can be used for packaging. The fourth heat-generating chip and the fifth heat-generating chip need to generate heat during the test process. Therefore, the positive power supply terminal of each heat-generating chip needs to be connected to the positive pole of the corresponding power supply 2, and the negative power supply terminal needs to be connected to the negative pole of the corresponding power supply 2. Take the epoxy resin packaged chip with a packaged chip of 4mm*4mm as an example. Figure 4 As shown in the figure, the spacing between packaged chips can be controlled at 1.5mm according to process requirements. Figure 6 As shown, the resistance of each 4mm x 4mm package chip is 36Ω, the maximum input voltage is 12V, and the maximum input current is 3.3A. Therefore, each 4mm x 4mm package chip can achieve 250W / cm 2 The heat flux density input is 100 nm. The temperature sensor uses a temperature diode. Four temperature diodes are arranged on each 4mm x 4mm packaged chip. Each 4mm x 4mm packaged chip unit can provide 10 unified heaters for heat generation and 4 diodes for temperature measurement.

[0063] Specifically, multiple heat-generating chips are integrated into a packaged chip, and then the packaged chip is used to realize the heat-generating module 1. The coverage area of ​​the packaged chip is larger than that of a single heat-generating chip, and it is not necessary to completely cover the heat-generating chips. Only some heat-generating chips need to be set to ensure the heat-generating efficiency of the entire heat-generating chip, thereby reducing the number of heat-generating chips in the entire analog heat source circuit and reducing the cost of the entire analog heat source circuit; the diagonal arrangement can also fully reduce the number of heat-generating chips on the basis of ensuring a certain heat-generating efficiency of the packaged chip, and can greatly reduce the number of heat-generating chips under the same area, saving costs and reducing system complexity.

[0064] As an optional embodiment, the heat generating module 1 is a single heat generating chip.

[0065] It is readily understood that if the heat generation of the chip to be simulated is complex, with significant variations in heat generation at different locations, heat generation module 1 can be implemented using a single heat generation chip to ensure the granularity of the chip simulation process. Implementing heat generation module 1 with a single heat generation chip minimizes the granularity of the simulated heat source circuit and enables the most accurate simulation of heat generation at each location on the chip. It should be noted that a heat generation chip is a chip unit that includes heating components and is capable of generating heat when powered by power supply 2, thereby simulating actual chip heat generation. This application does not specifically limit the specific type and implementation of the heat generation chip.

[0066] Specifically, when the test accuracy requirements are high or the heat generation conditions at different positions of the chip to be simulated are quite different, a single heat generation chip can be used to implement the heat generation module 1. The coverage area of ​​the heat generation chip is small, and the corresponding simulated chip heat generation position is also small. By regulating the output voltage of the power supply 2 connected to each heat generation chip, a more accurate and detailed simulation process of the heat generation conditions at different positions can be achieved by using heat generation chips with a smaller coverage area, thereby improving the accuracy and reliability of the test process.

[0067] Please refer to Figure 7 , Figure 7 This is a schematic diagram of the internal structure of a heat generating chip provided by the present invention; as an optional embodiment, the heat generating chip in the heat generating module 1 includes a packaging substrate and a plurality of heating resistors evenly arranged on the packaging substrate, the positive electrode of the heating resistor serves as the positive power supply terminal of the heat generating module 1, and the negative electrode of the heating resistor serves as the negative power supply terminal of the heat generating module 1.

[0068] It is understandable that the heat-generating chip can be realized by a heating resistor, which is a heating component. For ease of use, the heating resistor can be integrated on the packaging substrate and integrated into the form of a heat-generating chip for easy application and installation. At the same time, in order to ensure uniform heat generation of the heat-generating chip, when setting the heating resistor, it is best to arrange it evenly on the packaging substrate. The specific type, material, size, shape and other setting methods of the packaging substrate are not specifically limited in this application. There are also many options for the specific type, shape and size of the heating resistor. The specific arrangement method and the number of settings need to be selected according to the heat generation needs and the setting method of the packaging substrate. It can be implemented by an array arrangement with equal spacing. This application does not make special restrictions here. In order to improve the heat generation efficiency and expand the chip heat generation range that can be simulated by the simulated heat source circuit, a larger number of heating resistors can be set, and the heat-generating chip can be packaged in advance for subsequent direct application. Figure 7As shown, five heating resistors are arranged at equal intervals to realize the heat generation chip. The resistance of each heating resistor is set to 20Ω, the maximum input voltage of each resistor is 6V, and the maximum input current is 1.5A. Therefore, each 1mm*1mm silicon-based chip can achieve 900W / cm 2 The heat flux input.

[0069] Specifically, the heat-generating chip can use a heating resistor to achieve heat generation. Resistance heating has high energy conversion efficiency, and most of the electrical energy is converted into thermal energy; the temperature control is accurate, the heat generation stability is high, and the temperature can be precisely adjusted according to different needs; it has a wide range of applications and can heat objects of various materials and shapes; the heat generation is uniform and easy to use, and heat can be generated by simply connecting a power supply; it is conducive to the simple implementation of the heat-generating chip and the entire simulated heat source circuit.

[0070] Please refer to Figure 8 , Figure 8 This is a schematic diagram of a packaging method for a heat-generating chip provided by the present invention; as an optional embodiment, the heat-generating chip is set on a circuit board by wire bonding packaging.

[0071] It is easy to understand that the simulated heat source circuit is convenient to apply by integrating the heat generating module 1 on the circuit board, which is also closer to the application scenario of simulating the actual chip. Therefore, the heat generating chip in the heat generating module 1 needs to be integrated and packaged on the circuit board for application. There are many options for packaging the heat generating chip, which can be achieved by wire bonding packaging. Figure 8 As shown, the heat-generating chip is bound and connected to the PCB board through wire bonding. Wire bonding can be specifically implemented with gold wire. In this packaging method, the front of the heat-generating chip faces upwards, which can protect the surface of the chip. Metal blocks and solder balls for packaging are reserved in advance on the PCB board. During packaging, the heat-generating chip is soldered to the circuit board through the metal blocks and solder balls using gold wires to achieve packaging. Plastic packaging materials are then used to set a shell covering the heat-generating chip to achieve protection. This application does not make any special restrictions on the specific type and implementation of wire bonding. It can be selected and adjusted according to the cost and application requirements in actual applications. It is not limited to the gold wire method. Epoxy resin can be further used to protect the gold wire during wire bonding packaging. Wire bonding can be done using methods such as Figure 8 The triangular arrangement shown can achieve higher heat flux density on the package surface.

[0072] Specifically, when the heat-generating chip is integrated into the circuit board, a wire bonding packaging method can be adopted. The wire bonding packaging can protect the surface of the packaged heat-generating chip to ensure the reliable operation of the heat-generating chip and the heat-generating module 1 in which it is located. After all the heat-generating modules 1 on the circuit board are set up, a shell covering all the heat-generating modules 1 can be added to protect the simulated heat source circuit to ensure the safety and reliability of the simulated heat source circuit during the test.

[0073] Please refer to Figure 9 , Figure 9 This is a schematic diagram of another packaging method for a heat generating chip provided by the present invention. As an optional embodiment, the heat generating chip is placed on a circuit board by flip-chip packaging.

[0074] It is understood that the heat-generating chip can also be packaged using a flip-chip method, that is, using a flip-chip to integrate the heat-generating chip on the circuit board. Flip-chip packaging directly flips the chip and mounts it on the packaging substrate. Then, tiny solder joints or conductive glue are used to connect it. This can achieve high-density connections and reduce pin risks. During packaging, the heat-generating chip is flipped and soldered to the circuit board through the redistribution layer using solder balls. In this case, when arranging the heat-generating chip array, the spacing between the heat-generating chips can be less than 0.1mm, resulting in a higher effective heat-generating area for the simulated chip heat source.

[0075] Specifically, when the heat-generating chip is integrated into the circuit board, a flip-chip package can be used. Flip-chip packaging can reduce the spacing between chips when arranging the heat-generating chips, thereby enabling a higher density arrangement of heat-generating chips on the circuit board, thereby increasing the effective heat-generating area of ​​the entire simulated heat source circuit, further improving the accuracy of the actual chip simulation, and ensuring the accuracy and reliability of the test process.

[0076] As an optional embodiment, the method further includes:

[0077] Several temperature acquisition modules are connected to the heat generating modules 1 in a one-to-one correspondence, and their input ends are connected to the corresponding heat generating modules 1 for acquiring the temperatures of the corresponding heat generating modules 1 .

[0078] It's easy to understand that in order to accurately simulate actual chips and monitor the simulation process in real time, each heat-generating module 1 is not only equipped with a heat-generating chip to generate heat, but also with a temperature acquisition module to measure the real-time temperature of each heat-generating module 1. The input of the temperature acquisition module can be connected to the corresponding heat-generating module 1 to detect the temperature of each heat-generating module 1 during the test simulation. The temperature acquisition module can acquire the temperature of the heat-generating module 1 by connecting to the heat-generating module 1 or by directly placing the temperature acquisition module in the area where the heat-generating module 1 is located, thereby detecting the temperature of the heat-generating module 1. The acquisition of temperature data is not limited to a direct connection to the heat-generating module 1. If the heat-generating temperature of a heat-generating module 1 differs from the actual heat-generating temperature of the simulated target chip, the operator can promptly adjust the output voltage of the power supply 2 connected to the corresponding heat-generating module 1 so that each heat-generating module 1 accurately and stably maintains the actual heat-generating temperature of the chip to be simulated. The specific type and implementation of the temperature acquisition module are not specifically limited in this application; it can be implemented using sensors or other methods.

[0079] Specifically, by setting a one-to-one corresponding temperature acquisition module for each heat-generating module 1, the actual temperature of each heat-generating module 1 in the simulated heat source circuit during the simulation of the actual chip can be detected in real time, thereby monitoring the temperature inside the simulated chip and flexibly adjusting the power supply to each heat-generating module 1 according to the actual temperature conditions, effectively simulating the actual chip; avoiding the situation where the simulated heat source circuit cannot accurately simulate the actual chip heat generation due to damage to the heat-generating chip or other abnormal conditions, thereby improving the accuracy and reliability of the entire simulation test process.

[0080] As an optional embodiment, the temperature acquisition module includes:

[0081] Temperature measurement power supply;

[0082] The temperature measuring diode is provided on the packaging substrate of any heat generating chip in the corresponding heat generating module 1, with the positive electrode of the temperature measuring diode connected to the output end of the temperature measuring power supply and the negative electrode grounded;

[0083] The temperature reading module has an input end connected to the positive electrode of the temperature measuring diode and is used to convert the voltage across the temperature measuring diode into a corresponding temperature value.

[0084] It is understandable that the temperature acquisition module can obtain the temperature of the heat generating module 1 by setting a temperature sensor at the location of the heat generating module 1. The temperature sensor adopts a temperature measuring diode. At the same time, considering that the main heat generating part of the heat generating module 1 is the heat generating chip, the temperature sensor can be directly set on the corresponding heat generating chip, such as Figure 7As shown, two temperature measuring diodes are arranged on each 1mm*1mm silicon-based chip. Each temperature measuring diode inputs a current signal of 1mA, and the temperature of the chip is calculated by reading the voltage value of the temperature measuring diode. The voltage value of the diode is linearly related to the temperature, so it is also necessary to set up a temperature reading module to read the voltage value at both ends of the temperature measuring diode and convert the voltage value into a corresponding temperature value. This application does not make any special restrictions on the setting method of the temperature reading module. Generally, the volume of the temperature reading module is large and difficult to integrate on the heat generating chip. Therefore, a temperature reading port that is connected to the temperature measuring diode in a one-to-one correspondence is generally reserved on the circuit board in advance. The temperature reading port is connected to the positive pole of the corresponding temperature measuring diode, and the temperature reading module is directly plugged into the temperature reading port reserved on the circuit board to read the data.

[0085] It should be noted that when there are multiple heat generating chips in the heat generating module 1, one or part of the heat generating chips can be selected to set the temperature measuring diode, or a temperature measuring diode can be set on each heat generating chip to achieve accurate detection of the temperature of each heat generating chip. The temperature measurement process of the temperature measuring diode requires input current to be implemented, because the temperature measuring diode also needs to be configured with a corresponding temperature measuring power supply. This application does not make any special restrictions on the specific type, voltage level and implementation method of the temperature measuring power supply. It can be set and adjusted according to the specific type and working parameters of the temperature measuring diode used. It can be directly integrated on the heat generating chip, or a power port can be reserved in advance on the heat generating chip to connect the temperature measuring power supply. The temperature measuring diode can achieve temperature measurement in the range of -40 degrees to 120 degrees, with a temperature resolution of 0.1°C, high accuracy and a large measurement range. As Figure 7 As shown, each 1mmx1mm chip unit provides 5 unified heaters and 2 temperature measuring diodes for temperature measurement, thereby realizing the heat generation and temperature measurement functions of the heat generation module 1 respectively. TGP1, TGP2, TGP3, TGP4, and TGP5 are the positive electrodes of the five heating resistors, TGN1, TGN2, TGN3, TGN4, and TGN5 are the negative electrodes of the five heating resistors, TML1 and TML2 are the positive terminals of the first group of temperature measuring diodes, which are the current input ports, and TML3 and TML4 are the negative terminals of the first group of temperature measuring diodes, connected to GND; TMR1 and TMR2 are the positive terminals of the second group of temperature measuring diodes, which are the current input ports, and TMR3 and TMR4 are the negative terminals of the second group of temperature measuring diodes, connected to GND. In order to further reduce costs, as shown in FIG. Figure 2 As shown, when 12 heat generating modules 1 are set in the simulated heat source circuit, the number of temperature reading modules can be slightly reduced. There is no need to set them one by one with the temperature measuring diodes. Only four can be set. The specific number of settings can be adjusted according to actual test requirements.

[0086] Specifically, by further setting a temperature measuring diode on the heat generating chip, the real-time temperature of the heat generating module 1 can be detected. This not only realizes the process of detecting the surface temperature of the simulated heat source, but also can monitor the temperature inside the simulated chip by directly integrating the temperature measuring diode on the heat generating chip. By monitoring the temperature and node temperature inside the simulated chip, it is further ensured that each heat generating module 1 and the entire simulated heat source circuit accurately simulate the actual chip.

[0087] In order to solve the above technical problems, the present invention further provides a simulated heat source device, comprising a housing and the simulated heat source circuit as described above, wherein the heat generating module 1 in the simulated heat source circuit is arranged in the housing;

[0088] The circuit board in the simulated heat source circuit also includes several first power reserved ports corresponding one-to-one to the heat generating modules 1 and several second power reserved ports corresponding one-to-one to the heat generating modules 1. The first power reserved port is connected to the positive power supply terminal of the corresponding heat generating module 1, and the second power reserved port is connected to the negative power supply terminal of the corresponding heat generating module 1. The power supply 2 in the simulated heat source circuit is connected to the heat generating module 1 through the corresponding first power reserved port and the second power reserved port.

[0089] It is not difficult to understand that, considering that the volume of the power supply 2 is larger than that of the heat generating module 1, the heat generating module 1 is generally only integrated on the circuit board, and then the entire integrated heat generating module 1 is encapsulated and protected by a shell. The power supply 2 supplies power to the heating resistor in the heat generating module 1 through the port reserved on the PCB board. Therefore, when designing the circuit board and encapsulating the simulated heat source device, a first power reserved port corresponding to each heat generating module 1 and a second power reserved port corresponding to each heat generating module 1 are reserved on the circuit board. The first power reserved port is connected to the positive power supply terminal of the corresponding heat generating module 1 through the internal circuit of the circuit board, and the second power reserved port is connected to the negative power supply terminal of the corresponding heat generating module 1 through the internal circuit of the circuit board. The power supply 2 can be directly plugged into the power reserved port to realize power supply to the corresponding heat generating module 1. If the power supply 2 used is relatively small, it can also be directly integrated on the circuit board. The setting method can be adjusted according to the actual application situation, and this application does not make any special restrictions here.

[0090] For an introduction to a simulated heat source device provided by the present invention, please refer to the above-mentioned embodiment of the simulated heat source circuit, and the present invention will not be described in detail here.

[0091] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the embodiments can be referred to each other. It should also be noted that in this specification, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of further restrictions, the elements defined by the sentence "comprise a..." do not exclude the presence of other identical elements in the process, method, article or equipment including the elements.

[0092] The above description of the disclosed embodiments will enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A simulated heat source circuit, characterized in that: include: circuit boards; a plurality of heat generating modules arranged on the circuit board; Several power supplies are connected one-to-one with the heat generating modules, with the positive pole of the power supply connected to the positive power supply terminal of the corresponding heat generating module, and the negative pole is connected to the negative power supply terminal of the corresponding heat generating module, and are used to output voltages of different sizes to the corresponding heat generating module according to test requirements to control the heat generation of the heat generating module.

2. The simulated heat source circuit according to claim 1, wherein: The heat generating module includes a first packaging shell, a first heat generating chip, a second heat generating chip and a third heat generating chip. The first packaging shell is rectangular. The first heat generating chip, the second heat generating chip and the third heat generating chip are arranged in a herringbone shape in the first packaging shell. The positive power supply terminal of the first heat generating chip, the positive power supply terminal of the second heat generating chip, and the positive power supply terminal of the third heat generating chip are all connected to the positive electrode of the corresponding power supply, and the negative power supply terminal of the first heat generating chip, the negative power supply terminal of the second heat generating chip, and the negative power supply terminal of the third heat generating chip are all connected to the negative electrode of the corresponding power supply.

3. The simulated heat source circuit according to claim 1, wherein: The heat generating module includes a second packaging shell, a fourth heat generating chip and a fifth heat generating chip, the second packaging shell is rectangular, and the fourth heat generating chip and the fifth heat generating chip are arranged diagonally in the second packaging shell; The positive power supply terminal of the fourth heat generating chip and the positive power supply terminal of the fifth heat generating chip are both connected to the positive pole of the corresponding power supply, and the negative power supply terminal of the fourth heat generating chip and the negative power supply terminal of the fifth heat generating chip are both connected to the negative pole of the corresponding power supply.

4. The simulated heat source circuit according to claim 1, wherein: The heat generating module is a single heat generating chip.

5. The simulated heat source circuit according to any one of claims 2 to 4, characterized in that: The heat generating chip in the heat generating module includes a packaging substrate and a plurality of heating resistors evenly arranged on the packaging substrate. The positive electrodes of the heating resistors serve as the positive power supply terminal of the heat generating module, and the negative electrodes of the heating resistors serve as the negative power supply terminal of the heat generating module.

6. The simulated heat source circuit according to claim 5, wherein: The heat generating chip is arranged on the circuit board by wire bonding packaging.

7. The simulated heat source circuit according to claim 5, wherein: The heat generating chip is arranged on the circuit board by means of flip-chip packaging.

8. The simulated heat source circuit according to claim 5, wherein: Also includes: A plurality of temperature acquisition modules are connected to the heat generating modules in a one-to-one correspondence, and the input ends are connected to the corresponding heat generating modules for acquiring the temperatures of the corresponding heat generating modules.

9. The simulated heat source circuit according to claim 8, wherein: The temperature acquisition module includes: Temperature measurement power supply; A temperature measuring diode is provided on the packaging substrate of any heat generating chip in the corresponding heat generating module, wherein the positive electrode of the temperature measuring diode is connected to the output end of the temperature measuring power supply and the negative electrode is grounded; The temperature reading module has an input end connected to the positive electrode of the temperature measuring diode and is used to convert the voltage across the temperature measuring diode into a corresponding temperature value.

10. A simulated heat source device, characterized in that: The device comprises a housing and the simulated heat source circuit according to any one of claims 1 to 9, wherein the heat generating module in the simulated heat source circuit is arranged in the housing; The circuit board in the simulated heat source circuit also includes a plurality of first power reserved ports corresponding one-to-one to the heat generating modules and a plurality of second power reserved ports corresponding one-to-one to the heat generating modules. The first power reserved port is connected to the positive power supply terminal of the corresponding heat generating module, and the second power reserved port is connected to the negative power supply terminal of the corresponding heat generating module. The power supply in the simulated heat source circuit is connected to the heat generating module through the corresponding first power reserved port and the second power reserved port.

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