Phase change heat dissipation device for power device and electronic equipment

Abstract

The embodiment of the utility model provides a phase change heat dissipation device for a power device and electronic equipment. The phase change heat dissipation device comprises a plurality of heat conductors which are arranged to be stacked in the arrangement direction, each heat conductor in the plurality of heat conductors comprises a containing groove with an opening end, and the opening end of the containing groove abuts against and is sealed with the bottom end of the adjacent heat conductor to form a first containing space; the pair of packaging covers are respectively arranged at two ends of the plurality of heat conductors in the arrangement direction and are respectively coupled to the opening ends and the bottom ends of the heat conductors at the two ends so as to form a second accommodating space; and the phase change body is arranged in the first accommodating space and the second accommodating space so as to absorb heat released by the power device and transferred through the plurality of heat conductors. Therefore, the rising rate of the junction temperature of the power device can be reduced, so that the problem of instantaneous failure of the power device caused by overhigh junction temperature can be avoided, and the reliability of the power device under an overload condition is improved.

Description

Technical Field

[0001] Example embodiments of the present disclosure generally relate to the technical field of heat dissipation of electronic devices, and more particularly to a phase-change heat dissipation apparatus for power devices and an electronic device. Background Art

[0002] As the performance of electronic devices continues to improve and their application scenarios become increasingly diverse, power devices are being used in overload protection scenarios. These devices can quickly respond to circuit overloads and take appropriate protective measures to ensure the safe and stable operation of the entire circuit system. However, existing power devices used for overload protection suffer from high junction temperatures due to their high power consumption, making it impossible to effectively dissipate heat. This can lead to instantaneous failure of the power devices, reduced reliability, and shortened service life, thus compromising the performance and reliability of electronic devices. Utility Model Content

[0003] The purpose of the present disclosure is to provide a phase change heat dissipation device and an electronic device for a power device, so as to at least partially solve the above-mentioned problems and / or other potential problems existing in existing power devices.

[0004] In a first aspect of the present disclosure, a phase-change heat sink for a power device is provided. The phase-change heat sink comprises: a plurality of heat conductors arranged to be stacked along an arrangement direction, each of the plurality of heat conductors comprising a receiving groove having an open end, the open end of the receiving groove abutting and sealing against the bottom end of an adjacent heat conductor to form a first receiving space; a pair of packaging caps arranged at both ends of the plurality of heat conductors in the arrangement direction, respectively, and respectively engaging with the open ends and bottom ends of the heat conductors at both ends to form a second receiving space; and a phase-change body arranged within the first receiving space and the second receiving space to absorb heat released by the power device and transferred via the plurality of heat conductors.

[0005] In an embodiment according to the present disclosure, by arranging the phase changer in the first accommodation space and the second accommodation space, it is possible to fully contact and absorb the heat transferred by the power device through multiple heat conductors. When the power device generates heat during operation, the heat can be quickly and evenly transferred to the phase changer through the heat conductor. The phase changer utilizes its own physical properties to undergo a phase change in the process of absorbing heat, thereby effectively reducing the temperature of the power device and significantly slowing down the rate of temperature rise. Compared with existing heat dissipation methods, it can more efficiently meet the heat dissipation needs of the power device, avoid instantaneous failure problems caused by excessive temperature, and improve the stability and reliability of the power device during operation. Secondly, the close fit between the multiple heat conductors and with the packaging cover not only ensures the high efficiency of heat transfer, but also prevents the phase changer from leaking, ensuring the long-term stability of the heat dissipation process. Other benefits will be described in detail below in conjunction with the corresponding embodiments.

[0006] In some embodiments, the pair of package covers include through holes aligned along the arrangement direction, and the phase change heat dissipation device further includes: a locking member coupled and inserted into the through holes along the arrangement direction to lock the plurality of heat conductors and the package covers.

[0007] In some embodiments, the heat conductor includes: a first limiting hole arranged at the bottom end of the heat conductor; and a first limiting column arranged at the open end and suitable for coupling with the first limiting hole.

[0008] In some embodiments, the first packaging cover in a pair of packaging covers includes: a second limiting hole, arranged on a side close to the heat conductor, coupled with a first limiting column at the open end of the heat conductor, and the second packaging cover in a pair of packaging covers includes: a second limiting column, arranged on a side close to the heat conductor, coupled with the first limiting hole at the bottom end of the heat conductor.

[0009] In some embodiments, the plurality of heat conductors further include mounting holes arranged on side walls of some of the heat conductors and adapted for fasteners to pass through to couple the phase change heat sink to the power device.

[0010] In some embodiments, the phase change agent comprises solid paraffin flakes.

[0011] In some embodiments, the shape of the solid paraffin wax sheet matches the shape of the receiving groove and fills the receiving groove.

[0012] In some embodiments, the shape of the side of the phase-change heat sink adjacent to the power device matches the shape of the power device.

[0013] In a second aspect of the present disclosure, an electronic device is provided, comprising: a power device; and a phase-change heat sink according to the first aspect, coupled to the power device and adapted to absorb heat generated by the power device.

[0014] In some embodiments, the power device includes a solid-state starter or circuit breaker.

[0015] It should be understood that the content described in this summary section is not intended to limit the key features or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements, wherein:

[0017] Figure 1 An exploded view of a phase-change heat dissipation device according to an embodiment of the present disclosure is shown;

[0018] Figure 2 and Figure 3 A schematic structural diagram of a phase change heat dissipation device according to an embodiment of the present disclosure is shown; and

[0019] Figure 4 A cross-sectional view of a phase-change heat dissipation device according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0020] The following describes embodiments of the present disclosure in more detail with reference to the accompanying drawings. Although certain embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be construed as limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are for illustrative purposes only and are not intended to limit the scope of protection of the present disclosure.

[0021] In the description of the embodiments of the present disclosure, the term "including" and similar terms should be understood as open inclusion, that is, "including but not limited to". The term "based on" should be understood as "based at least in part on". The term "one embodiment" or "the embodiment" should be understood as "at least one embodiment". The term "some embodiments" should be understood as "at least some embodiments". Other explicit and implicit definitions may be included below. The terms "first", "second", etc. may refer to different or the same objects. Other explicit and implicit definitions may be included below.

[0022] As briefly mentioned above, the power devices used for overload protection have high junction temperatures due to their high power consumption, making it impossible to dissipate heat effectively, which in turn leads to problems such as instantaneous failure of the power devices, reduced reliability, and shortened service life. Specifically, in the application scenario of overload protection, power devices have the problem of high power consumption compared with existing electromechanical overload protection devices (for example, bimetallic strips + electromagnets). This is due to the working principles and characteristics of power devices such as metal oxide semiconductor field effect transistors (Mosfet), junction field effect transistors (Jfet), and insulated gate bipolar transistors (IGBT). When the power device switches between the on and off states, a certain on-resistance and switching loss will be generated, resulting in an increase in overall power consumption.

[0023] When the power consumption is high, the heat cannot be dissipated effectively and in a timely manner, which will cause the junction temperature to rise rapidly. Excessive junction temperature will affect the performance and reliability of power devices.

[0024] Specifically, excessively high junction temperatures can cause instantaneous failure of power devices. At high temperatures, the physical properties of the semiconductor materials within a power device change, causing its electrical performance parameters to exceed normal ranges, rendering it inoperable and instantly losing its circuit protection. This can even trigger other circuit faults, impacting the normal operation of the entire system.

[0025] Secondly, excessively high junction temperatures can reduce the reliability of power devices. Prolonged exposure to high temperatures can cause thermal expansion and fatigue in the packaging materials and metal wiring within power devices, leading to structural damage or loose connections. High temperatures also accelerate the aging and degradation of semiconductor materials, causing device performance to deteriorate, operational stability to deteriorate, and the probability of malfunctions to increase. This reduces the reliability and stability of the entire system and shortens the lifespan of power devices.

[0026] Meanwhile, existing heat dissipation structures typically connect power devices directly to copper or aluminum heat sinks, which can help dissipate heat generated during operation to a certain extent. However, they cannot effectively control the temperature of the power devices under overload conditions, causing them to operate unstably.

[0027] For example, with the continuous development of electronic technology, power devices such as silicon carbide (SiC) devices are widely used, and existing heat dissipation methods will not be able to effectively dissipate heat in the event of overload.

[0028] Specifically, the on-resistance (Rdson) of SiC devices is relatively large, and its resistance increases more than linearly with junction temperature. Specifically, as the temperature rises from 25°C to 175°C, its on-resistance can even double. This characteristic causes the on-resistance to increase rapidly during power device operation as the junction temperature rises due to heat generated by the current flowing through it. This increase in on-resistance further increases the heat generated by the power device, forming a vicious cycle that rapidly increases the temperature of the power device.

[0029] In overload protection applications, for some power devices, such as shunt devices, the rated current requirements are generally low (≤32A), while the overload protection current (OLR current) can reach 5-10 times the rated current. In this case, SiC devices cannot meet the overload protection requirements due to the rapid rise in junction temperature and the junction temperature limit of solid-state devices. Even if existing copper or aluminum heat sinks are used for heat dissipation, it is still difficult to effectively control the temperature of SiC devices so that they can operate stably under overload conditions. This not only affects the performance of the power device, but also causes the power device to be damaged due to excessive temperature when overloaded, reducing the reliability and safety of electronic equipment.

[0030] To address, or at least partially address, the aforementioned issues or other potential issues with existing power devices, embodiments of the present disclosure provide a phase-change heat sink and electronic device solution for power devices. The phase-change heat sink comprises a plurality of heat conductors, a pair of encapsulation caps, and a phase-changer. The plurality of heat conductors are stacked along an arrangement direction, each having a receiving slot with an open end. During assembly, the open end of the receiving slot tightly abuts and seals against the bottom end of an adjacent heat conductor, forming a first receiving space, providing a uniformly distributed storage area for the phase-changer.

[0031] Furthermore, a pair of encapsulating caps are located at either end of the arrangement of the multiple heat conductors. These caps tightly engage the open and bottom ends of the heat conductors, respectively, to form a second storage space. The caps not only seal the ends of the heat dissipation device, ensuring the integrity and stability of the internal structure, but also work together with the heat conductors to provide a relatively closed storage environment for the phase shifter, preventing leakage or interference from external factors.

[0032] Furthermore, the phase changer is arranged in the first accommodation space and the second accommodation space. During the operation of the power device, the heat released by it will be rapidly transferred through multiple heat conductors. The heat conductor uses its thermal conductivity to quickly collect heat and guide it to the phase changer. When the phase changer absorbs heat, a phase change can occur. During this phase change process, the phase changer can absorb a large amount of heat, and its heat absorption capacity is far higher than that of existing heat dissipation structures. In this way, the phase changer effectively absorbs and stores the heat generated by the power device, thereby achieving the purpose of reducing the temperature of the power device, ensuring that the power device operates stably within an appropriate temperature range, extending its service life, and improving the reliability and stability of the entire system.

[0033] Figure 1 FIG. 1 shows an exploded view of a phase-change heat dissipation device 100 according to an embodiment of the present disclosure. Figure 2 and Figure 3 The schematic diagram of the structure of the phase change heat dissipation device 100 of the embodiment of the present disclosure is shown below. Figures 1 to 3 The following describes the exemplary structure and operating process of a phase-change heat sink 100 for power devices in electronic devices. The power devices in the embodiments of the present disclosure may include solid-state starters or circuit breakers, or any other appropriate power devices other than solid-state starters or circuit breakers. The following describes the concepts of the present disclosure primarily using the application of the phase-change heat sink 100 to a solid-state starter or circuit breaker as an example. It should be understood that the same principles apply to other power devices, and will not be further described below.

[0034] like Figure 1 and Figure 3As shown, an electronic device according to an embodiment of the present disclosure includes a power device and a phase-change heat sink 100. The phase-change heat sink 100 is coupled to the power device to absorb heat generated by the power device. Furthermore, the power device generates heat during operation. This heat is generated by processes such as resistance loss within the power device when current flows through it and energy conversion during switching.

[0035] The phase change heat sink 100 is used to absorb the heat generated by the power device during operation. The phase change heat sink 100 utilizes the heat absorption and release characteristics of the phase change process of the material to achieve efficient heat dissipation. When the power device is working, a large amount of heat is generated. The working medium in the phase change heat sink 100 (such as the phase change medium 130 mentioned below) absorbs this heat and undergoes a phase change, such as from solid to liquid or from liquid to gas. In this process, a large amount of heat is taken away, thereby effectively reducing the temperature of the power device. In this way, it can be ensured that the power device operates within an appropriate temperature range, improve its operating efficiency and stability, and extend its service life.

[0036] At the same time, by tightly coupling the phase-change heat sink 100 with the power device, rapid heat transfer and dissipation can be achieved, further effectively reducing the temperature of the power device and ensuring the stability of the electronic device. Compared to existing heat dissipation methods, this phase-change heat dissipation method can more quickly and effectively deal with the heat generated by the power device, ensuring that the power device operates within an appropriate temperature range, improving its operating efficiency and reliability, and thus extending the service life of the electronic device.

[0037] The following will be combined Figures 1 to 3 The specific structure of the phase-change heat sink 100 is described below. In the embodiment of the present disclosure, the phase-change heat sink 100 generally includes a plurality of heat conductors 110, a pair of packaging covers 120, and a phase-change body 130. Through the synergistic effect of the heat conductors 110, packaging covers, and phase-change body 130, the phase-change heat sink 100 provides an efficient and reliable heat dissipation solution for power devices, effectively resolving issues caused by heat accumulation during power device operation.

[0038] Furthermore, the plurality of heat conductors 110 are arranged to be stacked along the arrangement direction A. Each heat conductor 110 includes a receiving groove 1101 having an open end, providing a storage space for the phase changer 130. When assembled, the open end of the receiving groove 1101 is tightly abutted against the bottom end of the adjacent heat conductor 110 to ensure a seal between the two, thereby forming a first receiving space. For example, the adjacent heat conductors 110 are sealed by pressing or using sealing means such as a sealing gasket or a sealing coating, which is not specifically limited in the embodiments of the present disclosure. This abutment and sealing method provides a relatively stable and closed storage environment for the phase changer 130, which helps the phase changer 130 to undergo endothermic phase change.

[0039] Furthermore, a pair of packaging covers 120 are respectively arranged at both ends of the plurality of heat conductors 110 in the arrangement direction A. The pair of packaging covers 120 match the structures at both ends of the heat conductor 110, and are tightly combined with the open end and the bottom end of the heat conductor 110 at both ends. Through this tight combination, the pair of packaging covers 120 form a second accommodation space with the corresponding heat conductor 110. In this way, the tight combination of the pair of packaging covers 120 and the heat conductor 110 further enhances the structural stability of the phase change heat dissipation device 100, and prevents the internal structure from loosening due to external forces or vibrations during use, thereby affecting the heat transfer effect. Secondly, the second accommodation space formed by the pair of packaging covers 120 provides an additional storage area for the phase change device 130, which can more comprehensively absorb the heat transferred from the power device.

[0040] Furthermore, the phase changer 130 is arranged in the first accommodation space and the second accommodation space. When the power device releases heat during operation, the heat will first be conducted to the heat conductor 110 in close contact with it. Since the heat conductor 110 has good thermal conductivity, heat can be quickly transferred through the heat conductor 110. As the heat is transferred in the heat conductor 110, the phase changer 130 begins to absorb the heat. When the phase changer 130 absorbs enough heat, it will undergo a phase change according to its own physical properties. For example, it can change from a solid state to a liquid state, or from a liquid state to a gas state, which is not specifically limited in the embodiments of the present disclosure.

[0041] During the phase change process, phase changer 130 absorbs a significant amount of latent heat. Compared to existing heat dissipation materials that absorb heat solely through temperature increases, this phase change heat absorption method of phase changer 130 has higher heat absorption efficiency. Furthermore, after the power device stops operating, it can quickly cool down to prepare for the next startup, ensuring its normal operation and performance stability. Therefore, phase changer 130 can effectively absorb and store the heat generated by the power device, thereby reducing its temperature and ensuring stable operation within an appropriate temperature range. This improves its performance and reliability, and extends its service life.

[0042] In some embodiments, the pair of packaging covers 120 and the plurality of heat conductors 110 include through holes 1201 aligned along an arrangement direction A. Furthermore, the phase change heat dissipation device 100 further includes a locking member 140. When the packaging covers and the heat conductors 110 are assembled, the locking member 140 is coupled and inserted into the through holes 1201 along the arrangement direction A, passing through the phase change body 130, to lock the plurality of heat conductors 110 and the pair of packaging covers 120. For example, the locking member 140 may include a rivet, a screw, or other structure, which is not specifically limited in the embodiments of the present disclosure.

[0043] During installation, the locking member 140 is accurately inserted into the through-hole 1201 along the arrangement direction A. By applying appropriate pressure or using a tightening tool, the locking member 140 is tightly bonded to the heat conductor 110 and the packaging cover. This tight bond not only prevents loosening or displacement between the heat conductor 110 and the packaging cover during use, ensuring the structural stability of the phase change heat sink 100, but also facilitates heat transfer between the various components, improving heat dissipation efficiency.

[0044] In some embodiments, in the phase-change heat dissipation device 100 , the heat conductor 110 includes a first limiting hole and a first limiting column 1102 .

[0045] Furthermore, first limiting holes are arranged at the bottom end of the heat conductor 110. They are arranged at a predetermined spacing and distribution on the bottom surface of the heat conductor 110. For example, the first limiting holes can be set at the four corners of the bottom end or along the edge. The specific location and number of the first limiting holes will be determined by the size and shape of the heat conductor 110 and the structural requirements of the entire phase change heat dissipation device 100.

[0046] The first limiting hole can ensure that when a plurality of heat conductors 110 are stacked, they can accurately dock with the corresponding structures of adjacent heat conductors 110 to achieve mechanical connection and heat conduction.

[0047] In terms of shape, the first limiting hole can be a circular hole to facilitate processing and manufacturing, and when matched with the cylindrical first limiting column 1102, it can provide guidance and positioning to ensure the assembly accuracy between adjacent heat conductors 110.

[0048] During the stacking and assembly of multiple heat conductors 110, when the first limiting posts 1102 of adjacent heat conductors 110 are inserted into the first limiting holes, the relative positions of the adjacent heat conductors 110 can be accurately determined, preventing displacement or misalignment between the heat conductors 110 during use, helping to ensure uniform heat transfer between the heat conductors 110, ensuring the structural stability of the phase change heat dissipation device 100, and improving heat dissipation efficiency and reliability.

[0049] Furthermore, first limiting posts 1102 are arranged at the open end of the heat conductor 110, corresponding to the first limiting holes. The position and number of the first limiting posts 1102 match the first limiting holes to ensure that they can be accurately inserted into the first limiting holes of the adjacent heat conductor 110 during assembly.

[0050] For example, if first limiting holes are provided at the four corners of the bottom end of the heat conductor 110, then four first limiting posts 1102 are also provided at the corresponding positions of the open end. This corresponding layout ensures the symmetry and stability of the heat conductors 110 when stacked.

[0051] The size of the first limiting column 1102 can closely match the first limiting hole to provide a stable connection.

[0052] In terms of shape, the first limiting column 1102 can be cylindrical, which is conducive to playing a guiding role when inserted into the first limiting hole, making the assembly process more convenient. At the same time, the cylindrical structure has good mechanical strength and can withstand certain external forces without being easily deformed.

[0053] In this way, the first limiting post 1102 cooperates with the first limiting hole to achieve fast and accurate assembly and positioning of the heat conductor 110. During the assembly process of the phase change heat dissipation device 100, the cooperation between the first limiting post 1102 and the first limiting hole can improve assembly efficiency and reduce assembly errors.

[0054] In some embodiments, the first package cover 121 of the pair of package covers 120 includes a second limiting hole. The second limiting hole is arranged on a side close to the thermal conductor 110 to accurately mate with the first limiting post 1102 at the open end of the thermal conductor 110. The second limiting holes can be evenly distributed in the area where the first package cover 121 contacts the adjacent thermal conductor 110 to ensure that the first limiting post 1102 of each thermal conductor 110 has a corresponding connection point.

[0055] For example, the second limiting holes may be arranged in the same spacing and arrangement as the first limiting posts 1102 at the open end of the heat conductor 110 , so that one-to-one coupling can be achieved during assembly.

[0056] The size of the second limiting hole should be configured according to the size of the first limiting column 1102 at the open end of the heat conductor 110 to ensure that the first limiting column 1102 can be inserted and ensure that there is a sufficiently tight fit between the two to prevent loosening or shaking during use.

[0057] In terms of shape, the second limiting hole can be circular, matching the cylindrical shape of the first limiting column 1102, which is conducive to providing guidance during assembly, so that the first limiting column 1102 can be accurately inserted into the second limiting hole.

[0058] The second limiting hole is coupled to the first limiting post 1102 at the open end of the heat conductor 110 to achieve positioning and connection between the first packaging cover 121 and the heat conductor 110. When assembling the phase-change heat sink 100, by inserting the first limiting post 1102 into the second limiting hole, the relative position between the first packaging cover 121 and the adjacent heat conductor 110 can be quickly and accurately determined, ensuring the structural accuracy of the entire phase-change heat sink 100.

[0059] During the heat dissipation process, due to heat transfer and possible external factors, the first packaging cover 121 can be tightly connected to the thermal conductor 110 to prevent displacement or deformation. The cooperation between the second limiting hole and the first limiting post 1102 can withstand certain external forces, ensuring a firm connection between the packaging cover and the thermal conductor 110, thereby ensuring the long-term and reliable operation of the phase change heat dissipation device 100.

[0060] In some embodiments, the second encapsulation cover 122 of the pair of encapsulation covers 120 includes a second limiting post. The second limiting post is arranged on a side close to the thermal conductor 110. Its position corresponds to the first limiting hole at the bottom end of the thermal conductor 110, ensuring that the second limiting post can be accurately inserted into the first limiting hole at the bottom end of the thermal conductor 110.

[0061] Similar to the second limiting holes of the first packaging cover 121 , the second limiting pillars can be evenly distributed in the area where the second packaging cover 122 contacts the adjacent heat conductor 110 to achieve effective coupling with the first limiting holes at the bottom end of the heat conductor 110 .

[0062] The size of the second limiting column is adapted to the first limiting hole at the bottom end of the heat conductor 110 to ensure that it can be inserted, and there is a certain tight fit after insertion to prevent it from falling off or loosening during use.

[0063] In terms of shape, the second limiting column can be cylindrical, matching the shape of the first limiting hole, and can provide guidance during assembly, so that the second limiting column can be accurately inserted into the first limiting hole, while also helping to improve the stability of the connection.

[0064] The second limiting post is coupled to the first limiting hole at the bottom end of the heat conductor 110 to achieve connection and fixation between the second packaging cover 122 and the heat conductor 110. During the assembly process, by inserting the second limiting post into the first limiting hole, the connection strength between the second packaging cover 122 and the heat conductor 110 can be strengthened, making the structure of the entire phase change heat dissipation device 100 more stable.

[0065] In this way, the second limiting holes and second limiting columns of a pair of packaging covers 120 in the phase change heat dissipation device 100 cooperate with the first limiting columns 1102 and first limiting holes of the heat conductor 110 to achieve precise assembly and stable operation of the phase change heat dissipation device 100.

[0066] In some embodiments, the pair of package covers may further include a slot for coupling with other components.

[0067] like Figure 3 As shown, in some embodiments, in the phase change heat sink 100, the plurality of heat conductors 110 include mounting holes 1103. The mounting holes 1103 are arranged on the side walls of some of the heat conductors 110 of the plurality of heat conductors 110. Furthermore, the position of the mounting holes 1103 can be determined according to the overall structure of the phase change heat sink 100 and the connection method with the power device, which is not specifically limited in the embodiments of the present disclosure. By connecting the fasteners in the mounting holes 1103, the coupling between the power device and the phase change heat sink 100 is achieved, which facilitates the rapid transfer of heat from the power device to the phase change heat sink 100, and then absorbs the heat through the phase change process of the phase change body 130, thereby achieving heat dissipation of the power device. At the same time, the mounting holes 1103 do not affect the heat transfer inside the phase change heat sink 100 and the operation of the phase change body 130. For example, the mounting holes 1103 can be threaded holes. In addition, the mounting hole 1103 may be arranged throughout the heat conductor 110 or may be arranged only on one side of the heat conductor 110 , which is not specifically limited in the embodiments of the present disclosure.

[0068] Figure 4 FIG shows a cross-sectional view of a phase change heat dissipation device 100 according to an embodiment of the present disclosure. Figure 1 and Figure 4As shown, in some embodiments, in the phase change heat dissipation device 100, the phase changer 130 includes a solid paraffin sheet. The solid paraffin is solid at room temperature and has a stable physical form. When it absorbs the heat transferred from the power device, it gradually changes from solid to liquid as the temperature rises. This phase change process can absorb a large amount of latent heat. Compared with the existing heat dissipation method that only relies on temperature increase to absorb sensible heat, the phase change heat absorption efficiency of the solid paraffin sheet is higher. For example, when a large amount of heat is generated during the operation of the power device, causing the temperature to rise, the solid paraffin sheet can quickly undergo a phase change and effectively absorb heat, thereby reducing the temperature around the power device.

[0069] Furthermore, the phase transition temperature of the solid paraffin sheet can be selected and adjusted based on the operating temperature range of the power device. Specifically, a power device maintains a relatively stable temperature range during normal operation, but experiences a temperature increase when overloaded or other conditions occur. The phase transition temperature of the solid paraffin sheet should be slightly higher than the normal operating temperature of the power device, but lower than the temperature at which it could potentially damage it. In this way, when the temperature of the power device rises slightly, the solid paraffin sheet can begin to phase-transition and absorb heat, thus regulating the temperature in a timely manner and preventing the power device from overheating and failing.

[0070] Furthermore, the solid paraffin sheet is arranged in the first accommodation space formed by the heat conductor 110 and the second accommodation space formed by the encapsulation cover. During installation, the solid paraffin sheet can be cut or customized according to the size of the space so that it can be tightly filled in these accommodation spaces. In order to ensure the heat conduction effect, the solid paraffin sheet should be in full contact with the heat conductor 110 to avoid gaps. Slight extrusion or vibration can be used to make the solid paraffin sheet evenly distributed in the accommodation space and closely fit the surface of the heat conductor 110. For example, after a plurality of heat conductors 110 are stacked and sealed to form the first accommodation space, the solid paraffin sheet is placed one by one in each accommodation groove 1101 so that it is in close contact with the bottom end of the adjacent heat conductor 110 and the inner wall of the accommodation groove 1101. For the second accommodation space, the solid paraffin sheet is also placed in the second accommodation space formed by a pair of encapsulation covers 120 and the end of the heat conductor 110 to ensure that the entire phase change heat dissipation device 100 is filled with solid paraffin sheets.

[0071] In some embodiments, in the present phase change heat dissipation device 100, the shape of the solid paraffin sheet is arranged to closely match the shape of the receiving groove 1101. The shape of the receiving groove 1101 on the heat conductor 110 may include a rectangle, a circle, an ellipse or other regular or irregular shapes, which is not specifically limited in the embodiments of the present disclosure, depending on the heat dissipation requirements of the power device. During the manufacturing process, mold forming or cutting and other processes can be used to ensure that the shape of the solid paraffin sheet is completely consistent with the receiving groove 1101. For example, if the receiving groove 1101 is rectangular, the solid paraffin sheet is also made into a rectangle, and its length, width and thickness must match the corresponding dimensions of the receiving groove 1101 to achieve seamless fit. In addition, the corners of the receiving groove 1101 can be rounded.

[0072] When the power device generates heat, the evenly distributed solid paraffin flakes that fill the receiving slots 1101 can simultaneously absorb heat from multiple directions and undergo phase change. This uniform heat absorption process prevents local overheating and makes the temperature distribution of the phase-change heat sink 100 more uniform. Furthermore, a sufficient amount of solid paraffin flakes ensures that there are sufficient phase-change particles 130 to absorb heat during long-term operation, maintaining the efficient operation of the phase-change heat sink 100 and extending its service life.

[0073] In some embodiments, the contact area between the power device and the phase-change heat sink 100 can be maximized by matching the shape of the side adjacent to the power device with the shape of the power device. For example, if the power device is rectangular, the corresponding side of the phase-change heat sink 100 should also be rectangular, with dimensions that match the outer dimensions of the power device. This ensures that the entire surface of the power device is in close contact with the phase-change heat sink 100, thereby improving heat transfer efficiency.

[0074] Furthermore, the surface of the phase-change heat sink 100 in contact with the power device can maintain a predetermined flatness. When the surface of the phase-change heat sink 100 in contact with the power device has a high flatness, a closer and more uniform contact can be achieved between the two, which helps reduce thermal resistance and improve heat transfer efficiency.

[0075] While various implementations of the present disclosure have been described above, the foregoing description is intended to be illustrative, not exhaustive, and not limited to the disclosed implementations. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described implementations. The terminology used herein is selected to best explain the principles of the implementations, their practical applications, or improvements to existing technologies, or to enable others skilled in the art to understand the various implementations disclosed herein.

Claims

1. A phase change heat dissipation device for power devices, characterized in that: include: A plurality of heat conductors (110) are arranged to be stacked along an arrangement direction (A), and each heat conductor (110) of the plurality of heat conductors (110) comprises a receiving groove (1101) having an open end, the open end of the receiving groove (1101) abutting against and sealing the bottom end of an adjacent heat conductor (110) to form a first receiving space; a pair of packaging covers (120) respectively arranged at both ends of the plurality of heat conductors (110) in the arrangement direction (A), and respectively coupled to the open ends and the bottom ends of the heat conductors (110) located at the two ends to form a second accommodation space; as well as A phase changer (130) is arranged in the first accommodation space and the second accommodation space to absorb heat released by the power device and transferred via the plurality of heat conductors (110).

2. The phase change heat dissipation device according to claim 1, characterized in that: The pair of packaging covers (120) include through holes (1201) aligned along the arrangement direction (A), and the phase change heat dissipation device further includes: A locking member (140) is coupled and inserted into the through hole (1201) along the arrangement direction (A) to lock the plurality of heat conductors (110) and the pair of packaging covers (120).

3. The phase change heat dissipation device according to claim 1, characterized in that: The heat conductor (110) comprises: A first limiting hole is arranged at the bottom end of the heat conductor (110); and A first limiting column (1102) is arranged at the open end and is suitable for coupling with the first limiting hole.

4. The phase change heat dissipation device according to claim 3, characterized in that: The first packaging cover (121) of the pair of packaging covers (120) comprises: The second limiting hole is arranged on a side close to the heat conductor (110), and is coupled to the first limiting column (1102) at the open end of the heat conductor (110), and The second packaging cover (122) of the pair of packaging covers (120) comprises: A second limiting column is arranged on a side close to the heat conductor (110) and is coupled to the first limiting hole at the bottom end of the heat conductor (110).

5. The phase change heat dissipation device according to claim 1, characterized in that: The plurality of heat conductors (110) further include: The mounting holes (1103) are arranged on the side walls of some of the heat conductors (110) of the plurality of heat conductors (110) and are suitable for fasteners to pass through so as to couple the phase-change heat sink to the power device.

6. The phase change heat dissipation device according to claim 1, characterized in that: The phase change agent (130) comprises a solid paraffin flake.

7. The phase change heat dissipation device according to claim 6, characterized in that: The shape of the solid paraffin sheet matches the shape of the receiving groove (1101) and fills the receiving groove (1101).

8. The phase change heat dissipation device according to claim 1, characterized in that: The shape of the phase-change heat sink adjacent to the power device matches the shape of the power device.

9. An electronic device, characterized in that: include: Power devices; as well as The phase change heat dissipation device according to any one of claims 1 to 8 is coupled to the power device and is suitable for absorbing heat generated by the power device.

10. The electronic device according to claim 9, wherein: The power device includes a solid-state starter or a circuit breaker.

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