Heater for vacuum cavity and semiconductor processing equipment
Through the design of multi-layer heating wire and thermal conduction disk, the problems of heating unevenness and slow heating rate are solved, efficient and uniform heating of the heater is achieved, and the product waste rate is reduced.
Patent Information
- Application Number
- CN202422228389.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-09-11
AI Technical Summary
During the heating process, existing heaters have problems such as heating unevenness and slow heating rate, resulting in high product waste rate.
The disk body made of at least two layers of heating wire and a thermally conductive material is fixed by vacuum brazing and welding to form a multi-layered vacuum cavity heater to ensure that the heating wire is located in the groove to increase the contact area, and selectively heated by the control device using a single-layer or double-layer heating wire.
It improves the heating uniformity and heating rate of the heater, reduces the product scrap rate, and improves the thermal stability and heating efficiency.
Smart Images
Figure CN223261672U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor equipment, in particular to a vacuum heater and semiconductor processing equipment. Background Art
[0002] In the semiconductor equipment industry, there are many types of heaters, such as four-sided aluminum tube heaters, copper tube four-sided heaters, and invasive aluminum semiconductor heaters. Since existing heaters will produce a high scrap rate after heating the product, the requirements for heating efficiency and uniform heat distribution when the heater heats the product are gradually increasing, and the requirements for the flatness of the heater are also gradually increasing. However, the structure of the designed heater has not been well considered from the perspective of processing and welding.
[0003] At present, there are some heaters in which the heating wire and the cooling tube are placed on a flat carrier with intervals. Since there is only one heating wire on the flat carrier of the heater, the heating wire will have a low heating rate and uneven heating, which will lead to a high scrap rate of the heated products.
[0004] Therefore, there is an urgent need for a vacuum chamber heater that can solve the problem of heater heating uniformity and the problem of slow heating rate. Utility Model Content
[0005] The purpose of the utility model is to provide a heater for a vacuum chamber, which can solve the problem of heating uniformity of the heater and the problem of slow heating rate.
[0006] As conceived above, the technical solution adopted by the present utility model is:
[0007] A heater for a vacuum chamber, comprising:
[0008] Heating wires, the number of which is set to at least two;
[0009] a disk body made of a heat-conducting material;
[0010] The number of the discs is set to be multiple, and the multiple discs are stacked and arranged, and the heating wire is arranged between any two adjacent discs.
[0011] As an optional solution for the vacuum chamber heater, at least one of the heating wires is an armored heating wire.
[0012] As an optional solution for the vacuum chamber heater, the material of the disk is stainless steel.
[0013] As an optional solution for the vacuum chamber heater, a groove is provided on the surface of the disk facing the heating wire, and the grooves on two adjacent disks are correspondingly arranged and enclose a receiving cavity, and the heating wire is located in the receiving cavity.
[0014] As an alternative to the vacuum chamber heater, the groove extends in a curved manner.
[0015] As an optional solution for the vacuum chamber heater, the shape and size of the accommodating cavity are adapted to the shape and size of the heating wire.
[0016] As an optional solution for the vacuum chamber heater, two adjacent discs are fixed by vacuum brazing.
[0017] As an optional solution for the vacuum chamber heater, all the discs are fixed by welding at one time.
[0018] As an optional solution for the vacuum chamber heater, the projections of two adjacent heating wires in a direction perpendicular to the disk are arranged opposite each other.
[0019] A semiconductor processing device comprises a body and a vacuum chamber heater. A vacuum heating chamber is formed in the body, and the vacuum chamber heater is arranged in the heating chamber.
[0020] The beneficial effects of the utility model are:
[0021] The utility model proposes a heater for a vacuum chamber, in which a product to be heated is placed on the uppermost disk, and then at least two layers of heating wires are energized to heat the product to be heated. Since at least two layers of heating wires are provided, not only the heating rate of the entire heater is improved, but also the heating uniformity of the heater is improved, thereby improving the thermal stability of the heater, thereby avoiding the situation in which the product to be heated is scrapped due to the low heating rate and poor heating stability of the heater. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 This is an exploded view of the vacuum chamber heater provided by the present invention;
[0023] Figure 2 It is an axonometric drawing of the second disk provided by the utility model.
[0024] In the picture:
[0025] 1. Heating wire; 11. First heating wire; 12. Second heating wire;
[0026] 2. Plate; 21. First plate; 22. Second plate; 23. Third plate;
[0027] 3. Groove. DETAILED DESCRIPTION
[0028] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved more clearly, the technical solutions of the present invention are further described below with reference to the accompanying drawings and through specific embodiments. It should be understood that the specific embodiments described herein are merely for the purpose of explaining the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the drawings only show portions relevant to the present invention, not all of them.
[0029] In the description of this utility model, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this invention based on the specific circumstances.
[0030] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.
[0031] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are used to refer to positions or locations based on those shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.
[0032] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.
[0033] like Figure 1 As shown, this embodiment provides a heater for a vacuum chamber, comprising a heating filament 1 and a disc 2. The number of heating filaments 1 is set to at least two, and the discs 2 are provided in a plurality, the plurality of discs 2 being stacked, and a heating filament 1 is provided between any two adjacent discs 2.
[0034] When in use, the vacuum chamber heater places the heated component on the outer plate 2. The presence of at least two layers of heating wires 1 improves thermal uniformity. Compared to using only a single layer of heating wires, the vacuum chamber heater heats up faster and achieves greater heating uniformity, thereby preventing the heated component from being scrapped due to substandard heating uniformity and heating rate, thus helping to reduce scrap rates. Furthermore, the plate 2 is constructed of a thermally conductive material, which improves thermal conductivity between the plate 2 and the heating wires 1. This allows heat from each layer of heating wire to be transferred more quickly to the heated component, increasing the vacuum chamber heater's heating rate and preventing the heated component from being scrapped due to substandard heating rate, which can lead to a high product scrap rate.
[0035] Alternatively, as Figure 1 As shown, to facilitate the connection and fixation of the entire vacuum chamber heater, this embodiment has two heating wires 1 and three discs 2. The two heating wires 1 are a first heating wire 11 and a second heating wire 12, and the three discs 2 are a first disc 21, a second disc 22, and a third disc 23. The first heating wire 11 is positioned between the first disc 21 and the second disc 22, and the second heating wire 12 is positioned between the second disc 22 and the third disc 23, to reduce the difficulty of subsequent welding.
[0036] In other embodiments, the number of the heating wires 1 may be multiple, such as three, four, five, etc., and the disk surface 2 also changes with the number of the heating wires 1 .
[0037] An armored heating wire is a device that heats a resistance wire or electric heating alloy wire enclosed in a tube made of stainless steel, copper, nickel, alloy steel, aluminum, or other materials. Because the armored tube possesses strong high-temperature and corrosion resistance, the armored heating wire not only prevents erosion and damage from external substances, but also allows it to operate at higher temperatures. The thinner the armored tube, the better the thermal conductivity of the armored heating wire, allowing it to more quickly transfer temperature changes to the product being heated. The high strength and wear resistance of the armored tube make the armored heating wire less susceptible to damage even in harsh environments, ensuring stable heating.
[0038] Optionally, in order to enable the vacuum chamber heater to increase the temperature to a higher level and have better thermal stability, at least one of the heating wires 1 is configured as an armored heating wire. In order to seek better thermal stability and heating effect, in this embodiment, both heating wires 1 are armored heating wires.
[0039] Optionally, in order to make the disk body 2 have stronger thermal conductivity and corrosion resistance, the disk body 2 can be made of stainless steel, such as 430 stainless steel, 304 stainless steel and 310 stainless steel, etc. In order to make the disk body 2 have better high temperature resistance and antioxidant functions, the disk body 2 of this embodiment uses 310 stainless steel, specifically SUS310S stainless steel.
[0040] Specifically, if Figure 1 and Figure 2 As shown, a groove is provided on the surface of the disk body 2 facing the heating wire 1, and the grooves on two adjacent disk bodies 2 are provided correspondingly and enclose a receiving cavity, and the heating wire 1 is located in the receiving cavity. The above arrangement makes the contact area between the disk body 2 and the heating wire 1 larger, thereby improving the heating rate and heating uniformity of the vacuum chamber heater.
[0041] Optionally, the shape and size of the accommodating cavity are adapted to the shape and size of the heating wire 1, so as to avoid the situation where the heating wire 1 is assembled and welded using two grooves of incompatible sizes, with a hollow area in the middle, and the heating wire 1 consumes heat in the hollow area, resulting in a decrease in the heating rate of the vacuum heater body. It should be noted here that the shape and size of the accommodating cavity are adapted to the shape and size of the heating wire 1, which means that the cross-sectional shape of the accommodating cavity is the same as the cross-sectional shape of the heating wire 1, and the cross-sectional size of the accommodating cavity is comparable to the cross-sectional size of the heating wire 1, so that the inner wall of the accommodating cavity can be in good contact with the outer wall of the heating wire 1, avoiding the occurrence of a hollow area.
[0042] Alternatively, as Figure 1 and Figure 2 As shown, the groove is designed to bend and extend on the disk body 2 to increase the length of the heating wire 1, increase the contact area between the heating wire 1 and the disk body 2, and improve the uniformity of the distribution of the heating wire 1 on the disk body 2, thereby improving the heating rate and thermal uniformity of the vacuum chamber heater and reducing the scrap rate of the product to be heated.
[0043] Specifically, two adjacent discs 2 are secured together with the heater wire 1 sandwiched between them using vacuum brazing. This method effectively joins the two adjacent discs 2 together. By placing a welding sheet between the two adjacent discs 2 and performing vacuum brazing under high temperature and high pressure, the various connected components are tightly bonded. Because vacuum brazing occurs in a high temperature and high pressure environment, the vacuum chamber heater exhibits enhanced high-temperature resistance.
[0044] More specifically, in order to make the vacuum chamber heater more stable, stronger and more integrated as a whole, the fixed connection between all the disks 2 and the heating wires 1 in the vacuum chamber heater is completed in only one welding process.
[0045] Optionally, two adjacent heating filaments 1 can be positioned perpendicular to the disk 2, with their projections facing each other or staggered. If two adjacent heating filaments 1 are positioned perpendicular to the disk 2, the vacuum chamber heater's heating rate can be increased. If two adjacent heating filaments 1 are positioned perpendicular to the disk 2, with their projections staggered, the heated area can be expanded, resulting in more uniform heating of the product. To further increase the vacuum chamber heater's heating rate, in this embodiment, two adjacent heating filaments 1 are positioned perpendicular to the disk 2, with their projections facing each other.
[0046] To illustrate the improved heating efficiency of the vacuum chamber heater provided by this embodiment, temperature rise tests were conducted on the vacuum chamber heater provided by this embodiment and a conventional single-layer heating wire heater. The first heating wire 11 had a total length of NA, a heating length of NA, and a room temperature resistance of 9.97Ω. The second heating wire 12 had a total length of NA, a heating length of NA, and a room temperature resistance of 10.65Ω. The parameters of the conventional single-layer heating wire were substantially the same as those of the first and second heating wires. The first and second heating wires 11 and 12 were placed between the two cavities formed by the first, second, and third disks 21, 22, and 23, respectively, and the vacuum chamber heater was vacuum brazed in a single step. The power supply voltage used during the test is AC220V and the frequency is 50Hz. The operating temperature of the disk body 2 during the test is between 0 and 450°C. The power of the heating wire 1 of the vacuum chamber heater provided in this embodiment is 9000W to 10000W, which is twice the power of the existing single-layer heating wire, and the temperature rise time is shortened by more than half compared with the power of the existing single-layer heating wire. During the test, the rated power of the first heating wire 11 is 4854W, which meets the normal power requirement, and the rated power of the second heating wire 12 is 4544W, which meets the normal power requirement.
[0047] When the vacuum chamber heater provided in this embodiment is subjected to a withstand voltage test, at 1500V AC, the leakage current is less than 3mA, the withstand voltage strength of the first heating wire 11 is 0.720mA, and the withstand voltage strength of the second heating wire 11 is 0.687mA, which meets the withstand voltage test requirements; when conducting a cold insulation test, at 1500V AC, the insulation resistance of the two layers of heating wires 1 is greater than 1000MΩ, which meets the cold insulation test requirements; when conducting a hot insulation test, at 300°C in a vacuum environment, the insulation resistance of the two layers of heating wires 1 is greater than 100MΩ, which meets the hot insulation test requirements.
[0048] From the above tests, it can be seen that the power of the vacuum chamber heater is doubled compared to the power of the existing single-layer heating wire, and the temperature rise time is shortened by more than half compared to the power of the existing single-layer heating wire. In subsequent performance tests such as voltage resistance test, cold insulation test and hot insulation test, it passed the test, indicating that it is feasible to use a double-layer heating wire to improve the heating rate and thermal uniformity of the vacuum chamber heater, and its rated power during the heating process is in line with the normal use power requirement range, which also shows that it is feasible to use vacuum brazing to perform a single welding connection between the disk body 2 and the disk body 2.
[0049] This embodiment also provides a semiconductor processing device for heating semiconductors. The semiconductor processing device includes a housing and a vacuum chamber heater. The housing defines a vacuum heating chamber, and the vacuum chamber heater is disposed within the vacuum heating chamber. When a semiconductor product requires heating, the housing can be opened and the semiconductor product, which can be a wafer, placed on the vacuum chamber heater within the vacuum heating chamber. The housing is then closed and a heating switch is turned on to heat the semiconductor product.
[0050] The semiconductor heating device provided in this embodiment also includes a power supply device and a control device. The power supply device is electrically connected to the control device, and the power supply device is electrically connected to the first heating filament 11 and the second heating filament 12, respectively, for supplying power to the first heating filament 11 and the second heating filament 12. The control device is used to control the power supply device and the first heating filament 11 and the second heating filament 12 to operate independently of each other, or to operate simultaneously. The control device is mounted on the device body. After the semiconductor product is placed on the vacuum chamber heater, the vacuum chamber is closed and the power switch is turned on. The control device on the device body can select whether to heat the semiconductor product with only one layer of heating filament 1 or with both layers of heating filament 1. When the semiconductor product does not require an excessively high heating rate, only one layer of heating filament 1 is turned on to heat the semiconductor product. This configuration saves energy and avoids waste of resources.
[0051] It should be noted here that the power supply device and the control device are existing structures. Setting up a power supply device and a control device in semiconductor processing equipment is a conventional setting in this field. In this embodiment, any connection method in the existing technology can be used to connect the power supply device, the control device, the first heating wire 11 and the second heating wire 12. As long as the control device can switch between heating the semiconductor product with only one layer of heating wire 1 and heating the semiconductor product with two layers of heating wire 1, no further detailed introduction will be given.
[0052] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.
Claims
1. A heater for a vacuum chamber, characterized in that: include: Heating wires (1), the number of the heating wires (1) is set to at least two; A disk body (2), wherein the disk body (2) is made of a heat-conducting material; The number of the disc bodies (2) is set to be multiple, and the multiple disc bodies (2) are stacked and arranged, and the heating wire (1) is arranged between any two adjacent disc bodies (2).
2. The vacuum chamber heater according to claim 1, wherein: At least one of the heating wires (1) is an armored heating wire.
3. The vacuum chamber heater according to claim 1, wherein: The material of the disc body (2) is stainless steel.
4. The vacuum chamber heater according to any one of claims 1 to 3, characterized in that: A groove (3) is provided on the surface of the disk body (2) facing the heating wire (1), and the grooves (3) on two adjacent disk bodies (2) are correspondingly arranged to form an accommodating cavity, and the heating wire (1) is located in the accommodating cavity.
5. The vacuum chamber heater according to claim 4, wherein: The groove (3) extends in a curved manner.
6. The vacuum chamber heater according to claim 4, wherein: The shape and size of the accommodating cavity are adapted to the shape and size of the heating wire (1).
7. The vacuum chamber heater according to any one of claims 1 to 3, characterized in that: The two adjacent disc bodies (2) are fixed by vacuum brazing.
8. The vacuum chamber heater according to any one of claims 1 to 3, characterized in that: All the disc bodies (2) are fixed by welding at one time.
9. The vacuum chamber heater according to any one of claims 1 to 3, characterized in that: The projections of two adjacent heating wires (1) in a direction perpendicular to the disk body (2) are arranged opposite to each other.
10. A semiconductor processing equipment, characterized in that: The vacuum chamber heater comprises a body and any one of claims 1 to 9, wherein a vacuum heating chamber is formed in the body, and the vacuum chamber heater is arranged in the heating chamber.