Metal-based copper-clad plate

Abstract

The metal-based copper-clad plate comprises a metal substrate, a first insulating layer, a metal heat-conducting plate, a second insulating layer and a conducting layer which are arranged in sequence, the first insulating layer is at least one of a heat-conducting prepreg or a heat-conducting glue composite film; and the second insulating layer is a heat-conducting glue layer. According to the utility model, the insulating layers and the heat-conducting layers which are made of different materials are arranged in the copper-clad plate structure, the heat-conducting property is enhanced through the metal heat-conducting plate between the insulating layers, and the second insulating layer and the conductive layer which are thinner are arranged adjacently, so that heat can be quickly transferred to the metal heat-conducting plate; the metal heat-conducting plate with good heat-conducting property transfers heat out, so that good voltage-resistant insulativity is realized, good heat conductivity is also realized, and the requirements of high heat conductivity and high voltage-resistant property of the metal-based copper-clad plate are met.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit boards, and in particular relates to a metal-based copper-clad plate. Background Art

[0002] With the rapid development of environmental protection, new energy technologies, and the LED lighting industry, the technology behind copper-clad laminates (CCLs), a foundational material for electronic products, has also seen significant advancements. In particular, aluminum-based CCLs, with their excellent thermal conductivity, are widely used in products such as LED lighting, high-power power supplies, TV backlights, automotive electronics, and power modules. The circuit boards used in these products must be able to quickly and efficiently dissipate the accumulated waste heat generated by electronic components and LED chips, thereby reducing the temperature of the circuit boards and electronic components and maintaining stable electronic and electrical performance. Furthermore, they must also possess high voltage resistance to ensure stable operation under overvoltage conditions. However, in existing aluminum-based CCL structures, voltage resistance is ensured by an insulating layer. While a thicker insulating layer improves voltage resistance, this thickness also affects thermal conductivity, making it difficult to achieve both high voltage resistance and thermal conductivity. Utility Model Content

[0003] The purpose of the utility model is to provide a metal-based copper-clad plate with high thermal conductivity and high voltage resistance.

[0004] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0005] A metal-based copper-clad laminate comprises: a metal substrate, a first insulating layer, a metal heat-conducting plate, a second insulating layer and a conductive layer arranged in sequence; the first insulating layer is at least one of a heat-conducting prepreg or a heat-conducting adhesive composite film; the second insulating layer is a heat-conducting adhesive layer.

[0006] In some embodiments, the metal heat conductive plate is a copper plate.

[0007] In some embodiments, the thickness of the metal heat conducting plate is 40 to 100 μm; and / or the thickness of the first insulating layer is 80 to 250 μm; and / or the thickness of the second insulating layer is 50 to 80 μm.

[0008] In some embodiments, the second insulating layer includes at least one thermally conductive prepreg and / or at least one thermally conductive adhesive composite film.

[0009] In some embodiments, the thermally conductive prepreg comprises glass fiber cloth and prepreg thermally conductive adhesive, and the thickness of the thermally conductive prepreg is 80 to 130 μm.

[0010] In some embodiments, the thermally conductive adhesive composite film includes a polyester film and a semi-cured thermally conductive epoxy resin adhesive layer coated on the surface of the polyester film.

[0011] In some embodiments, the thickness of the thermally conductive adhesive composite film is greater than 80 μm.

[0012] In some embodiments, the conductive layer is a conductive metal foil, and the thickness of the conductive layer is 10 to 150 μm.

[0013] In some embodiments, the thermal conductive adhesive layer is coated on the rough surface of the conductive layer.

[0014] In some embodiments, the metal substrate is an aluminum plate.

[0015] It can be seen from the above technical solution that the utility model arranges insulating layers and heat-conducting layers of different materials in the copper-clad laminate structure. In the "sandwich" structure composed of the insulating layer and the metal heat-conducting plate, the thermal conductivity is enhanced by the metal heat-conducting plate between the insulating layers. The second insulating layer with a thinner thickness and the conductive layer are arranged adjacent to each other, so that heat can be quickly transferred to the metal heat-conducting plate, and the metal heat-conducting plate with good thermal conductivity transfers the heat away. While achieving good voltage resistance insulation through multiple insulating layers, it also has good thermal conductivity, meeting the requirements of high thermal conductivity and high voltage resistance of metal-based copper-clad laminates. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 This is a schematic structural diagram of a copper clad laminate of the present invention;

[0018] Figure 2 This is a structural diagram of another embodiment of the copper clad laminate of the present invention;

[0019] Figure 3 This is a structural schematic diagram of another embodiment of the copper clad laminate of the present invention.

[0020] The specific implementation of the present invention will be further described in detail below with reference to the accompanying drawings. DETAILED DESCRIPTION

[0021] The present invention is described in detail below in conjunction with the accompanying drawings. When describing the embodiments of the present invention in detail, for the sake of convenience, the drawings showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. It should be noted that the drawings are simplified and use non-precise scales, which are only used to facilitate and clearly assist in explaining the purpose of the embodiments of the present invention. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated; the terms "front", "back", "bottom", "upper", "lower", "front", "back", "left", "right", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the present invention.

[0022] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, it can mean a fixed connection, a detachable connection, or an integral connection; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean internal communication between two components; it can mean a wireless connection or a wired connection. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0023] An insulating layer is typically included in aluminum-based copper-clad laminates to ensure their voltage resistance. During the manufacturing process, pores and gaps inevitably form within the insulating layer, which can affect its high-voltage resistance. Increasing the thickness of the insulating layer or using a double-layer structure can reduce the impact of pores and gaps on voltage resistance. However, excessively thick insulating layers significantly reduce thermal conductivity. If the thickness of the insulating layer is reduced to improve thermal conductivity, the pores and gaps within the insulating layer will affect its voltage resistance. Therefore, it is often difficult to achieve both high-voltage resistance and thermal conductivity in copper-clad laminates.

[0024] In order to take into account the thermal conductivity and voltage resistance insulation performance of the copper clad laminate, the utility model improves the process structure of the metal-based copper clad laminate and applies a multi-layer insulation and multi-layer thermal conductive structure to achieve high thermal conductivity and high voltage resistance insulation of the copper clad laminate.

[0025] like Figure 1As shown, the metal-based copper-clad laminate of this embodiment includes a metal substrate 1, a first insulating layer 2, a metal heat-conducting plate 3, a second insulating layer 4 and a conductive layer 5 which are arranged in sequence.

[0026] The metal substrate 1 of this embodiment is an aluminum plate. In a specific application, both sides of the metal substrate 1 are subjected to anodizing treatment to improve the insulation performance and bonding strength of the metal substrate 1.

[0027] The first insulating layer 2 can be a thermally conductive prepreg, a thermally conductive adhesive composite film, or a combination of a thermally conductive prepreg and a thermally conductive adhesive composite film. The first insulating layer 2 must have high insulation performance. When a thermally conductive prepreg is used as the first insulating layer 2, it can be formed by stacking multiple thermally conductive prepregs; when a thermally conductive adhesive composite film is used as the first insulating layer 2, it can be formed by stacking multiple thermally conductive adhesive composite films; when a thermally conductive prepreg and a thermally conductive adhesive composite film are used as the first insulating layer 2, the number of thermally conductive prepregs and the number of thermally conductive adhesive composite films can be one or more. The thickness of the first insulating layer 2 is 80 to 250 μm. The main function of the first insulating layer is to provide electrical insulation performance and conduct heat in a direction perpendicular to the surface of the copper clad laminate. For ease of description, in the following description, the direction perpendicular to the surface of the copper clad laminate is defined as radial, and the direction parallel to the surface of the copper clad laminate is defined as transverse.

[0028] Thermally conductive prepregs are made from glass fiber cloth impregnated with thermally conductive adhesive. Specifically, the glass fiber cloth models include 101, 106, 1078, 1080, 2113, 2313, and 2116. These models feature thin, smoothly woven glass fiber cloth. The glass fiber cloth is impregnated with thermally conductive adhesive, and its thickness is controlled using a metering roller. The cloth is then baked at high temperature to semi-cure the impregnated glass fiber cloth, producing the thermally conductive prepreg. The thermally conductive adhesive used can be FR-4 adhesive. The thickness of the thermally conductive prepreg can range from 80 to 130 μm.

[0029] Thermally conductive adhesive composite film is made by impregnating polyester film with a thermally conductive epoxy resin adhesive on both sides, then baking it at high temperature to a semi-cured state. The polyester film can be PET or PI film. The thickness of the thermally conductive adhesive composite film is greater than 80μm.

[0030] The metal heat conducting plate 3 is located between the first insulating layer 2 and the second insulating layer 4. The metal heat conducting plate 3 can be a copper plate. In specific applications, the surfaces of both sides of the metal heat conducting plate 3 are roughened to improve the interfacial bonding strength. The metal heat conducting plate 3 arranged between the insulating layers mainly functions to conduct heat. The heat conduction direction of the metal heat conducting plate 3 is horizontal, and the heat is conducted to the surroundings. Therefore, the thicker the metal heat conducting plate 3, the better the heat conduction effect. In a specific embodiment, the thickness of the metal heat conducting plate 3 can be 40 to 100 μm.

[0031] The second insulating layer 4 is a thermally conductive adhesive layer, and the thickness of the second insulating layer 4 can be 50 to 80 μm. The second insulating layer 4 can be a separate layer of thermally conductive adhesive film, or it can be a thermally conductive adhesive film coated on the surface of the conductive layer 5. When it is a separate thermally conductive adhesive film, a thermally conductive adhesive liquid is coated on the carrier release film, and then baked at high temperature to form a semi-cured state. When used, the carrier release film can be torn off. When coated on the surface of the conductive layer 5, the thermally conductive adhesive liquid can be directly applied to the surface of the conductive layer 5, and then baked at high temperature to form a semi-cured state, and then no carrier release film is required. The second insulating layer 4 has good thermal conductivity and low thermal resistance.

[0032] The conductive layer 5 is a conductive metal foil, specifically, an electrolytic copper foil or an aluminum foil. The thickness of the conductive layer 5 is 10 to 150 μm. When applying thermal conductive adhesive to the conductive layer 5, the thermal conductive adhesive is applied to the rough surface of the conductive layer 5.

[0033] Figure 1 The figure shows the structure of a metal-based copper-clad laminate according to an embodiment of the present invention. Figure 1 The metal-based copper-clad laminate shown in this example comprises, in order: a metal substrate 1 (aluminum plate), a first insulating layer 2 (thermally conductive prepreg), a metal thermally conductive plate 3 (copper plate), a second insulating layer 4 (thermally conductive adhesive film), and a conductive layer 5 (conductive metal foil). The second insulating layer 4 and the conductive layer 5 are independent of each other. The metal substrate 1, first insulating layer 2, metal thermally conductive plate 3, second insulating layer 4, and conductive layer 5 are hot-pressed to form the metal-based copper-clad laminate.

[0034] Figure 2 Shown is a schematic structural diagram of a metal-based copper-clad laminate according to another embodiment of the present invention. Figure 2 The metal-based copper-clad laminate shown includes, in sequence: a metal substrate 1 (aluminum plate), a first insulating layer 2 (thermal conductive prepreg), a metal thermal conductive plate 3 (copper plate) and a conductive metal foil coated with glue, that is, the second insulating layer 4 is a thermal conductive adhesive film formed by directly applying a thermal conductive adhesive liquid on the surface of the conductive layer 5.

[0035] Figure 3 The figure shows the structure of a metal-based copper-clad laminate according to an embodiment of the present invention. Figure 3 The metal-based copper-clad laminate shown includes, in sequence: a metal substrate 1 (aluminum plate), a first insulating layer 2 (thermal conductive adhesive composite film), a metal thermal conductive plate 3 (copper plate), a second insulating layer 4 (thermal conductive adhesive film) and a conductive layer 5 (conductive metal foil).

[0036] The copper-clad laminate of the present invention improves its voltage resistance by providing multiple insulating layers. Metal heat-conducting plates are also provided between the insulating layers. When heat is transferred from the components to the second insulating layer, the heat conduction direction is primarily radial. The thinner the second insulating layer, the better the thermal conductivity. By providing a thinner second insulating layer (50-80 μm), heat is rapidly transferred to the metal heat-conducting plate 3. When heat continues to transfer to the metal heat-conducting plate, the heat conduction direction is both radial and transverse. Radial heat conduction occurs through the first insulating layer, while transverse heat conduction occurs through the metal heat-conducting plate. The thicker the metal heat-conducting plate, the better the transverse thermal conductivity. This invention achieves a balance between voltage resistance and high thermal conductivity through a thermally conductive and insulating composite structure composed of different materials.

[0037] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A metal-based copper-clad laminate, characterized in that: include: A metal substrate, a first insulating layer, a metal heat conducting plate, a second insulating layer and a conductive layer are sequentially arranged; The first insulating layer is at least one of a thermally conductive prepreg or a thermally conductive adhesive composite film; The second insulating layer is a thermal conductive adhesive layer.

2. The metal-based copper-clad laminate according to claim 1, wherein: The metal heat conducting plate is a copper plate.

3. The metal-based copper-clad laminate according to claim 1, wherein: The thickness of the metal heat conducting plate is 40 to 100 μm; And / or, the thickness of the first insulating layer is 80 to 250 μm; And / or, the thickness of the second insulating layer is 50-80 μm.

4. The metal-based copper-clad laminate according to claim 1, wherein: The second insulating layer includes at least one thermally conductive prepreg and / or at least one thermally conductive adhesive composite film.

5. The metal-based copper-clad laminate according to claim 1, wherein: The thermally conductive prepreg comprises glass fiber cloth and prepreg thermally conductive adhesive, and the thickness of the thermally conductive prepreg is 80 to 130 μm.

6. The metal-based copper-clad laminate according to claim 1, wherein: The thermally conductive adhesive composite film comprises a polyester film and a semi-cured thermally conductive epoxy resin adhesive layer coated on the surface of the polyester film.

7. The metal-based copper-clad laminate according to claim 1, wherein: The thickness of the thermally conductive adhesive composite film is greater than 80 μm.

8. The metal-based copper-clad laminate according to claim 1, wherein: The conductive layer is a conductive metal foil, and the thickness of the conductive layer is 10 to 150 μm.

9. The metal-based copper-clad laminate according to claim 1, wherein: The thermal conductive adhesive layer is coated on the rough surface of the conductive layer.

10. The metal-based copper-clad laminate according to claim 1, wherein: The metal substrate is an aluminum plate.

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