Unidirectional deformation durable FPC structure
By introducing a combined design of linear airbags and reinforced cylinder clips into the FPC structure, the problem of FPC twisting and lifting under external forces is solved, and the unidirectional deformation and durability improvement is achieved. It is suitable for electronic devices that require frequent bending or stretching.
Patent Information
- Application Number
- CN202422540085.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-18
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-10-18
AI Technical Summary
When existing FPCs are subjected to external forces, they are prone to deformation in different dimensions such as torsion, resulting in the layer structure being curled up and layered, poor durability, and the existing reinforcement design cannot effectively absorb and disperse external forces, resulting in structural damage.
A combined structure of linear airbags, reinforced columns and clamps is adopted. The extension direction of the airbag is perpendicular to the circuit board, absorbs vertical external forces, combines reinforced rib strips and glue layers to ensure unidirectional deformation, and tightens each layer through reinforced columns and clamps to form a stable FPC structure.
The unidirectional deformation of FPC is realized, the stability and durability of the structure is improved, the curling and layering caused by torsion is avoided, and the overall stability and reliability are enhanced. It is suitable for application scenarios where frequent bending or stretching are performed.
Smart Images
Figure CN223261701U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of flexible circuit boards, in particular to a unidirectionally deformable durable FPC structure. Background Art
[0002] In the field of electronic product manufacturing, FPC (Flexible Printed Circuit) is widely used in various portable devices due to its light, thin and bendable characteristics.
[0003] In related technologies, FPC mainly includes a circuit structure and an insulating layer structure on both sides of the circuit structure. When subjected to external force, it is prone to deformation in different dimensions such as torsion, which can easily cause the layer structure of the FPC to warp, delaminate, and other problems, thereby causing the guide column circuit structure to break or performance degradation, poor durability, and insufficient reliability of the FPC. Utility Model Content
[0004] The present invention aims to solve at least one of the technical problems in the prior art. To this end, the present invention proposes a unidirectionally deformable durable FPC structure, which can achieve unidirectional deformation, good durability, and a stable and reliable structure.
[0005] According to an embodiment of the present invention, a unidirectionally deformable durable FPC structure includes a circuit board body, a first adhesive layer and an insulating substrate are sequentially provided on one side of the circuit board body, a second adhesive layer and an insulating protective layer are sequentially provided on the other side of the circuit board body, a plurality of linear airbags are provided between the second adhesive layer and the insulating protective layer, the extension direction of the linear airbags is perpendicular to the extension direction of the circuit board body, and all the linear airbags are spaced apart along the extension direction of the circuit board body; each linear airbag is provided with a reinforcing column at both opposite ends, and a first clip and a second clip are respectively provided at both opposite ends of the reinforcing column, the first clip abuts against the side of the insulating substrate away from the circuit board body, and the second clip abuts against the side of the insulating protective layer away from the circuit board body.
[0006] In this embodiment, a reinforcing rib is provided on the side of the insulating protective layer away from the second adhesive layer. A reinforcing rib is provided between every two adjacent linear airbags, and a gap is formed between each reinforcing rib and the adjacent linear airbag.
[0007] In this embodiment, the thickness of the reinforcing rib is smaller than the height of the linear airbag.
[0008] In this embodiment, the reinforcement ribs are polyimide ribs.
[0009] In this embodiment, the circuit board body is provided with a positioning hole that simultaneously passes through the insulating substrate, the first adhesive layer, the second adhesive layer and the insulating protective layer, and the reinforcement column is provided in the positioning hole.
[0010] In this embodiment, the circuit board body includes at least one conductive circuit layer, and the positioning holes are located outside the distribution range of the conductive circuit layer.
[0011] In this embodiment, the conductive circuit layer is provided with at least two layers, an insulating layer is provided between every two adjacent conductive circuit layers, and an adhesive layer is provided between each insulating layer and the adjacent conductive circuit layer.
[0012] In this embodiment, the linear airbag is filled with an inert gas.
[0013] The embodiments of the present invention have at least the following beneficial effects:
[0014] By connecting the insulating substrate and the insulating protective layer through adhesive layers on opposite sides of the circuit board body, and embedding a number of linear airbags between the second adhesive layer and the insulating protective layer as a reinforcement structure, not only the stability of the FPC structure can be effectively enhanced, but also the weight of the overall FPC structure can be effectively controlled. The lightweight degree is high and can meet the application needs of current lightweight electronic devices. The extension direction of the linear airbag is perpendicular to the extension direction of the circuit board body, and can effectively absorb and disperse external forces perpendicular to the extension direction of the circuit board. When the FPC structure is subjected to such external forces, it mainly exhibits unidirectional deformation, which makes the FPC The structure can only be bent around the extension direction parallel to the linear airbag, which can effectively prevent the FPC structure from twisting during use, thereby effectively avoiding defects such as edge warping and delamination caused by twisting. The structure is stable and reliable with good durability. In addition, by reinforcing the column and cooperating with the first clip and the second clip to clamp on the insulating substrate and the insulating protective layer respectively, the insulating substrate, the first adhesive layer, the circuit board body, the second adhesive layer and the insulating protective layer can be tightly combined together, which can effectively improve the stability of the position of the linear airbag between the second adhesive layer and the insulating protective layer, and the integrity and stability of the FPC structure are high. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0016] Figure 1 A schematic diagram of the three-dimensional structure of a unidirectionally deformable durable FPC structure according to an embodiment of the present invention;
[0017] Figure 2 Schematic diagram of the cross-sectional structure of a unidirectionally deformable durable FPC structure according to an embodiment of the present invention;
[0018] Figure 3 This is a schematic cross-sectional view of the durable FPC structure with unidirectional deformation according to an embodiment of the present invention in another direction;
[0019] Figure 4FIG. 1 is a schematic cross-sectional view of a durable FPC structure with unidirectional deformation in another embodiment of the present invention in another direction.
[0020] Reference numerals:
[0021] Circuit board body 100, positioning hole 101, conductive circuit layer 110, insulating layer 120, adhesive layer 130;
[0022] First adhesive layer 210, insulating substrate 220;
[0023] Second adhesive layer 310, insulating protective layer 320, linear airbag 330, reinforcing rib 340;
[0024] Reinforcement column 410 , first clip 420 , second clip 430 . DETAILED DESCRIPTION
[0025] The following describes in detail embodiments of the present invention. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.
[0026] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, left, right, front, back, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.
[0027] In the description of this utility model, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0028] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.
[0029] In the field of electronic product manufacturing, FPC (Flexible Printed Circuit) is widely used in various portable devices due to its thinness and bendability. In related technologies, FPCs primarily consist of a circuit structure and insulating layers on both sides of the circuit structure. When subjected to external forces, they are prone to deformation in various dimensions, such as torsion. This can easily cause the FPC's layers to warp and delaminate, leading to breakage or performance degradation of the guide post circuit structure, poor durability, and insufficient FPC reliability.
[0030] Durability and reliability, particularly in applications requiring repeated bending or stretching, become key factors limiting the performance of electronic products. Furthermore, existing FPC structures typically enhance stability and durability through simple layering, such as directly attaching a protective film. However, this design often fails to effectively absorb and disperse external forces, particularly in specific directions, such as those perpendicular to the circuit board's extension, where stress concentration can easily lead to structural damage. Furthermore, this simple layer-stacked structure is expensive to manufacture.
[0031] The following reference Figure 1 To the attached Figure 4 , describing a unidirectionally deformable durable FPC structure of an embodiment of the present utility model, which can achieve unidirectional deformation, has good durability, and a stable and reliable structure.
[0032] Reference Figures 1 to 4 The embodiment of the present invention is a unidirectional deformation durable FPC structure, comprising a circuit board body 100, a first adhesive layer 210 and an insulating substrate 220 are sequentially provided on one side of the circuit board body 100, the first adhesive layer 210 covers one side of the circuit board body 100, and the insulating substrate 220 covers the side of the first adhesive layer 210 away from the circuit board body 100, and the other side of the circuit board body 100 is sequentially provided with a second adhesive layer 310 and an insulating protective layer 320, the second adhesive layer 310 covers the circuit board body 100. On the other side, an insulating protective layer 320 covers the side of the second adhesive layer 310 away from the circuit board body 100. A plurality of linear airbags 330 are provided between the second adhesive layer 310 and the insulating protective layer 320. The linear airbags 330 are in the shape of an elongated strip, such as a rectangular or elliptical strip. The size of the elongated strip in one dimension is larger than the sizes in the other two dimensions. The extension direction of the linear airbags 330 is perpendicular to the extension direction of the circuit board body 100. All linear airbags 330 are arranged at intervals along the extension direction of the circuit board body 100.
[0033] Each linear airbag 330 is provided with a reinforcement column 410 at opposite ends. A first clip 420 and a second clip 430 are provided at opposite ends of the reinforcement column 410, respectively. The first clip 420 abuts the side of the insulating substrate 220 away from the circuit board body 100, and the second clip 430 abuts the side of the insulating protective layer 320 away from the circuit board body 100. The first clip 420 and the second clip 430 cooperate with the reinforcement column 410 to clamp the insulating substrate and the insulating protective layer 320, thereby ensuring the structural stability of the insulating substrate 220, the first adhesive layer 210, the circuit board body 100, the second adhesive layer 310, and the insulating protective layer 320. This effectively improves the stability of the linear airbag 330 between the second adhesive layer and the insulating protective layer 320, further enhancing the durability of the FPC structure. Preferably, the first adhesive layer 210 and the second adhesive layer 310 can be configured as prepreg or other adhesive layers.
[0034] By connecting the insulating substrate 220 and the insulating protective layer 320 via adhesive layers on opposite sides of the circuit board body 100, and embedding a plurality of linear airbags 330 as a reinforcement structure between the second adhesive layer 310 and the insulating protective layer 320, not only can the stability of the FPC structure be effectively enhanced, but the weight of the entire FPC structure can also be effectively controlled, resulting in a high degree of lightweighting that can meet the application requirements of current lightweight electronic devices. The extension direction of the linear airbags 330 is perpendicular to the extension direction of the circuit board body 100, and can effectively absorb and disperse external forces perpendicular to the extension direction of the circuit board. When the FPC structure is subjected to such external forces, it mainly exhibits unidirectional deformation, so that the FPC structure can only bend around the extension direction parallel to the extension direction of the linear airbags 330, which can effectively prevent the FPC structure from twisting during use, thereby effectively avoiding defects such as edge warping and delamination caused by twisting. The structure is stable and reliable, and has good durability.
[0035] In addition, by cooperating with the first clip 420 and the second clip 430 to clamp the insulating substrate 220 and the insulating protective layer 320 respectively, the insulating substrate 220, the first adhesive layer 210, the circuit board body 100, the second adhesive layer 310 and the insulating protective layer 320 can be tightly combined together, which can effectively prevent peeling between the interlayers, effectively avoid the displacement or deformation of the airbag during the force process, and effectively improve the stability of the position of the linear airbag 330 between the second adhesive layer 310 and the insulating protective layer 320. The integrity and stability of the FPC structure are high, especially for electronic devices that need to be frequently bent, stretched or withstand complex stresses, such as electronic devices that need to use FPC structures such as FPC cables.
[0036] It can be understood that a plurality of reinforcing ribs 340 are provided on the side of the insulating protective layer 320 away from the second adhesive layer 310, and a reinforcing rib 340 is provided between each two adjacent linear airbags 330. A gap is formed between each reinforcing rib 340 and the adjacent linear airbags 330. The reinforcing ribs 340 can further limit the position of each linear airbag 330, and can effectively reduce the position deviation of the linear airbag 330 when subjected to external force, and can effectively improve the stability of the FPC structure, thereby effectively ensuring the unidirectional deformation characteristics of the FPC structure of the present invention.
[0037] It can be understood that the thickness of the reinforcing rib 340 is less than the height of the linear airbag 330, which can ensure the protective buffering effect of the linear airbag 330 on the overall structure, and can effectively save the material input of the reinforcing rib 340, thereby effectively saving material costs, and can effectively control the weight of the FPC structure to ensure a lightweight design.
[0038] It can be understood that the reinforcing ribs 340 are polyimide ribs. Polyimide, also known as PI, is an organic polymer material with excellent comprehensive performance, excellent electrical insulation performance, and no obvious melting point. The thickness of the polyimide ribs can be set to 2 mil.
[0039] It can be understood that the circuit board body 100 is provided with a positioning hole 101 that simultaneously penetrates the insulating substrate 220, the first adhesive layer 210, the second adhesive layer 310 and the insulating protective layer 320. The positioning hole 101 is located in the extension direction of the linear airbag 330, and the reinforcement column 410 is passed through the positioning hole 101. By providing the positioning hole 101 at the edge of the circuit board, the conductive circuit structure of the circuit board can be effectively avoided. By utilizing the reinforcement column 410, the first clip 420 and the second clip 430 to clamp and position each layer of the FPC structure, the stability of the overall structure can be effectively improved, and the position of the linear airbag 330 in the FPC structure can be effectively controlled.
[0040] Specifically, the structure composed of the reinforcement column 410, the first clip 420 and the second clip 430 is a rivet structure after riveting, or the reinforcement column 410, the first clip 420 and the second clip 430 are a clamping and positioning structure made of chemical copper plating.
[0041] It can be understood that the circuit board body 100 includes at least one conductive circuit layer 110, and the positioning hole 101 is located outside the distribution range of the conductive circuit layer 110, that is, the positioning hole 101 and the projection of the conductive circuit layer 110 on the insulating substrate 220 are separated from each other and have no contact, which can effectively avoid the positioning hole 101 and the reinforcement column 410 therein from causing adverse effects on the functional realization of the conductive circuit, and can effectively improve the reliability of the FPC structure.
[0042] It can be understood that the conductive circuit layer 110 in the circuit board is provided with at least two layers, and an insulating interlayer 120 is provided between each two adjacent conductive circuit layers 110. The insulating interlayer 120 can be a PI structural layer. An adhesive layer 130 is provided between each insulating interlayer 120 and the adjacent conductive circuit layer 110. The adhesive layer 130 can be a layer structure made of a semi-cured sheet, and the positioning hole 101 penetrates both the insulating interlayer 120 and the adhesive layer 130.
[0043] It can be understood that the linear airbag 330 is filled with inert gas. By filling the linear airbag 330 with inert gas, the stability of the structure of the linear airbag 330 can be effectively improved, and the overall structure can still be ensured to be stable and reliable when used in an unstable environment. Specifically, it can be filled with inert gases such as helium and argon.
[0044] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.
Claims
1. A durable FPC structure with unidirectional deformation, characterized in that: The invention comprises a circuit board body (100), wherein a first adhesive layer (210) and an insulating substrate (220) are sequentially provided on one side of the circuit board body (100), and a second adhesive layer (310) and an insulating protective layer (320) are sequentially provided on the other side of the circuit board body (100), and a plurality of linear airbags (330) are provided between the second adhesive layer (310) and the insulating protective layer (320), wherein the extension direction of the linear airbags (330) is perpendicular to the extension direction of the circuit board body (100), and all the linear airbags (330) are provided at the same time. 0) are arranged at intervals along the extension direction of the circuit board body (100); each of the linear airbags (330) is provided with a reinforcing column (410) at opposite ends, and a first clip (420) and a second clip (430) are provided at opposite ends of the reinforcing column (410), the first clip (420) abuts against the side of the insulating base (220) away from the circuit board body (100), and the second clip (430) abuts against the side of the insulating protective layer (320) away from the circuit board body (100).
2. The unidirectionally deformable durable FPC structure according to claim 1, characterized in that: A reinforcing rib (340) is provided on a side of the insulating protective layer (320) away from the second adhesive layer (310), a reinforcing rib (340) is provided between each two adjacent linear airbags (330), and a gap is formed between each reinforcing rib (340) and the adjacent linear airbag (330).
3. The unidirectionally deformable durable FPC structure according to claim 2, characterized in that: The thickness of the reinforcing rib (340) is smaller than the height of the linear airbag (330).
4. The unidirectionally deformable durable FPC structure according to claim 3, characterized in that: The reinforcing ribs (340) are polyimide ribs.
5. The unidirectionally deformable durable FPC structure according to claim 1, characterized in that: The circuit board body (100) is provided with a positioning hole (101) that simultaneously passes through the insulating substrate (220), the first adhesive layer (210), the second adhesive layer (310) and the insulating protective layer (320); the reinforcing column (410) is passed through the positioning hole (101).
6. The unidirectionally deformable durable FPC structure according to claim 5, characterized in that: The circuit board body (100) comprises at least one conductive circuit layer (110), and the positioning hole (101) is located outside the distribution range of the conductive circuit layer (110).
7. The unidirectionally deformable durable FPC structure according to claim 6, characterized in that: The conductive circuit layer (110) is provided with at least two layers, an insulating spacer (120) is provided between each two adjacent conductive circuit layers (110), and an adhesive layer (130) is provided between each insulating spacer (120) and the adjacent conductive circuit layer (110).
8. The unidirectionally deformable durable FPC structure according to claim 1, characterized in that: The linear airbag (330) is filled with inert gas.