LED chip full-automatic assembling system

Abstract

The utility model provides an LED chip full-automatic assembling system which comprises a substrate, the substrate is provided with a plurality of bonding pads and through holes, the assembling system further comprises a preprocessing unit, the preprocessing unit comprises a feeding module and a pin inserting module which are in process connection with each other, the feeding module conveys the substrate to the pin inserting module, and the pin inserting module inserts pins into the through holes; the substrate processing unit comprises a template and a printing module, the printing module is in link connection with the pin module, the template is provided with an opening corresponding to the bonding pad, and the printing module aligns the template to the substrate and attaches the template to the substrate so as to print solder paste on the substrate; the fixing unit is in link connection with the printing module, and the fixing unit is used for fixing the LED lamp beads on the bonding pads. By means of the automatic feeding and pin inserting module, pins can be automatically inserted into through holes, automatic solder paste printing is achieved through the printing module, the problems caused by manual operation are reduced, the fixing unit can automatically and accurately fix LED lamp beads to a bonding pad, and the problems of position deviation and the like during manual fixing are solved.

Description

Technical Field

[0001] The present application relates to the technical field of automated assembly of LED chips, and in particular to a fully automated assembly system for LED chips. Background Art

[0002] LED assembly systems play a vital role in modern electronics manufacturing. With the continuous advancement of LED technology and its expanding application scope, assembly systems must not only achieve efficient production but also ensure assembly precision. Traditional LED assembly systems typically involve multiple steps, such as loading, pin insertion, solder paste printing, LED fixture mounting, and reflow soldering. While these systems are somewhat automated, most still require manual intervention for key operations. This manual work not only impacts production efficiency but can also lead to inconsistent production quality, limiting production capacity and improving product quality.

[0003] Compared to traditional LED assembly systems, some steps, such as solder paste printing and LED fixtures, have been partially automated. However, the entire assembly process still relies on manual labor, such as manual pin insertion and board separation, limiting the overall efficiency of the automated system. Furthermore, traditional solutions cannot achieve fully automated transitions between each process, requiring manual intervention to complete transitions and adjustments between steps on the production line. This not only increases production costs but also limits production efficiency and product consistency. Utility Model Content

[0004] In view of this, it is necessary to provide an LED chip assembly system that reduces manual intervention and has a higher degree of automation to solve the above problems.

[0005] An embodiment of the present application provides a fully automated assembly system for LED chips, including a substrate, wherein the substrate is provided with multiple solder pads and through holes, and the assembly system further includes a pre-processing unit, wherein the pre-processing unit includes a loading module and a pin module with mutually connected processes, wherein the loading module transports the substrate to the pin module, and the pin module inserts the pins into the through holes; the substrate processing unit includes a template and a printing module, wherein the printing module is linked to the pin module, the template is provided with openings corresponding to the solder pads, and the printing module aligns the template and fits the substrate to print solder paste on the substrate; the fixing unit is linked to the printing module, and the fixing unit is used to fix the LED lamp beads on the solder pads.

[0006] In at least one embodiment of the present application, the preprocessing unit further includes an alignment recognition module, which is electrically connected to the pin module. The alignment recognition module identifies the through-hole position and generates first position information. The pin module inserts the pin into the through-hole according to the first position information.

[0007] In at least one embodiment of the present application, the substrate processing unit further includes a flip module, and the flip module is respectively connected to the pin module and the printing module;

[0008] The flip module flips the substrate after the pin insertion and transports it to the printing module to print the substrate.

[0009] In at least one embodiment of the present application, the substrate processing unit further includes an alignment module, wherein the alignment module is electrically connected to the printing module;

[0010] The alignment module identifies the position of the pad and the position of the template opening to generate second position information. The printing module receives the second position information, aligns the opening with the pad, and then performs bonding to print solder paste.

[0011] In at least one embodiment of the present application, the fixing unit includes a die bonding module and a welding module connected to the die bonding module process, the die bonding module is linked to the printing module, the die bonding module places the LED lamp beads on the soldering pad, and the welding module heats the soldering pad to melt the solder paste to fix the LED lamp beads.

[0012] In at least one embodiment of the present application, the fixing unit further includes a pre-fixing module, which is electrically connected to the die bonding module. When the die bonding module places the LED lamp bead on the soldering pad, the pre-fixing module pre-fixes the LED lamp bead on the soldering pad.

[0013] In at least one embodiment of the present application, the welding module includes a first heating zone, a second heating zone, and a third heating zone arranged in sequence, and the first heating zone is close to the die bonding module;

[0014] The temperature of the first heating zone is a, the temperature of the second heating zone is b, and the temperature of the third heating zone is c, where a<b<c.

[0015] In at least one embodiment of the present application, the assembly system further includes a lower plate unit, which is linked to the welding module and is used to fix the LED lamp beads to the lower plate of the substrate for subsequent processing.

[0016] In at least one embodiment of the present application, the lower plate unit includes a cleaning module and a blanking module. The cleaning module is linked to the welding module and is used to clean the substrate. The blanking module blanks the cleaned substrate.

[0017] In at least one embodiment of the present application, the lower plate unit further includes a plate separation module, a detection module, and a packaging module, which are sequentially connected in process;

[0018] The panel splitting module is connected to the welding module and is used to split the substrate into LED modules.

[0019] The detection module detects the LED module, and after the detection is completed, the packaging module is used to package the LED module.

[0020] The above-mentioned fully automated LED chip assembly system uses the automatic loading and pin insertion modules of the pre-processing unit to automatically insert pins into through-holes, eliminating the manual pin insertion steps required in traditional solutions. The template and printing module in the substrate processing unit are connected via a link, enabling automated solder paste printing, ensuring precise distribution of solder paste on the pads and reducing the problems of uneven solder paste and misalignment caused by manual operation in traditional solutions. The fixing unit, through a link connection with the printing module, can automatically and precisely fix the LED lamp beads to the pads, avoiding the problems of lamp bead position deviation or poor contact during manual fixing, thereby improving product reliability and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is an overall flow chart of a fully automated LED chip assembly system in one embodiment of the present application.

[0022] Figure 2 for Figure 1 A detailed flow chart of the fully automated LED chip assembly system.

[0023] Figure 3 for Figure 1 A flowchart of the fixing unit and lower plate unit of the fully automated LED chip assembly system.

[0024] Description of main component symbols

[0025] 100. A fully automated assembly system for LED chips; 10. Substrate; 11. Through-hole; 12. Pad; 20. Pre-processing unit; 21. Loading module; 22. Pin module; 23. Alignment recognition module; 231. First position information; 30. Substrate processing unit; 31. Template; 32. Printing module; 33. Copy module; 34. Alignment module; 341. Second position information; 40. Fixing unit; 41. Crystal bonding module; 42. Soldering module; 421. First heating zone; 422. Second heating zone; 423. Third heating zone; 43. Pre-fixing module; 50. Lowering unit; 51. Cleaning module; 52. Unloading module; 53. Depaneling module; 54. Inspection module; 55. Packaging module. DETAILED DESCRIPTION

[0026] The embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0027] It should be noted that when a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component. When a component is considered to be "disposed on" another component, it can be directly disposed on the other component or there may be an intermediate component. The terms "top", "bottom", "upper", "lower", "left", "right", "front", "back", and similar expressions used herein are for illustrative purposes only.

[0028] An embodiment of the present application provides a fully automated LED chip assembly system, comprising a substrate having a plurality of pads and through holes, and the assembly system further comprising:

[0029] The pre-processing unit includes a loading module and a pin insertion module connected with each other, wherein the loading module transports the substrate to the pin insertion module, and the pin insertion module inserts the pins into the through holes;

[0030] A substrate processing unit includes a template and a printing module, wherein the printing module is linked to the pin module, the template is provided with openings corresponding to the solder pads, and the printing module aligns the template and attaches it to the substrate to print solder paste on the substrate;

[0031] A fixing unit is connected to the printing module link, and the fixing unit is used to fix the LED lamp bead on the soldering pad.

[0032] The above-mentioned fully automated LED chip assembly system uses the automatic loading and pin insertion modules of the pre-processing unit to automatically insert pins into through-holes, eliminating the manual pin insertion steps required in traditional solutions. The template and printing module in the substrate processing unit are connected via a link, enabling automated solder paste printing, ensuring precise distribution of solder paste on the pads and reducing the problems of uneven solder paste and misalignment caused by manual operation in traditional solutions. The fixing unit, through a link connection with the printing module, can automatically and precisely fix the LED lamp beads to the pads, avoiding the problems of lamp bead position deviation or poor contact during manual fixing, thereby improving product reliability and production efficiency.

[0033] The following embodiments of the present application are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0034] See also Figure 1-Figure 3 The embodiment of the present application provides a fully automated LED chip assembly system 100, including a substrate 10, wherein the substrate 10 is provided with a plurality of pads 12 and through holes 11, and the assembly system further includes:

[0035] The pre-processing unit 20 includes a loading module 21 and a pin insertion module 22 that are interconnected. The loading module 21 transports the substrate 10 to the pin insertion module 22, and the pin insertion module 22 inserts the pins into the through holes 11.

[0036] The substrate 10 processing unit includes a template 31 and a printing module 32. The printing module 32 is connected to the pin module 22. The template 31 has openings corresponding to the pads 12. The printing module 32 aligns the template 31 and attaches it to the substrate 10 to print solder paste on the substrate 10.

[0037] The fixing unit 40 is connected to the printing module 32 in a chain, and the fixing unit 40 is used to fix the LED lamp bead on the soldering pad 12 .

[0038] Specifically, the loading module 21 is responsible for transporting substrates 10 from the upstream process or material storage area to the pin insertion module 22, ensuring a continuous flow of substrates 10. This reduces manual handling, maintains production line continuity, and improves overall automation. The pin insertion module 22 automatically and precisely inserts the pins into the through-holes 11 of the substrate 10, ensuring accurate installation. This avoids potential misalignment or damage during manual pin insertion, improves pin insertion accuracy and speed, and reduces production errors.

[0039] Furthermore, stencil 31 features openings corresponding to pads 12, ensuring solder paste is applied only to pads 12 and preventing contamination of other surfaces. The precise openings in stencil 31 improve solder paste printing accuracy, reduce material waste, and ensure the cleanliness and solderability of pads 12. After aligning stencil 31 with pads 12, solder paste is precisely printed on pads 12. This automated printing process ensures uniform solder paste application, avoiding errors and unevenness that can occur during manual operation and improving the reliability of subsequent soldering.

[0040] Furthermore, the LED lamp beads are fixed on the pads 12 and placed by automated equipment to ensure the precise alignment of the LED chips and the pads 12. Automated placement of LED lamp beads reduces the possibility of misalignment or looseness caused by manual operation, improves the quality consistency of the components, and increases production efficiency.

[0041] Furthermore, the loading module 21 transports the substrate 10 to the pin insertion module 22. The pin insertion module 22 can have multiple pin insertions at the same time. After the pin insertion is completed, the substrate 10 is carried by multiple docking stations and is merged into the transplanting machine to be transported to the printing module 32. After the printing module 32 tinns the substrate 10, it is transferred to the fixing unit 40 to fix the LED lamp beads on the solder pad 12 to complete the assembly. The multiple units use docking stations to receive the processed substrates 10, and then the units are connected through the transplanting machine, so that the overall assembly system is smooth and the connection is high-precision and automated.

[0042] In a specific embodiment, the preprocessing unit 20 also includes an alignment recognition module 23, which is electrically connected to the pin module 22. The alignment recognition module 23 identifies the position of the through hole 11 and generates first position information 231. The pin module 22 inserts the pin into the through hole 11 according to the first position information 231.

[0043] Specifically, the alignment recognition module 23 is used to detect the position of the through-hole 11 on the substrate 10 and generate first position information 231. This module uses visual recognition or sensors to identify the precise position of the substrate 10 and the position of the through-hole 11, thereby providing data for the subsequent operation of the pin insertion module 22. Through automatic detection by the alignment recognition module 23, the position of each through-hole 11 is accurately identified, avoiding manual detection or errors, and improving the accuracy of pin insertion during the production process. The alignment recognition module 23 can adapt to substrates 10 of different sizes and shapes, ensuring the versatility and flexibility of the equipment. This reduces the need for manual operation and further improves the degree of automation of the entire assembly system.

[0044] Furthermore, the pin insertion module 22 automatically and precisely inserts the pins into the through-holes 11 of the substrate 10 based on the first position information 231 generated by the alignment recognition module 23. The pin insertion module 22 performs the pin insertion operation using a robotic arm or precision pin insertion equipment. The pin insertion process no longer relies on manual operation. Through alignment recognition and automatic control, the errors, looseness, and damage that can occur during manual pin insertion are avoided. This improves production efficiency and precision, and especially in high-volume production environments, the automated pin insertion system can significantly reduce scrap and rework rates.

[0045] In a specific embodiment, the substrate 10 processing unit further includes a flip module, and the flip module is respectively connected to the pin module 22 and the printing module 32;

[0046] The flip module flips the substrate 10 after the pin insertion and transports it to the printing module 32 to print the substrate 10.

[0047] Specifically, the flip module flips the substrate 10 after pin insertion, transferring it from the pin insertion module 22 to the printing module 32. The flip module's primary function is to ensure that the front and back sides of the substrate 10 can be processed separately. This prevents the substrate 10 from shifting or being damaged during the flipping process, improving the accuracy of subsequent processes. The automated transition of all processes eliminates the need for manual intervention, reducing operational errors during production and enhancing the automation level and product consistency of the entire system.

[0048] Furthermore, the board module is linked to the pin insertion module 22 and the printing module 32 via a link connection. This ensures that after the pin insertion operation, the substrate 10 can be accurately transferred to the printing module 32 via the flip module for the subsequent solder paste printing process. This link connection streamlines the operation between the different modules, effectively reducing the waiting time during the substrate 10 transfer process and improving production efficiency. The seamless connection between the modules ensures the accurate positioning of the substrate 10, allowing the solder paste printing module 32 to accurately align the pads 12 and ensure printing quality.

[0049] In a specific embodiment, the substrate 10 processing unit further includes an alignment module 34 , and the alignment module 34 is electrically connected to the printing module 32 ;

[0050] The alignment module 34 identifies the position of the pad 12 and the position of the opening of the template 31 to generate second position information 341. The printing module 32 receives the second position information 341, aligns the opening with the pad 12, and then performs bonding to print solder paste.

[0051] Specifically, the alignment module 34 is electrically connected to the printing module 32 to ensure precise alignment during the printing process. It provides precise positioning information to guide the printing module 32, ensuring that the openings in the stencil 31 are perfectly aligned with the solder pads 12 on the substrate 10. This ensures extremely precise alignment between the stencil 31 and the solder pads 12, preventing solder paste misalignment during printing and ensuring reliable subsequent LED chip fixation. The alignment module 34 transmits data to the printing module 32 through electrical connections, enabling automated adjustments, reducing manual operations and improving efficiency and accuracy.

[0052] Furthermore, the alignment module 34 possesses a highly precise recognition function, capable of simultaneously identifying the positions of the pads 12 on the substrate 10 and the openings in the stencil 31. Using image recognition or sensor technology, these positions are detected in real time. The alignment module 34 accurately identifies the relative positions of the pads 12 and the openings in the stencil 31, eliminating manual alignment errors and improving solder paste printing accuracy. Even if there are slight errors in the position of the pads 12 on the substrate 10, the alignment module 34 can adjust in real time to ensure consistent printing quality.

[0053] Furthermore, the alignment module 34 converts the recognition result into specific position information, namely "second position information 341", which is a set of position information for guiding the printing module 32, including the relative coordinates of the pad 12 and the opening of the template 31. The position information can help the printing module 32 to achieve precise positioning, thereby ensuring that the solder paste is accurately applied to the pad 12. The alignment module 34 continuously generates and transmits position information to ensure that the entire system can be adjusted according to actual conditions. The printing module 32 receives the position information generated by the alignment module 34, and adjusts the position of the template 31 based on this information, so that the opening of the template 31 is completely aligned with the pad 12 before printing the solder paste. After receiving the position information, the printing module 32 can complete the alignment operation in a short time, thereby improving the efficiency of the entire production process. Guided by the position information, the printing module 32 accurately aligns the opening with the pad 12, avoiding solder paste printing defects caused by misalignment.

[0054] In a specific embodiment, the fixing unit 40 includes a die-bonding module 41 and a welding module 42 connected to the die-bonding module 41. The die-bonding module 41 is linked to the printing module 32. The die-bonding module 41 places the LED lamp bead on the soldering pad 12. The welding module 42 heats the soldering pad 12 to melt the solder paste to fix the LED lamp bead.

[0055] Specifically, the fixing unit 40 is a key component of the system that ensures the LED lamp beads are firmly fixed to the substrate 10. It includes a die-bonding module 41 and a welding module 42, each responsible for placing the LED lamp beads on the pads 12 and securing them to the substrate 10 through welding. The combination of the die-bonding module 41 and the welding module 42 ensures that the LED lamp beads are accurately fixed to the pads 12, reducing human error. The process connection between the die-bonding module 41 and the welding module 42 enables continuous, assembly-line operation, significantly improving production efficiency.

[0056] Furthermore, the die-bonding module 41 is connected to the printing module 32 via a link to achieve seamless integration of the automated process. After printing the solder paste, the die-bonding module 41 receives the substrate 10 and places the LED lamp beads. After printing the solder paste, the substrate 10 can enter the die-bonding module 41 without interruption. The various parts of the system are interconnected, reducing downtime and waiting time and increasing production speed. The die-bonding module 41 has high-precision control capabilities to ensure that the LED lamp beads are accurately placed on the pads 12, avoiding misalignment or poor contact, and improving assembly quality.

[0057] Furthermore, welding module 42 is responsible for heating pads 12 on substrate 10, melting the previously printed solder paste, and thus securely soldering the LED beads to pads 12. By heating pads 12, the solder paste melts, forming a solid connection point, ensuring that the LED beads are stably fixed to substrate 10 and have good electrical conductivity. This automated welding operation reduces manual intervention, ensures uniform soldering of each LED bead, and improves product consistency and yield.

[0058] In a specific embodiment, the fixing unit 40 also includes a pre-fixing module 43, which is electrically connected to the die-bonding module 41. When the die-bonding module 41 places the LED lamp bead on the soldering pad 12, the pre-fixing module 43 pre-fixes the LED lamp bead on the soldering pad 12.

[0059] Specifically, the pre-fixing module 43 is an auxiliary module in the fixing unit 40, which is specifically used to pre-fix the LED lamp beads when the solid crystal module 41 places the LED lamp beads on the soldering pad 12. It plays a key role in the working connection between the solid crystal module 41 and the welding module 42, ensuring that the LED lamp beads do not move before welding. Before welding, the LED lamp beads may move due to the transmission of the substrate 10 or environmental influences. The pre-fixing module 43 can stabilize the lamp beads, prevent position displacement, and ensure the subsequent welding accuracy. Through pre-fixation, the LED lamp beads can maintain a good contact state with the soldering pad 12, ensuring that the solder paste can be evenly distributed during welding, and reducing poor welding.

[0060] In a specific embodiment, the pre-fixing module 43 may be fixed by using hot melt adhesive or by lightly pressing the lamp beads with a mechanical pressing head to achieve pre-fixing.

[0061] Furthermore, while die-bonding module 41 places the LED bead on solder pad 12, pre-fixing module 43 is activated to pre-fix the bead in a timely manner. The design of pre-fixing module 43 ensures that the bead is already stably positioned on solder pad 12 before soldering. Pre-fixing the LED bead during placement prevents minor shaking or shifting after placement, improving the accuracy of the overall assembly. Automated pre-fixing reduces the need for manual adjustment of the bead position, avoiding errors caused by human operation.

[0062] In a specific embodiment, the welding module 42 includes a first heating zone 421 , a second heating zone 422 and a third heating zone 423 arranged in sequence, wherein the first heating zone 421 is close to the die-bonding module 41 ;

[0063] The temperature of the first heating zone 421 is a, the temperature of the second heating zone 422 is b, and the temperature of the third heating zone 423 is c, where a<b<c

[0064] Specifically, the first heating zone 421 has a lower temperature and is located near the die bonding module 41. It is mainly used to preheat the solder pad 12 and the solder paste so that the surface of the solder paste gradually melts, and at the same time uniformly distributes the temperature of the LED lamp beads and the substrate 10 to avoid damage to the LED lamp beads or deformation of the substrate 10 due to excessive heating.

[0065] Furthermore, the temperature of the second heating zone 422 is higher than that of the first heating zone 421, and the temperature is gradually increased to completely melt the solder paste and begin to form a stable liquid solder connection. The temperature at this time can ensure sufficient contact between the solder pad 12 and the solder paste, ensuring the integrity of the solder joint.

[0066] Furthermore, the third heating zone 423 reaches the highest temperature and is primarily used for the final soldering process. At this point, the solder is completely liquefied and penetrates between the solder pad 12 and the LED pin, ensuring a secure solder joint. The high temperature of the third heating zone 423 also effectively removes any residual bubbles or impurities that may have formed during the soldering process, ensuring the strength and conductivity of the solder joint.

[0067] In summary, providing sufficient temperature and time ensures that the solder joints are completely firm and the soldering quality reaches the best state. By gradually increasing the temperature, solder condensation or overheating damage during the soldering process is avoided, ensuring the integrity of the LED lamp beads and the substrate 10.

[0068] In a specific embodiment, the assembly system further includes a lower plate unit 50 , which is linked to the welding module 42 and is used to remove the substrate 10 after the LED lamp beads are fixed for subsequent processing.

[0069] Specifically, the plate unit is responsible for removing the substrate 10 from the welding module 42 after welding is complete, preparing for subsequent production steps. By connecting to the welding module 42, it ensures that the substrate 10 can be effectively removed after the welding process is completed and promptly transferred to subsequent processing steps.

[0070] In a specific embodiment, the lower plate unit 50 includes a cleaning module 51 and a blanking module 52 . The cleaning module 51 is linked to the welding module 42 for cleaning the substrate 10 , and the blanking module 52 blanks the cleaned substrate 10 .

[0071] Specifically, by removing contaminants generated during the soldering process, the cleaning module 51 ensures a clean surface for the substrate 10, preventing defects or quality issues in subsequent steps. A consistent cleaning process helps improve product consistency and reliability. Clean substrates 10 help reduce electrical failures caused by residue, improving overall product performance and lifespan. After cleaning, the substrates 10 are transferred to the unloading module 52. After receiving the substrates 10, the unloading module 52 removes them from the cleaning position within the production line.

[0072] In a specific embodiment, the lower panel unit 50 further includes a panel separation module 53, a detection module 54 and a packaging module 55 which are sequentially connected in process;

[0073] The panel splitting module 53 is connected to the welding module 42 and is used to remove the edges of the substrate 10 and split the substrate 10 into LED modules.

[0074] The detection module 54 detects the LED module. After the detection is completed, the packaging module 55 is used to package the LED module.

[0075] Specifically, a multi-axis robotic arm moves the processed substrate 10 from the welding module 42 to the panel separation module 53. This robotic arm configuration allows for simultaneous transport of multiple transport lines. The panel separation module 53 is responsible for slicing and trimming the soldered and cleaned substrate 10 to produce individual LED modules. Trimming removes waste material and edges around the substrate 10 to ensure the edges of each LED module are neat and meet subsequent processing requirements. The large substrate 10 is then cut into multiple individual LED modules according to design requirements.

[0076] Furthermore, the inspection module 54 is used to perform quality inspection on the LED modules after depaneling. This includes inspecting the electrical performance, optical performance and any physical defects of the LED modules. The inspection contents include current, voltage testing, light intensity testing, color consistency inspection, etc. to ensure that each LED module meets the quality standards. Through comprehensive inspection, it is ensured that the performance and quality of each LED module meet the design requirements and reduce the influx of defective products. Unqualified modules are discovered and removed in time to avoid quality problems in the subsequent packaging process. The packaging module 55 is responsible for the final packaging of the inspected LED modules, including placing the LED modules in the packaging shell and completing the sealing,

[0077] The above is only an implementation method of the present application. It should be pointed out that for ordinary technicians in this field, improvements can be made without departing from the creative concept of the present application, but these all fall within the scope of protection of the present application.

Claims

1. A fully automated LED chip assembly system, comprising a substrate having a plurality of pads and through holes, characterized in that: The assembly system further comprises: The pre-processing unit includes a loading module and a pin insertion module connected with each other, wherein the loading module transports the substrate to the pin insertion module, and the pin insertion module inserts the pins into the through holes; A substrate processing unit includes a template and a printing module, wherein the printing module is linked to the pin module, the template is provided with openings corresponding to the solder pads, and the printing module aligns the template and attaches it to the substrate to print solder paste on the substrate; A fixing unit is connected to the printing module link, and the fixing unit is used to fix the LED lamp bead on the soldering pad.

2. The fully automated LED chip assembly system according to claim 1, characterized in that: The pre-processing unit also includes a positioning recognition module, which is electrically connected to the pin module. The positioning recognition module recognizes the position of the through hole and generates first position information. The pin module inserts the pin into the through hole according to the first position information.

3. The fully automated LED chip assembly system according to claim 1, characterized in that: The substrate processing unit further includes a flip module, which is respectively connected to the pin module and the printing module; The flip module flips the substrate after the pin insertion and transports it to the printing module to print the substrate.

4. The fully automated LED chip assembly system according to claim 3, characterized in that: The substrate processing unit further includes an alignment module, wherein the alignment module is electrically connected to the printing module; The alignment module identifies the position of the pad and the position of the template opening to generate second position information. The printing module receives the second position information, aligns the opening with the pad, and then performs bonding to print solder paste.

5. The fully automated LED chip assembly system according to claim 1, characterized in that: The fixing unit includes a die-bonding module and a welding module connected with the die-bonding module process. The die-bonding module is linked to the printing module. The die-bonding module places the LED lamp beads on the soldering pad. The welding module heats the soldering pad to melt the solder paste to fix the LED lamp beads.

6. The fully automated LED chip assembly system according to claim 5, characterized in that: The fixing unit further includes a pre-fixing module, which is electrically connected to the die-bonding module. When the die-bonding module places the LED lamp bead on the soldering pad, the pre-fixing module pre-fixes the LED lamp bead on the soldering pad.

7. The fully automated LED chip assembly system according to claim 5, characterized in that: The welding module comprises a first heating zone, a second heating zone and a third heating zone arranged in sequence, wherein the first heating zone is close to the die bonding module; The temperature of the first heating zone is a, the temperature of the second heating zone is b, and the temperature of the third heating zone is c, where a<b<c.

8. The fully automated LED chip assembly system according to claim 5, characterized in that: The assembly system further includes a lower plate unit, which is linked to the welding module and is used to fix the LED lamp beads to the lower plate of the substrate for subsequent processing.

9. The fully automated LED chip assembly system according to claim 8, characterized in that: The lower plate unit includes a cleaning module and a blanking module. The cleaning module is linked to the welding module and is used to clean the substrate. The blanking module blanks the cleaned substrate.

10. The fully automated LED chip assembly system according to claim 8, characterized in that: The lower plate unit also includes a plate separation module, a detection module and a packaging module which are connected in sequence; The panel splitting module is connected to the welding module and is used to split the substrate into LED modules. The detection module detects the LED module, and after the detection is completed, the packaging module is used to package the LED module.

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