Multi-chip integrated circuit packaging structure
By designing a detachable multi-chip integrated circuit packaging structure, the maintenance difficulties caused by welding and fixing are solved, and the effect of convenient maintenance and reduced maintenance costs is achieved.
Patent Information
- Application Number
- CN202421475661.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-26
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-06-26
AI Technical Summary
Most existing multi-chip integrated circuit packages are fixed by welding and cannot be disassembled, resulting in maintenance difficulties and increasing maintenance costs.
A multi-chip integrated circuit packaging structure is designed, using a button and a chute mechanism. By pressing the button, the connecting block is pushed away from the movable bump, which realizes the removable upper cover, facilitates circuit maintenance, and maintains stable connection through the spring mechanism.
It realizes convenient maintenance and disassembly of integrated circuits, prevents external impact damage and reduces maintenance costs.
Smart Images
Figure CN223261739U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated circuits, and in particular to a multi-chip integrated circuit packaging structure. Background Art
[0002] An integrated circuit is a miniature electronic device or component. Using a specific process, the transistors, resistors, capacitors, inductors, and other components required for a circuit are interconnected with wiring. These components are then fabricated on one or several small semiconductor wafers or dielectric substrates and then packaged in a housing to create a miniature structure that performs the desired circuit function.
[0003] With respect to the existing related technologies, the inventors believe that the following defects often exist: the existing multi-chip integrated circuit packages are mostly fixed by welding and cannot be disassembled, resulting in the integrated circuit being unable to be repaired when problems occur, thereby increasing the cost of equipment maintenance. Utility Model Content
[0004] The technical problem to be solved by the present invention is that in the prior art, most of the existing multi-chip integrated circuit packages are fixed by welding and cannot be disassembled, resulting in the integrated circuit being unable to be repaired when problems occur, increasing the cost of equipment maintenance. For this reason, we propose a multi-chip integrated circuit packaging structure.
[0005] In order to achieve the above-mentioned purpose, the present application adopts the following technical solution: a multi-chip integrated circuit packaging structure, including an integrated circuit board, a base is fixed at the bottom of the integrated circuit board, a plurality of pins are installed on the four sides of the top of the base, an upper cover is installed on the top of the base, a heat sink is installed on the top of the integrated circuit board, a first slide groove is opened on the four sides of the top of the upper cover, a button is slidably connected inside the first slide groove, a pressure plate is fixed at the bottom of the button, a second slide groove is opened at the bottom of the pressure plate, connecting blocks are installed on both sides of the bottom of the pressure plate, first sliders are fixed on both sides of the connecting block, the surface of the first slider is slidably connected to the inside of the second slide groove, a tension spring is fixed on the inner side of the connecting block, the other end of the tension spring is fixed to one side of the pressure plate, a locking block is fixed on one side of the inner side of the connecting block, a third slide groove is opened on the top of the base, a bump column is fixed at the bottom inside the third slide groove, a fixed bump is fixed on the surface of the bump column, and a movable bump is slidably connected to the surface of the bump column.
[0006] Preferably, first limiting blocks are fixed on both sides of the pressing plate, and the inner side of the first limiting blocks is in contact with the outer side of the connecting block.
[0007] Preferably, a first limiting groove is formed on the surface of the first sliding groove, a second limiting block is fixed on one side of the first limiting block, and the surface of the second limiting block is slidably connected inside the first limiting groove.
[0008] Preferably, a first thrust spring is fixed to the bottom of the first limiting groove, and the top end of the first thrust spring is fixedly connected to the bottom of the second limiting block.
[0009] Preferably, a fourth sliding groove is provided at the bottom of the upper cover, and a second sliding block is slidably connected inside the fourth sliding groove.
[0010] Preferably, a second thrust spring is fixed to the top of the fourth sliding groove, and the bottom of the second thrust spring is fixedly connected to the top of the second sliding block.
[0011] Preferably, a second limiting groove is provided inside the fourth sliding groove, and third limiting blocks are fixedly connected to both sides of the second sliding block, and the surface of the third limiting block is slidably connected to the inside of the second limiting groove.
[0012] Technical effects and advantages of this utility model:
[0013] In the utility model, when the user needs to deal with a problem of the integrated circuit board, he only needs to press the button downward to push the connecting block to fall. When the connecting block contacts the top of the movable protrusion, the connecting block moves to both sides through the oblique angle of the locking block and the second sliding groove provided in the pressure plate, until the locking block pulls the movable protrusion upward to intersect with the protrusion column, thereby releasing the restriction of the locking block and allowing the upper cover to be removed, thereby facilitating the maintenance and replacement of the integrated circuit on the integrated circuit board. By adding the upper cover, the integrated circuit board can be prevented from being damaged by external impact. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is the main view of the utility model;
[0015] Figure 2 This is a cross-sectional view of the chip integrated circuit of the present utility model;
[0016] Figure 3 This is a cross-sectional view of the lock structure of the utility model;
[0017] Figure 4 This is a cross-sectional view of the lock limit structure of the utility model;
[0018] Figure 5 This is a cross-sectional view of the heat sink fixing structure of the present invention.
[0019] Legend: 1. Integrated circuit board; 2. Base; 3. Pin; 4. Top cover; 5. Heat sink; 6. Button; 7. First slide; 8. Pressure plate; 9. Second slide; 10. Tension spring; 11. Connecting block; 12. Locking block; 13. Fixed protrusion; 14. Protrusion column; 15. Movable protrusion; 16. First limit block; 17. Second limit block; 18. First limit slot; 19. First thrust spring; 20. Fourth slide; 21. Second thrust spring; 22. Second slider; 23. Second limit slot; 24. Third limit block; 25. Third slide; 26. First slider. DETAILED DESCRIPTION
[0020] The present invention will now be described in further detail with reference to the accompanying drawings and preferred embodiments. These drawings are simplified schematic diagrams that only illustrate the basic structure of the present invention in a schematic manner, and therefore only show components related to the present invention.
[0021] Reference Figure 1 - Figure 3 As shown, the utility model provides a technical solution: a multi-chip integrated circuit packaging structure, including an integrated circuit board 1, a base 2 is fixed to the bottom of the integrated circuit board 1, a plurality of pins 3 are installed around the top of the base 2, an upper cover 4 is installed on the top of the base 2, a heat sink 5 is installed on the top of the integrated circuit board 1, a first slide groove 7 is provided on the four sides of the top of the upper cover 4, a button 6 is slidably connected inside the first slide groove 7, a pressing plate 8 is fixed to the bottom of the button 6, a second slide groove 9 is provided at the bottom of the pressing plate 8, connecting blocks 11 are installed on both sides of the bottom of the pressing plate 8, a first slider 26 is fixed on both sides of the connecting block 11, the surface of the first slider 26 is slidably connected to the inside of the second slide groove 9, a tension spring 10 is fixed on the inner side of the connecting block 11, the other end of the tension spring 10 is fixed to one side of the pressing plate 8, and the inner side of the connecting block 11 A locking block 12 is fixed on one side, and a third sliding groove 25 is provided on the top of the base 2. A protruding column 14 is fixed at the bottom inside the third sliding groove 25. A fixed protrusion 13 is fixed on the surface of the protruding column 14, and a movable protrusion 15 is slidably connected to the surface of the protruding column 14. When the user needs to deal with a problem on the integrated circuit board 1, he only needs to press the button 6 downward to push the connecting block 11 to fall. When the connecting block 11 contacts the top of the movable protrusion 15, the connecting block 11 moves to both sides through the oblique angle of the locking block 12 and the second sliding groove 9 provided in the pressure plate 8, until the locking block 12 pulls the movable protrusion 15 upward to intersect with the protruding column 14 and disengages from the limit of the locking block 12, so that the upper cover 4 can be removed, which is convenient for repairing and replacing the integrated circuit on the integrated circuit board 1. By adding the upper cover 4, the integrated circuit board 1 can be prevented from being damaged by external impact.
[0022] Reference Figure 3 and Figure 4As shown, in this embodiment: a first limit block 16 is fixed on both sides of the pressure plate 8, and the inner side of the first limit block 16 is in contact with the outer side of the connecting block 11. When the connecting block 11 moves to both sides, in order to prevent the first slider 26 from disengaging from the inside of the second slide groove 9, the first limit blocks 16 are fixed on both sides of the pressure plate 8 for limiting.
[0023] Reference Figure 3 As shown, in this embodiment: a first limit groove 18 is provided on the surface of the first slide groove 7, a second limit block 17 is fixed to one side of the first limit block 16, and the surface of the second limit block 17 is slidably connected inside the first limit groove 18. When the user presses the button 6 to push the pressure plate 8 to move, the second limit blocks 17 on both sides of the first limit block 16 move inside the first limit groove 18 to assist the movement of the pressure plate 8 and prevent the pressure plate 8 from rotating or tilting during the movement, resulting in movement jamming.
[0024] Reference Figure 3 As shown, in this embodiment: a first thrust spring 19 is fixed to the bottom of the first limiting groove 18, and the top of the first thrust spring 19 is fixedly connected to the bottom of the second limiting block 17. In order to ensure that the base 2 and the upper cover 4 continue to fit together and can rebound after being pressed, the upward movement of the thrust of the first thrust spring 19 will cause the locking block 12 and the fixed protrusion 13 to be locked with each other, and can automatically disengage upward when the locking state needs to be released.
[0025] Reference Figure 5 As shown, in this embodiment: a fourth slide groove 20 is provided at the bottom of the upper cover 4, and a second slider 22 is slidably connected inside the fourth slide groove 20. When the heat sink 5 needs to dissipate heat for the integrated circuit board 1, the heat sink 5 only needs to be placed on the integrated circuit board 1 and fixed by the second slider 22, so that the heat sink 5 will not fall off the top of the integrated circuit board 1.
[0026] Reference Figure 5 As shown, in this embodiment: a second thrust spring 21 is fixed to the top of the fourth slide groove 20, and the bottom of the second thrust spring 21 is fixedly connected to the top of the second slider 22. The second thrust spring 21 pushes the second slider 22 to avoid the user repeatedly pushing and pulling the second slider 22 to fix the heat sink 5, and the heat sink 5 can also be disassembled.
[0027] Reference Figure 5 As shown, in this embodiment: a second limiting groove 23 is opened inside the fourth slide groove 20, and a third limiting block 24 is fixedly connected to both sides of the second slider 22. The surface of the third limiting block 24 is slidably connected to the inside of the second limiting groove 23. In order to prevent the second slider 22 from disengaging from the inside of the fourth slide groove 20 when in use, it is limited by the third limiting block 24.
[0028] Working principle: When the user needs to deal with a problem on the integrated circuit board 1, he only needs to press the button 6 downward to push the connecting block 11 to fall. When the connecting block 11 contacts the top of the movable protrusion 15, the connecting block 11 is moved to both sides through the oblique angle of the locking block 12 and the second sliding groove 9 opened in the pressing plate 8, until the locking block 12 pulls the movable protrusion 15 upward to intersect with the protrusion column 14 and disengages to release the restriction of the locking block 12. When the connecting block 11 moves to both sides, in order to prevent the first sliding block 26 from disengaging from the second sliding groove 9, the first limiting blocks 16 are fixed on both sides of the pressing plate 8 for limiting. When the user presses the button 6 to push the pressing plate 8 to move, the second limiting blocks 17 on both sides of the first limiting block 16 move inside the first limiting groove 18 to assist the movement of the pressing plate 8 and prevent the pressing plate 8 from being damaged during the movement. The first push spring 19 pushes the second slider 22 to prevent the user from repeatedly pushing and pulling the second slider 22 to fix the heat sink 5. The heat sink 5 can also be disassembled. In order to prevent the second slider 22 from being separated from the inside of the fourth slide groove 20 during use, it is limited by the third limit block 24.
[0029] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A multi-chip integrated circuit package structure, comprising an integrated circuit board (1), characterized in that: The bottom of the integrated circuit board (1) is fixed with a base (2), the top of the base (2) is equipped with a plurality of pins (3) on all sides, the top of the base (2) is equipped with an upper cover (4), the top of the integrated circuit board (1) is equipped with a heat sink (5), the top of the upper cover (4) is provided with a first slide groove (7) on all sides, the interior of the first slide groove (7) is connected to a button (6) in a sliding manner, the bottom of the button (6) is fixed with a pressure plate (8), the bottom of the pressure plate (8) is provided with a second slide groove (9), both sides of the bottom of the pressure plate (8) are equipped with connecting blocks (11), both sides of the connecting block (11) are connected to the A first slider (26) is fixed, and the surface of the first slider (26) is slidably connected to the inside of the second slide groove (9). A tension spring (10) is fixed to the inner side of the connecting block (11), and the other end of the tension spring (10) is fixed to one side of the pressure plate (8). A locking block (12) is fixed to one side of the inner side of the connecting block (11). A third slide groove (25) is opened on the top of the base (2), and a protrusion column (14) is fixed to the bottom inside the third slide groove (25). A fixed protrusion (13) is fixed to the surface of the protrusion column (14), and a movable protrusion (15) is slidably connected to the surface of the protrusion column (14).
2. The multi-chip integrated circuit package structure according to claim 1, wherein: First limiting blocks (16) are fixed on both sides of the pressing plate (8), and the inner side of the first limiting block (16) is in contact with the outer side of the connecting block (11).
3. The multi-chip integrated circuit package structure according to claim 2, wherein: A first limiting groove (18) is provided on the surface of the first sliding groove (7), a second limiting block (17) is fixed on one side of the first limiting block (16), and the surface of the second limiting block (17) is slidably connected inside the first limiting groove (18).
4. The multi-chip integrated circuit package structure according to claim 3, wherein: A first thrust spring (19) is fixed to the bottom of the first limiting groove (18), and the top end of the first thrust spring (19) is fixedly connected to the bottom of the second limiting block (17).
5. The multi-chip integrated circuit package structure according to claim 1, wherein: A fourth sliding groove (20) is provided at the bottom of the upper cover (4), and a second sliding block (22) is slidably connected inside the fourth sliding groove (20).
6. The multi-chip integrated circuit package structure according to claim 5, wherein: A second thrust spring (21) is fixed to the top of the fourth sliding groove (20), and the bottom of the second thrust spring (21) is fixedly connected to the top of the second sliding block (22).
7. The multi-chip integrated circuit package structure according to claim 6, wherein: A second limiting groove (23) is provided inside the fourth sliding groove (20), and third limiting blocks (24) are fixedly connected to both sides of the second sliding block (22), and the surface of the third limiting block (24) is slidably connected to the inside of the second limiting groove (23).