Pressure control device for semiconductor processing equipment

Abstract

The utility model discloses a pressure control device for semiconductor processing equipment, which comprises a pressure control instrument, a frame is arranged outside the pressure control instrument, a sliding groove is arranged on the inner wall of the frame, a cover plate is connected inside the sliding groove in a sliding manner, a metal sheet is embedded at the top of the cover plate, a magnet is embedded on the inner wall of the frame, and the magnet is embedded on the inner wall of the frame. And the metal sheet is connected to the surface of the magnet block in an adsorption manner. According to the pressure control device for the semiconductor processing equipment, the frame is arranged outside the pressure control instrument, the cover plate is connected to the interior of the frame in a sliding connection mode, and the top of the cover plate is connected with the inner wall of the frame in a magnetic attraction mode, so that a button of the pressure control instrument can be protected from being touched by mistake, and the pressure control device has the effect of preventing mistaken touch.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor processing pressure control, and in particular relates to a pressure control device for semiconductor processing equipment. Background Art

[0002] A pressure control device refers to an industrial equipment used for pressure control. It consists of one or more pressure sensors, a controller and a set of control logic. It can measure the input pressure and convert it into electrical signals, and transmit these signals to the controller. The controller then adjusts the output pressure by executing the control logic based on the comparison between the input pressure and the set value to ensure that the pressure is within the set value range. Pressure control devices are needed in the semiconductor processing process.

[0003] The current pressure control devices for semiconductor processing equipment on the market have the following problems when used:

[0004] 1. In actual use, traditional voltage control devices for semiconductor processing equipment mainly rely on buttons on the panel to adjust operating parameters. Traditional voltage control devices for semiconductor processing equipment often do not have a structure on the outside to prevent accidental touches. Therefore, during use, the control buttons may be accidentally touched, thereby disrupting the set parameters. The device does not have an anti-accidental touch effect.

[0005] 2. Most voltage control devices used in semiconductor processing equipment generate a lot of heat when in use because they have many electrical components inside. Most voltage control devices used in semiconductor processing equipment generally do not have additional heat dissipation structures, which easily leads to heat accumulation and poor heat dissipation effect. Utility Model Content

[0006] The purpose of the utility model is to provide a voltage control device for semiconductor processing equipment to solve the technical problems raised in the background technology.

[0007] To achieve the above-mentioned purpose, the specific technical solution of the present invention is as follows: A pressure control device for semiconductor processing equipment, including a pressure controller, a frame is provided on the outside of the pressure controller, a slide groove is provided on the inner wall of the frame, the inside of the slide groove is slidably connected to a cover plate, a metal sheet is embedded in the top of the cover plate, a magnet block is embedded in the inner wall of the frame, and the metal sheet is adsorbed and connected to the surface of the magnet block.

[0008] Preferably, a rectangular groove is opened on the surface of the pressure controller, a copper plate is embedded in the inside of the rectangular groove, a heat conducting plate is provided on the outside of the copper plate, the top of the pressure controller is fixedly connected to the fixed plate, a motor is provided at the bottom of the fixed plate, and the outside of the motor is connected to the fan blades through an output shaft.

[0009] Preferably, the bottom of the cover plate is fixedly connected to a pinching plate, and the surface of the pinching plate is provided with convex strips, and the convex strips are distributed in an equidistant manner.

[0010] Preferably, a first plug board is fixedly connected to the surface of the frame, a first slot is provided on the surface of the pressure controller, and the first plug board is inserted and connected to the inside of the first slot.

[0011] Preferably, the top of the cover plate is fixedly connected to a stopper, and the bottom of the stopper is in close contact with the slide groove.

[0012] Preferably, a second slot is provided on the top of the copper plate, the surface of the heat conducting plate is fixedly connected to a second plug-in plate, and the second plug-in plate is inserted and connected to the inside of the second slot.

[0013] Preferably, the surface of the pressure controller is fixedly connected to the first mounting plate, the surface of the frame is fixedly connected to the second mounting plate, the surface of the heat conducting plate is provided with a third mounting plate, and the interiors of the second mounting plate and the third mounting plate are both connected to the pressure controller by bolts.

[0014] The utility model provides a pressure control device for semiconductor processing equipment with the following advantages:

[0015] 1. This pressure control device for semiconductor processing equipment is designed to protect the buttons of the pressure controller from accidental touch by providing a frame on the outside of the pressure controller, with a cover plate connected to the inside of the frame by a sliding connection. Furthermore, the top of the cover plate is magnetically connected to the inner wall of the frame. This prevents accidental touches on the buttons of the pressure controller.

[0016] 2. This voltage control device for semiconductor processing equipment has a copper plate embedded in the surface of the voltage controller, and a plurality of heat conducting plates are provided on the surface of the copper plate. A fixed plate is fixedly connected to the top of the voltage controller, and a motor is installed on the surface of the fixed plate. The outside of the motor is connected to the fan blades via the output shaft. In this way, when the voltage controller is running, the heat generated inside it will be transferred to the heat conducting plates through the copper plate and then blown away by the fan blades, thereby enhancing its heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2This is a schematic structural diagram of the pressure control instrument of the present utility model;

[0020] Figure 3 This is a schematic diagram of the cover structure of the utility model;

[0021] Figure 4 This is a schematic diagram of the fan blade structure of the present utility model;

[0022] Figure 5 This is a schematic structural diagram of the heat conducting plate of the present utility model.

[0023] Explanation of the markings in the figure: 1. Pressure controller; 2. Frame; 3. Cover; 4. Pinch plate; 5. First plug-in plate; 6. First slot; 7. Magnet block; 8. Metal sheet; 9. Stopper; 10. First mounting plate; 11. Second mounting plate; 12. Fixed plate; 13. Motor; 14. Fan blades; 15. Copper plate; 16. Heat conducting plate; 17. Second slot; 18. Second plug-in plate; 19. Third mounting plate. DETAILED DESCRIPTION

[0024] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the embodiments of the present invention. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0025] In the description of the embodiments of the present invention, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc. indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0027] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0028] The disclosure below provides many different embodiments or examples for implementing different structures of the embodiments of the present invention. In order to simplify the disclosure of the embodiments of the present invention, the components and settings of specific examples are described below. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. In addition, the embodiments of the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0029] In order to better understand the purpose, structure and function of the present invention, the following is a further detailed description of a pressure control device for semiconductor processing equipment of the present invention in conjunction with the accompanying drawings.

[0030] like Figure 1-5 As shown, the utility model is a pressure control device for semiconductor processing equipment, including a pressure controller 1, a frame 2 is provided on the outside of the pressure controller 1, a slide groove is provided on the inner wall of the frame 2, and a cover plate 3 is slidably connected inside the slide groove, so that it is convenient to open the cover plate 3 and operate the button. A metal sheet 8 is embedded in the top of the cover plate 3, and a magnet block 7 is embedded in the inner wall of the frame 2. The metal sheet 8 is adsorbed and connected to the surface of the magnet block 7, so that the buttons of the pressure controller 1 can be protected from being accidentally touched, so that it has an anti-accidental touch effect.

[0031] A rectangular groove is provided on the surface of the pressure controller 1, and a copper plate 15 is embedded inside the rectangular groove. A heat conducting plate 16 is provided outside the copper plate 15. The top of the pressure controller 1 is fixedly connected to the fixed plate 12, and a motor 13 is provided at the bottom of the fixed plate 12. The outside of the motor 13 is connected to the fan blades 14 through the output shaft. In this way, when the pressure controller 1 is running, the heat generated inside it will be transferred to the heat conducting plate 16 through the copper plate 15, and then blown away by the fan blades 14, thereby enhancing its heat dissipation effect.

[0032] The bottom of the cover plate 3 is fixedly connected to the pinching plate 4. The surface of the pinching plate 4 is provided with convex strips, which are evenly distributed. The provided convex strips can increase the friction when in contact with the hand, making it easier to pinch the pinching plate 4 and thus pull the cover plate 3.

[0033] The surface of the frame 2 is fixedly connected to the first plugboard 5, and the surface of the pressure controller 1 is provided with a first slot 6, and the first plugboard 5 is inserted and connected inside the first slot 6, so as to play a positioning role when the frame 2 is installed.

[0034] The top of the cover plate 3 is fixedly connected to the stopper 9 , and the bottom of the stopper 9 is in close contact with the slide slot, which can prevent the cover plate 3 from being completely pulled out from the inside of the frame 2 .

[0035] A second slot 17 is opened on the top of the copper plate 15, and the surface of the heat conducting plate 16 is fixedly connected to the second plug-in plate 18, which is inserted into the interior of the second slot 17. In this way, when the heat conducting plate 16 is damaged, it can be replaced individually without replacing the entire copper plate 15, saving materials.

[0036] The surface of the pressure controller 1 is fixedly connected to the first mounting plate 10, the surface of the frame 2 is fixedly connected to the second mounting plate 11, and the surface of the heat conducting plate 16 is provided with a third mounting plate 19. The interiors of the second mounting plate 11 and the third mounting plate 19 are both connected to the pressure controller 1 by bolts, which makes it easy to disassemble and assemble the frame 2.

[0037] The working principle of the pressure control device for semiconductor processing equipment is as follows: when in use, a frame 2 is provided on the outside of the pressure controller 1, and a slide groove is provided on the inner wall of the frame 2. The inside of the slide groove is slidably connected to the cover plate 3. The top of the cover plate 3 is inlaid with a metal sheet 8. The inner wall of the frame 2 is embedded with a magnet block 7. The metal sheet 8 is adsorbed and connected to the surface of the magnet block 7. The bottom of the cover plate 3 is fixedly connected to the pinching plate 4. The surface of the pinching plate 4 is provided with convex strips, and the convex strips are evenly distributed. The provided convex strips can increase the friction when in contact with the hand, making it easy to pinch the pinching plate 4 to pull the cover plate 3. The top of the cover plate 3 is fixedly connected to the stopper 9, which can prevent the cover plate 3 from being completely pulled out from the inside of the frame 2. When in use, pinch the pinching plate 4 and pull the cover plate 3 downward until the bottom of the stopper 9 is close to the slide groove, so that the button of the pressure controller 1 can be protected from being accidentally touched, so that it has the effect of preventing accidental touch. As shown in FIG1 , a rectangular groove is provided on the surface of the pressure controller 1, a copper plate 15 is embedded inside the rectangular groove, a heat conducting plate 16 is provided on the outside of the copper plate 15, the top of the pressure controller 1 is fixedly connected to the fixed plate 12, and a motor 13 is provided at the bottom of the fixed plate 12. The outside of the motor 13 is connected to the fan blades 14 through the output shaft, so that when the pressure controller 1 is running, the heat generated inside it will be transferred to the heat conducting plate 16 through the copper plate 15. When the motor 13 is started, the motor 13 drives the fan blades 14 to rotate, which will cause the heat to be blown away along with the air, thereby enhancing its heat dissipation effect. A second slot 17 is provided on the top of the copper plate 15, and the surface of the heat conducting plate 16 is fixedly connected to the second plug-in plate 18, which is inserted into the inside of the second slot 17. In this way, when the heat conducting plate 16 is damaged, it can be replaced individually without replacing the entire copper plate 15, saving materials.

[0038] It is understood that the present invention is described by way of certain embodiments, and those skilled in the art will appreciate that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. Furthermore, under the guidance of the present invention, these features and embodiments may be modified to suit specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are intended to be protected by the present invention.

Claims

1. A pressure control device for semiconductor processing equipment, comprising a pressure controller (1), characterized in that: The pressure controller (1) is provided with a frame (2) on the outside, a slide groove is provided on the inner wall of the frame (2), the inner part of the slide groove is slidably connected to a cover plate (3), a metal sheet (8) is embedded on the top of the cover plate (3), a magnet block (7) is embedded on the inner wall of the frame (2), and the metal sheet (8) is adsorbed and connected to the surface of the magnet block (7).

2. The voltage control device for semiconductor processing equipment according to claim 1, wherein: A rectangular groove is provided on the surface of the pressure controller (1), a copper plate (15) is embedded in the rectangular groove, a heat conducting plate (16) is provided on the outside of the copper plate (15), the top of the pressure controller (1) is fixedly connected to a fixed plate (12), a motor (13) is provided on the bottom of the fixed plate (12), and the outside of the motor (13) is connected to a fan blade (14) via an output shaft.

3. The voltage control device for semiconductor processing equipment according to claim 1, wherein: The bottom of the cover plate (3) is fixedly connected to the pinching plate (4), and the surface of the pinching plate (4) is provided with convex strips, and the convex strips are distributed in an equidistant manner.

4. The voltage control device for semiconductor processing equipment according to claim 1, wherein: The surface of the frame (2) is fixedly connected to a first plugboard (5), the surface of the pressure controller (1) is provided with a first slot (6), and the first plugboard (5) is inserted and connected inside the first slot (6).

5. The voltage control device for semiconductor processing equipment according to claim 1, wherein: The top of the cover plate (3) is fixedly connected to a stopper (9), and the bottom of the stopper (9) is in close contact with the slide groove.

6. The voltage control device for semiconductor processing equipment according to claim 2, wherein: A second slot (17) is provided on the top of the copper plate (15), a second plug-in plate (18) is fixedly connected to the surface of the heat conducting plate (16), and the second plug-in plate (18) is inserted and connected inside the second slot (17).

7. The voltage control device for semiconductor processing equipment according to claim 2, wherein: The surface of the pressure controller (1) is fixedly connected to a first mounting plate (10), the surface of the frame (2) is fixedly connected to a second mounting plate (11), the surface of the heat conducting plate (16) is provided with a third mounting plate (19), and the interiors of the second mounting plate (11) and the third mounting plate (19) are both connected to the pressure controller (1) via bolts.

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