Pressing structure and electrical equipment

By setting up a tightening structure between the circuit board and the shell, the problems of insufficient circuit board space and poor heat dissipation effect are solved, and efficient utilization of circuit board space and improved heat dissipation efficiency are achieved, which is suitable for electrical equipment.

CN223261790UActive Publication Date: 2025-08-22GREE ELECTRIC APPLIANCE INC OF ZHUHAI +1
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Patent Information

Application Number
CN202422410509.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-08
Publication Date
2025-08-22
Estimated Expiration
2034-10-08

AI Technical Summary

Technical Problem

In the prior art, with the miniaturization of electrical equipment, there is insufficient circuit board space and poor heat dissipation effect, especially in high power and high device density environments, the device occupies a large area and lacks heat dissipation.

Method used

The compacting structure is adopted, and the electrical components are fixed between the housing and the circuit board through the compacting parts. The gap between the back of the circuit board and the shell is used to cancel the heat dissipation fins on the front of the circuit board, and combined with the heat dissipation plate on the shell to improve the heat dissipation efficiency.

Benefits of technology

Effectively save circuit board space, improve device installation integration, reduce MOSFET device temperature, improve heat dissipation efficiency, extend device service life, and save additional heat dissipation device costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a pressing structure and electrical equipment. The pressing structure comprises a shell; a circuit board; the circuit board comprises a first mounting surface and a second mounting surface which are used for mounting devices; the first mounting surface and the second mounting surface are oppositely arranged; the electric appliance part is connected with the circuit board; the pressing part is connected with the electric appliance part; and the pressing structure is connected with the pressing component, so that the electric appliance component is fixed between the pressing component and the shell by extruding the pressing component, and the pressing structure solves the technical problem that the space of a circuit board of an electronic product in the related technology is insufficient.
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Description

Technical Field

[0001] The utility model relates to the technical field of electrical appliances, in particular to a compression structure and electrical equipment. Background Art

[0002] With the implementation of the dual carbon policy and the development of new energy and energy storage technologies, photovoltaic and energy storage integrated machines or inverters are becoming increasingly lightweight and convenient. In order to reduce the installation space and convenience of the products, the size of the entire machine is developing towards a smaller size.

[0003] However, as the size of the device continues to shrink, the line density on the circuit board is also getting higher and higher. Usually, the MOSFET is combined with a small fin heat sink and then placed on the circuit board in a vertical manner.

[0004] Therefore, electronic products in the prior art have problems such as insufficient circuit board space and poor heat dissipation. Utility Model Content

[0005] The purpose of the present invention is to overcome the above technical deficiencies and provide a compression structure and electrical equipment to solve the technical problem of insufficient circuit board space in electronic products in the related art.

[0006] In order to achieve the above technical objectives, the utility model adopts the following technical solutions: a clamping structure is provided, including: a shell; a circuit board; the circuit board includes a first mounting surface and a second mounting surface for mounting devices; the first mounting surface and the second mounting surface are arranged opposite to each other; an electrical component, the electrical component is connected to the circuit board; a clamping component, the clamping component is connected to the electrical component; a clamping structure, the clamping structure is connected to the clamping component, so that the electrical component is fixed between the clamping component and the shell by squeezing the clamping component.

[0007] Furthermore, the pressing component is arranged between the circuit board and the electrical component; the pressing structure includes a fixing component, which passes through the circuit board and presses the electrical component.

[0008] Furthermore, the pressing structure includes a mounting assembly, which is connected to the housing; and the mounting assembly is connected to the fixing component.

[0009] Furthermore, the mounting assembly includes: a fixing post connected to the shell; a fixing plate connected to an end of the fixing post away from the shell; and the fixing plate connected to the fixing component.

[0010] Furthermore, a mounting through hole is provided on the circuit board, and the fixing post is provided through the mounting through hole.

[0011] Furthermore, a connecting through hole is provided on the fixing column, and an internal thread is provided in the connecting through hole; the clamping structure also includes a fastener, and the fastener is provided with an external thread that matches the internal thread in the connecting through hole; the fixing plate and the fixing column are connected by inserting the fastener into the fixing plate and the fixing column.

[0012] Furthermore, the pressing component is provided with a fixing through hole, and an internal thread is provided in the fixing through hole; and the fixing component is provided with an external thread that matches the internal thread in the fixing through hole.

[0013] Furthermore, there are multiple electrical components; there are multiple pressing components, and the multiple pressing components are arranged in a one-to-one correspondence with the multiple electrical components; and / or the pressing component is a plate-shaped structure.

[0014] Furthermore, a heat sink is attached to the inner wall surface of the shell, one end of the electrical component is attached to the heat sink, and the other end of the electrical component is attached to the pressing component.

[0015] An electrical device comprises a compression structure, wherein the compression structure is the above-mentioned compression structure.

[0016] Beneficial effects:

[0017] The clamping structure of the utility model includes a housing; a circuit board; the circuit board includes a first mounting surface and a second mounting surface for mounting components; the first mounting surface and the second mounting surface are arranged relative to each other; an electrical component, the electrical component is connected to the circuit board; a clamping component, the clamping component is connected to the electrical component; a clamping structure, the clamping structure is connected to the clamping component, so that the electrical component is fixed between the clamping component and the housing by squeezing the clamping component. With the above arrangement, when installing, the first mounting surface is the front side and the second mounting surface is the back side. The clamping structure of the electrical component utilizes the gap between the back side of the circuit board and the housing, making use of the originally useless space, and at the same time eliminating the heat dissipation fins on the front side of the circuit board, saving a lot of space, reducing the size of the circuit board, improving the integration of component installation, and solving the technical problem of insufficient circuit board space in electronic products in related technologies.

[0018] The compacting structure of the utility model enables each MOSFET device on the circuit board to save 155 mm² area.

[0019] The compression structure of the utility model reduces the temperature of the MOSFET device on the circuit board from 128.6°C to 90.2°C. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the compression structure adopted in the embodiment of the present utility model;

[0021] Figure 2 yes Figure 1A partially enlarged schematic diagram of part I used in the embodiment of the present utility model;

[0022] Figure 3 It is a cross-sectional view of the compression structure adopted in the embodiment of the present utility model;

[0023] Figure 4 yes Figure 3 A partially enlarged schematic diagram of part II of the embodiment of the present utility model;

[0024] Figure 5 It is a top view of the compression structure adopted in the embodiment of the present utility model;

[0025] Figure 6 yes Figure 5 A partially enlarged schematic diagram of part III of the embodiment of the present utility model;

[0026] Figure 7 This is a structural diagram of a fixing plate of a compression structure used in an embodiment of the present utility model;

[0027] Figure 8 It is a structural schematic diagram of the pressing component of the pressing structure adopted in the embodiment of the present utility model.

[0028] The above drawings include the following reference numerals:

[0029] 1. Housing; 2. Circuit board; 21. Mounting through hole; 3. Electrical components; 4. Pressing component; 5. Pressing structure; 51. Fixing component; 52. Mounting assembly; 521. Fixing column; 522. Fixing plate; 6. Fastener; 7. Heat sink. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0031] See also Figures 1 to 8According to an embodiment of the utility model, a clamping structure is provided, comprising: a housing 1; a circuit board 2; the circuit board 2 comprising a first mounting surface and a second mounting surface for mounting components; the first mounting surface and the second mounting surface being arranged opposite to each other; an electrical component 3, the electrical component 3 being connected to the circuit board 2; a clamping component 4, the clamping component 4 being connected to the electrical component 3; a clamping structure 5, the clamping structure 5 being connected to the clamping component 4, so as to fix the electrical component 3 between the clamping component 4 and the housing 1 by squeezing the clamping component 4. With the above arrangement, during installation, the first mounting surface is the front side, and the second mounting surface is the back side. The clamping structure of the electrical component 3 utilizes the gap between the back side of the circuit board 2 and the housing 1, making use of the originally useless space, while eliminating the heat dissipation fins on the front side of the circuit board 2, saving a lot of space, reducing the size of the circuit board 2, improving the integration of component installation, and solving the technical problem of insufficient circuit board space in electronic products in related technologies.

[0032] In the compression structure of this embodiment, see Figure 4 The pressing member 4 is disposed between the circuit board 2 and the electrical component 3; the pressing structure 5 includes a fixing member 51 that passes through the circuit board 2 and presses against the electrical component 3. Thus, the pressing member 4 passes through the hole in the circuit board 2 and then presses against the electrical component 3, thus preserving the structure of the circuit board 2 and saving space on the circuit board 2.

[0033] See also Figure 2 In the compression structure of this embodiment, the compression structure 5 includes a mounting assembly 52, which is connected to the housing 1 and is connected to the fixing member 51. In this way, the fixing member 51 is fixed to the housing 1 through the mounting assembly 52, so that the fixing member 51 is securely installed.

[0034] See also Figure 2 In the clamping structure of this embodiment, the mounting assembly 52 includes: a fixing column 521, the fixing column 521 is connected to the shell 1; a fixing plate 522, the fixing plate 522 is connected to the end of the fixing column 521 away from the shell 1; and the fixing plate 522 is connected to the fixing component 51.

[0035] In the compression structure of this embodiment, see Figure 2 The circuit board 2 is provided with a mounting through hole 21, and the fixing post 521 is provided through the mounting through hole 21. In this way, on the one hand, the position setting of the fixing post 521 is facilitated, and on the other hand, the fixing post 521 can play a role in limiting the position of the circuit board 2, thereby facilitating the installation of the circuit board 2.

[0036] See also Figure 2In the clamping structure of this embodiment, the fixing post 521 is provided with a connecting through-hole having an internal thread. The clamping structure also includes a fastener 6 having an external thread that mates with the internal thread in the connecting through-hole. The fastener 6 is inserted through the fixing plate 522 and the fixing post 521 to connect the fixing plate 522 to the fixing post 521. The provision of the fastener 6 facilitates installation and removal of the fixing plate 522.

[0037] Example 1

[0038] In the compression structure of this embodiment, see Figure 4 The pressing part 4 is provided with a fixing through hole, in which an internal thread is provided; the fixing part 51 is provided with an external thread that matches the internal thread in the fixing through hole. In this way, the fixing part 51 passes through the pressing part 4 and directly contacts the electrical component 3, thereby improving the pressing effect.

[0039] Example 2

[0040] In the clamping structure of this embodiment, different from the first embodiment, a threaded hole is provided on the fixing plate 522, and an external thread matching the threaded hole is provided on the fixing component 51. The fixing component 51 directly abuts against the clamping component 4, and the electrical component 3 is clamped by the clamping component 4, so that the structure of the electrical component 3 can be protected.

[0041] See also Figure 5 In the clamping structure of this embodiment, there are multiple electrical components 3; there are multiple clamping components 4, and the multiple clamping components 4 are arranged in a one-to-one correspondence with the multiple electrical components 3; and / or, the clamping component 4 is a plate-shaped structure.

[0042] Specifically, multiple pressing components 4 and multiple electrical components 3 are provided to save more space and improve heat dissipation efficiency. The pressing component 4 is provided as a plate-like structure to increase the contact area of ​​the pressing component 4, protect the structure, and improve the pressing effect.

[0043] See also Figure 2 In the compression structure of this embodiment, a heat sink 7 is attached to the inner wall surface of the housing 1, one end of the electrical component 3 is attached to the heat sink 7, and the other end of the electrical component 3 is attached to the compression component 4. In this way, the heat dissipation efficiency of the structure can be improved.

[0044] The electrical device of this embodiment includes a compression structure, which is the compression structure described above. The electrical device of this embodiment employs the compression structure described above, thereby resolving the issue of components and heat sinks occupying a large area on the circuit board, reducing the overall size of the circuit board. This also addresses the issue of insufficient heat dissipation in high-power and high-device density environments.

[0045] The description of the compression structure of this embodiment is as follows:

[0046] This embodiment provides a compacting structure for MOS tubes. This structure is simple. The fixing column 521, the fixing plate 522, and the compacting component 4 on the housing 1 can be used to compact the MOSFET device (i.e., the electrical component 3 of this embodiment) onto the housing 1. This saves space on the circuit board 2 and utilizes the large area of ​​the housing 1 to greatly improve the heat dissipation efficiency of the MOSFET. The specific implementation scheme is as follows:

[0047] like Figure 5 This is a front view of the clamping structure. You can see that there are four screws on the fixing plate 522. The clamping structure consists of the following parts: the fixing plate 522, the clamping component 4, the fixing column 521 and the fixing screws. The clamping component 4 is embedded in the gap between the MOSFET and the circuit board 2 before the circuit board 2 is installed into the machine housing 1. The circuit board 2 is then installed into the housing 1, and the fixing column 521 passes through the hole reserved on the circuit board 2 and protrudes above the circuit board 2. The fixing plate 522 is fixed to the fixing column 521 with two screws, using Figure 6 The two through holes in the fixing plate 522 are slightly larger than the major diameter of the screw and smaller than the outer diameter of the screw head. Therefore, when the screw is tightened down on the fixing column 521, the screw head can press the fixing plate 522 onto the fixing column 521. After the fixing plate 522 is installed, the other two screws are screwed into the two screw holes on the fixing plate 522, first passing through the reserved holes on the circuit board 2, and then tightening the clamping component 4 pre-clamped between the MOSFET and the circuit board 2. While the clamping component 4 is pressed down by the screw, it presses the MOSFET onto the machine housing 1, so that the heating surface of the MOSFET is in close contact with the machine housing 1. After the MOSFET is installed on the back of the circuit board 2, it effectively saves the device area on the front of the circuit board 2, which can further reduce the area of ​​the circuit board 2 and further enrich the functions of the circuit board 2 of the same area. At the same time, the MOSFET relies on the larger area of ​​the housing to dissipate heat, which significantly improves the efficiency of heat dissipation, extends the service life of the device, and ensures the normal operation of the machine function.

[0048] In summary, the compression structure of this embodiment can effectively save the use area of ​​the circuit board 2, and at the same time has the advantage of improving the heat dissipation efficiency, saving the economic cost of using additional heat dissipation devices, and has great promotion value.

[0049] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in a sequence other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0050] Optionally, the specific examples in this embodiment may refer to the examples described in the above embodiments, and this embodiment will not be described in detail here.

[0051] The serial numbers of the above-mentioned embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments.

[0052] In the above embodiments of the present application, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments.

[0053] The above is only a preferred embodiment of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A compression structure, characterized in that: include: housing (1); A circuit board (2); the circuit board (2) comprises a first mounting surface and a second mounting surface for mounting components; the first mounting surface and the second mounting surface are arranged opposite to each other; An electrical component (3), the electrical component (3) being connected to the circuit board (2); A pressing component (4), the pressing component (4) being connected to the electrical component (3); A pressing structure (5) is connected to the pressing component (4) so ​​as to fix the electrical component (3) between the pressing component (4) and the housing (1) by squeezing the pressing component (4).

2. The compression structure according to claim 1, characterized in that: The pressing component (4) is arranged between the circuit board (2) and the electrical component (3); the pressing structure (5) comprises a fixing component (51), and the fixing component (51) passes through the circuit board (2) and presses against the electrical component (3).

3. The compression structure according to claim 2, characterized in that: The pressing structure (5) comprises a mounting assembly (52), wherein the mounting assembly (52) is connected to the housing (1); and the mounting assembly (52) is connected to the fixing component (51).

4. The compression structure according to claim 3, characterized in that: The mounting assembly (52) includes: A fixing column (521), the fixing column (521) being connected to the housing (1); a fixing plate (522), the fixing plate (522) being connected to an end of the fixing column (521) away from the housing (1); The fixing plate (522) is connected to the fixing component (51).

5. The compression structure according to claim 4, characterized in that: A mounting through hole (21) is provided on the circuit board (2), and the fixing column (521) is provided through the mounting through hole (21).

6. The compression structure according to claim 4, characterized in that: The fixing column (521) is provided with a connecting through hole, and an internal thread is provided in the connecting through hole; the pressing structure further comprises a fastener (6), and the fastener (6) is provided with an external thread that matches the internal thread in the connecting through hole; the fixing plate (522) and the fixing column (521) are connected by inserting the fastener (6) through the fixing plate (522) and the fixing column (521).

7. The compression structure according to claim 4, characterized in that: The pressing component (4) is provided with a fixing through hole, and an internal thread is provided in the fixing through hole; the fixing component (51) is provided with an external thread that matches the internal thread in the fixing through hole.

8. The compression structure according to claim 1, characterized in that: There are multiple electrical components (3); there are multiple pressing components (4), and the multiple pressing components (4) are arranged in a one-to-one correspondence with the multiple electrical components (3); and / or the pressing components (4) are plate-shaped structures.

9. The compression structure according to any one of claims 1 to 8, characterized in that: A heat dissipation plate (7) is attached to the inner wall surface of the housing (1); one end of the electrical component (3) is attached to the heat dissipation plate (7); and the other end of the electrical component (3) is attached to the pressing component (4).

10. An electrical device comprising a compression structure, characterized in that: The compression structure is the compression structure according to any one of claims 1 to 9.