Circuit board packaging box and vehicle
Through the design of circuit board packaging boxes, effective shielding and heat dissipation of electromagnetic signals and heat is achieved using the abutment plate and elastic grounding column, solving the structural bulkiness caused by the increase of parts in the prior art, and achieving lightweight and cost reduction.
Patent Information
- Application Number
- CN202422544657.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-21
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-10-21
AI Technical Summary
In the prior art, the shielding cover in the battery management system controller increases the number of parts and occupies internal space, making the structure bloated and bulky.
The circuit board packaging box is adopted, and the abutment plate on the upper shell board is directly abutted with the electronic components on the circuit board. Combined with elastic grounding columns and thermal pads, heat dissipation and shielding are achieved, reducing the individual heat dissipation and shielding elements and reducing the number of parts.
It realizes a lightweight structure, reduces costs, and improves heat dissipation and shielding effects.
Smart Images
Figure CN223261801U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of vehicles, in particular to a circuit board packaging box and a vehicle. Background Art
[0002] The vehicle's battery management system controller is equipped with a system on chip (SOC). During operation, the chip generates electromagnetic signals, which interfere with the electromagnetic signals generated by other electronic components in the battery management system controller.
[0003] In the prior art, the above technical problems are generally solved by covering the chip with a shielding cover. However, the shielding cover increases the number of components in the battery management system controller, occupies the internal space of the battery management system controller, and makes the overall structure of the battery management system controller bloated and bulky. Utility Model Content
[0004] In order to solve the above technical problem or at least partially solve the above technical problem, the utility model provides a circuit board packaging box and a vehicle.
[0005] In the first aspect, the present application provides a circuit board packaging box, which includes: a circuit board, the circuit board including a first surface and a second surface relative to each other; an electronic component, the electronic component is arranged on the first surface; a shielding shell, the shielding shell defines a shielding space, the circuit board and the electronic component are arranged in the shielding space, the shielding shell includes an upper shell plate and a lower shell plate, the upper shell plate is located on the side facing the first surface of the circuit board, the lower shell plate is located on the side facing the second surface of the circuit board, the upper shell plate includes an abutting plate, the abutting plate abuts against the electronic component; a grounding column, one end of the grounding column abuts against the second surface, and the other end abuts against the lower shell plate, the orthographic projection of the grounding column on the first surface is located within the orthographic projection of the electronic component on the first surface.
[0006] In this way, the circuit board packaging box provided by the present application directly abuts against the electronic components on the circuit board through the abutment plate on the upper shell plate, thereby achieving heat dissipation and shielding of the electronic components, reducing the number of heat dissipation and shielding elements set up separately for the electronic components, reducing the number of parts in the circuit board packaging box, reducing costs, and making the overall structure lightweight.
[0007] In some embodiments of the present application, the grounding column is formed as an elastic grounding column.
[0008] In some embodiments of the present application, an orthographic projection of the electronic component on the first surface is located within an orthographic projection of the abutting plate on the first surface.
[0009] In some embodiments of the present application, the upper shell plate includes an abutment groove, which is formed by a portion of the upper shell plate being recessed toward the circuit board, and a bottom wall of the abutment groove forms the abutment plate.
[0010] In some embodiments of the present application, the circuit board packaging box includes: an elastic thermal pad, which is clamped between the electronic component and the abutment plate, one end of the elastic thermal pad is thermally conductive with the electronic component, and the other end is thermally conductive with the abutment plate.
[0011] In some embodiments of the present application, the circuit board packaging box includes: a grounding plate, which is arranged on the second surface, and is arranged opposite to the electronic component in the direction from the first surface to the second surface, and the grounding plate abuts against the grounding column.
[0012] In some embodiments of the present application, the shielding shell includes an upper shell and a lower shell, the upper shell includes an upper shell plate, the lower shell includes a lower shell plate, and the upper shell and the lower shell are detachably connected.
[0013] In some embodiments of the present application, the upper shell plate includes an avoidance groove, and the avoidance groove is formed by a portion of the upper shell plate being recessed in a direction away from the circuit board.
[0014] In some embodiments of the present application, the lower shell plate includes: a reinforcing rib, and the reinforcing rib is arranged on a side surface of the lower shell plate facing the circuit board.
[0015] In a second aspect, the present application further provides a vehicle, which may include the circuit board packaging box and the vehicle frame described in any of the above solutions, and the circuit board packaging box is arranged on the vehicle frame.
[0016] Among them, the technical effects brought about by any design scheme in the second aspect can refer to the technical effects brought about by different design methods in the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The accompanying drawings are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present invention, and together with the description, serve to explain the principles of the present invention.
[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0019] Figure 1An exploded view of a circuit board packaging box provided in some embodiments of the present application;
[0020] Figure 2 for Figure 1 A schematic diagram of the upper housing shown in ;
[0021] Figure 3 for Figure 1 A schematic diagram of the lower housing shown in ;
[0022] Figure 4 for Figure 1 Schematic diagram of the circuit board shown in .
[0023] Reference numerals:
[0024] 100. Circuit board packaging box;
[0025] 110. Circuit board; 111. First surface; 112. Second surface;
[0026] 120, shielding shell; 121, upper shell; 1211, upper shell plate; 1212, abutting plate; 1213, abutting groove; 1214, avoidance groove; 122, lower shell; 1221, lower shell plate; 1222, reinforcing rib; 1223, connecting portion;
[0027] 130. Electronic components;
[0028] 140. Grounding column;
[0029] 150. Elastic thermal pad;
[0030] 160. Ground plate. DETAILED DESCRIPTION
[0031] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the scheme of the present invention will be further described below. It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein can be combined with each other.
[0032] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present invention, rather than all of the embodiments.
[0033] The vehicle's battery management system controller is equipped with a system on chip (SOC). During operation, the chip generates electromagnetic signals, which interfere with the electromagnetic signals generated by other electronic components in the battery management system controller.
[0034] In the prior art, the above technical problems are generally solved by covering the chip with a shielding cover. However, the shielding cover increases the number of components in the battery management system controller, occupies the internal space of the battery management system controller, and makes the overall structure of the battery management system controller bloated and bulky.
[0035] In order to solve the above technical problems, the present application provides a vehicle, which may include a circuit board packaging box 100 and a frame, and the circuit board packaging box 100 is arranged on the frame, wherein the circuit board packaging box 100 can be a battery management system controller, the circuit board packaging box 100 has fewer components, lower cost, and smaller volume, so that the overall structure of the circuit board packaging box 100 occupies less space.
[0036] For details, please refer to Figure 1 The circuit board package box 100 may include: a circuit board 110 , electronic components 130 , a shielding shell 120 and a grounding column 140 .
[0037] Among them, the circuit board 110 can be a printed circuit board 110 (PCB), the circuit board 110 is formed in a plate shape, and the circuit board 110 may include a first surface 111 and a second surface 112 opposite to each other in its thickness direction, and a plurality of points for electrical connection or fixation are provided on the first surface 111 and the second surface 112.
[0038] The electronic component 130 is disposed on the first surface 111. Specifically, the electronic component 130 is electrically connected to the connection point of the first surface 111. The electronic component 130 can be a system on chip (SOC) chip, a graphics processing unit (GPU), or a graphics double date (GDDR). On the one hand, the electronic component 130 radiates electromagnetic signals during operation, which may affect the normal operation of other electronic components on the circuit board 110. On the other hand, the electronic component 130 generates severe heat due to its high power consumption during long-term operation. However, excessively high operating temperatures of the electronic component 130 may affect its normal operation. Therefore, the electronic component 130 needs to be shielded and heat-dissipated.
[0039] Please continue reading Figure 1The shielding shell 120 defines a shielding space, and the circuit board 110 and the electronic component 130 are arranged in the shielding space. The shielding shell 120 can be made of a material with a shielding function. Specifically, the shielding shell 120 can be a metal shell. The shielding shell 120 can include an upper shell 121 and a lower shell 122. The upper shell 121 and the lower shell 122 are detachably connected. Specifically, the upper shell 121 and the lower shell 122 are snap-fitted or threadedly connected.
[0040] The shielding shell 120 can be generally formed into a rectangular shape, the upper shell 121 can include an upper shell plate 1211, and the lower shell 122 includes a lower shell plate 1221. The upper shell plate 1211 is located on the side facing the first surface 111 of the circuit board 110, and the lower shell plate 1221 is located on the side facing the second surface 112 of the circuit board 110. The upper shell plate 1211 includes an abutting plate 1212, and the abutting plate 1212 abuts against the electronic component 130.
[0041] Therefore, by setting an abutting plate 1212 on the upper shell plate 1211 to abut against the electronic component 130, the shell can achieve signal shielding and heat conduction of the electronic component 130, and there is no need to set up an independent structure to dissipate heat and shield the electronic component 130, thereby reducing the number of components in the circuit board packaging box 100.
[0042] Among them, the orthographic projection of the electronic component 130 on the first surface 111 is located within the orthographic projection of the abutting plate 1212 on the first surface 111, that is, the abutting plate 1212 can completely cover the electronic component 130, thereby maximizing the heat conduction area between the upper shell plate 1211 and the electronic component 130, thereby improving the heat dissipation and shielding effects of the electronic component 130.
[0043] Please continue reading Figure 1 One end of the grounding column 140 abuts against the second surface 112, and the other end abuts against the lower shell plate 1221. The orthographic projection of the grounding column 140 on the first surface 111 is located within the orthographic projection of the electronic component 130 on the first surface 111. That is, the grounding column 140 provides the electronic component 130 with a thrust from the second surface 112 toward the first surface 111, and the abutting plate 1212 provides the electronic component 130 with a thrust from the first surface 111 toward the second surface 112. The stability of the position of the electronic component 130 can be ensured by the grounding column 140 and the grounding column 140.
[0044] Furthermore, the grounding post 140 is formed as an elastic grounding post 140 , which can avoid a hard collision between the circuit board 110 and the grounding post 140 .
[0045] In this way, through the circuit board packaging box 100 provided by the present application, the abutment plate 1212 on the upper shell plate 1211 directly abuts against the electronic components 130 on the circuit board 110, thereby achieving heat dissipation and shielding of the electronic components 130, reducing the heat dissipation and shielding elements set separately for the electronic components 130, reducing the number of parts in the circuit board packaging box 100, reducing costs, and making the overall structure lightweight.
[0046] In some embodiments of this application, please continue to refer to Figure 1 and Figure 2 The circuit board packaging box 100 may further include an elastic thermal pad 150, one end of the elastic thermal pad 150 is thermally conductive with the electronic component 130, and the other end is thermally conductive with the abutting plate 1212. The elastic thermal pad 150 can effectively alleviate the hard contact between the electronic component 130 and the abutting plate 1212 while achieving thermal conductivity between the electronic component 130 and the abutting plate 1212.
[0047] In some embodiments of this application, please continue to refer to Figure 2 The upper shell 121 may further include an abutment groove 1213, which is formed by a portion of the upper shell plate 1211 being recessed toward the circuit board 110, and the bottom wall of the abutment groove 1213 is formed as an abutment plate 1212. It should be noted that the first surface 111 of the circuit board 110 is provided with other components, and the height of the electronic component 130 is relatively low. By setting the abutment groove 1213, the abutment between the abutment plate 1212 and the electronic component 130 is achieved, and the abutment groove 1213 can be formed by a stamping process.
[0048] Furthermore, the upper shell plate 1211 may also include an avoidance groove 1214, which is formed by a portion of the upper shell plate 1211 being recessed in a direction away from the circuit board 110. It should be noted that higher components are provided on the first surface 111 of the circuit board 110, and by setting the avoidance groove 1214, avoidance of higher components is achieved.
[0049] In some embodiments of this application, please refer to Figure 3 The lower shell 1221 may further include reinforcing ribs 1222 disposed on the side of the lower shell 1221 facing the circuit board 110. The provision of the reinforcing ribs 1222 enhances the structural strength of the lower shell 1221, thereby enhancing the structural strength of the lower housing 122. Furthermore, the provision of the reinforcing ribs 1222 on the side of the lower shell 1221 facing the circuit board 110 means that the reinforcing ribs 1222 are located within the shielding space, thereby maintaining the flatness of the exterior surface of the shielding housing 120.
[0050] In some embodiments of this application, please continue to refer to Figure 3, and refer to Figure 1 The circuit board packaging box 100 may further include a connecting portion 1223, which is disposed on the outside of the shielding shell 120 and is used to fix the circuit board packaging box 100 on the vehicle frame. Specifically, the connecting portion 1223 may be disposed on the lower shell 122 and be detachably connected to the vehicle frame through bolt connection.
[0051] In some embodiments of this application, please refer to Figure 4 PCB package 100 may further include a grounding plate 160, which may be a grounding copper sheet. Grounding plate 160 is disposed on second surface 112. In a direction from first surface 111 toward second surface 112, grounding plate 160 is disposed opposite electronic component 130 and abuts grounding posts 140. Thus, grounding of PCB 110 is achieved by providing grounding plate 160.
[0052] The central axes of the contact plate 1212 , the electronic component 130 , and the grounding plate 160 may be arranged to coincide with each other.
[0053] In order to improve the thermal conductivity and heat dissipation performance, electronic shielding performance and grounding effect of the overall structure, the upper shell 121 and the lower shell 122 adopt a multi-point coupling direction on all sides, that is, the upper shell 121 and the lower shell 122 are connected by multiple contact surfaces, and each circumferential side has at least one coupling surface, thereby improving the coupling effect of the entire structure.
[0054] When the electronic component 130 generates heat, the heat is first transferred to the upper housing 121 through the elastic thermal pad 150 and the abutting plate 1212 , and then transferred to the lower housing 122 through the coupling surface, thereby increasing the heat dissipation area.
[0055] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0056] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, unless otherwise specified, "plurality" means two or more.
[0057] In the description of the embodiments of the present invention, the term "and / or" refers to and encompasses any and all possible combinations of one or more of the listed items. The term "and / or" describes an association relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in the present invention generally indicates that the associated objects are in an "or" relationship.
[0058] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that the two are connected to each other and the relative position relationship after the connection remains unchanged. In addition, the directional terms mentioned in the embodiments of the present invention, such as "inside" and "outside", etc., are only reference to the directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.
[0059] In the description of the embodiments of the present invention, the terms "comprises", "includes" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element limited by the sentence "comprises a..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In the absence of further restrictions, an element limited by the sentence "comprises a..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.
[0060] The foregoing description is intended only to provide specific embodiments of the present invention, which will enable those skilled in the art to understand and implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not intended to be limited to the embodiments described herein, but rather to be embodied in the broadest possible manner consistent with the principles and novel features disclosed herein.
Claims
1. A circuit board packaging box, characterized in that: include: a circuit board comprising a first surface and a second surface opposite to each other; an electronic component, the electronic component being disposed on the first surface; a shielding shell defining a shielding space, wherein the circuit board and the electronic component are disposed in the shielding space, the shielding shell comprising an upper shell plate and a lower shell plate, the upper shell plate being located on a side facing the first surface of the circuit board, the lower shell plate being located on a side facing the second surface of the circuit board, the upper shell plate comprising an abutting plate, the abutting plate abutting against the electronic component; A grounding post, one end of which abuts the second surface, and the other end abuts the lower shell plate, and the orthographic projection of the grounding post on the first surface is located within the orthographic projection of the electronic component on the first surface.
2. The circuit board packaging box according to claim 1, wherein: The grounding column is formed as an elastic grounding column.
3. The circuit board packaging box according to claim 1, wherein: The orthographic projection of the electronic component on the first surface is located within the orthographic projection of the abutting plate on the first surface.
4. The circuit board packaging box according to claim 1, wherein: The upper shell plate includes an abutting groove, which is formed by a portion of the upper shell plate being recessed toward the circuit board, and a bottom wall of the abutting groove is formed as the abutting plate plate.
5. The circuit board packaging box according to claim 1, wherein: include: An elastic thermal pad is sandwiched between the electronic component and the abutting plate, one end of the elastic thermal pad is thermally connected to the electronic component, and the other end is thermally connected to the abutting plate.
6. The circuit board packaging box according to claim 1, wherein: include: A grounding plate is provided on the second surface. In a direction from the first surface to the second surface, the grounding plate is arranged opposite to the electronic component and abuts against the grounding post.
7. The circuit board packaging box according to claim 1, wherein: The shielding shell includes an upper shell and a lower shell, the upper shell includes an upper shell plate, the lower shell includes a lower shell plate, and the upper shell and the lower shell are detachably connected.
8. The circuit board packaging box according to claim 7, wherein: The upper shell plate includes an avoidance groove, and the avoidance groove is formed by a portion of the upper shell plate being recessed in a direction away from the circuit board.
9. The circuit board packaging box according to claim 1, wherein: The lower shell plate comprises: A reinforcing rib is provided on a surface of the lower shell plate facing the circuit board.
10. A vehicle, characterized in that: include: The circuit board packaging box according to any one of claims 1 to 9; A vehicle frame, wherein the circuit board packaging box is arranged on the vehicle frame.