Heat dissipation device

Abstract

The utility model discloses a heat dissipation device, which comprises a plurality of heated units, a plurality of heat dissipation units, a plurality of heat dissipation units, a plurality of heat dissipation units, a plurality of heat dissipation units and a plurality of heat dissipation units, and the heat conduction seat is used for guiding out heat, and the at least two heated units can be detachably installed on the heat conduction seat and make heat conduction contact with the heat conduction seat. According to the heat dissipation device, the multiple heated units are arranged side by side in the direction perpendicular to the heated surface, so that the heated units can dissipate heat of the corresponding heat dissipation objects, and due to the fact that part of the heated units can be detached from the heat conduction base, the corresponding heated units can be detached when the corresponding heat dissipation objects are lacked. In conclusion, the heat dissipation device can effectively solve the problem that an existing heat dissipation device is poor in adaptability when heat dissipation objects are increased or decreased.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, and more particularly to a heat dissipation device. Background Art

[0002] In recent years, the electronics industry has experienced rapid development, with a wide variety of functions emerging one after another. This has led to a continuous increase in chip power and an exponential increase in heat generation. Liquid cooling has become a major development direction for electronics cooling.

[0003] Liquid cooling is the mainstream heat dissipation method for existing server platforms, but it lacks efficient heat dissipation for memory modules. Currently, liquid cooling systems sacrifice CPU cooling performance to maintain memory module cooling, and can also result in high temperatures at specific points on the memory modules. Furthermore, server platforms often have numerous memory modules, and the number of installed modules is uncertain, with the number of modules increasing or decreasing during use. This makes cooling devices less adaptable.

[0004] In the process of realizing the invention of the present utility model, the inventor discovered that there are at least the following problems in the prior art: the current heat dissipation device has poor adaptability when the number of heat dissipation objects increases or decreases. Utility Model Content

[0005] In view of this, an object of the present invention is to provide a heat dissipation device, which can effectively solve the problem that the current heat dissipation device has poor adaptability when the number of heat dissipation objects increases or decreases.

[0006] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions:

[0007] A heat dissipation device, comprising:

[0008] A heating unit, wherein the heating surface is used to receive heat from a heat dissipation object, and a plurality of the heating units are arranged in parallel in a direction perpendicular to the heating surface so as to receive heat from the corresponding heat dissipation object respectively;

[0009] The heat-conducting seat is used to conduct heat away. At least part of the heat receiving unit can be detached from the heat-conducting seat and is in thermal contact with the heat-conducting seat.

[0010] During use, since the multiple heating units are arranged side by side in a direction perpendicular to the heating surface, the spacing between adjacent heating units is adapted according to the adjacent heat dissipation targets, so that each heating unit is respectively in contact with the corresponding heat dissipation target, so that the heating surface of each heat dissipation unit and the corresponding heat dissipation target can transfer heat. After the heat is transferred to the heating unit through the heating surface, it is transferred to the heat conduction base through the heating unit, and then transferred out by the heat conduction base. In actual application, the corresponding heating unit is selected according to the heat dissipation target to achieve targeted heat dissipation. If a heating unit is damaged, the corresponding heating unit can be replaced without replacing the entire unit. In this heat dissipation device, since the multiple heating units are arranged side by side in a direction perpendicular to the heating surface, each heating unit can dissipate heat to the corresponding heat dissipation target separately. Moreover, because some heating units can be detached from the heat conduction base, the corresponding heating unit can be detached when the corresponding heat dissipation target is missing. In summary, this heat dissipation device can effectively solve the problem of poor adaptability of current heat dissipation devices when the number of heat dissipation targets increases or decreases.

[0011] In some technical solutions, the heat receiving unit is a thermal siphon unit.

[0012] In some technical solutions, the heat receiving unit is in the shape of an elongated strip, and the two heat conducting seats are respectively arranged at both ends of the heat receiving unit; the heat receiving surface is located between the two heat conducting seats.

[0013] In some technical solutions, the heat receiving unit includes a first thermally conductive film and a second thermally conductive film. The first thermally conductive film is arranged at the end to be in thermal contact with the thermal seat, and the second thermally conductive film is arranged at the heating surface to be in thermal contact with the heat dissipation object.

[0014] In some technical solutions, the medium cavity of the heating unit is divided into:

[0015] an evaporation zone, arranged corresponding to the heated surface;

[0016] A condensation chamber, arranged corresponding to the heat conducting seat;

[0017] a gas guide cavity, disposed above the evaporation zone, to guide the gas evaporated from the evaporation zone to the condensation chamber;

[0018] The guide chamber is arranged at the lower part of the condensation chamber to guide the liquid in the condensation chamber to the bottom of the evaporation zone.

[0019] In some technical solutions, the evaporation zone has a plurality of first ribs extending up and down, and the first ribs are arranged in parallel in the length direction of the heat receiving unit; the connection between the evaporation zone and the air guide cavity is separated by a plurality of second ribs arranged in parallel along the length direction of the heat receiving unit, and the second ribs are arranged along the length direction of the heat receiving unit, with gaps between adjacent second ribs.

[0020] In some technical solutions, the condensation chamber is arranged lower than the air guide chamber, and the lower part of the condensation chamber is higher than the lower part of the evaporation zone.

[0021] In some technical solutions, a plurality of mounting grooves are provided on the thermal seat, the ends of the heat receiving unit are matched with the mounting grooves, and the two sides are fitted with the walls of the mounting grooves; a guide channel is provided inside the thermal seat, and the guide channel is provided with an external interface.

[0022] In some technical solutions, a fixing member is further included, wherein the blocking portion of the fixing member blocks the notch of the installation slot to prevent the heating unit from detaching from the notch, and at least one end of the fixing member is detachably fixedly connected to the heat conducting seat.

[0023] In some technical solutions, the notch of the mounting groove faces upward, the fixing piece is in an inverted U shape, and the two ends are located on the two ends of the thermal seat and are connected by downward screws so that it can be disassembled on the upper side of the thermal seat; the thermal seat is long and strip-shaped along the vertical direction of the heated surface, and a plurality of the mounting grooves are arranged in sequence along the extension direction of the thermal seat, and the groove width direction of the mounting groove is consistent with the extension direction of the thermal seat; the guide channel extends along the extension direction of the thermal seat, and the external interface is formed at both ends; the guide channel is located on the lower side of the mounting groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 An exploded schematic diagram of a heat dissipation device provided by an embodiment of the present utility model;

[0026] Figure 2 A schematic structural diagram of a heating unit provided in an embodiment of the present utility model;

[0027] Figure 3 A schematic diagram of the explosion structure of the heating unit provided in an embodiment of the present utility model;

[0028] Figure 4 A schematic diagram of the internal structure of the heating unit provided in an embodiment of the present utility model.

[0029] The following are marked in the accompanying drawings:

[0030] Heating unit 1, heat conducting seat 2, fixing part 3, screw 4;

[0031] A first thermally conductive film 11, a second thermally conductive film 12, a bottom plate 13, a cover plate 14, and a top cover 15;

[0032] Evaporation area 16, condensation area 17, air guide cavity 18, flow guide cavity 19;

[0033] diversion channel 21;

[0034] The first rib 13 - 1 and the second rib 13 - 2 .

[0035] Figure 4 The arrows in the middle indicate the direction of internal fluid flow. DETAILED DESCRIPTION

[0036] The embodiment of the utility model discloses a heat dissipation device, which effectively solves the problem that the current heat dissipation device has poor adaptability when the heat dissipation objects are increased or decreased.

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0038] See also Figure 1-Figure 4 , Figure 1 An exploded schematic diagram of a heat dissipation device provided by an embodiment of the present utility model; Figure 2 A schematic structural diagram of a heating unit provided in an embodiment of the present utility model; Figure 3 A schematic diagram of the explosion structure of the heating unit provided in an embodiment of the present utility model; Figure 4 A schematic diagram of the internal structure of the heating unit provided in an embodiment of the present utility model.

[0039] In some embodiments, a heat sink is provided for dissipating heat from a heat sink object. For example, the heat sink object may be a memory card or other plate-like structure. Thus, the heat sink device herein may specifically be a memory heat sink, but it may also be a heat sink with an array of heat sources. Of course, in some applications, heat can also be dissipated from structures of other shapes (non-plate-like structures). The heat sink object, as used herein, refers to the heat source portion, the object from which the heat sink device dissipates heat.

[0040] In some embodiments, the heat dissipation device includes a heat receiving unit 1 and a heat conducting seat 2. The heat receiving unit 1 is used to receive heat from the heat dissipation object to achieve heat dissipation of the heat dissipation object. The heat conducting seat 2 is in thermal contact with the heat receiving unit 1 so that the heat receiving seat transfers the heat received by the heat receiving unit 1 to the heat conducting seat 2, and then the heat is transferred out by the heat conducting seat 2. The way in which the heat conducting seat 2 transfers heat out can be to conduct heat out through a heat conducting structure with a very good thermal conductivity coefficient, or it can be to carry heat out through a fluid flowing in the internal guide channel 21 during use. The heat receiving unit 1 can use a heat conductor to directly transfer heat from the heat dissipation object to the heat conducting seat 2, or it can use the internal fluid flow to transfer heat to the heat receiving unit 1.

[0041] In some embodiments, at least a portion of the heat receiving unit 1 can be detached from the heat conducting base 2. For example, the heat receiving unit 1 can be detachably mounted on the heat conducting base 2 to facilitate replacement of the heat receiving unit 1 or adjustment of the number of heat receiving units 1 installed, thereby increasing ease of use. For a heat dissipation device, when the heat receiving unit 1 is detachably mounted on the heat conducting base 2, the heat dissipation device can also be referred to as a heat dissipation device with a detachable heat receiving unit 1.

[0042] In some embodiments, the heating unit 1 can be in the shape of a plate, a block or other shapes, but the heating unit 1 at least has a heating surface to receive heat from the heat dissipation object through the heating surface. In practical applications, the heating surface generally needs to be close to the heat dissipation surface of the heat dissipation object. If the heat dissipation object is a memory card, the plate surfaces on both sides of the memory card in the thickness direction are generally the main heat dissipation surfaces, so the heating surface of the heating unit 1 is at least used to be close to one side of the plate surface of the memory card, and the heating surface is set perpendicular to the thickness direction of the memory card. It should be noted that, for the memory card, the heating unit 1 can form two relatively set heating surfaces to be close to the two side plates of the memory card respectively, but this method is more troublesome when disassembling and assembling the memory card separately; therefore, the two heat objects can also be close to the two sides of the memory card respectively. It should be noted that the heating unit 1 can have one or more heating surfaces. Generally, the heating unit 1 is a plate-shaped structure, and both sides of the plate along the thickness direction are heating surfaces. When in use, part of the heating unit 1 can be located between two memory cards, and the heating surfaces on both sides are respectively attached to the memory cards on both sides to achieve heat dissipation.

[0043] In some embodiments, it is considered that multiple heat dissipation objects are generally arranged in parallel, such as multiple memory cards are arranged in parallel. Based on this, it is preferred that multiple heat receiving units 1 are arranged in parallel along a direction perpendicular to the heating surface so that heat can be dissipated to multiple heat dissipation objects at the same time. In the direction perpendicular to the heating surface, multiple heat receiving units 1 are arranged in parallel, that is, the corresponding heating surfaces of the heat receiving units 1 are arranged in parallel in sequence to respectively abut against each heat dissipation object. When in use, the heat dissipation object is located between adjacent heat receiving units 1. When heat is required on both sides of the heat dissipation object in the direction perpendicular to the heating surface, both sides of the corresponding heat receiving unit 1 are heating surfaces, and the heat dissipation surfaces on both sides of the heat dissipation object are respectively abutted against the heat receiving units 1 on both sides to dissipate heat. When there are multiple heating surfaces in the heat receiving unit 1, only one of the heating surfaces can be the reference heating surface, and each heat receiving unit 1 is arranged in parallel in sequence along the direction perpendicular to the reference heating surface. The other heating surfaces can all be parallel to the reference heating surface, or at least some of the heating surfaces are not parallel to the reference heating surface.

[0044] At least two heat receiving units 1 can be detachably mounted on the heat conducting base 2. Generally, each heat receiving unit 1 can be detachably mounted on the heat conducting base 2. The detachable connection allows at least some of the heat receiving units 1 to be detached for easy replacement. It also facilitates adding or removing heat receiving units 1. When in use, the corresponding heat receiving units 1 can be added or removed according to the increase or decrease of heat dissipation targets, thereby making the heat conducting base 2 more targeted in heat dissipation.

[0045] In some embodiments, when in use, the spacing between adjacent heat-receiving units 1 is adapted according to the adjacent heat-receiving objects, so that each heat-receiving unit 1 is respectively abutted against the corresponding heat-receiving object, so that the heat-receiving surface and the corresponding heat-receiving object are heat-transferred, and the heat is transferred to the heat-receiving unit 1 through the heat-receiving surface, and then transferred to the heat-conducting seat 2 through the heat-receiving unit 1, and then transferred out by the heat-conducting seat 2. According to the heat-receiving objects arranged in actual applications, the corresponding heat-receiving unit 1 is selected to achieve targeted heat dissipation. When the heat-receiving unit 1 is damaged, the corresponding heat-receiving unit 1 can be replaced without replacing the entire unit. In this heat-receiving device, a plurality of the heat-receiving units 1 are arranged in parallel in a direction perpendicular to the heat-receiving surface, so that each heat-receiving unit 1 can dissipate heat to the corresponding heat-receiving object respectively, and because the heat-receiving unit 1 is detachably connected to the heat-conducting seat 2, the heat-receiving units 1 can be added or removed as needed. In summary, this heat-receiving device can effectively solve the problem that the current heat-receiving device has poor adaptability when the heat-receiving objects are added or removed.

[0046] In some embodiments, the heat receiving unit 1 can be a thermosiphon unit. Compared with direct heat conduction by a separate heat conductor, the heat conduction efficiency of the thermosiphon unit is higher. This is because the thermosiphon unit uses a fluid. The internal liquid fluid absorbs heat and evaporates, then turns into gas. The gas flows to a low-temperature, low-pressure area and condenses into liquid, which then flows to the evaporation area 16. After adopting the thermosiphon unit, the heat dissipation device can be a thermosiphon heat dissipation device. When the heat receiving unit 1 and the heat conducting base 2 are detachably connected, the heat dissipation device can be a detachable thermosiphon heat dissipation device.

[0047] When using a thermosiphon unit, the evaporation zone 16 of the thermosiphon unit should be set corresponding to the heated surface, and the condensation zone 17 should be set at the heat conducting seat 2. After the heated surface is heated, the liquid in the evaporation zone 16 evaporates to form gas to absorb heat. The generated gas flows to the condensation zone 17, transfers the heat to the heat conducting seat 2, becomes liquid, and then returns to the evaporation zone 16, thus forming an internal cycle.

[0048] It should be noted that the heat receiving unit 1 is in thermal contact with the heat conducting base 2 , that is, the fluid inside the heat receiving unit 1 does not flow to the heat conducting base 2 , and the heat receiving unit 1 forms a separate closed system.

[0049] In some embodiments, in order to facilitate heat dissipation, when the heat receiving unit 1 is in the shape of an elongated strip, two heat conducting seats 2 may be provided accordingly. In this case, the two heat conducting seats 2 are provided at both ends of the heat receiving unit 1, respectively, so as to receive heat from both ends of the heat receiving unit 1, thereby improving the outward heat transfer efficiency of the heat receiving unit 1. At the same time, because they are provided at two ends far away from each other, they will not interfere too much with the installation of the heat dissipation object. Of course, when space is limited, only one heat receiving unit 1 may be provided. In terms of the length direction of the heat receiving unit 1, the heating surface can be located between the two heat conducting seats 2. At this time, it is possible to better avoid the interference of the heat conducting seats 2 at both ends with the disassembly and assembly of the heat dissipation object in the middle.

[0050] Furthermore, the heat receiving unit 1 can be configured to have a plate-like structure corresponding to the memory stick. Accordingly, the spacing between the heat conducting bases 2 can be no less than the length of the memory stick, so that the memory stick can be installed and removed between the two heat receiving units 1 without having to remove the corresponding heat receiving unit 1.

[0051] In some embodiments, in order to ensure thermal contact between each other to ensure the thermal conductivity effect, it is preferred that the heat receiving unit 1 includes a first thermal conductive film 11 and a second thermal conductive film 12, wherein the first thermal conductive film 11 is arranged at the end to be in thermal contact with the thermal seat 2, so that the thermal conductivity efficiency can be improved through the thermal conductive film, and the second thermal conductive film 12 is arranged at the heating surface for thermal contact with the heat dissipation object to further improve the thermal conductivity efficiency. And through the detachable connection, when the first thermal conductive film 11 or the second thermal conductive film 12 is damaged, the corresponding heat receiving unit 1 can be disassembled and replaced accordingly, making film replacement more convenient.

[0052] The first thermally conductive film 11 and the second thermally conductive film 12 can both be provided with corresponding structures according to the actual required heat conduction area to facilitate heat conduction.

[0053] In some embodiments, when the heating unit 1 is a thermosiphon unit, in order to better facilitate the flow of fluid therein, the medium chamber of the heating unit 1 is preferably divided into: an evaporation chamber, a condensation chamber, an air guide chamber 18, and a flow guide chamber 19 by a partition. The main function of the partition is to guide the flow of fluid, not to isolate it. For some chambers, it is still necessary to communicate with each other to ensure the entire fluid circulation.

[0054] The evaporation area 16 is configured to correspond to the heated surface, while the condensation chamber is configured to correspond to the heat conducting base 2. The size of the evaporation area 16 should be adjusted to correspond to the heated surface, while the size of the heated surface should be adjusted to correspond to the heat dissipation surface of the heat dissipation object. Correspondingly, the size of the condensation chamber should be adjusted to correspond to the area required for heat dissipation.

[0055] A gas guide cavity 18 is provided above the evaporation zone 16 to guide the evaporated gas from the evaporation zone 16 to the condensation chamber. When two thermally conductive bases 2 are provided, two corresponding condensation zones 17 are provided. In this case, the two ends of the gas guide cavity 18 are connected to the condensation zones 17 located at their respective ends. The evaporated gas from the evaporation zone 16 rises into the gas guide cavity 18, where it is then guided laterally by the cavity walls and barriers to enter the condensation zone 17.

[0056] The guide chamber 19 is arranged at the lower part of the condensation chamber to guide the liquid in the condensation chamber to the bottom of the evaporation area 16. The liquid condensed in the condensation chamber flows downward under the action of gravity to enter the guide chamber 19. Through the guiding effect of the guide chamber 19, the liquid enters the bottom of the evaporation area 16 and then enters the evaporation area 16. When it enters the bottom of the evaporation area 16, it can avoid the gas being diverted through the guide chamber 19 and affecting the reflux of the liquid.

[0057] In some embodiments, for ease of styling, it is preferred that the evaporation region 16 include a plurality of vertically extending first ribs 13-1, each of which is arranged in parallel along the length of the heat receiving unit 1. The first ribs 13-1 may be higher than the bottom of the evaporation region 16 to facilitate the formation of a transverse flow channel at the bottom of the evaporation region 16 to connect the spaces between any adjacent first ribs 13-1. The first ribs 13-1 are arranged in parallel.

[0058] A plurality of second ribs 13-2 are provided between the connection between the evaporation area 16 and the air guide cavity 18, so that the evaporation area 16 and the air guide cavity 18 are separated by a plurality of second ribs 13-2 arranged in parallel along the length direction of the heat receiving unit 1, wherein a gap is preferably provided between the upper end of the first rib 13-1 and the second rib 13-2 to form a cavity that can be connected laterally.

[0059] Furthermore, the second ribs 13-2 can be arranged along the length direction of the heat receiving unit 1, and gaps between adjacent second ribs 13-2 can be set to form a gas channel, so that the gas between the evaporation areas 16 enters the gas guide cavity 18 through the gaps between adjacent second ribs 13-2. At this time, the second ribs 13-2 extend laterally, which can better guide the gas laterally.

[0060] In some embodiments, the condensation chamber can be arranged lower than the gas guide chamber 18, and the lower portion of the condensation chamber can be higher than the lower portion of the evaporation region 16 to better accommodate gas flow.

[0061] Specifically, the heat receiving unit 1 can include a base plate 13, a cover plate 14, and a top cover 15. The inner side wall of the base plate 13 is integrally formed with a first rib 13-1, a second rib 13-2, and a third rib. The third rib is arc-shaped, forming a flow channel between the corresponding edges of the base plate 13 to serve as a flow guide cavity 19. The cover plate 14 covers the base plate 13, and the outer side surfaces of the base plate 13 and the cover plate 14 are both heating surfaces. The top cover 15 defines an air guide cavity 18 within the top cover 15 to abut against the upper edges of the base plate 13 and the cover plate 14. The first thermally conductive rubber sheet 11 is sleeve-shaped and is mounted on the end of the structure enclosed by the base plate 13 and the cover plate 14. The second thermally conductive rubber sheet 12 is in an inverted U-shape and is mounted on the top cover 15, with its two sides extending to the outer side surfaces of the base plate 13 and the cover plate 14, respectively.

[0062] In some embodiments, a plurality of mounting grooves can be provided on the heat-conducting seat 2, wherein the end of the heat-receiving unit 1 is matched with the mounting groove, and the two sides are fitted with the walls of the mounting groove to achieve thermal contact, and can also be fixed under interference fit.

[0063] In some embodiments, a flow guide channel 21 is provided inside the heat conducting seat 2, wherein the flow guide channel 21 is provided with an external interface so as to connect to an external heat dissipation structure when in use, so that low-temperature fluid enters the heat conducting channel, absorbs heat and is then discharged.

[0064] In some embodiments, the heat receiving unit 1 and the heat conducting base 2 can be fixed by an interference fit between the end of the heat receiving unit 1 and the heat conducting base 2. However, since the interference fit is difficult to disassemble and the end is subjected to excessive pressure, it is not conducive to thermal expansion and contraction, which affects the service life. Based on this, it is preferred that a fixing member 3 is also included, wherein the blocking portion of the fixing member 3 blocks the notch of the installation slot to prevent the heat receiving unit 1 from detaching from the notch, and at least one end of the fixing member 3 is detachably fixed to the heat conducting base 2.

[0065] In some embodiments, the notch of the mounting slot can be directed upward, the fixing member 3 can be in an inverted U-shape, and the two ends can be located on the ends of the thermal base 2 and connected by downward-pointing screws 4 so that it can be removed from the upper side of the thermal base 2. Disassembly from the upper side facilitates assembly and disassembly. It should be noted that the thermal base 2 can also be provided with vertically extending through holes to facilitate the passage of the screws 4 to install the heat dissipation device on the corresponding work object, and the heat dissipation object can be detachably mounted on the work object.

[0066] The heat conducting base 2 is elongated in the vertical direction of the heated surface, and a plurality of mounting slots are arranged in sequence along the extension direction of the heat conducting base 2. The width of the mounting slots is consistent with the extension direction of the heat conducting base 2. By providing multiple mounting slots, multiple heating units 1 can be installed accordingly.

[0067] The flow guiding channel 21 extends along the extension direction of the heat conducting base 2 and has external interfaces formed at both ends, so as to facilitate the introduction of fluid from one end and the discharge of fluid from the other end.

[0068] In some embodiments, the guide channel 21 can be located at the lower side of the installation groove. In this case, the entire condensation area 17 is located at the upper side of the guide channel 21, so that the temperature of the condensation area 17 gradually decreases from top to bottom, thereby better introducing gas and discharging liquid.

[0069] In some embodiments, the thermal seat 2 can be an integral part, with multiple vertical plate portions arranged in sequence along the first direction, and mounting grooves formed between adjacent vertical plate portions. The bottoms of the multiple vertical plate portions are all integrally connected to the same long plate portion, and are vertically arranged with the long plate portion. The long plate portion is provided with a guide channel 21 that passes through along the first direction, and external interfaces are formed at both ends of the guide channel 21.

[0070] The two heat-conducting seats 2 are arranged side by side along a second direction, which is perpendicular to the first direction. During use, the heat-conducting fluid in the two heat-conducting seats 2 can flow in opposite directions to ensure that the cooling power of each heat receiving unit 1 is nearly consistent. Of course, it can also be the same.

[0071] The heating unit 1 mainly includes a cover plate 14, a bottom plate 13, a top cover 15, a first thermal conductive film 11 and a second thermal conductive film 12. The first thermal conductive film 11 is sleeved on the end and is placed against the groove walls on both sides of the installation groove to transfer heat.

[0072] The plurality of heating units 1 are arranged in parallel along a first direction, and both ends of the heating unit 1 are respectively embedded in the heating seats at both ends.

[0073] Two fixing members 3 arranged in parallel along the second direction are used at both ends to block the notch of the installation slot, wherein both ends of the fixing members 3 along the first direction are connected to the long strip portion of the heat conducting seat 2 through screws 4 extending up and down.

[0074] The memory module is located between the two heat-conducting seats 2 and between the two heat-receiving units 1 and is attached to the corresponding second heat-conducting film 12 to achieve heat transfer.

[0075] During maintenance, when replacing a memory module, the memory module can be directly placed from the top without disassembling the heating unit 1. When the heating unit 1 needs to be replaced, only the fixing member 3 needs to be removed and the corresponding heating unit 1 can be taken out.

[0076] In some embodiments, sheet metal may be soldered to the top cover 15 to transfer heat to the condensation block through the sheet metal to improve condensation efficiency.

[0077] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0078] The above description of the disclosed embodiments will enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation device, characterized in that: include: A heating unit, wherein the heating surface is used to receive heat from a heat dissipation object, and a plurality of the heating units are arranged in parallel in a direction perpendicular to the heating surface so as to receive heat from the corresponding heat dissipation object respectively; The heat-conducting seat is used to conduct heat away. At least part of the heat receiving unit can be detached from the heat-conducting seat and is in thermal contact with the heat-conducting seat.

2. The heat dissipation device according to claim 1, characterized in that: The heat receiving unit is a thermosiphon unit.

3. The heat dissipation device according to claim 2, characterized in that: The heat receiving unit is in the shape of an elongated strip, and the two heat conducting seats are respectively arranged at the two ends of the heat receiving unit; the heat receiving surface is located between the two heat conducting seats.

4. The heat dissipation device according to claim 3, characterized in that: The heat receiving unit includes a first heat conductive film and a second heat conductive film. The first heat conductive film is arranged at the end to be in heat conductive contact with the heat conductive seat, and the second heat conductive film is arranged at the heat receiving surface to be in heat conductive contact with the heat dissipation object.

5. The heat dissipation device according to claim 4, characterized in that: The medium cavity of the heating unit is divided into: an evaporation zone, arranged corresponding to the heated surface; A condensation chamber, arranged corresponding to the heat conducting seat; a gas guide cavity, disposed above the evaporation zone, to guide the gas evaporated from the evaporation zone to the condensation chamber; The guide chamber is arranged at the lower part of the condensation chamber to guide the liquid in the condensation chamber to the bottom of the evaporation zone.

6. The heat dissipation device according to claim 5, characterized in that: The evaporation zone has a plurality of first ribs extending up and down, and the first ribs are arranged in parallel in the length direction of the heat receiving unit; the connection between the evaporation zone and the air guide cavity is separated by a plurality of second ribs arranged in parallel along the length direction of the heat receiving unit, and the second ribs are arranged along the length direction of the heat receiving unit, with gaps between adjacent second ribs.

7. The heat dissipation device according to claim 6, characterized in that: The condensation chamber is arranged lower than the air guide chamber, and the lower part of the condensation chamber is higher than the lower part of the evaporation zone.

8. The heat dissipation device according to any one of claims 1 to 7, characterized in that: The heat-conducting seat is provided with a plurality of mounting grooves, the ends of the heat receiving unit are matched with the mounting grooves, and the two sides are fitted with the walls of the mounting grooves; a guide channel is provided inside the heat-conducting seat, and the guide channel is provided with an external interface.

9. The heat dissipation device according to claim 8, characterized in that: It also includes a fixing member, the blocking portion of the fixing member blocks the notch of the installation slot to prevent the heating unit from detaching from the notch, and at least one end of the fixing member is detachably fixedly connected to the heat conducting seat.

10. The heat dissipation device according to claim 9, characterized in that: The notch of the mounting slot faces upward, the fixing piece is in an inverted U shape, and the two ends are located on the two ends of the heat-conducting seat and are connected by downward screws so that it can be disassembled on the upper side of the heat-conducting seat; the heat-conducting seat is long and narrow along the vertical direction of the heated surface, and a plurality of mounting slots are arranged in sequence along the extension direction of the heat-conducting seat, and the slot width direction of the mounting slot is consistent with the extension direction of the heat-conducting seat; the guide channel extends along the extension direction of the heat-conducting seat, and the external interface is formed at both ends; the guide channel is located on the lower side of the mounting slot.

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