Heat conduction structure and electrical equipment
By setting grooves on the contact surface of the thermally conductive layer and filling the thermally conductive medium, the problem of large space and high cost of heat dissipation of power electronic equipment is solved, efficient and low-cost heat dissipation effect is achieved, and equipment maintenance is simplified.
Patent Information
- Application Number
- CN202422447058.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-10-10
AI Technical Summary
The existing power electronic equipment has large space, high cost and poor results, making it difficult to meet the heat dissipation needs of high-power equipment.
A groove is provided on the contact surface of the thermally conductive layer and filled with a heat-conducting medium to increase the contact area between the thermally conductive layer and the heating device, and use the thermally conductive medium between the thermally conductive layer and the heat-dissipating shell to transfer heat, avoiding additional occupancy of the internal space of the equipment.
Improves heat dissipation efficiency, reduces costs, and simplifies the maintenance process of equipment and reduces the risk of failure.
Smart Images
Figure CN223261825U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of equipment heat dissipation, and in particular to a heat-conducting structure and electrical equipment. Background Art
[0002] With the rapid development of industry, large-scale power electronic equipment is being used more and more widely in various industries. The power level is getting higher and higher, and the requirements for equipment size are getting higher and higher. At the same time, the equipment installation environment is becoming more and more harsh, which puts higher requirements on the environmental adaptability of the equipment.
[0003] Power electronic devices generate significant heat during operation. Device temperature is a key factor limiting their lifespan: higher device temperatures shorten their lifespan. Currently, cooling is typically achieved through air cooling and / or by increasing the heat dissipation area using thicker conductive bars. However, these methods are not ideal due to limitations in internal device space and material costs.
[0004] Therefore, in response to the above technical problems, how to provide a heat-conducting structure with good heat dissipation effect, small space occupation and low cost is a technical problem that needs to be solved by those skilled in the art. Utility Model Content
[0005] The purpose of this application is to provide a heat-conducting structure and electrical equipment, which increases the heat dissipation area of the heat-conducting layer and the heating device through the grooves on the heat-conducting layer and the heat-conducting medium cooperating with the grooves, thereby improving the heat dissipation performance; at the same time, the heat-conducting layer is located between the heating device and the heat dissipation shell, and does not occupy additional internal space of the equipment.
[0006] To achieve the above-mentioned purpose, the present application provides a heat-conducting structure, including a heat-conducting layer arranged between a heating device and a heat dissipation shell, the heat-conducting layer being provided with a first contact surface that is in contact with the heating device, the heat-conducting layer being provided with a second contact surface that is in contact with the heat dissipation shell, the first contact surface and / or the second contact surface being provided with a groove, the heat-conducting layer being provided with a heat-conducting medium, and the heat-conducting medium being filled in the groove.
[0007] Preferably, the groove includes a plurality of parallel strip grooves and a plurality of arc grooves located at the ends of the strip grooves, the cross-sections of the strip grooves and the arc grooves are U-shaped, and each of the arc grooves is connected one by one with its corresponding strip groove.
[0008] Preferably, two ends of the arc-shaped groove are respectively connected to the two strip-shaped grooves, so that the two strip-shaped grooves are connected.
[0009] Preferably, the intersection of the arc-shaped groove and the strip-shaped groove has a smooth transition, and the cross-sectional shape of any part of the strip-shaped groove is congruent with the cross-sectional shape of any part of the groove.
[0010] Preferably, the end of the groove forms a closed end located on the heat conducting medium, or / and,
[0011] The grooves are a plurality of annular grooves connected end to end.
[0012] Preferably, the coating surface of the heat-conducting layer coated with the heat-conducting medium at least covers the first contact surface and the second contact surface.
[0013] Preferably, the heat-conducting layer is a heat-dissipating ceramic sheet, and the heat-conducting medium is thermal grease.
[0014] Preferably, a limiting member is fixed on the heat dissipation shell, and the heating device is fixed on the heat dissipation shell through the limiting member. The limiting member is provided with a notch adapted to the outer contour of the heat conducting layer, and the heat conducting layer is embedded in the notch.
[0015] Preferably, the surface of the heat-conducting layer facing the heating device protrudes from the plate surface of the limiting member, or is flush with the plate surface of the limiting member.
[0016] An electrical device comprises the above-mentioned heat-conducting structure.
[0017] Compared to the above-mentioned background technology, the heat-conducting layer of the present application is located between the heating device and the heat dissipation housing. A heat-conducting medium is coated on both sides of the heat-conducting layer, and a groove is provided on the surface of the heat-conducting layer facing the heating device. The heat-conducting medium can be filled in the groove. Compared to applying the heat-conducting medium on a flat surface, the groove can increase the contact area between the heat-dissipating medium and the heat-conducting medium, thereby increasing the heat-conducting area between the heat-conducting layer and the heating device, improving the thermal conductivity, and then achieving heat dissipation of the heating device through the heat dissipation housing, with higher heat dissipation performance. At the same time, the provision of the heat-conducting layer does not occupy additional internal space of the device, allowing for quick and easy installation. Compared to the existing method of using air cooling and conductive bars to increase the heat dissipation area, the present application is more cost-effective and has more reliable performance. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.
[0019] Figure 1 A schematic diagram of the heat conduction structure provided in an embodiment of the present application;
[0020] Figure 2 This is a schematic diagram of the heat-conducting layer structure provided in an embodiment of the present application.
[0021] In the figure: 1-heating device; 2-heat conducting layer; 21-groove; 211-arc groove; 212-strip groove; 3-limiting member; 31-notch. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0023] It should be noted that in this embodiment, the directions or positional relationships indicated by "upper," "lower," "front," and "back" are based on the directions or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific direction, be constructed, or operate in a specific direction. Therefore, they should not be construed as limitations on this application. Furthermore, "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0024] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.
[0025] In related technologies, power electronic semiconductor devices have a small thermal capacity and must be protected by fast fuses in fault conditions. Fast fuses have thermal characteristics similar to those of semiconductor devices and will generate certain losses during the operation of the fuse. If this loss cannot be dissipated, the temperature of the fuse body will continue to rise until the loss conducted by the fuse and the loss generated by the fuse itself reach a balance; as the surface temperature of the fuse rises, the copper busbar joints on the surface of the fuse will be oxidized, causing the contact resistance to further increase and the loss to further increase, forming a vicious cycle until the fuse burns out.
[0026] There are usually the following solutions for heat dissipation of fuses:
[0027] Solution 1: Place the fuse at the fan outlet and force heat exchange on the fuse directly through the airflow generated by the fan drive.
[0028] Option 2: Increase the thickness of the conductive bar connected to the fuse to conduct away the heat of the fuse;
[0029] Option 3: It is a combination of Option 1 and Option 2.
[0030] The problem with option one is that it requires placing the entire fuse in a sealed air duct to ensure adequate airflow around it, or installing a fan near the fuse. However, as a circuit protection device, fuses require very high maintenance frequency, requiring ample space around the fuse to ensure quick and easy maintenance. Placing the fuse in a sealed air duct would make maintenance very difficult. Installing a fan near the fuse would not only increase the fan material cost and add control logic, but would also occupy some of the fuse maintenance space, making maintenance more difficult. Furthermore, since the fan itself is a fragile component and requires frequent maintenance, adding a fan would undoubtedly increase the system's risk of failure and the maintenance workload.
[0031] The problem with Option 2 is that it essentially dissipates the heat from the fuse through the conductive busbar, which is not ideal in actual applications for the following reasons: the conductive busbar itself is made of relatively expensive materials, and increasing or thickening it will significantly increase its cost; multiple fuses are generally installed in parallel in high-power cabinets, and the distance between them is not very large. Increasing the conductive busbar will reduce safety regulations and block some wind from blowing across the fuse surface; although thickening the conductive busbar does not directly affect safety regulations, it only increases the heat dissipation surface area of the conductive busbar, so the heat dissipation effect on the fuse is not obvious.
[0032] Based on the above situation, the present application provides a large heat-conducting structure applicable to heating devices 1 such as fuses, which improves the heat dissipation efficiency of the heating device 1, does not occupy additional internal space of the device, and is easy to install and low in cost. Of course, the above description uses a fuse as an example of the heating device 1. The scope of application of the heat-conducting structure of the present application includes but is not limited to fuses, and can also be applied to other heating devices 1 with similar thermal characteristics to fuses.
[0033] like Figure 1 As shown, in this embodiment, a heat-conducting structure is provided, including a heat-conducting layer 2 arranged between the heating device 1 and the heat-dissipating housing. The heat-conducting layer 2 has at least two surfaces, one of which serves as a first contact surface for the heat-conducting layer 2 to be attached to the heating device 1, and the other serves as a second contact surface for the heat-conducting layer 2 to be attached to the heat-dissipating housing. A thin layer of heat-conducting medium is evenly coated on the two contact surfaces of the heat-conducting layer 2, so that the heat on the heating device 1 is transferred to the heat-conducting layer 2 through the heat-conducting medium, and then transferred from the heat-conducting layer 2 to the heat-dissipating housing through the heat-conducting medium for heat dissipation.
[0034] In some embodiments, a groove 21 is provided on the first contact surface. Figure 2When the thermal conductive medium is applied to the first contact surface and / or the second contact surface of the thermal conductive layer 2, it should be filled in the groove 21 at the same time, that is, one side of the thermal conductive medium can be in contact with the heat dissipation shell, and the other side can be in contact with the thermal conductive layer 2 while also filling in the groove 21. By utilizing the groove characteristics of the groove 21, the contact area between the thermal conductive medium and the thermal conductive layer 2 is increased, that is, the heat dissipation area between the thermal conductive medium and the thermal conductive layer 2 is increased, thereby improving the efficiency of the heating device 1 in transferring heat to the thermal conductive layer 2 through the thermal conductive medium.
[0035] Specifically, compared to coating a heat-conducting medium on a planar structure, when a heat-conducting medium is coated on a plane having a groove 21, the heat-conducting medium will form a convex structure that matches the shape of the groove 21, thereby utilizing the outer wall of the convex structure to contact the inner wall of the groove 21, thereby increasing the contact area between the heat-conducting medium and the heat-conducting layer 2.
[0036] Of course, a groove 21 can also be set on the second contact surface, which will not be described in detail here. The specific setting method can be referred to the above to ensure that the contact area between the heat-conducting medium and the heat-conducting layer 2 can be increased, thereby improving the heat conduction effect between the heat-conducting layer 2 and the heat-conducting medium.
[0037] For the two contact surfaces of the above-mentioned heat-conducting layer 2, in order to ensure the uniform heat conduction effect of the heat-conducting layer 2 and avoid the situation where the local temperature of the heat-conducting layer 2 is too high, in some embodiments, the two contact surfaces of the heat-conducting layer 2 can be respectively arranged parallel to the contact surfaces of the corresponding heating device 1 and the heat dissipation shell, that is, the two contact surfaces between the heat-conducting layer 2 and the heating device 1 are arranged in parallel, and the two contact surfaces between the heat-conducting layer 2 and the heat dissipation shell are arranged in parallel, and the heat-conducting medium is evenly coated between the two contact surfaces and maintains a constant thickness.
[0038] The heating device 1 is fixed on the heat dissipation shell, which can be the outer shell of an electrical device, or other shells with heat dissipation function. There are no excessive restrictions here, and it is sufficient to ensure that the heat can be dissipated on the heat dissipation shell. The heating device 1 can press the heat conductive layer 2 onto the heat dissipation shell, thereby realizing the transfer of heat between the heat conductive layer 2-heat conductive medium-heat dissipation shell. In addition, the heat conductive layer 2 is located between the heat dissipation shell and the heating device 1, and its volume and occupied space are small. Its special position does not occupy additional space inside the equipment, making the maintenance of the heating device 1 more convenient. The heat conductive layer 2 is not a fragile device, which can reduce the risk of failure points and maintenance workload of the equipment.
[0039] In summary of the above embodiments, the heat-conducting layer 2 of the present application is located between the heating device 1 and the heat dissipation housing, a heat-conducting medium is coated on the two contact surfaces of the heat-conducting layer 2, and a groove 21 is provided on the first contact surface and / or the second contact surface. The heat-conducting medium can be filled in the groove 21. Compared with the flat coating of the heat-conducting medium, the contact area between the heat dissipation medium and the heat-conducting medium can be made larger through the groove 21, thereby increasing the heat-conducting area between the heat-conducting layer 2 and the heating device 1, improving the thermal conductivity, and then achieving heat dissipation of the heating device 1 through the heat dissipation housing, with higher heat dissipation performance. At the same time, the provision of the heat-conducting layer 2 does not take up additional internal space of the device, and can be installed quickly and conveniently. Compared with the existing method of using air cooling and conductive bars to increase the heat dissipation area, the cost of the present application is lower and the performance is more reliable.
[0040] It should be noted that the purpose of the above-mentioned groove 21 is to increase the contact area between the heat-conducting layer 2 and the heat-conducting medium, thereby increasing the heat dissipation area of the heating device 1 and the heat-conducting layer 2. As for the specific setting of the groove 21, there can be many ways, such as strip grooves 212, arc grooves 211, annular grooves, etc. with different shapes and distribution methods, which will not be described in detail here.
[0041] In some embodiments, please refer to Figure 2 The groove 21 includes a plurality of parallel strip grooves 212 and a plurality of arc grooves 211 located at the ends of the strip grooves 212. The cross-sections of the strip grooves 212 and the arc grooves 211 are both U-shaped, and the arc grooves 211 can be connected to the strip grooves 212, so that the heat-conducting medium can flow in the arc grooves 211 and the strip grooves 212 when applied, and then evenly fill the groove 21.
[0042] Specifically, the strip groove 212 and the arc groove 211 can form a serpentine groove 21, and the two ends of the arc groove 211 are respectively connected to the two strip grooves 212 so that the two strip grooves 212 are connected, that is, the groove 21 has two ends, and the ends of the groove 21 form closed ends located on the heat-conducting medium, so that the heat-conducting medium is subject to certain restrictions at the ends of the groove 21, preventing the heat-conducting medium from overflowing from the ends of the groove 21.
[0043] Alternatively, the groove 21 is a plurality of annular grooves connected end to end, so that the heat conducting medium can flow in the annular grooves and the heat conducting medium can be prevented from overflowing from the ends of the groove 21 .
[0044] It should be noted that, regardless of the above-mentioned strip grooves 212, arc grooves 211 or annular grooves, the number can be set to multiple and distributed on the heat-conducting layer 2 in a certain regularity. For example, the grooves 21 are evenly distributed in a periodic manner, so that the heat on the heating device 1 can be evenly transferred to the heat-conducting layer 2 through the heat-conducting medium, avoiding local thermal conductivity differences in the heat-conducting layer 2.
[0045] Furthermore, for the groove 21 formed by the strip groove 212 and the arcuate groove 211, the intersection of the arcuate groove 211 and the strip groove 212 should have a smooth transition so that the heat-conducting medium can flow smoothly within the groove 21. At the same time, the cross-sectional shape of any portion of the strip groove 212 is congruent with the cross-sectional shape of any portion of the arcuate groove 211. Congruence here means that the cross-sectional shape of the rectangular groove and the cross-sectional shape of the arcuate groove 211 are identical and of equal size, so that the contact area of the heat-conducting medium within the strip groove 212 and the arcuate groove 211 is the same, thereby enabling the heat-conducting medium to uniformly transfer heat to the heat-conducting layer 2.
[0046] To ensure that the heat of the heating device 1 can be fully transferred to the heat-conducting layer 2 through the heat-conducting medium, the surface of the heat-conducting layer 2 facing the heating device 1 is greater than or equal to the contact surface of the heating device 1. At the same time, the coated surface of the heat-conducting layer 2 coated with the heat-conducting medium covers at least the first contact surface and the second contact surface, thereby ensuring that the contact surface between the heat-conducting layer 2 and the heating device 1 can be fully in contact with the heat-conducting medium, thereby achieving sufficient heat transfer.
[0047] In addition, the heat conducting layer 2 can be made of a material with good thermal conductivity, such as a heat dissipation ceramic sheet, and the heat conducting medium also has good thermal conductivity, such as thermal conductive silicone grease.
[0048] Please refer to Figure 1 , a limiting member 3 is also fixed on the heat dissipation shell, and the heating device 1 is fixed on the heat dissipation shell through the limiting member 3. A notch 31 that matches the outer contour of the heat-conducting layer 2 is opened on the limiting member 3, and the heat-conducting layer 2 is embedded in the notch 31, so that the heat-conducting layer 2 is easier to fix, and the heating device 1 can be pressed against the heat-conducting layer 2 conveniently and quickly. For example, the limiting member 3 can be an epoxy board with flat surfaces on both sides, and the surface of the heat-conducting layer 2 facing the heating device 1 protrudes from the board surface of the limiting member 3, or is flush with the board surface of the limiting member 3, so as to ensure that the surface of the heating device 1 can contact with the heat-conducting layer 2; the epoxy board is fixed to the heat dissipation shell through the insulating column, and the heat-conducting layer 2 is coated with an appropriate amount of heat-conducting medium on both sides and then placed in the corresponding notch 31 of the epoxy board, and then the heating device 1 is aligned with the hole of the insulating column and quickly tightened and fixed by bolts, so that the surface of the heating device 1 can be fully pressed and contacted with the heat-conducting layer 2.
[0049] The present application also provides an electrical device, which includes the above-mentioned heat-conducting structure, so the electrical device also has all the advantages of the above-mentioned heat-conducting structure.
[0050] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.
[0051] This document uses specific examples to illustrate the principles and implementation methods of this application. The description of the above examples is only intended to help understand the method and core ideas of this application. It should be noted that for those skilled in the art, without departing from the principles of this application, various improvements and modifications can be made to this application, and such improvements and modifications also fall within the scope of protection of the claims of this application.
Claims
1. A heat-conducting structure, characterized in that: The invention comprises a heat-conducting layer (2) provided between a heating device (1) and a heat-dissipating housing, wherein the heat-conducting layer (2) is provided with a first contact surface affixed to the heating device (1), and the heat-conducting layer (2) is provided with a second contact surface affixed to the heat-dissipating housing, wherein the first contact surface and / or the second contact surface are provided with a groove (21), and a heat-conducting medium is provided on the heat-conducting layer (2), and the heat-conducting medium is filled in the groove (21).
2. The heat conducting structure according to claim 1, characterized in that: The groove (21) comprises a plurality of parallel strip grooves (212) and a plurality of arc grooves (211) located at the ends of the strip grooves (212). The cross sections of the strip grooves (212) and the arc grooves (211) are U-shaped, and each of the arc grooves (211) is connected one by one to the corresponding strip groove (212).
3. The heat conducting structure according to claim 2, characterized in that: The two ends of the arc-shaped groove (211) are respectively connected to the two strip-shaped grooves (212), so that the two strip-shaped grooves (212) are connected.
4. The heat conducting structure according to claim 2, characterized in that: The intersection of the arc-shaped groove (211) and the strip-shaped groove (212) is smoothly transitioned, and the cross-sectional shape of any part of the strip-shaped groove (212) is congruent with the cross-sectional shape of any part of the arc-shaped groove (211).
5. The heat conducting structure according to claim 1, characterized in that: The end of the groove (21) forms a closed end located on the heat-conducting medium, or / and, The grooves (21) are a plurality of annular grooves connected end to end.
6. The heat conducting structure according to claim 1, characterized in that: The coating surface of the heat-conducting layer (2) coated with the heat-conducting medium at least covers the first contact surface and the second contact surface.
7. The heat-conducting structure according to claim 1, characterized in that: The heat-conducting layer (2) is a heat-dissipating ceramic sheet, and the heat-conducting medium is heat-conducting silicone grease.
8. The heat conducting structure according to claim 1, characterized in that: A limiting member (3) is fixedly provided on the heat dissipation housing, and the heating device (1) is fixedly provided on the heat dissipation housing via the limiting member (3). A notch (31) adapted to the outer contour of the heat conducting layer (2) is provided on the limiting member (3), and the heat conducting layer (2) is embedded in the notch (31).
9. The heat conducting structure according to claim 8, characterized in that: The surface of the heat-conducting layer (2) facing the heating device (1) protrudes from the plate surface of the limiting component (3), or is flush with the plate surface of the limiting component (3).
10. An electrical device, characterized in that: The heat-conducting structure comprises the heat-conducting structure according to any one of claims 1 to 9.