5G mainboard with good shielding effect

Abstract

The utility model relates to the technical field of 5G mainboards, and provides a 5G mainboard with a good shielding effect, the 5G mainboard comprises a mainboard support and a mounting hole, the mainboard support comprises the mounting hole, a mainboard body, a connecting plate, a connecting structure, a heat dissipation structure and a buffer structure, and the mounting hole is arranged at the edge position in the mainboard support. According to the utility model, the connecting structure is arranged, the shielding cover is installed at the top end of the mainboard body, the fixed block is pressed to drive the bolt to be inserted into the internal cavity under the action of the reset plate and the reset spring, and the second wedge-shaped block is extruded in the insertion process of the first wedge-shaped block, so that the telescopic spring is compressed; the first wedge-shaped block is arranged in the built-in cavity, so that the first wedge-shaped block forms a clamping structure in the built-in cavity, the shielding cover can be conveniently and rapidly mounted and dismounted, electromagnetic interference can be well isolated by arranging the shielding cover, key components on the mainboard body are protected against interference of external electromagnetic signals, and meanwhile heat dissipation is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of 5G motherboards, and in particular to a 5G motherboard with good shielding effect. Background Art

[0002] A 5G motherboard is one that supports 5G network capabilities. These motherboards are typically equipped with dedicated 5G network cards or modules to enable high-speed wireless communication. A 5G motherboard with excellent shielding is a key hardware component specifically designed to effectively block or reduce electromagnetic interference. With the widespread adoption of 5G technology, higher requirements are being placed on the electromagnetic shielding of electronic devices. Therefore, selecting a 5G motherboard with excellent shielding becomes particularly important.

[0003] The existing 5G motherboard is not convenient for shielding external electromagnetic signals during use, which makes it impossible for the 5G motherboard to bring higher frequencies and stronger signals. It is also inconvenient to disassemble and assemble the shielding cover, which can easily damage electronic components. Utility Model Content

[0004] The purpose of the utility model is to provide a 5G motherboard with good shielding effect, so as to solve the defect that the existing 5G motherboard is not easy to shield.

[0005] In order to solve the above technical problems, the present utility model provides the following technical solutions: a 5G motherboard with good shielding effect, comprising a motherboard bracket and a mounting hole;

[0006] The motherboard bracket includes a mounting hole, a motherboard body, a connecting plate, a connecting structure, a heat dissipation structure, and a buffer structure. The mounting hole is provided at an edge position inside the motherboard bracket, and the motherboard body is installed on the top of the motherboard bracket.

[0007] Connecting plates are fixed at the outer edge of the mainboard body, and a connecting structure is installed at the top of the mainboard body;

[0008] A heat dissipation structure is installed at the top of the mainboard body inside the connection structure, and a buffer structure is installed at the edge of the top of the mainboard bracket.

[0009] Preferably, the connecting structure includes a shielding cover, a built-in cavity, a connecting groove, a latch, a reset plate, a reset spring, a fixed block, a first wedge block, a telescopic spring and a second wedge block. The shielding cover is installed at the top of the mainboard body, and the edge position inside the shielding cover is provided with a built-in cavity, the interior of the connecting plate is provided with a connecting groove, the interior of the connecting groove is provided with a latch, the outside of the latch at one end of the connecting groove is provided with a reset plate, one end of the reset plate outside the latch is provided with a reset spring, one end of the latch is fixed with a fixed block, the other end of the latch is fixed with a first wedge block, telescopic springs are fixed on both sides of the interior of the built-in cavity, and one end of the telescopic spring is fixed with a second wedge block.

[0010] Preferably, four groups of built-in cavities are provided, and the built-in cavities are distributed at equal intervals at the edge positions inside the shielding cover. The built-in cavities correspond one-to-one to the connecting grooves, and the latch and the reset plate form a telescopic structure through a reset spring. One end of the latch passes through one end of the connecting groove and extends to the interior of the built-in cavity and is fixedly connected to the bottom end of the first wedge block. Two groups of telescopic springs are provided, and the telescopic springs are symmetrically distributed on both sides of the built-in cavity.

[0011] Preferably, the heat dissipation structure includes a mounting shell, a cooling fan, a heat absorbing plate and a heat conducting hole. The mounting shell is installed at the edge position of the top of the mainboard bracket. A cooling fan is installed inside the mounting shell. A heat absorbing plate is fixed to the bottom end of the shielding cover, and a heat conducting hole is provided at the top of the shielding cover.

[0012] Preferably, four groups of the mounting shells are provided, and the mounting shells are evenly spaced on the top of the mainboard bracket; several groups of the heat conducting holes are provided, and the heat conducting holes are evenly spaced on the top of the shielding cover.

[0013] Preferably, the buffer structure includes a rubber pad, a slot, a fixed sleeve, a movable rod, a pressure plate and a buffer airbag. The rubber pad is fixed at the middle position of the top of the mainboard bracket, a slot is provided at the edge position of the bottom end of the mainboard body, a fixed sleeve is fixed at the edge position of the top end of the mainboard bracket on one side of the mounting shell, a movable rod is installed inside the fixed sleeve, a pressure plate is fixed at the bottom end of the movable rod, and a buffer airbag is installed at the bottom end of the pressure plate inside the fixed sleeve.

[0014] Preferably, the top end of the rubber pad contacts the bottom end of the mainboard body, the top end of the movable rod forms a snap-fit ​​structure with the inside of the slot, and the movable rod and the fixed sleeve form a telescopic structure via a buffer airbag.

[0015] The utility model provides a 5G motherboard with good shielding effect, which has the following advantages:

[0016] By providing a connection structure, by installing the shield cover on the top of the mainboard body, pressing the fixed block to drive the latch to be inserted into the interior of the built-in cavity through the action of the reset plate and the reset spring, and at the same time, during the insertion of the first wedge block, the second wedge block is squeezed to compress the telescopic spring, thereby forming a locking structure inside the built-in cavity, thereby facilitating the rapid installation and removal of the shield cover. By providing the shield cover, electromagnetic interference can be effectively isolated, and key components on the mainboard body can be protected from interference from external electromagnetic signals, while also facilitating heat dissipation.

[0017] By providing a heat dissipation structure, the heat dissipation fan is started to dissipate heat from the mainboard body, and at the same time, the heat is absorbed by the mainboard body inside the shield through the heat absorbing plate, so that the hot air is dissipated outward through the heat conduction holes, thereby allowing the hot air on the mainboard body to be dissipated quickly, facilitating heat dissipation and achieving good heat dissipation effect;

[0018] By providing a buffer structure, the movable rod and the card slot form a locking structure, and then the mainboard body is installed on the top of the mainboard bracket. At the same time, by providing a rubber pad, the mainboard body is provided with a stable support and protection function. At the same time, when the mainboard body is subjected to external impact, the movable rod is driven to move downward so that the pressure plate compresses the buffer airbag, thereby causing the buffer airbag to undergo elastic deformation, weakening the external impact, thereby protecting the mainboard body and avoiding damage to components on the mainboard body. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0020] Figure 2 This is a schematic diagram of the front cross-sectional structure of the present utility model;

[0021] Figure 3 For the utility model Figure 2 A in the middle is an enlarged structural diagram;

[0022] Figure 4 This is a schematic diagram of the cross-sectional structure of the main board body of the utility model from a top view;

[0023] Figure 5 This is a schematic diagram of the cross-sectional structure of the mainboard bracket of the present invention when viewed from above.

[0024] Explanation of the reference numerals in the figure: 1. mainboard bracket; 101. mounting hole; 102. mainboard body; 103. connecting plate; 104. connecting structure; 1041. shielding cover; 1042. built-in cavity; 1043. connecting groove; 1044. latch; 1045. reset plate; 1046. reset spring; 1047. fixing block; 1048. first wedge block; 1049. telescopic spring; 10410. second wedge block; 105. heat dissipation structure; 1051. mounting shell; 1052. cooling fan; 1053. heat absorbing plate; 1054. heat conducting hole; 106. buffer structure; 1061. rubber pad; 1062. card slot; 1063. fixing sleeve; 1064. movable rod; 1065. pressure plate; 1066. buffer airbag. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] See also Figure 1-5 The utility model provides a 5G motherboard with good shielding effect, including a motherboard bracket 1 and a mounting hole 101.

[0027] Reference Figure 1-Figure 4As shown, the motherboard bracket 1 includes a mounting hole 101, a motherboard body 102, a connecting plate 103, a connecting structure 104, a heat dissipation structure 105 and a buffer structure 106. The mounting hole 101 is set at the edge position inside the motherboard bracket 1. The motherboard body 102 is installed on the top of the motherboard bracket 1. The edge position of the outer side of the motherboard body 102 is fixed with a connecting plate 103. The top of the motherboard body 102 is installed with a connecting structure 104. The connecting structure 104 includes a shielding cover 1041, a built-in cavity 1042, connecting groove 1043, latch 1044, reset plate 1045, reset spring 1046, fixed block 1047, first wedge block 1048, telescopic spring 1049 and second wedge block 10410, shielding cover 1041 is installed on the top of main board body 102, and the edge position of shielding cover 1041 is provided with built-in cavity 1042, the interior of connecting plate 103 is provided with connecting groove 1043, the interior of connecting groove 1043 is provided with latch 1044, connecting groove A reset plate 1045 is installed on the outside of the latch 1044 at one end of 1043, and a reset spring 1046 is installed on one end of the reset plate 1045 on the outside of the latch 1044. A fixing block 1047 is fixed to one end of the latch 1044, and a first wedge-shaped block 1048 is fixed to the other end of the latch 1044. Telescopic springs 1049 are fixed on both sides of the internal cavity 1042, and a second wedge-shaped block 10410 is fixed to one end of the telescopic spring 1049. The internal cavity 1042 is provided with four groups, and the internal cavity 104 The inner edges of the shielding cover 1041 are evenly spaced, and the built-in cavities 1042 correspond to the connecting slots 1043 one-to-one. The latch 1044 and the reset plate 1045 form a telescopic structure via a reset spring 1046. One end of the latch 1044 passes through one end of the connecting slot 1043 and extends into the inner cavity 1042, where it is fixedly connected to the bottom end of the first wedge-shaped block 1048. Two sets of telescopic springs 1049 are provided, and the telescopic springs 1049 are symmetrically distributed on both sides of the built-in cavity 1042.

[0028] By installing the shielding cover 1041 on the top of the main board body 102, pressing the fixing block 1047 to drive the pin 1044 to be inserted into the interior of the built-in cavity 1042 under the action of the reset plate 1045 and the reset spring 1046, and at the same time, during the insertion of the first wedge block 1048, the second wedge block 10410 is squeezed so that the telescopic spring 1049 is compressed, and then the first wedge block 1048 forms a locking structure inside the built-in cavity 1042, thereby facilitating the quick installation and disassembly of the shielding cover 1041. By setting the shielding cover 1041, electromagnetic interference can be well isolated, and the key components on the main board body 102 can be protected from interference from external electromagnetic signals, while also helping to dissipate heat.

[0029] Reference Figure 2 and Figure 5As shown, a heat dissipation structure 105 is installed at the top of the motherboard body 102 inside the connection structure 104. The heat dissipation structure 105 includes a mounting shell 1051, a cooling fan 1052, a heat absorbing plate 1053 and heat conducting holes 1054. The mounting shell 1051 is installed at the edge of the top of the motherboard bracket 1. The cooling fan 1052 is installed inside the mounting shell 1051. The heat absorbing plate 1053 is fixed to the bottom end of the shielding cover 1041. The top of the shielding cover 1041 is provided with heat conducting holes 1054. Four groups of mounting shells 1051 are provided, and the mounting shells 1051 are evenly spaced at the top of the motherboard bracket 1. Several groups of heat conducting holes 1054 are evenly spaced at the top of the shielding cover 1041.

[0030] The cooling fan 1052 is started to dissipate heat from the main board body 102. At the same time, the heat is absorbed by the main board body 102 inside the shielding cover 1041 through the heat absorbing plate 1053, so that the hot air is dissipated outward through the heat conducting hole 1054. As a result, the hot air on the main board body 102 can be dissipated quickly, which is convenient for heat dissipation and has a good heat dissipation effect.

[0031] Reference Figure 3 and Figure 5 As shown, a buffer structure 106 is installed at the edge of the top of the motherboard bracket 1. The buffer structure 106 includes a rubber pad 1061, a card slot 1062, a fixed sleeve 1063, a movable rod 1064, a pressure plate 1065 and a buffer airbag 1066. The rubber pad 1061 is fixed at the middle position of the top of the motherboard bracket 1. The card slot 1062 is provided at the edge of the bottom end of the motherboard body 102. The fixing sleeve is fixed at the edge of the top of the motherboard bracket 1 on one side of the mounting shell 1051. Tube 1063, a movable rod 1064 is installed inside the fixed sleeve 1063, a pressure plate 1065 is fixed to the bottom end of the movable rod 1064, a buffer airbag 1066 is installed at the bottom end of the pressure plate 1065 inside the fixed sleeve 1063, the top end of the rubber pad 1061 is in conflict with the bottom end of the main board body 102, the top end of the movable rod 1064 and the inside of the card slot 1062 form a locking structure, and the movable rod 1064 and the fixed sleeve 1063 form a telescopic structure through the buffer airbag 1066.

[0032] By forming a locking structure between the movable rod 1064 and the card slot 1062, the mainboard body 102 is installed on the top of the mainboard bracket 1. At the same time, by providing the rubber pad 1061, the mainboard body 102 is provided with a stable support and protection. At the same time, when the mainboard body 102 is subjected to external impact, the movable rod 1064 is driven to move downward so that the pressure plate 1065 compresses the buffer airbag 1066, thereby causing the buffer airbag 1066 to undergo elastic deformation, weakening the external impact, thereby protecting the mainboard body 102 and preventing damage to the components on the mainboard body 102.

[0033] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A 5G motherboard with good shielding effect, comprising a motherboard bracket (1) and a mounting hole (101); Its characteristics are: The motherboard bracket (1) comprises a mounting hole (101), a motherboard body (102), a connecting plate (103), a connecting structure (104), a heat dissipation structure (105) and a buffer structure (106); the mounting hole (101) is arranged at an edge position inside the motherboard bracket (1); and the motherboard body (102) is mounted on the top end of the motherboard bracket (1); Connecting plates (103) are fixed at the outer edge of the mainboard body (102), and a connecting structure (104) is installed at the top of the mainboard body (102); A heat dissipation structure (105) is installed at the top of the mainboard body (102) inside the connection structure (104), and a buffer structure (106) is installed at the edge of the top of the mainboard bracket (1).

2. A 5G motherboard with good shielding effect according to claim 1, characterized in that: The connecting structure (104) includes a shielding cover (1041), a built-in cavity (1042), a connecting groove (1043), a latch (1044), a reset plate (1045), a reset spring (1046), a fixing block (1047), a first wedge block (1048), a telescopic spring (1049) and a second wedge block (10410). The shielding cover (1041) is installed on the top of the main board body (102). The edge position of the shielding cover (1041) is provided with a built-in cavity (1042). The connecting plate (103) is provided with a connecting groove (1043). The connecting groove A latch (1044) is installed inside (1043), a reset plate (1045) is installed on the outside of the latch (1044) at one end of the connecting groove (1043), a reset spring (1046) is installed on one end of the reset plate (1045) outside the latch (1044), a fixed block (1047) is fixed to one end of the latch (1044), a first wedge block (1048) is fixed to the other end of the latch (1044), telescopic springs (1049) are fixed on both sides of the interior of the built-in cavity (1042), and a second wedge block (10410) is fixed to one end of the telescopic spring (1049).

3. A 5G motherboard with good shielding effect according to claim 2, characterized in that: The built-in cavities (1042) are provided with four groups, and the built-in cavities (1042) are distributed at equal intervals at the edge position inside the shielding cover (1041). The built-in cavities (1042) correspond to the connecting grooves (1043) one by one. The latch (1044) and the reset plate (1045) form a telescopic structure through the reset spring (1046). One end of the latch (1044) passes through one end of the connecting groove (1043) and extends to the interior of the built-in cavity (1042) and is fixedly connected to the bottom end of the first wedge block (1048). The telescopic springs (1049) are provided with two groups, and the telescopic springs (1049) are symmetrically distributed on both sides of the built-in cavity (1042).

4. A 5G motherboard with good shielding effect according to claim 2, characterized in that: The heat dissipation structure (105) comprises a mounting shell (1051), a heat dissipation fan (1052), a heat absorbing plate (1053) and a heat conduction hole (1054); the mounting shell (1051) is mounted at the edge of the top end of the mainboard bracket (1); the heat dissipation fan (1052) is mounted inside the mounting shell (1051); the heat absorbing plate (1053) is fixed at the bottom end of the shielding cover (1041); and the heat conduction hole (1054) is provided at the top end of the shielding cover (1041).

5. A 5G motherboard with good shielding effect according to claim 4, characterized in that: The mounting shells (1051) are provided in four groups, and the mounting shells (1051) are distributed at equal intervals on the top of the mainboard bracket (1); the heat conduction holes (1054) are provided in several groups, and the heat conduction holes (1054) are distributed at equal intervals on the top of the shielding cover (1041).

6. A 5G motherboard with good shielding effect according to claim 4, characterized in that: The buffer structure (106) comprises a rubber pad (1061), a slot (1062), a fixed sleeve (1063), a movable rod (1064), a pressure plate (1065) and a buffer airbag (1066); the rubber pad (1061) is fixed at the middle position of the top of the mainboard bracket (1); the slot (1062) is provided at the edge position of the bottom end of the mainboard body (102); the fixed sleeve (1063) is fixed at the edge position of the top end of the mainboard bracket (1) on one side of the mounting shell (1051); the movable rod (1064) is installed inside the fixed sleeve (1063); the bottom end of the movable rod (1064) is fixed with a pressure plate (1065); and the bottom end of the pressure plate (1065) inside the fixed sleeve (1063) is installed with a buffer airbag (1066).

7. A 5G motherboard with good shielding effect according to claim 6, characterized in that: The top end of the rubber pad (1061) contacts the bottom end of the main board body (102), the top end of the movable rod (1064) and the inside of the slot (1062) form a snap-fit ​​structure, and the movable rod (1064) and the fixed sleeve (1063) form a telescopic structure through the buffer airbag (1066).

Images