Solder paste dipping device for probe welding and probe welding equipment

Abstract

The utility model discloses a probe welding solder paste dipping device and probe welding equipment, comprising a solder paste disc moving mechanism, the solder paste disc moving mechanism is provided with a solder paste loading mechanism and a solder paste recovery mechanism which are in the same direction, and the solder paste recovery device is located at the end part of the solder paste loading mechanism. A plurality of solder paste loading containers are arranged on the solder paste loading mechanism at intervals, a solder paste quantifying mechanism and a solder paste injecting mechanism are arranged on one side of the solder paste recycling mechanism, and the solder paste quantifying mechanism and the solder paste injecting mechanism are respectively connected with a lifting driving mechanism; and a quantitative scraping blade of the solder paste quantitative mechanism is positioned above a recovery cavity arranged on the solder paste recovery mechanism. According to the utility model, the problem of non-uniform tin paste dipping of the probe before welding is solved.

Description

Technical Field

[0001] The utility model belongs to the field of probe laser welding, specifically a probe welding solder paste dipping device and a probe welding equipment, which are mainly used for probe welding of wafer test probe cards. The function is to dip the probe into solder paste before welding to ensure welding accuracy and reliability. Background Art

[0002] During the probe welding process of the wafer test probe card, in order to ensure the cleanliness of the welding pad and facilitate the precise positioning of the pad and the control of the welding height, the pad itself cannot be coated with solder paste. Instead, soldering is performed by dipping the probe in solder paste.

[0003] Controlling the amount of solder paste dipped into the probe before soldering has a great influence on the soldering accuracy. Too much solder paste will overflow from the pad during soldering, and the probe will be deformed due to the large heated area. Too little solder paste will not make the soldering firm enough. Summary of the Invention

[0004] The purpose of the utility model is to provide a probe welding solder paste dipping device and a probe welding equipment to solve the problem of uneven solder paste dipping of the probe before welding.

[0005] According to one aspect of the utility model specification, a probe welding solder paste dipping device is provided, including a solder paste tray moving mechanism, the solder paste tray moving mechanism is provided with a unidirectional solder paste loading mechanism and a solder paste recovery mechanism, the solder paste recovery device is located at the end of the solder paste loading mechanism, the solder paste loading mechanism is provided with a plurality of spaced solder paste loading containers, a solder paste quantitative mechanism and a solder paste injection mechanism are provided on one side of the solder paste recovery mechanism, the solder paste quantitative mechanism and the solder paste injection mechanism are respectively connected to a lifting drive mechanism, and the quantitative scraper of the solder paste quantitative mechanism is located above the recovery cavity configured by the solder paste recovery mechanism.

[0006] As a further technical solution, the device includes a support frame, and the solder paste tray moving mechanism is installed on the support frame to drive the solder paste tray to move in a directional manner.

[0007] As a further technical solution, a fixing seat is provided on one side of the support frame, two lifting drive mechanisms are provided on the fixing seat, and the fixing seat is also fixed with a solder paste injection mechanism through a fixing block.

[0008] As a further technical solution, the solder paste injection mechanism includes a solder paste injection storage tube, and the solder paste injection storage tube is connected to the first lifting drive mechanism.

[0009] As a further technical solution, the solder paste quantitative mechanism includes a quantitative scraper, and the quantitative scraper is connected to the second lifting drive mechanism.

[0010] As a further technical solution, the height of the solder paste loading container is adjustable.

[0011] As a further technical solution, the arrangement direction of the plurality of spaced-apart solder paste loading containers is parallel to the moving direction of the solder paste tray.

[0012] As a further technical solution, the device further includes a probe posture correction mechanism, and a probe correction clamping mechanism is connected above the probe posture correction mechanism.

[0013] As a further technical solution, the probe posture correction mechanism includes a rotating platform and a rotation driving mechanism for driving the rotating platform to rotate.

[0014] According to one aspect of the present invention, a probe welding device is provided, which is equipped with the probe welding solder paste dipping device.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] The utility model first injects solder paste into the solder paste loading container through the solder paste injection mechanism, and then scrapes excess solder paste into the recovery cavity of the solder paste recovery mechanism through the solder paste quantitative scraper, so that the solder paste capacity of each solder paste loading container is basically the same, and the cutting height is also basically the same, ensuring that each dipping position can dip a fixed amount of dipping glue; the solder paste moving mechanism drives the solder paste loading mechanism and the solder paste recovery mechanism to move in a directional manner, so as to scrape off excess solder paste and make the scraped excess solder paste fall into the recovery cavity; at the same time, by coordinating multiple solder paste loading containers with each probe corresponding to a dipping position, the dipping position switching is controlled, so that the probe can dip a precise amount of solder paste from the same container each time, solving the problem of uneven solder paste dipping of the probe before welding, avoiding the situation in which the solder paste dipping amount cannot be accurately controlled due to the fixed solder paste dipping position or the change of the solder paste dipping depth during the solder paste dipping process, and ensuring the quality of the probe during the welding process.

[0017] The utility model performs probe posture correction before dipping in glue, ensures that the probes are lowered in the same posture to dip in solder paste, and realizes that each probe dips in the same amount of solder paste. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall structure of a probe welding solder paste dipping device provided in an embodiment of the present invention.

[0019] Figure 2 A schematic diagram of the structure of probe solder paste loading and quantification provided in an embodiment of the utility model.

[0020] Figure 3 A schematic diagram of a solder paste loading container provided in an embodiment of the present invention.

[0021] Figure 4 This is a structural diagram of the probe clamping mechanism provided in an embodiment of the present utility model.

[0022] Figure: 10, solder paste injection system; 20, solder paste loading mechanism; 30, solder paste dosing mechanism; 40, solder paste tray moving mechanism; 50 - probe clamping mechanism; 60, probe posture correction mechanism; 70, solder paste recovery device;

[0023] 2-1. Solder paste injection storage tube; 2-2. Solder paste storage tube fixing block; 2-3. Solder paste dosing scraper lifting and driving mechanism; 2-4. Solder paste storage tube lifting and driving mechanism; 2-5. Lifting mechanism fixing seat; 2-6. Solder paste tray Y-axis; 2-7. Solder paste loading container fixing frame; 2-8. Probe posture correction laser; 2-9. Solder paste recovery device; 2-10. Probe correction clamping mechanism; 2-11. Solder paste loading container; 2-12. Solder paste dosing scraper;

[0024] 4-1. Gripper lifting shaft; 4-2. Gripper angle adjustment mechanism fixing plate; 4-3. Gripper angle adjustment mechanism; 4-4. Gripper clamping and pushing cylinder; 4-5. Movable gripper fixing plate; 4-6. Fixed gripper fixing plate; 4-7. Probe gripper. DETAILED DESCRIPTION

[0025] The following is a clear and complete description of the technical solution of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] When defining directions for the purpose of clearly describing the embodiments of the present invention, the X direction mentioned in the specification may be a direction parallel to the horizontal plane, and the Y direction may be a direction perpendicular to the horizontal plane.

[0027] The present invention provides a probe welding device for dipping solder paste, such as Figure 1As shown, it includes: a solder paste tray moving mechanism, the solder paste tray moving mechanism is provided with a solder paste loading mechanism and a solder paste recovery mechanism in the same direction, the solder paste recovery device is located at the end of the solder paste loading mechanism, the solder paste loading mechanism is provided with multiple solder paste loading containers arranged at intervals, and one side of the solder paste recovery mechanism is provided with a solder paste quantitative mechanism and a solder paste injection mechanism, the solder paste quantitative mechanism and the solder paste injection mechanism are respectively connected to a lifting drive mechanism, and the quantitative scraper of the solder paste quantitative mechanism is located above the recovery cavity configured by the solder paste recovery mechanism. The solder paste tray moving mechanism, the solder paste quantitative mechanism, and the solder paste injection mechanism are also connected to a control mechanism for controlling the movement of the solder paste tray, driving the quantitative scraper to scrape off excess solder paste, and controlling the injection of solder paste into the loading container.

[0028] Reference Figure 1 and Figure 2 The solder paste moving mechanism includes a Y-axis moving shaft for the solder paste tray, which is mounted on a support frame and is used to drive the solder paste tray to move in the Y direction. For example, when solder paste needs to be injected, the Y-axis moving shaft of the solder paste tray is driven to move, driving the solder paste loading container close to the injection port, and at the same time, the solder paste injection mechanism is driven down to inject the solder paste into the solder paste loading container. After one loading container is injected, the moving shaft is driven to move one container interval to inject the next loading container. After all loading containers are injected, the solder paste tray is driven to move in the opposite direction and the solder paste injection mechanism is raised. At the same time, the quantitative scraper is driven to rise and fall to a preset height to scrape off excess solder paste from the loading containers that pass by, thereby obtaining multiple loading containers with substantially the same solder paste capacity and cutting height.

[0029] Furthermore, a lifting mechanism fixing base is provided on one side of the support frame for fixing and supporting the solder paste dosing scraper lifting drive mechanism and the solder paste storage tube lifting drive mechanism. The lifting mechanism fixing base also fixes the solder paste injection mechanism via a solder paste storage tube fixing block, so that the solder paste storage tube moves up and down along the fixing block when the solder paste storage tube lifting drive mechanism is in operation.

[0030] In the embodiment of the present invention, the solder paste loading mechanism includes a solder paste loading container fixing frame and a solder paste loading container arranged on the fixing frame. Figure 3 As shown, the solder paste container holder is equipped with multiple solder paste containers spaced apart. Each container is evenly spaced and pre-adjusted to a consistent height. This ensures that after solder paste injection and quantitative scraping, the solder paste volume and cutting height in each container remain consistent, ensuring that the probe can dip from the same height and obtain the same amount of solder paste each time.

[0031] In order to ensure that the probe descends in the same posture to dip the solder paste, the present invention is also provided with a probe posture correction mechanism, and a probe correction clamping mechanism is provided above the probe posture correction mechanism. Before dipping the solder paste, the XY coordinate data and rotation angle data of the probe are obtained by image shooting, and then the deviation of the probe in the X direction is corrected by the Y-direction moving axis of the solder paste tray, the deviation of the probe in the Y direction is corrected by the probe clamping mechanism, and the rotation angle deviation of the probe is corrected by the probe posture correction mechanism. The Y-direction deviation data is compensated by the material picking height of the probe clamping mechanism, that is, the deviation data is added or subtracted at the standard material picking height, which can be regarded as using the compensated height to move the probe when moving from the posture correction station to the solder paste dipping station. It should be noted that the coordinates described in the embodiment of the present invention are based on the probe as a reference, and the plane placement direction of the probe is perpendicular to the device itself, so the deviation of the probe in the X direction can be executed by the Y-direction moving axis of the solder paste tray.

[0032] It should be noted that the probe posture correction mechanism here can be implemented through a rotating platform. By controlling the rotation axis of the rotating platform to rotate, the angle of the rotating platform is corrected, thereby achieving correction of the probe angle.

[0033] After the calibration is completed, the probe calibration clamping mechanism is released, and the probe clamping mechanism takes out the probe and moves it to the solder paste dipping station, and then descends to a preset position for solder paste dipping.

[0034] Reference Figure 4 The probe gripping mechanism includes a jaw lifting shaft connected to a jaw angle adjustment mechanism via a jaw angle adjustment mechanism fixing plate. The jaw angle adjustment mechanism is connected to a jaw assembly via a connector. The jaw assembly includes a jaw clamping and pushing cylinder and a probe jaw. The probe jaw is further equipped with a movable jaw and a fixed jaw, each of which is connected to the connector via a fixing plate.

[0035] The working principle of this utility model is:

[0036] The solder paste injection mechanism first injects the solder paste into the solder paste loading container ( Figure 3 ), the amount injected must be higher than the container mouth, and then the solder paste quantitative scraper will scrape the excess solder paste into the solder paste recovery mechanism. At this time, the solder paste capacity in each container is basically the same, and the cutting height is also basically the same. The height of the container is pre-adjusted and parallel to the Y-axis moving mechanism.

[0037] Then the probe clamping mechanism will take out a probe from the tray and place it in the posture correction station. The probe will then be photographed by two mutually perpendicular cameras to obtain its position status, and then the probe posture correction mechanism will correct the probe.

[0038] After the calibration is completed, the probe clamping mechanism takes out the probe again and moves it to the solder paste dipping station. The clamping claw drops to the preset position to ensure that the amount of glue dipped is the set amount. The depth of the clamping claw at this time determines the amount of glue dipped. The posture calibration before dipping is to ensure that the probe dips in the solder paste in the same posture. After the probe is dipped in solder paste, the clamping claw mechanism will move to the welding position, completing the probe's solder paste dipping function before welding. When the second probe is dipped in solder paste, it will switch a position ( Figure 3 ), ensure the solder paste is dipped into a consistent depth.

[0039] The solder paste container is equipped with multiple dipping positions at intervals. After the current probe has dipped the glue, the next probe switches to the next position for dipping. The position switching here is performed by the horizontal movement axis of the probe clamping structure to perform the X-direction movement, and the Y-direction movement axis of the solder paste tray to perform the Y-direction movement, thus completing the dipping position switching.

[0040] It should be noted that the preset position is the control position for the amount of glue the probe dips into. That is, the deeper the probe is lowered, the greater the amount of glue. The preset position is adjusted according to the welding state. The control condition of the amount is: it can weld firmly, but it does not overflow the pad area due to excessive glue.

[0041] Based on the above-mentioned working principle, the utility model realizes the control of the amount of solder paste dipped into the probe before welding, solves the problem of uneven solder paste dipping of the probe before welding, avoids the situation in which the amount of solder paste dipped cannot be accurately controlled due to the fixed solder paste dipping position or the change in the solder paste dipping depth during the solder paste dipping process, and ensures the quality of the probe during the welding process.

[0042] Based on the same technical concept as the aforementioned embodiment, the present invention also provides a probe welding device equipped with the aforementioned probe welding solder paste dipping device. When using the probe welding device provided in the present invention for laser welding of probes, the problem of uneven solder paste dipping of the probes before welding can be solved. This also avoids the problem of the inability to accurately control the amount of solder paste dipped during the dipping process due to a fixed solder paste dipping position or varying solder paste dipping depth, thereby ensuring the quality of the probes during the welding process.

[0043] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A probe welding device for dipping solder paste, characterized in that: It includes a solder paste tray moving mechanism, which is provided with a solder paste loading mechanism and a solder paste recovery mechanism in the same direction, the solder paste recovery device is located at the end of the solder paste loading mechanism, and the solder paste loading mechanism is provided with multiple solder paste loading containers arranged at intervals, and a solder paste quantitative mechanism and a solder paste injection mechanism are provided on one side of the solder paste recovery mechanism, and the solder paste quantitative mechanism and the solder paste injection mechanism are respectively connected to a lifting drive mechanism, and the quantitative scraper of the solder paste quantitative mechanism is located above the recovery cavity configured by the solder paste recovery mechanism.

2. The probe welding device for dipping solder paste according to claim 1, characterized in that: The device comprises a support frame, and the solder paste tray moving mechanism is installed on the support frame and is used to drive the solder paste tray to move in a directional manner.

3. The probe welding solder paste dipping device according to claim 2, characterized in that: A fixing seat is provided on one side of the support frame. Two lifting drive mechanisms are provided on the fixing seat. The fixing seat is also fixed with a solder paste injection mechanism through a fixing block.

4. The probe welding solder paste dipping device according to claim 3, characterized in that: The solder paste injection mechanism includes a solder paste injection storage tube, and the solder paste injection storage tube is connected to the first lifting drive mechanism.

5. The probe welding solder paste dipping device according to claim 3, characterized in that: The solder paste quantitative mechanism includes a quantitative scraper, and the quantitative scraper is connected to the second lifting drive mechanism.

6. The probe welding solder paste dipping device according to claim 1, characterized in that: The height of the solder paste loading container is adjustable.

7. The probe welding solder paste dipping device according to claim 1, characterized in that: The arrangement direction of the plurality of spaced-apart solder paste loading containers is parallel to the moving direction of the solder paste tray.

8. The probe welding solder paste dipping device according to claim 1, characterized in that: The device further comprises a probe posture correction mechanism, and a probe correction clamping mechanism is connected above the probe posture correction mechanism.

9. The probe welding solder paste dipping device according to claim 8, characterized in that: The probe posture correction mechanism includes a rotating platform and a rotation driving mechanism for driving the rotating platform to rotate.

10. A probe welding device, characterized in that: The device is provided with a probe welding and solder paste dipping device as claimed in any one of claims 1 to 9.

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