Die cutting device for CMP (Chemical Mechanical Polishing) pad

Abstract

The utility model discloses a CMP polishing pad die-cutting device which comprises a base, a support is fixedly connected to the rear wall of the base, a hydraulic telescopic rod is fixedly connected to the top end of the support, the movable end of the hydraulic telescopic rod penetrates through the top end of the support and is fixedly connected with a die-cutting assembly, a movable groove is formed in the front side of the base, and the die-cutting assembly is fixedly connected with the movable groove. Sliding grooves are symmetrically formed in the inner walls of the left side and the right side of the movable groove, and discharging limiting assemblies in sliding fit with the sliding grooves are arranged in the movable groove. During operation, a plurality of polishing pads are overlapped up and down and placed on the base, then, the hydraulic telescopic rod extends out of the movable rod to push the die cutting assembly downwards, a plurality of polishing pads can be die-cut and machined at a time, and the machining efficiency is greatly improved; and during discharging, the discharging limiting assembly relieves limiting, the spring pushes the pressing plate to directly push a die-cut finished product out of the barrel to complete discharging, then machining is repeated in this way, manual auxiliary discharging is not needed, and the machining efficiency is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of polishing pad manufacturing, in particular to a die-cutting device for a CMP polishing pad. Background Art

[0002] CMP technology, or chemical mechanical polishing, is a key process for flattening wafer surfaces during semiconductor manufacturing. As a key consumable in semiconductor manufacturing, CMP polishing pads are crucial in the wafer planarization process due to their variety, technical requirements, and application areas.

[0003] Die cutting is a processing method that uses a mold or a tool to cut the material into a specific shape. When the polishing pad is die-cut, only the polishing points can be die-cut one by one, which has low processing efficiency. In addition, when the material is discharged after die-cutting, human assistance is required to pick up the material, and the steps are relatively cumbersome. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, one of the purposes of the present invention is to provide a die-cutting device for a CMP polishing pad. Through the provision of a hydraulic telescopic rod, a die-cutting assembly, a cutting table, and a cutting groove, during operation, several polishing pads are overlapped and placed on a base. In the next step, the hydraulic telescopic rod extends the movable rod to push the die-cutting assembly downward, and multiple polishing pads can be die-cut at one time, greatly improving the processing efficiency; through the provision of a discharge limit assembly, a movable groove, and a slide groove, when discharging, the discharge limit assembly releases the limit, and the spring pushes the pressure plate to push the die-cut product directly out of the cylinder to complete the discharging. The processing is then repeated in this way, and no manual assistance is required for discharging, further improving the processing efficiency.

[0005] One of the objectives of the present invention is achieved by the following technical solution: a die-cutting device for a CMP polishing pad, comprising: a base, a bracket fixedly connected to the rear wall of the base, a hydraulic telescopic rod fixedly connected to the top end of the bracket, a movable end of the hydraulic telescopic rod passing through the top end of the bracket and fixedly connected to a die-cutting assembly, a movable groove formed on the front side of the base, slide grooves symmetrically formed on the left and right inner walls of the movable groove, and a discharge limit assembly slidably engaged with the slide groove provided in the movable groove;

[0006] The die-cutting assembly includes a cylinder, a blade is provided at the lower end of the cylinder, four cutting tips are evenly arranged at the bottom end of the blade, a fixing plate is fixedly connected to the top end of the inner wall of the cylinder, a spring is fixedly connected to the bottom end of the fixing plate, and a pressure plate is fixedly connected to the bottom end of the spring;

[0007] The discharge limit assembly includes a mounting plate, with an electric push rod fixedly connected through the middle of the mounting plate. The rear wall of the movable rod of the electric push rod is fixedly connected to a cutting table. The upper surface of the cutting table is provided with a cutting groove, and sliders are symmetrically fixedly connected to the left and right outer walls of the cutting table. Through the provision of a hydraulic telescopic rod, a die-cutting assembly, a cutting table, and a cutting groove, during operation, several polishing pads are stacked up and placed on the base. Next, the hydraulic telescopic rod extends the movable rod to push the die-cutting assembly downward, allowing multiple polishing pads to be die-cut at once, greatly improving processing efficiency. Through the provision of a discharge limit assembly, a movable groove, and a slide, when discharging, the discharge limit assembly is released, and a spring pushes the pressure plate to directly push the die-cut product out of the cylinder to complete the discharge. The processing is then repeated in this manner, eliminating the need for manual assistance in discharging, further improving processing efficiency.

[0008] According to the die-cutting device for a CMP polishing pad, the outer side walls of the sliding block are slidably connected to the inner side walls of the sliding groove.

[0009] According to the die-cutting device for a CMP polishing pad, the left and right outer walls of the mounting plate are fixedly connected to the left and right inner walls of the movable groove.

[0010] A die-cutting device for a CMP polishing pad is provided, wherein the position of the cylinder corresponds to the position of the cutting groove.

[0011] According to the die-cutting device for a CMP polishing pad, the outer side wall of the pressing plate fits with the inner side wall of the cylinder, ensuring that the pressing plate presses smoothly.

[0012] According to the die-cutting device for a CMP polishing pad, the inclined surface of the blade is arranged on the outer side of the bottom end of the cylinder, which reduces cutting errors and prevents the finished polishing pad from being stuck in the cylinder.

[0013] According to the die-cutting device for a CMP polishing pad, the length of the movable rod of the electric push rod is twice the diameter of the cutting table to avoid obstruction of material discharge.

[0014] According to the die-cutting device for a CMP polishing pad, a rubber protective pad is bonded to the bottom end of the pressing plate to avoid damage to the polishing pad.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0017] Figure 1 This is a three-dimensional diagram of a die-cutting device for a CMP polishing pad according to the present invention;

[0018] Figure 2 This is a three-dimensional diagram of the base of a die-cutting device for a CMP polishing pad according to the present invention;

[0019] Figure 3 This is a structural diagram of a die-cutting assembly of a die-cutting device for a CMP polishing pad according to the present invention;

[0020] Figure 4 This is a structural diagram of a discharge limiting component of a die-cutting device for a CMP polishing pad according to the present invention.

[0021] Legend:

[0022] 1. Base; 2. Bracket; 3. Hydraulic telescopic rod; 4. Die-cutting assembly; 5. Discharge limit assembly; 101. Movable groove; 102. Slide; 401. Cylinder; 4011. Blade; 4012. Cutting tip; 402. Fixed plate; 403. Spring; 404. Press plate; 501. Mounting plate; 502. Electric push rod; 503. Cutting table; 5031. Cutting groove; 504. Slider. DETAILED DESCRIPTION

[0023] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0024] Reference Figure 1-4 The present invention provides a die-cutting device for a CMP polishing pad, comprising: a base 1, a bracket 2 fixedly connected to the rear wall of the base 1, a hydraulic telescopic rod 3 fixedly connected to the top of the bracket 2, a movable end of the hydraulic telescopic rod 3 passing through the top of the bracket 2 and fixedly connected to a die-cutting component 4, a movable groove 101 formed on the front side of the base 1, symmetrically formed slide grooves 102 on the left and right inner walls of the movable groove 101, and a discharge limiter component 5 provided in the movable groove 101 and slidably engaged with the slide groove 102;

[0025] The die-cutting assembly 4 includes a cylinder 401, a blade 4011 is provided at the lower end of the cylinder 401, and four cutting tips 4012 are evenly provided at the bottom end of the blade 401. The inclined surface of the blade 4011 is arranged on the outer side of the bottom end of the cylinder 401 to reduce cutting errors and prevent the finished polishing pad from being stuck in the cylinder 401. A fixing plate 402 is fixed to the top of the inner wall of the cylinder 401, a spring 403 is fixed to the bottom end of the fixing plate 402, a pressing plate 404 is fixed to the bottom end of the spring 403, and a rubber protective pad is bonded to the bottom end of the pressing plate 404 to avoid damage to the polishing pad. The outer wall of the pressing plate 404 fits the inner wall of the cylinder 401 to ensure that the pressing plate 404 presses smoothly.

[0026] The discharge limit assembly 5 includes a mounting plate 501, the left and right outer walls of the mounting plate 501 are fixedly connected to the left and right inner walls of the movable groove 101, and an electric push rod 502 is fixedly connected through the middle of the mounting plate 501. The length of the movable rod of the electric push rod 502 is twice the diameter of the cutting table 503 to avoid interfering with the discharge of materials. The rear wall of the movable rod of the electric push rod 502 is fixedly connected to the cutting table 503, and a cutting groove 5031 is provided on the upper surface of the cutting table 503. The position of the cylinder 401 corresponds to the position of the cutting groove 5031. The left and right outer walls of the cutting table 503 are symmetrically fixed with sliders 504, and the outer side walls of the sliders 504 are both slidably connected to the inner side walls of the slide groove 102. Through the hydraulic telescopic rod 3, die-cutting assembly 4, cutting table 503, and cutting groove 5031, when in operation, several polishing pads are overlapped and placed on the base 1. Next, the hydraulic telescopic rod 3 extends the movable rod to push the die-cutting assembly 4 downward, and the cutting tip 4012 first cuts into the uppermost polishing pad, and continues to push the blade 4011 downward to cut the polishing pad along the shape of the cylinder 401. At the same time, the spring 403 pushes the pressure plate 404 downward to press the polishing pad to prevent the polishing pad from shifting during cutting and affecting the quality of the finished product. Finally, until the blade 4011 completely enters the cutting groove 50 31, and multiple polishing pads can be die-cut at one time, which greatly improves the processing efficiency; through the set discharge limit component 5, movable groove 101, and slide groove 102, when discharging, the hydraulic telescopic rod 3 drives the die-cutting component 4 to rise, and when the cutting tip 4012 disengages from the cutting groove 5031, the electric push rod 502 is started to retract the movable rod to drive the cutting table 503 to move, until it is away from the bottom of the cylinder 401, and the spring 403 pushes the pressure plate 404 to push the die-cut product directly out of the cylinder 401 to complete the discharge, and then the processing is repeated in this way, without the need for manual assistance in discharging, further improving the processing efficiency.

[0027] When the cutting blade 4012 is out of the cutting groove 5031, the electric push rod 502 is started to retract the movable rod to drive the cutting table 503 to move. When it is away from the bottom of the cylinder 401, the spring 403 pushes the pressure plate 404 to push the die-cutting product directly out of the cylinder 401 to complete the discharge. After that, the processing is repeated in this way, and no manual assistance is required for discharge.

[0028] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A die-cutting device for a CMP polishing pad, comprising: The base (1) is characterized in that a bracket (2) is fixedly connected to the rear wall of the base (1), a hydraulic telescopic rod (3) is fixedly connected to the top of the bracket (2), a movable end of the hydraulic telescopic rod (3) passes through the top of the bracket (2) and is fixedly connected to a die-cutting component (4), a movable groove (101) is provided on the front side of the base (1), and sliding grooves (102) are symmetrically provided on the left and right inner walls of the movable groove (101), and a discharge limit component (5) that slides with the sliding groove (102) is provided in the movable groove (101); The die-cutting assembly (4) comprises a cylinder (401), a blade (4011) is provided at the lower end of the cylinder (401), four cutting tips (4012) are evenly provided at the bottom end of the blade (4011), a fixing plate (402) is fixedly connected to the top end of the inner wall of the cylinder (401), a spring (403) is fixedly connected to the bottom end of the fixing plate (402), and a pressing plate (404) is fixedly connected to the bottom end of the spring (403); The discharging limiting assembly (5) comprises a mounting plate (501), an electric push rod (502) is fixedly connected through the middle of the mounting plate (501), a cutting table (503) is fixedly connected to the rear wall of the movable rod of the electric push rod (502), a cutting groove (5031) is provided on the upper surface of the cutting table (503), and sliding blocks (504) are symmetrically fixedly connected to the left and right outer walls of the cutting table (503).

2. The die-cutting device for a CMP polishing pad according to claim 1, wherein: The outer side walls of the slider (504) are slidably connected to the inner side walls of the slide groove (102).

3. The die-cutting device for a CMP polishing pad according to claim 1, wherein: The left and right outer walls of the mounting plate (501) are fixedly connected to the left and right inner walls of the movable groove (101).

4. The die-cutting device for a CMP polishing pad according to claim 1, wherein: The position of the cylinder (401) corresponds to the position of the cutting groove (5031).

5. The die-cutting device for a CMP polishing pad according to claim 1, wherein: The outer wall of the pressing plate (404) fits in contact with the inner wall of the cylinder (401), ensuring that the pressing plate (404) presses smoothly.

6. The die-cutting device for a CMP polishing pad according to claim 1, wherein: The inclined surface of the blade (4011) is arranged on the outer side of the bottom end of the cylinder (401), thereby reducing cutting errors and preventing the finished polishing pad from being stuck in the cylinder (401).

7. The die-cutting device for a CMP polishing pad according to claim 1, wherein: The length of the movable rod of the electric push rod (502) is twice the diameter of the cutting table (503) to avoid obstruction of material discharge.

8. The die-cutting device for a CMP polishing pad according to claim 1, wherein: A rubber protective pad is bonded to the bottom end of the pressing plate (404) to avoid damage to the polishing pad.

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