Solder paste split charging tool

Abstract

The utility model relates to the technical field of tin soldering paste processing, in particular to a tin soldering paste split charging tool which comprises a conveyor, a plurality of limiting mechanisms are evenly distributed and fixed on the conveyor, a supporting frame is fixed on the conveyor, a top plate is fixed on the supporting frame, a filling head is fixed on the top plate in a penetrating mode, a filling machine is fixed on the filling head, and the filling machine is fixed on the top plate. A connecting plate is fixed to the supporting frame, a first electric telescopic rod is fixed to the connecting plate, and a box body is fixed to the first electric telescopic rod. When the tin soldering paste collecting device is used, the box body is used for collecting the tin soldering paste occasionally dripping from the filling head, so that the tin soldering paste occasionally dripping from the filling head cannot pollute the box body containing the tin soldering paste and the conveyor, the cleanliness of the conveyor and the box body containing the tin soldering paste can be ensured, and the tin soldering paste can be collected; and tin soldering paste occasionally dripping on the filling head can be recycled, and waste of the tin soldering paste is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of tin solder paste processing, in particular to a tin solder paste packaging tool. Background Art

[0002] Solder paste refers to the process of printing and applying solder paste on pads on a printed circuit board (PCB), accurately placing surface mount components onto the solder paste-coated pads, and then heating the PCB according to a specific reflow temperature curve to melt the solder paste. After the alloy cools and solidifies, solder joints are formed between the components and the PCB, achieving a metallurgical connection. For ease of use, after processing, the solder paste is dispensed into multiple boxes using a filling machine. Although the solder paste does not have strong fluidity during filling, it still maintains a certain degree of fluidity to ensure smooth filling. When the box below the filling head of the filling machine is replaced, occasional dripping of solder paste from the filling head can easily contaminate the box or conveyor containing the solder paste, affecting the cleanliness of the box or conveyor and resulting in waste of solder paste. Utility Model Content

[0003] The utility model aims to solve the defect in the prior art that the solder paste dripping from the filling head of the filling machine cannot be collected during the solder paste dispensing, and proposes a solder paste dispensing tool.

[0004] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0005] A solder paste packaging tool is designed, including a conveyor, a plurality of limit mechanisms evenly fixed on the conveyor, a support frame fixed on the conveyor, a top plate fixed on the support frame, a filling head fixed through the top plate, a filling machine fixed on the filling head, a connecting plate fixed on the support frame, a first electric telescopic rod fixed on the connecting plate, and a box body fixed on the first electric telescopic rod.

[0006] Preferably, the limiting mechanism includes a first circular ring, the first circular ring is fixed on the conveyor, a plurality of support rods are symmetrically fixed on the first circular ring, and a second circular ring is commonly fixed on the plurality of support rods.

[0007] Preferably, the first circular ring and the second circular ring are coaxially arranged.

[0008] Preferably, a leveling mechanism is fixed on the top plate.

[0009] Preferably, the vibrating mechanism includes a fixing frame, the fixing frame is fixed on the top plate, a second electric telescopic rod is fixed on the fixing frame, a motor is fixed on the second electric telescopic rod, and a knocking assembly is fixed on the output shaft of the motor.

[0010] Preferably, the knocking assembly includes a fixing rod, which is a semicircular structure. The center of the fixing rod is fixed to the output shaft of the motor, and knocking balls are fixed to both ends of the fixing rod.

[0011] The utility model provides a solder paste packaging tool, which has the following beneficial effects: when the solder paste packaging tool is in use, the box body is used to collect the solder paste occasionally dripping from the filling head, so that the solder paste occasionally dripping from the filling head will not contaminate the box body and the conveyor containing the solder paste, which can not only ensure the cleanliness of the conveyor and the box body containing the solder paste, but also can recycle the solder paste occasionally dripping from the filling head, thereby avoiding waste of the solder paste. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a front view of a solder paste dispensing tool proposed by the present invention;

[0013] Figure 2 This is a left view of a solder paste dispensing tool proposed by the present invention;

[0014] Figure 3 This is a top view of a solder paste dispensing tool proposed in the present invention;

[0015] Figure 4 A tin solder paste packaging tool proposed by the utility model Figure 1 Top view at AA in the middle;

[0016] Figure 5 The present invention is a schematic structural diagram of a box body of a solder paste packaging tool when in use.

[0017] In the figure: 1. Conveyor; 2. First ring; 3. Support rod; 4. Second ring; 5. Support frame; 6. Top plate; 7. Filling head; 8. Connecting plate; 9. First electric telescopic rod; 10. Box body; 11. Fixed frame; 12. Second electric telescopic rod; 13. Motor; 14. Fixed rod; 15. Knocking ball. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0019] Example 1: Reference Figure 1-5A tin solder paste packaging tool includes a conveyor 1, and a plurality of limiting mechanisms are evenly fixed on the conveyor 1. The limiting mechanism includes a first circular ring 2, which is fixed on the conveyor 1. A plurality of support rods 3 are symmetrically fixed on the first circular ring 2, and a second circular ring 4 is commonly fixed on the plurality of support rods 3. The second circular ring 4 and the first circular ring 2 are separated by the plurality of support rods 3. The first circular ring 2 and the second circular ring 4 are coaxially arranged. The filled box body is inserted into the second circular ring 4 and the first circular ring 2. The first circular ring 2 and the second circular ring 4 are used to limit the position of the filled box body, so that the conveyor 1 will not tip over when driving the plurality of filled boxes to move, thereby ensuring the safety of the filled boxes.

[0020] A support frame 5 is fixed on the conveyor 1, and a top plate 6 is fixed on the support frame 5. A filling head 7 is fixed through the top plate 6, and a filling machine is fixed on the filling head 7. A connecting plate 8 is fixed on the support frame 5, and a first electric telescopic rod 9 is fixed on the connecting plate 8. A box body 10 is fixed on the first electric telescopic rod 9. The position of the box body 10 is changed by the extension and contraction of the first electric telescopic rod 9, so that the box body 10 can collect the solder paste occasionally dripping from the filling head 7 without affecting the normal use of the filling head 7.

[0021] During use, after the filling head 7 finishes filling, before the box bodies inserted in the first ring 2 and the second ring 4 are taken away by the conveyor 1, the first electric telescopic rod 9 drives the box body 10 to move to the bottom of the filling head 7, and then the conveyor 1 is used to take away the box body after filling. The box body 10 is used to collect the solder paste occasionally dripping from the filling head 7, so that the solder paste occasionally dripping from the filling head 7 will not contaminate the box body containing the solder paste and the conveyor 1, which can not only ensure the cleanliness of the conveyor 1 and the box body containing the solder paste, but also can recycle the solder paste occasionally dripping from the filling head 7 to avoid waste of solder paste.

[0022] Example 2: In Example 1, after the box containing the solder paste is filled with the solder paste, it is impossible to ensure that there are no bubbles or cavities inside the solder paste during filling. Relying on the weight of the solder paste to remove the bubbles or cavities takes a long time and has a poor effect. Figure 1-4 As another preferred embodiment of the present invention, the difference from Example 1 is that a vibrating mechanism is fixed on the top plate 6, and the vibrating mechanism includes a fixing frame 11, which is fixed on the top plate 6, and a second electric telescopic rod 12 is fixed on the fixing frame 11, and a motor 13 is fixed on the second electric telescopic rod 12. A knocking assembly is fixed on the output shaft of the motor 13, and the motor 13 can drive the knocking assembly to swing back and forth. When the second electric telescopic rod 12 is retracted, the position of the motor 13 and the knocking assembly will be raised, so that the knocking assembly will not affect the movement of the box containing the solder paste driven by the conveyor 1.

[0023] The knocking assembly includes a fixed rod 14, which has a semicircular structure. The center of the fixed rod 14 is fixed to the output shaft of the motor 13. Knocking balls 15 are fixed to both ends of the fixed rod 14. The semicircular fixed rod 14 and the box body are coaxially arranged. The two knocking balls 15 knock on the box body alternately. The vibration generated by the knocking allows the bubbles and cavities in the solder paste in the box body to be quickly discharged, thereby ensuring the quality of the solder paste filled in the box body.

[0024] During use, when the filling head 7 is filling, the second electric telescopic rod 12 is extended, and the extended second electric telescopic rod 12 lowers the position of the fixed rod 14 and the two knocking balls 15 through the motor 13, and then starts the motor 13, allowing the motor 13 to drive the two knocking balls 15 through the fixed rod 14 to alternately knock on the box body filled with the solder paste, so that the bubbles and cavities in the solder paste in the box body can be quickly discharged. When the filling head 7 completes the filling, the box body 10 moves, and the position of the fixed rod 14 and the two knocking balls 15 are also raised, so that the movement of the box body containing the solder paste driven by the conveyor 1 will not be affected.

[0025] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A solder paste dispensing tool comprising a conveyor (1), characterized in that: A plurality of limiting mechanisms are evenly distributed and fixed on the conveyor (1), a support frame (5) is fixed on the conveyor (1), a top plate (6) is fixed on the support frame (5), a filling head (7) is fixed through the top plate (6), a filling machine is fixed on the filling head (7), a connecting plate (8) is fixed on the support frame (5), a first electric telescopic rod (9) is fixed on the connecting plate (8), and a box body (10) is fixed on the first electric telescopic rod (9).

2. The solder paste packaging tool according to claim 1, characterized in that: The limiting mechanism comprises a first circular ring (2), the first circular ring (2) being fixed on the conveyor (1), a plurality of support rods (3) being symmetrically fixed on the first circular ring (2), and a second circular ring (4) being commonly fixed on the plurality of support rods (3).

3. The solder paste packaging tool according to claim 2, characterized in that: The first circular ring (2) and the second circular ring (4) are coaxially arranged.

4. The solder paste packaging tool according to claim 1, characterized in that: A vibrating mechanism is fixed on the top plate (6).

5. The solder paste packaging tool according to claim 4, characterized in that: The vibrating mechanism comprises a fixing frame (11), the fixing frame (11) being fixed on the top plate (6), a second electric telescopic rod (12) being fixed on the fixing frame (11), a motor (13) being fixed on the second electric telescopic rod (12), and a knocking assembly being fixed on the output shaft of the motor (13).

6. The solder paste packaging tool according to claim 5, characterized in that: The knocking assembly comprises a fixing rod (14), the fixing rod (14) is a semicircular structure, the center of the fixing rod (14) is fixed to the output shaft of the motor (13), and knocking balls (15) are fixed to both ends of the fixing rod (14).

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