Chip transfer platform

By designing a chip transport platform, the coordinated work of slip components and jacking components is used to achieve synchronous chips and transport at different heights, solving the problem of low chip transport efficiency and improving transport efficiency and stability.

CN223267667UActive Publication Date: 2025-08-26SUZHOU YUFENGYUAN INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202421850457.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-01
Publication Date
2025-08-26
Estimated Expiration
2034-08-01

AI Technical Summary

Technical Problem

The problem of low chip transport efficiency in the prior art.

Method used

A chip transport platform is designed, including a first slip assembly, a second slip assembly, a first transportation assembly, a second transportation assembly and a jacking assembly. Through the coordinated work of these components, the synchronous transport of the chip and the transport at different heights are realized, and mutual interference in the transport process is avoided.

Benefits of technology

It improves chip transport efficiency and flexibility, ensuring the stability and safety of chips during transport.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a chip transfer platform which comprises a first sliding assembly, a second sliding assembly, a first transportation assembly, a second transportation assembly and a jacking assembly, the first sliding assembly is arranged above the second sliding assembly, the first transportation assembly is connected with the first sliding assembly, and the second transportation assembly is connected with the jacking assembly. The first conveying assembly is connected with the first sliding assembly, the first sliding assembly drives the first conveying assembly to reciprocate in the transfer direction, the second conveying assembly is connected with the second sliding assembly, the second sliding assembly drives the second conveying assembly to reciprocate in the transfer direction, and the second conveying assembly comprises a supporting plate and is supported above the supporting plate; the second conveying assembly is connected with the jacking assembly, the jacking assembly drives the second conveying assembly to move in the direction away from or close to the supporting plate, and the first conveying assembly and the second conveying assembly synchronously move in opposite directions. The two trays can be synchronously moved in opposite directions, so that the exchange between the empty tray and the tray on which the chip to be detected is placed is realized, and the chip transfer efficiency is improved.
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Description

Technical Field

[0001] The utility model belongs to the technical field of chip production, and particularly relates to a chip transport platform. Background Art

[0002] A chip is an integrated circuit commonly used in electronic devices. Made of semiconductor materials, it integrates a large number of electronic components, such as transistors, capacitors, and resistors. Its primary function is to process, store, and control data within electronic devices. Chips come in a wide variety of types, including processor chips, memory chips, and sensor chips. Each type of chip has a specific purpose. For example, processor chips perform computational tasks, memory chips store data, and sensor chips detect environmental parameters. Chip manufacturing techniques include photolithography, ion implantation, and thin-film deposition. The resulting chips are characterized by their small size, high performance, and low power consumption. Chips play a vital role in modern electronic devices and are core components of various electronic products, including computers, mobile phones, and smart homes. In the field of semiconductor manufacturing and electronic component processing, chip transportation and handling are critical steps in the chip production process. Currently, traditional manual transportation methods are inefficient. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the purpose of the present invention is to provide a chip transfer platform to solve the problem of low chip transfer efficiency in the existing technology.

[0004] The utility model discloses a chip transfer platform, including a first sliding component, a second sliding component, a first transport component, a second transport component and a lifting component. The first sliding component is arranged above the second sliding component, the first transport component is connected to the first sliding component, the first sliding component drives the first transport component to reciprocate along the transfer direction, the second transport component is connected to the second sliding component, the second sliding component drives the second transport component to reciprocate along the transfer direction, the second transport component includes a support plate, the second transport component is supported above the support plate, the second transport component is connected to the lifting component, the lifting component drives the second transport component to move away from or close to the support plate, the first transport component and the second transport component move synchronously, and the movement directions are opposite.

[0005] In some embodiments, the first transport component includes a first pallet and a first pallet, the first pallet is supported on the first pallet, and the first pallet is provided with a first core groove for placing the chip, and the second transport component includes a second pallet and a second pallet, the second pallet is supported on the second pallet, and the second pallet is provided with a second core groove for placing the chip.

[0006] In some embodiments, two adjacent first core grooves are connected to each other, and two adjacent second core grooves are connected to each other.

[0007] In some embodiments, a first bracket is formed on the first support plate, and the first support plate is accommodated in the first bracket; a second bracket is formed on the second support plate, and the second support plate is accommodated in the second bracket.

[0008] In some embodiments, a plurality of first tightening holes are provided on the first slot wall of the first bracket, and a plurality of second tightening holes are provided on the second slot wall of the second bracket. The first tightening holes penetrate the thickness of the first slot wall, and the second tightening holes penetrate the thickness of the second slot wall. The first tightening holes are used to penetrate the first screw, and the second tightening holes are used to penetrate the second screw. The first screw abuts or separates from the first tray, and the second screw abuts or separates from the second tray.

[0009] In some embodiments, the first sliding assembly includes a first sliding block and a first sliding rail, one end of the first sliding block is detachably connected to the first transport assembly, and the other end of the first sliding block is slidably installed on the first sliding rail, and the second sliding assembly includes a second sliding block and a second sliding rail, one end of the second sliding block is detachably connected to the second transport assembly, and the other end of the second sliding block is slidably installed on the second sliding rail.

[0010] In some embodiments, the first sliding assembly further includes a servo drive motor, a pulley, a belt, and a linkage assembly. The motor shaft of the servo drive motor drives the pulley to rotate, the belt is sleeved on the pulley, the belt passes through the linkage assembly, and drives the linkage assembly to move synchronously. The linkage assembly is detachably connected to the first support plate, and the first support plate moves synchronously driven by the linkage assembly.

[0011] In some embodiments, the linkage assembly includes an adapter plate and a clamping plate, the adapter plate and the clamping plate are detachably connected, the clamping plate is arranged below the adapter plate, the belt is clamped between the adapter plate and the clamping plate, and at least one of the adapter plate and the clamping plate is provided with a protrusion, and the protrusion is arranged facing the belt.

[0012] In some embodiments, the jacking assembly includes a jacking cylinder and an auxiliary jacking kit. The jacking cylinder is arranged below the support plate. The auxiliary jacking kit includes a support rod and a storage sleeve that are arranged mutually. One end of the support rod is connected to the support plate, and the other end of the support rod is arranged in the storage sleeve. When the jacking cylinder is in a first state, the support plate is lifted by the jacking cylinder, and the support rod extends out of the storage sleeve. When the jacking cylinder is in a second state, the support plate falls back, and the support rod shrinks into the storage sleeve. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for describing the embodiments or the prior art.

[0014] Figure 1 This is a schematic diagram of the overall structure of the chip transfer platform according to an embodiment of the present invention;

[0015] Figure 2 This is a schematic plan view of a chip transfer platform according to an embodiment of the present invention from one angle;

[0016] Figure 3 This is a plan view of the chip transfer platform according to another embodiment of the present invention from another angle;

[0017] Figure 4 This is a partial structural diagram of the chip transfer platform according to an embodiment of the present invention;

[0018] Figure 5 yes Figure 4 Enlarged view of point B in the middle;

[0019] Figure 6 This is a schematic structural diagram of a first tray according to an embodiment of the present utility model;

[0020] Figure 7 This is a schematic structural diagram of the first support plate of an embodiment of the present utility model;

[0021] In the figure, 1-first transport assembly, 11-first pallet, 12-first support plate, 13-first core groove, 14-first bracket, 15-first tightening hole, 2-first sliding assembly, 21-first sliding block, 22-first slide rail, 23-servo drive motor, 24-pulley, 25-belt, 26-linking assembly, 261-adapter plate, 262-clamping plate, 263-protrusion, 3-second transport assembly, 31-second pallet, 32-second support plate, 33-support plate, 4-second sliding assembly, 41-second sliding block, 42-second slide rail, 5-lifting assembly, 51-lifting cylinder, 52-auxiliary lifting kit, 521-support rod, 522-storage sleeve. DETAILED DESCRIPTION

[0022] The following is a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0023] The utility model discloses a chip transport platform, specifically, Figures 1 to 7As shown, the chip transfer platform includes a first sliding component 2, a second sliding component 4, a first transport component 1, a second transport component 3 and a lifting component 5. The first sliding component 2 is arranged above the second sliding component 4. The first transport component 1 is connected to the first sliding component 2. The first sliding component 2 drives the first transport component 1 to reciprocate along the transfer direction. The second transport component 3 is connected to the second sliding component 4. The second sliding component 4 drives the second transport component 3 to reciprocate along the transfer direction. The second transport component 3 includes a support plate 33. The second transport component 3 is supported above the support plate 33. The second transport component 3 is connected to the lifting component 5. The lifting component 5 drives the second transport component 3 to move away from or close to the support plate 33. The first transport component 1 and the second transport component 3 move synchronously with opposite directions of movement. In some embodiments, the first transport component 1 includes a first tray 11 and a first pallet 12, wherein the first tray 11 is supported on the first pallet 12, and a first core groove 13 for placing chips is provided on the first tray 11, and the second transport component 3 includes a second tray 31 and a second pallet 32, wherein the second tray 31 is supported on the second pallet 32, and a second core groove for placing chips is provided on the second tray 31. Specifically, during the actual transport process, the chips in the second tray 31 will be transported to the testing equipment, and the chips in the first tray 11 are used to compensate for the chips in the second tray 31 after all the chips in the second tray 31 have been transported to the testing equipment. That is, after all the chips on the second tray 31 have been transported to the testing equipment, the second tray 31 is an empty tray, and at this time, the chip transport platform is started. The first transport component 1 and the second transport component 3 are respectively moved synchronously in opposite directions under the action of the first sliding component 2 and the second sliding component 4, transporting the first tray 11 to the position where the second tray 31 is fed to the test equipment, transporting the empty second tray 31 to the initial position of the first tray 11, and placing chips in the empty second tray 31. After all the chips in the first tray 11 are transported to the test equipment, the positions of the first transport component 1 and the second transport component 3 are exchanged through the chip transfer platform. Specifically, when the second tray 31 is at the initial position for feeding the test equipment, the second tray 31 is lifted by the lifting component 5, and the height of the second tray 31 is the same as that of the first tray 11. When the second tray 31 needs to be transported to the initial position of the first tray 11, the lifting component 5 is returned to its original position to lower the position of the second tray 31, thereby avoiding interference between the first transport component 1 and the second transport component 3 during transportation.

[0024] It can be understood that through the coordinated work of the first sliding component 2 and the second sliding component 4, the synchronous transportation of chips in different directions is achieved, thereby improving the chip transportation efficiency; through the combination of the lifting cylinder 51 and the auxiliary lifting kit 52, the transportation of chips at different heights is achieved, thereby avoiding mutual interference during the transportation process, and improving the chip transportation efficiency and transportation flexibility.

[0025] In some embodiments, continue to refer to Figure 6 , two adjacent first core slots 13 are connected to each other, and two adjacent second core slots are connected to each other. By setting the connection between two adjacent core slots on the tray, a chip taking space is reserved, which facilitates chip removal.

[0026] In some embodiments, continue to refer to Figure 7 The first support plate 12 is provided with a first bracket 14 , and the first support plate 12 is accommodated in the first bracket 14 ; the second support plate 32 is provided with a second bracket, and the second support plate 32 is accommodated in the second bracket.

[0027] In some embodiments, a plurality of first tightening holes 15 are provided on the first groove wall of the first bracket 14, and a plurality of second tightening holes are provided on the second groove wall of the second bracket. The first tightening holes 15 penetrate the thickness of the first groove wall, and the second tightening holes penetrate the thickness of the second groove wall. The first tightening holes 15 are used to penetrate the first screw, and the second tightening holes are used to penetrate the second screw. The first screw abuts or separates with the first tray 11, and the second screw abuts or separates with the second tray 31. By providing the tightening holes, after the tray is placed in the bracket, the tray can be stabilized by tightening the screws passing through the tightening holes, thereby improving the stability of the tray during transportation and reducing the damage of the chip during transportation.

[0028] In some embodiments, continue to refer to Figure 3 The first sliding assembly 2 includes a first sliding block 21 and a first sliding rail 22, one end of the first sliding block 21 is detachably connected to the first transport assembly 1, and the other end of the first sliding block 21 is slidably installed on the first slide rail 22, the second sliding assembly 4 includes a second sliding block 41 and a second slide rail 42, one end of the second sliding block 41 is detachably connected to the second transport assembly 3, and the other end of the second sliding block 41 is slidably installed on the second slide rail 42.

[0029] In some embodiments, continue to refer to Figure 4The first sliding assembly 2 further includes a servo drive motor 23, a pulley 24, a belt 25, and a linkage assembly 26. The motor shaft of the servo drive motor 23 drives the pulley 24 to rotate. The belt 25 is sleeved on the pulley 24. The belt 25 passes through the linkage assembly 26 and drives the linkage assembly 26 to move synchronously. The linkage assembly 26 is detachably connected to the first support plate 12. The first support plate 12 moves synchronously under the drive of the linkage assembly 26. In some embodiments, the linkage assembly 26 includes an adapter plate 261 and a clamping plate 262. The adapter plate 261 and the clamping plate 262 are detachably connected. The clamping plate 262 is disposed below the adapter plate 261. The belt 25 is clamped between the adapter plate 261 and the clamping plate 262. At least one of the adapter plate 261 and the clamping plate 262 is provided with a protrusion 263, and the protrusion 263 is disposed facing the belt 25. It can be understood that the control accuracy of the first sliding component 2 is improved through the combination of the servo drive motor 23 and the pulley 24; the combination of the adapter plate 261 and the clamping plate 262 ensures the stable transmission of the belt 25 and the reliability of the equipment.

[0030] In some embodiments, continue to refer to Figure 3 The jacking assembly 5 includes a jacking cylinder 51 and an auxiliary jacking kit 52. The jacking cylinder 51 is arranged below the support plate 33. The auxiliary jacking kit 52 includes a support rod 521 and a storage sleeve 522 that are arranged mutually. One end of the support rod 521 is connected to the support plate 33, and the other end of the support rod 521 is arranged in the storage sleeve 522. When the jacking cylinder 51 is in the first state, the support plate 33 is lifted by the jacking cylinder 51, and the support rod 521 extends out of the storage sleeve 522. When the jacking cylinder 51 is in the second state, the support plate 33 falls back, and the support rod 521 shrinks into the storage sleeve 522.

[0031] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention as claimed.

Claims

1. A chip transport platform, characterized in that: The invention comprises a first sliding assembly (2), a second sliding assembly (4), a first transport assembly (1), a second transport assembly (3) and a lifting assembly (5), wherein the first sliding assembly (2) is arranged above the second sliding assembly (4), the first transport assembly (1) is connected to the first sliding assembly (2), the first sliding assembly (2) drives the first transport assembly (1) to reciprocate along the transfer direction, the second transport assembly (3) is connected to the second sliding assembly (4), the second sliding assembly (4) drives the second transport assembly (3) to reciprocate along the transfer direction, the second transport assembly (3) comprises a support plate (33), the second transport assembly (3) is supported above the support plate (33), the second transport assembly (3) is connected to the lifting assembly (5), the lifting assembly (5) drives the second transport assembly (3) to move in a direction away from or close to the support plate (33), the first transport assembly (1) and the second transport assembly (3) move synchronously, and the movement directions are opposite.

2. The chip transport platform according to claim 1, characterized in that: The first transport assembly (1) comprises a first tray (11) and a first support plate (12), wherein the first tray (11) is supported on the first support plate (12), and a first core groove (13) for placing chips is provided on the first tray (11); the second transport assembly (3) comprises a second tray (31) and a second support plate (32), wherein the second tray (31) is supported on the second support plate (32), and a second core groove for placing chips is provided on the second tray (31).

3. The chip transport platform according to claim 2, characterized in that: Two adjacent first core grooves (13) are communicated with each other, and two adjacent second core grooves are communicated with each other.

4. The chip transport platform according to claim 2, characterized in that: The first support plate (12) is provided with a first bracket (14), and the first support plate (12) is accommodated in the first bracket (14); the second support plate (32) is provided with a second bracket, and the second support plate (32) is accommodated in the second bracket.

5. The chip transport platform according to claim 4, characterized in that: A plurality of first tightening holes (15) are provided on the first slot wall of the first bracket (14), and a plurality of second tightening holes are provided on the second slot wall of the second bracket. The first tightening holes (15) pass through the thickness of the first slot wall, and the second tightening holes pass through the thickness of the second slot wall. The first tightening holes (15) are used to pass through the first screw, and the second tightening holes are used to pass through the second screw. The first screw is in contact with or separated from the first tray (11), and the second screw is in contact with or separated from the second tray (31).

6. The chip transport platform according to claim 2, characterized in that: The first sliding assembly (2) comprises a first sliding block (21) and a first sliding rail (22), one end of the first sliding block (21) is detachably connected to the first transport assembly (1), and the other end of the first sliding block (21) is slidably mounted on the first sliding rail (22), and the second sliding assembly (4) comprises a second sliding block (41) and a second sliding rail (42), one end of the second sliding block (41) is detachably connected to the second transport assembly (3), and the other end of the second sliding block (41) is slidably mounted on the second sliding rail (42).

7. The chip transport platform according to claim 6, characterized in that: The first sliding assembly (2) further comprises a servo drive motor (23), a pulley (24), a belt (25) and a linkage assembly (26); the motor shaft of the servo drive motor (23) drives the pulley (24) to rotate; the belt (25) is sleeved on the pulley (24); the belt (25) passes through the linkage assembly (26) and drives the linkage assembly (26) to move synchronously; the linkage assembly (26) is detachably connected to the first support plate (12); and the first support plate (12) moves synchronously driven by the linkage assembly (26).

8. The chip transport platform according to claim 7, characterized in that: The linkage assembly (26) comprises an adapter plate (261) and a clamping plate (262), wherein the adapter plate (261) and the clamping plate (262) are detachably connected to each other, and the clamping plate (262) is arranged below the adapter plate (261). The belt (25) is clamped between the adapter plate (261) and the clamping plate (262), and at least one of the adapter plate (261) and the clamping plate (262) is provided with a protrusion (263), and the protrusion (263) is arranged facing the belt (25).

9. The chip transport platform according to claim 1, characterized in that: The jacking assembly (5) includes a jacking cylinder (51) and an auxiliary jacking kit (52), wherein the jacking cylinder (51) is arranged below the support plate (33), and the auxiliary jacking kit (52) includes a support rod (521) and a storage sleeve (522) which are sleeved with each other, wherein one end of the support rod (521) is connected to the support plate (33), and the other end of the support rod (521) is arranged in the storage sleeve (522). When the jacking cylinder (51) is in a first state, the support plate (33) is jacked by the jacking cylinder (51), and the support rod (521) extends out of the storage sleeve (522). When the jacking cylinder (51) is in a second state, the support plate (33) falls back, and the support rod (521) shrinks into the storage sleeve (522).