PVD (Physical Vapor Deposition) carrier plate mechanism for compensating deformation of sub-carrier plate

Abstract

The utility model relates to the field of photovoltaic equipment, and discloses a PVD (Physical Vapor Deposition) carrier plate mechanism for compensating the deformation of a sub-carrier plate, which comprises an outer frame, a plurality of carrier plate mounting seats and a plurality of silicon wafer sub-carrier plates. And the carrier plate mounting seat is fixed on the outer frame. The silicon wafer sub-carrier plates are arranged on the carrier plate mounting seats in a one-to-one correspondence manner. A compensation supporting rod is arranged in the middle of the carrier plate mounting seat, and the upper surface of the compensation supporting rod is higher than the periphery of the carrier plate mounting seat. Adjusting and tensioning mechanisms used for tensioning the silicon wafer sub-carrier plates towards the two sides are arranged on the two sides of the outer frame. According to the utility model, the compensation support rod protruding upwards is arranged in the middle of the support plate mounting seat, the sagging deformation of the sub-support plate due to the gravity is counteracted by utilizing the principle of reaction in advance, and meanwhile, the adjustment tensioning mechanisms are arranged on the two sides of the outer frame, so that the deformation can be corrected and reduced, and the probability that a silicon wafer is separated from the support plate and broken is reduced. And meanwhile, the service life of the silicon wafer sub-carrier plate can be prolonged, and the slightly deformed silicon wafer sub-carrier plate can be corrected.

Description

Technical Field

[0001] The utility model relates to the field of photovoltaic equipment, in particular to a PVD carrier plate mechanism for compensating for deformation of a sub-carrier plate. Background Art

[0002] In the manufacture of heterojunction solar cells, it is necessary to use physical vapor deposition (PVD) equipment to perform a PVD process, so as to deposit a transparent conductive film (TCO) on the P-type amorphous silicon and N-type amorphous silicon formed by the PECVD process. As the production capacity of the entire heterojunction solar cell line continues to increase, the PVD equipment also needs to continuously improve its production capacity. The PVD carrier in the existing technology includes multiple silicon wafer carriers, support rods and transmission support plates; as the size of the silicon wafer carrier increases, the support and deformation suppression effects of the support rods gradually weaken, and the overall deformation of the PVD carrier can reach 4-5mm. This deformation will increase the probability of the carried silicon wafer detaching from the carrier and breaking.

[0003] Therefore, how to provide a PVD carrier to reduce the deformation of the PVD carrier and meet the demand for increasing PVD production capacity has become a technical problem that needs to be solved urgently in the industry. Utility Model Content

[0004] The purpose of the present invention is to provide a PVD carrier mechanism that compensates for the deformation of the sub-carrier, which can reduce the deformation of the PVD large carrier, reduce the probability of silicon wafers detaching from the carrier and breaking, and meet the demand for increasing PVD production capacity.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] The utility model discloses a PVD carrier mechanism for compensating for deformation of a sub-carrier, comprising an outer frame, a plurality of carrier mounting seats, and a plurality of silicon wafer sub-carriers. The carrier mounting seats are fixed to the outer frame. The silicon wafer sub-carriers are disposed on the carrier mounting seats in a one-to-one correspondence. A compensating support rod is disposed in the middle of each carrier mounting seat, the upper surface of which is higher than the height of the surrounding perimeter of the carrier mounting seat. Adjustable tensioning mechanisms are disposed on both sides of the outer frame for tightening the silicon wafer sub-carriers.

[0007] Furthermore, both ends of the compensation support rod are upward inclined surfaces, and the middle is a flat surface.

[0008] Furthermore, the inclined surfaces at both ends of the compensation support rod are symmetrically arranged, the angle of the inclined surface is 0.55°-0.65°, and the middle protrusion is 3-5 mm higher than the surrounding areas of the carrier plate mounting seat.

[0009] Furthermore, the adjusting and tightening mechanism includes an adjusting nut, an adjusting bolt and a tightening connecting block; the tightening connecting block is fixedly connected to the silicon wafer sub-carrier, the adjusting bolt is freely rotatably connected to the tightening connecting block, the adjusting bolt is threadedly connected to the adjusting nut, and the adjusting nut is fixed on the outer frame.

[0010] Furthermore, the outer frame includes two groups of C-shaped channel steels, the carrier plate mounting seat includes four round support tubes forming a rectangular frame, and the C-shaped channel steels are arranged on both sides of several rectangular frames to fix several carrier plate mounting seats into a whole.

[0011] Furthermore, two carrier mounting seats and two silicon wafer sub-carriers are provided, and the length of the outer frame is 2.5m-3m and the width is 2m-2.5m.

[0012] Furthermore, the silicon wafer sub-carrier is provided with several waist-shaped holes around it, and the carrier mounting seat is provided with several threaded holes corresponding to the waist-shaped holes. Bolts pass through the waist-shaped holes to fix the silicon wafer sub-carrier to the threaded holes on the carrier mounting seat.

[0013] The benefits of this utility model are:

[0014] This utility model incorporates an upwardly protruding compensating support rod in the middle of the carrier mounting base, utilizing the principle of pre-reaction to offset the downward deformation of the sub-carrier due to its own gravity. Adjustable tensioning mechanisms are also provided on both sides of the outer frame to correct and reduce deformation, thereby minimizing the chance of silicon wafers detaching from the carrier and breaking. This also extends the service life of the silicon wafer sub-carrier and corrects even slightly deformed silicon wafer sub-carriers. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 It is a structural diagram of this embodiment.

[0017] Figure 2 It is a front view schematic diagram of this embodiment.

[0018] Figure 3 yes Figure 2 A partial enlarged view of point A in the middle.

[0019] Figure 4 It is a front view schematic diagram without the silicon wafer carrier.

[0020] Figure 5 It is a structural diagram of the compensation support rod.

[0021] Figure 6 yes Figure 5 Schematic diagram of the cross-sectional structure along BB.

[0022] Figure 7 This is a simulation diagram of the shape of the compensation support rod after the protrusion amplitude is increased.

[0023] Figure 8 It is a structural diagram of the silicon wafer sub-carrier. DETAILED DESCRIPTION

[0024] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] In the present invention, unless otherwise specified, directional words such as "up, down, left, right" are generally understood in conjunction with the directions shown in the drawings and actual applications.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0027] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," and "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "below," "below," and "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0028] The endpoints and any values ​​of the ranges disclosed herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of each range, the endpoint values ​​of each range and the individual point values, and the individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein. Among them, the terms "optional" and "optional" all mean that they may be included or not (or may be present or not).

[0029] like Figure 1 、 Figure 2 As shown, the present invention discloses a PVD carrier mechanism for compensating for deformation of a sub-carrier, which includes an outer frame 103 , a plurality of carrier mounting seats and a plurality of silicon wafer sub-carriers 101 .

[0030] In this embodiment, two substrate mounting bases and two silicon wafer sub-sub ...

[0031] Among them, such as Figure 4 As shown, the outer frame 103 comprises two sets of C-shaped channel steels that match the equipment. The carrier mounting base comprises four round support tubes 102 that form a rectangular frame. The C-shaped channel steels are installed on both sides of the two rectangular frames, fixing the two carrier mounting bases into a single unit. The outer frame 103 is 2.5m-3m long and 2m-2.5m wide.

[0032] A compensating support rod 104 is provided in the middle of the carrier mounting seat. The upper surface of the compensating support rod 104 is higher than the surrounding height of the carrier mounting seat. Specifically, the ends of the compensating support rod 104 are upwardly inclined, and the middle is flat. The inclined surfaces at both ends of the compensating support rod 104 are symmetrically arranged, with an angle of 0.55°-0.65°, and the middle protrusion is 3-5mm higher than the surrounding height of the carrier mounting seat. Figure 5 、 Figure 6 As shown. Since the amount of the compensation support rod 104 protrusion is very small, in order to more vividly show the shape of the compensation support rod protrusion, it can be seen Figure 7 As shown in the simulation of the increased shape, as the size of the silicon wafer sub-carrier 101 increases, the support and deformation-suppressing effect of the support tube 102 gradually weakens, and the overall deformation of the PVD carrier can reach 4-5mm. This deformation increases the probability of the silicon wafer being detached from the carrier and breaking. The upwardly protruding compensating support rod 104 utilizes the principle of pre-reaction to offset the downward deformation of the sub-carrier due to its own gravity, thereby reducing the probability of the silicon wafer detaching from the carrier and breaking.

[0033] Among them, such as Figure 8As shown, the wafer sub-carrier 101 is provided with a plurality of waist-shaped holes 1011 around its perimeter. The carrier mounting base is provided with a plurality of threaded holes corresponding to the waist-shaped holes 1011. Bolts pass through the waist-shaped holes 1011 to secure the wafer sub-carrier 101 to the threaded holes on the carrier mounting base. The waist-shaped holes 1011 facilitate the adjustment of the deformation of the wafer sub-carrier 101 in conjunction with the tensioning mechanism 201.

[0034] Wherein, the outer frame 103 is provided with an adjusting and tightening mechanism 201 for tightening the silicon wafer sub-carrier 101 to both sides. Figure 3 As shown, the adjustment and tensioning mechanism 201 includes an adjustment nut 2013, an adjustment bolt 2012, and a tensioning connection block 2011. The tensioning connection block 2011 is fixedly connected to the silicon wafer sub-carrier 101, and the adjustment bolt 2012 is rotatably connected to the tensioning connection block 2011. The adjustment bolt 2012 is threadedly connected to the adjustment nut 2013, and the adjustment nut 2013 is fixed to the outer frame 103.

[0035] During use, the silicon wafer sub-carrier 101 is placed on the carrier mounting base, and the adjusting bolt 2012 is threadedly connected to the adjusting nut 2013. The tightening connection block 2011 is fixedly connected to the silicon wafer sub-carrier 101 by the bolt. The tightening force of the silicon wafer sub-carrier 101 can be controlled by adjusting the screwing amount of the bolt 2012. In conjunction with the compensating support rod 104, the deformation of the silicon wafer sub-carrier 101 is corrected and reduced, and even slightly deformed silicon wafer sub-carrier 101 can be corrected. This not only prevents the silicon wafer sub-carrier 101 from being in a deformed state for a long time and prolongs the service life of the silicon wafer sub-carrier 101, but also reduces the probability of silicon wafers detaching from the carrier and breaking, thereby improving production efficiency and reducing production costs. Finally, the silicon wafer sub-carrier is fixed to the carrier mounting base with a bolt passing through the waist-shaped hole 1011 of the silicon wafer sub-carrier.

[0036] In summary, the present invention can reduce the deformation of large PVD carriers, reduce the probability of silicon wafers detaching from the carriers and breaking, and meet the demand for increasing PVD production capacity.

[0037] The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited thereto. Within the technical concept of the present invention, various simple variations of the technical solution of the present invention may be made, including combining the various technical features in any other appropriate manner. These simple variations and combinations should also be considered as disclosed in the present invention and fall within the scope of protection of the present invention.

Claims

1. A PVD carrier mechanism for compensating for deformation of a sub-carrier, characterized by: The device comprises an outer frame, a plurality of carrier mounting seats, and a plurality of silicon wafer sub-carriers; the carrier mounting seats are fixed to the outer frame; the silicon wafer sub-carriers are arranged on the carrier mounting seats in a one-to-one correspondence; a compensating support rod is provided in the middle of the carrier mounting seat, and the upper surface of the compensating support rod is higher than the height of the surrounding of the carrier mounting seat; and adjustment and tensioning mechanisms are provided on both sides of the outer frame for tightening the silicon wafer sub-carriers to both sides; The adjusting and tightening mechanism includes an adjusting nut, an adjusting bolt and a tightening connection block; the tightening connection block is fixedly connected to the silicon wafer sub-carrier, the adjusting bolt is freely rotatably connected to the tightening connection block, the adjusting bolt is threadedly connected to the adjusting nut, and the adjusting nut is fixed to the outer frame.

2. The PVD carrier mechanism for compensating for sub-carrier deformation according to claim 1, characterized in that: The two ends of the compensation support rod are upward inclined surfaces, and the middle is a flat surface.

3. The PVD carrier mechanism for compensating for sub-carrier deformation according to claim 2, characterized in that: The inclined surfaces at both ends of the compensation support rod are symmetrically arranged, the angle of the inclined surface is 0.55°-0.65°, and the middle protrusion is 3-5mm higher than the surrounding areas of the carrier plate mounting seat.

4. The PVD carrier mechanism for compensating for sub-carrier deformation according to claim 1, wherein: The outer frame includes two groups of C-shaped channel steels, and the carrier plate mounting seat includes four round support tubes forming a rectangular frame. The C-shaped channel steels are arranged on both sides of several rectangular frames to fix several carrier plate mounting seats into a whole.

5. The PVD carrier mechanism for compensating for sub-carrier deformation according to claim 1, characterized in that: There are two carrier mounting seats and two silicon wafer sub-carriers, and the length of the outer frame is 2.5m-3m; the width is 2m-2.5m.

6. The PVD carrier mechanism for compensating for sub-carrier deformation according to claim 1, wherein: The silicon wafer sub-carrier is provided with a plurality of waist-shaped holes around it, and the carrier mounting seat is provided with a plurality of threaded holes corresponding to the waist-shaped holes. Bolts pass through the waist-shaped holes to fix the silicon wafer sub-carrier to the threaded holes on the carrier mounting seat.

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