Wet etching auxiliary rotor device
By designing a wet corrosion auxiliary rotary device, the silicon wafer is rotated by rolling components and driving components, the problem of uneven contact time of the corrosion liquid at the upper and lower ends of the silicon wafer is solved, and the uniformity of the silicon wafer corrosion and product yield are improved.
Patent Information
- Application Number
- CN202422531224.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-18
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-10-18
AI Technical Summary
During the manufacturing process of semiconductor silicon wafers, during wet corrosion, the corrosion effect is uneven due to the time difference between the upper and lower ends of the silicon wafers and the corrosion rate is affected, which is affected.
A wet corrosion auxiliary rotor device is designed, including corrosion grooves, rolling components, support members and baskets. The rolling components drive the silicon wafer in the basket to rotate, so that the upper and lower ends of the silicon wafer contact the corrosion liquid consistently. The Tefron roller and stepper motor drive components are used to ensure uniform rotation.
The uniformity of silicon wafer corrosion is achieved and the product yield is significantly improved.
Smart Images
Figure CN223273225U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor manufacturing, and in particular to a wet etching auxiliary wafer transfer device. Background Art
[0002] Wet etching is a critical step in the semiconductor silicon wafer manufacturing process. It uses a chemical solution to precisely etch the wafer surface. Typically, an operator places a basket of wafers to be etched in a designated location. A robotic arm then lifts the basket and slowly immerses it in a tank filled with the etchant. However, since the bottom of the wafers come into contact with the etchant first, followed by the top, when the robotic arm lifts the wafers after etching is complete, the top leaves the etchant first, followed by the bottom. This difference in the amount of time the top and bottom ends of the wafers are in contact with the etchant can lead to uneven etching results, affecting product yield. Utility Model Content
[0003] In order to overcome the technical problems mentioned in the above technical background, an embodiment of the present application provides a wet etching auxiliary transfer device, the wet etching auxiliary transfer device comprising:
[0004] The corrosion groove comprises a receiving space formed by a groove bottom and a groove wall;
[0005] A rolling assembly is provided between two opposite groove walls, wherein the extending direction of the rolling assembly is parallel to the extending direction of the groove bottom;
[0006] Support members are provided on opposite sides of the rolling assembly;
[0007] A wafer basket is fixed in the accommodating space by the support member, and the wafer basket is used to accommodate silicon wafers to be corroded. The bottom of the wafer basket has a groove, and the groove exposes at least part of the silicon wafer. The rolling assembly contacts the exposed silicon wafer, and the rolling assembly is used to drive the silicon wafers to be corroded in the wafer basket to rotate so that the silicon wafers are corroded evenly.
[0008] In a possible implementation, the support member includes a first support member and a second support member, and the first support member and the second support member are respectively located on opposite sides of the rolling assembly;
[0009] The orthographic projections of the first support member and the second support member on the groove bottom are parallel to the orthographic projection of the rolling assembly on the groove bottom.
[0010] In a possible implementation, the groove wall includes a first groove wall and a second groove wall that are oppositely disposed, and the rolling assembly includes a rolling shaft and a rolling element, wherein one end of the rolling shaft is connected to the first groove wall, and the other end is connected to the second groove wall;
[0011] The rolling element is sleeved on the rolling shaft.
[0012] In a possible implementation, the rolling element includes a Teflon roller.
[0013] In a possible implementation, the wet etching auxiliary rotor device further includes a driving assembly, the driving assembly includes a driving member, and the driving member is disposed near the second groove wall;
[0014] The second groove wall includes a through hole, and the driving member is electrically connected to the rolling shaft through the through hole. The driving member is used to drive the rolling shaft to rotate and thereby drive the rolling member to rotate.
[0015] In a possible implementation, the driving assembly further includes a control unit, which is connected to the driving member and is configured to set the number of revolutions that the driving member drives the rolling shaft to rotate.
[0016] In a possible implementation, the sheet basket includes fixed legs, which are provided on opposite sides of the slot, and the extending direction of the fixed legs is perpendicular to the extending direction of the rolling assembly;
[0017] The sheet basket is fixed on the support member through the cooperation between the fixed legs and the support member.
[0018] In a possible implementation manner, in a direction perpendicular to the groove bottom, there is a gap between the rolling assembly and the groove bottom.
[0019] In a possible implementation, in a direction perpendicular to the groove bottom, the cross-sectional shape of the rolling assembly and the support member includes a circle.
[0020] In a possible implementation, the corrosion trough, the rolling assembly, the support member, and the sheet basket are made of corrosion-resistant materials.
[0021] Based on any of the above aspects, the embodiments of the present application provide a wet etching auxiliary wafer transfer device. Thus, through the above structure, the uniformity of the silicon wafer etching effect is ensured, thereby significantly improving the product yield. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.
[0023] Figure 1A schematic diagram from a first angle of a wet etching auxiliary transfer device provided in this embodiment;
[0024] Figure 2 A schematic diagram of the etching tank provided in this embodiment;
[0025] Figure 3 A schematic diagram from a second angle showing a partial structure of a wet etching auxiliary transfer device provided in this embodiment;
[0026] Figure 4 This is a possible state of the silicon wafer provided in this embodiment before the wet etching auxiliary wafer transfer device operates;
[0027] Figure 5 This embodiment provides a possible state of the silicon wafer after the wet etching auxiliary transfer device operates.
[0028] Icons: 1-wet etching auxiliary transfer device, 2-silicon wafer, 10-etching groove, 100-groove bottom, 110-groove wall, 1101-first groove wall, 1102-second groove wall, 120-accommodation space, 20-rolling assembly, 200-rolling shaft, 210-rolling member, 30-support member, 300-first support member, 310-second support member, 40-wafer basket, 400-slotting, 410-fixed support leg, 50-driving assembly, 500-driving member. DETAILED DESCRIPTION
[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.
[0030] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.
[0031] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.
[0032] In the description of this application, it should be noted that the terms "upper" and "lower" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or the orientations or positional relationships in which the product of this application is typically placed when in use. These terms are intended solely to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" and the like are used solely for distinction and should not be construed as indicating or implying relative importance.
[0033] It should be noted that, in the absence of conflict, different features in the embodiments of the present application can be combined with each other.
[0034] In order to solve the technical problems mentioned in the above background technology, the inventors innovatively designed the following technical solutions, and the specific implementation solutions of this application will be described in detail with reference to the accompanying drawings.
[0035] See Figure 1 and Figure 2 , Figure 1 This is a front view of a wet etching auxiliary transfer device 1 provided in this embodiment. Figure 2 The wet etching auxiliary wafer transfer device 1 includes an etching tank 10 , a rolling assembly 20 , a support member 30 and a wafer basket 40 .
[0036] The etching tank 10 includes a receiving space 120 formed by a tank bottom 100 and tank walls 110. A rolling assembly 20 is disposed between two opposing tank walls 110, with the rolling assembly 20 extending parallel to the extending direction of the tank bottom 100. Support members 30 are disposed on opposite sides of the rolling assembly 20. A wafer basket 40 is secured within the receiving space 120 via the support members 30. The wafer basket 40 is used to receive the silicon wafers 2 to be etched. The bottom of the wafer basket 40 has a slot 400 that exposes at least a portion of the silicon wafers. The rolling assembly 20 contacts the exposed silicon wafers 2 and is used to rotate the silicon wafers 2 to be etched in the wafer basket 40 so that the silicon wafers 2 are etched evenly.
[0037] In this embodiment, the etching tank 10 is used to hold etching liquid, the support member 30 provides support for the wafer basket 40, and the rolling assembly 20 drives the silicon wafer 2 to rotate. When the wafer basket 40 is placed in the etching tank 10, it is fixed within the accommodating space 120 by the support member 30. At this time, the silicon wafer 2 to be etched in the wafer basket 40 contacts the rolling assembly 20 through the slot 400. The rolling assembly 20 drives the silicon wafer 2 to rotate, causing the upper and lower ends of the silicon wafer 2 to be reversed. This can reduce the difference in the time the upper and lower ends of the silicon wafer 2 are in contact with the etching liquid, thereby reducing the problem of uneven etching, which helps to improve etching quality and product yield.
[0038] It is worth noting that the etching liquid can be a mixture of hydrofluoric acid (HF) and nitric acid (HNO3) for removing the oxide layer on the surface of the silicon wafer, or a sodium hydroxide (NaOH) solution, etc. The type of etching liquid contained in the etching tank 10 is not specifically limited here and should be selected according to actual conditions. In addition, the height of the etching liquid in the etching tank 10 should be sufficient to immerse the silicon wafer 2 to be etched in the wafer basket 40.
[0039] Further, see Figure 1 and Figure 3 , Figure 3 The top view of the corrosion tank 10, the rolling assembly 20, the support member 30 and the driving assembly 50 provided in this embodiment. The support member 30 includes a first support member 300 and a second support member 310, which are respectively located on opposite sides of the rolling assembly 20.
[0040] The orthographic projections of the first support member 300 and the second support member 310 on the groove bottom 100 are parallel to the orthographic projection of the rolling assembly 20 on the groove bottom 100 .
[0041] In this embodiment, the support member 30 can be cylindrical and positioned between two opposing tank walls 110. The first and second support members 300, 310 are positioned on opposing sides of the rolling assembly 20 to ensure the stability of the wafer basket 40. Furthermore, the orthographic projections of the first and second support members 300, 310 on the tank bottom 100 are parallel to the orthographic projection of the rolling assembly 20 on the tank bottom 100, ensuring uniform etching of the silicon wafer 2.
[0042] Further, please see again Figure 1 and Figure 3 The groove wall 110 includes a first groove wall 1101 and a second groove wall 1102 arranged opposite to each other. The rolling assembly 20 includes a rolling shaft 200 and a rolling member 210. One end of the rolling shaft 200 is connected to the first groove wall 1101, and the other end is connected to the second groove wall 1102.
[0043] The rolling element 210 is sleeved on the rolling shaft 200 .
[0044] In this embodiment, the rolling shaft 200 drives the rolling element 210 to rotate. Since the rolling element 210 is in direct contact with the silicon wafer 2, the surface of the rolling element 210 needs to have a low friction coefficient and high wear resistance to reduce wear and corrosion during rotation.
[0045] Furthermore, the rolling element 210 includes a Teflon roller.
[0046] In the present embodiment, Teflon roller generally refers to a roller made of polytetrafluoroethylene (PTFE) as a material. It has high-quality corrosion resistance, low friction coefficient, high lubrication non-stickiness, good electrical insulation and other performance. Wherein, the low friction coefficient of the Teflon roller helps to reduce the wear and tear of the silicon wafer 2 during rotation, while also reducing energy consumption and improving the service life of the equipment. In addition, the non-stick property of the Teflon roller helps to prevent the silicon wafer 2 from adhering to the roller, which is all useful for the cleaning and subsequent processing of the silicon wafer 2.
[0047] Further, see Figure 3 The wet etching auxiliary transfer device 1 further includes a driving assembly 50 , which includes a driving member 500 , and the driving member 500 is disposed close to the second groove wall 1102 .
[0048] The second groove wall 1102 includes a through hole (not shown in the figure), and the driving member 500 is electrically connected to the rolling shaft 200 through the through hole. The driving member 500 is used to drive the rolling shaft 200 to rotate and thereby drive the rolling member 210 to rotate.
[0049] In this embodiment, the driving member 500 can be a stepper motor drive, which drives the rolling shaft 200, which in turn drives the rolling member 210 to rotate, thereby rotating the silicon wafer 2 and improving the uniformity of etching. Using a stepper motor drive to rotate the rolling assembly 20 rather than manually rotating the rolling assembly 20 ensures that the silicon wafers 2 to be etched in the wafer basket 40 rotate at a constant speed, ensuring more uniform contact between the silicon wafers 2 and the etching solution.
[0050] It is worth noting that the driving member 500 can drive the rolling assembly 20 to rotate clockwise or counterclockwise. The specific rotation direction is not specifically limited here and needs to be set according to actual conditions.
[0051] Further, please see again Figure 3 The driving assembly 50 further includes a control unit (not shown in the figure), which is connected to the driving member 500 and is used to set the number of revolutions that the driving member 500 drives the rolling shaft 200 to rotate.
[0052] In this embodiment, the control unit can preset the number of revolutions that the driving member 500 drives the rolling shaft 200 to rotate. In actual applications, the number of pulses can be programmed to control the number of revolutions of the driving member 500. For example, the number of revolutions preset by the control unit causes the rolling shaft 200 to drive the rolling member 210, which in turn drives the silicon wafers 2 to be etched in the wafer basket 40 to rotate 180°, thereby achieving uniform etching.
[0053] It is worth noting that the control unit can be a programmable logic controller or a computer system.
[0054] Further, see Figure 1 The sheet basket 40 includes fixed legs 410 , which are disposed on opposite sides of the slot 400 . The extending direction of the fixed legs 410 is perpendicular to the extending direction of the rolling assembly 20 .
[0055] The film basket 40 is fixed on the support member 30 by the cooperation between the fixing legs 410 and the support member 30 .
[0056] In this embodiment, fixed legs 410 are disposed on opposite sides of the slot 400 of the film basket 40 and are perpendicular to the extension direction of the rolling assembly 20. The fixed legs 410 cooperate with the support member 30 to provide necessary support for the film basket 40. The fixed legs 410 and the support member 30 are disposed in a corresponding manner. This design also allows the robot to flexibly move the film basket 40. First, the robot places the film basket 40 into the etching tank 10 and secures it to the support member 30. After etching is completed, the robot moves the film basket 40 out of the etching tank 10 for subsequent operations.
[0057] Further, please see again Figure 1 In the direction perpendicular to the groove bottom 100 , there is a gap between the rolling assembly 20 and the groove bottom 100 .
[0058] In this embodiment, the gap between the rolling assembly 20 and the groove bottom 100 is to prevent the rolling element 210 in the rolling assembly 20 from directly contacting the groove bottom 100, which may cause wear between the rolling element 210 and the groove bottom 100, and also to ensure the stability of the rolling element 210 during rotation.
[0059] Further, please see again Figure 1 , in a direction perpendicular to the groove bottom 100 , the cross-sectional shape of the rolling assembly 20 and the support member 30 includes a circle.
[0060] Furthermore, the corrosion tank 10, the rolling assembly 20, the support member 30 and the sheet basket 40 are made of corrosion-resistant materials.
[0061] In this embodiment, the materials used to make the etching tank 10, rolling assembly 20, support member 30, and film basket 40 should be resistant to chemical and electrochemical corrosion, thereby extending their service life and reducing maintenance costs. For example, the materials can be stainless steel, special alloys, or ceramic materials.
[0062] See Figure 4 and Figure 5 , Figure 4 The following example illustrates a possible state in which the silicon wafer 2 is placed in the etching tank 10 before the wet etching auxiliary transfer device 1 is operated. Figure 5 The following illustrates a possible state of the silicon wafer 2 after the wet etching auxiliary wafer transfer device 1 operates.
[0063] First, the robot puts the wafer basket 40 into the etching tank 10, and the etching liquid in the etching tank 10 immerses the silicon wafer 2 to be etched in the wafer basket 40. At this time, the shadow part of the silicon wafer 2 is at the upper end.
[0064] Next, the driver 500 rotates the rolling assembly 20 according to the number of revolutions preset by the control unit, thereby rotating the silicon wafer 2. After the rolling assembly 20 has rotated the preset number of revolutions, the shaded portion of the silicon wafer 2 is at the bottom, and the top and bottom of the silicon wafer 2 are reversed, ensuring that the top and bottom ends of the silicon wafer 2 are exposed to the etching solution for the same amount of time, achieving uniform etching.
[0065] Finally, the robot moves the wafer basket 40 out of the etching tank 10 .
[0066] In summary, the present application provides a wet-etching auxiliary wafer transfer device. The wet-radiation auxiliary wafer transfer device includes an etching trough, a rolling assembly, a support member, and a wafer basket. The etching trough includes a accommodating space formed by a trough bottom and a trough wall. The rolling assembly is arranged between two opposite trough walls, and its extension direction is parallel to the extension direction of the trough bottom. The support members are arranged on opposite sides of the rolling assembly. The wafer basket is fixed in the accommodating space by the support member. The wafer basket is used to accommodate silicon wafers to be etched. The bottom of the wafer basket has a slot that exposes at least part of the silicon wafer. The rolling assembly contacts the exposed silicon wafer. The rolling assembly is used to drive the silicon wafer to be etched in the wafer basket to rotate so that the silicon wafer is etched evenly. In this way, through the above structure, the uniformity of the silicon wafer etching effect is ensured, thereby significantly improving the product yield.
[0067] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.
Claims
1. A wet etching auxiliary transfer device, characterized in that: The device comprises: The corrosion groove comprises a receiving space formed by a groove bottom and a groove wall; A rolling assembly is provided between two opposite groove walls, wherein the extending direction of the rolling assembly is parallel to the extending direction of the groove bottom; Support members are provided on opposite sides of the rolling assembly; A wafer basket is fixed in the accommodating space by the support member, and the wafer basket is used to accommodate silicon wafers to be corroded. The bottom of the wafer basket has a groove, and the groove exposes at least part of the silicon wafer. The rolling assembly contacts the exposed silicon wafer, and the rolling assembly is used to drive the silicon wafers to be corroded in the wafer basket to rotate so that the silicon wafers are corroded evenly.
2. The wet etching auxiliary transfer device according to claim 1, wherein: The support member includes a first support member and a second support member, wherein the first support member and the second support member are respectively located on opposite sides of the rolling assembly; The orthographic projections of the first support member and the second support member on the groove bottom are parallel to the orthographic projection of the rolling assembly on the groove bottom.
3. The wet etching auxiliary transfer device according to claim 1, wherein: The groove wall includes a first groove wall and a second groove wall arranged opposite to each other, and the rolling assembly includes a rolling shaft and a rolling element, wherein one end of the rolling shaft is connected to the first groove wall, and the other end is connected to the second groove wall; The rolling element is sleeved on the rolling shaft.
4. The wet etching auxiliary transfer device according to claim 3, wherein: The rolling element includes a Teflon roller.
5. The wet etching auxiliary transfer device according to claim 3, wherein: The wet etching auxiliary rotating device further includes a driving assembly, the driving assembly includes a driving member, and the driving member is arranged close to the second groove wall; The second groove wall includes a through hole, and the driving member is electrically connected to the rolling shaft through the through hole. The driving member is used to drive the rolling shaft to rotate and thereby drive the rolling member to rotate.
6. The wet etching auxiliary transfer device according to claim 5, wherein: The driving assembly further includes a control unit, which is connected to the driving member and is used to set the number of revolutions that the driving member drives the rolling shaft to rotate.
7. The wet etching auxiliary transfer device according to claim 1, wherein: The sheet basket includes fixed legs, which are arranged on opposite sides of the slot, and the extending direction of the fixed legs is perpendicular to the extending direction of the rolling assembly; The sheet basket is fixed on the support member through the cooperation between the fixed legs and the support member.
8. The wet etching auxiliary transfer device according to claim 1, wherein: In a direction perpendicular to the groove bottom, there is a gap between the rolling assembly and the groove bottom.
9. The wet etching auxiliary transfer device according to claim 1, wherein: In a direction perpendicular to the groove bottom, the cross-sectional shape of the rolling assembly and the support member includes a circle.
10. The wet etching auxiliary transfer device according to claim 1, wherein: The corrosion trough, the rolling assembly, the support member and the sheet basket are made of corrosion-resistant materials.