Wafer centering mechanism and semiconductor processing equipment

Abstract

The utility model relates to the technical field of semiconductor processing equipment, in particular to a wafer centering mechanism and semiconductor processing equipment, and the wafer centering mechanism comprises a lifting assembly which extends along the vertical direction; each centering unit comprises a pushing handle assembly, an adjustable damper, a driving assembly and a base, the pushing handle assembly, the adjustable damper and the driving assembly are arranged on the top face of the base, pushing handles are arranged at the end, facing the lifting assembly, of the pushing handle assembly, and the driving assembly can drive the pushing handle assembly to move in the first direction so as to adjust the distance between the two pushing handles; the free end of the adjustable damper is connected with the pushing handle assembly, the fixed end of the adjustable damper is fixed to the top face of the base, and the position, relative to the base, of the fixed end in the first direction is adjustable so that the minimum distance between the two pushing handles can be adjusted. The sensor is located on one side of the lifting assembly. The wafer centering device at least facilitates accurate and stable centering operation on wafers of various models.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor processing equipment, and in particular relates to a wafer centering mechanism and semiconductor processing equipment. Background Art

[0002] A wafer is a chip used to make silicon semiconductor circuits. The starting material can be silicon. The main wafer processing methods are sheet processing and batch processing, which involves processing a single wafer or multiple wafers simultaneously.

[0003] Wafers can be cut from silicon ingots. During the cutting process, some wafer sizes will have a small V-shaped notch cut into them, called a notch. The notch is used to locate the wafer through edge detection, facilitating subsequent wafer processing.

[0004] In the prior art, when wafer positioning is achieved through edge detection, the center of the wafer needs to be positioned to the desired position for centering operation. After the wafer centering is completed, edge detection is performed. However, the current wafer centering cannot perform centering operations for wafers of different sizes, resulting in poor versatility of the wafer edge detection device. Utility Model Content

[0005] In view of this, the present invention aims to provide a wafer centering mechanism and semiconductor processing equipment, which are at least conducive to achieving accurate and stable centering operations on wafers of various models.

[0006] In order to achieve the above-mentioned purpose, the technical solution of the utility model is achieved as follows:

[0007] On the one hand, the utility model provides a wafer centering mechanism, comprising: a lifting assembly extending in a vertical direction, the top of the lifting assembly is used to carry the wafer, and the lifting assembly is used to drive the wafer to rotate and perform lifting movements; two centering units arranged opposite to each other, and the two centering units are located on opposite sides of the lifting assembly in a first direction; each centering unit comprises: a pusher assembly, an adjustable damping, a drive assembly and a base, the pusher assembly, the adjustable damping and the drive assembly are arranged on the top surface of the base, the pusher assembly has a pusher at one end facing the lifting assembly, the pusher assembly is connected to the drive assembly at one end away from the lifting assembly, the drive assembly can drive the pusher assembly to move in a first direction to adjust the distance between the two pushers, the free end of the adjustable damping is connected to the pusher assembly, the fixed end of the adjustable damping is fixed on the top surface of the base, the direction in which the free end points to the fixed end is the direction in which the drive assembly points to the pusher assembly, and the position of the fixed end relative to the base in the first direction is adjustable to adjust the minimum distance between the two pushers; a sensor, the sensor is located on one side of the lifting assembly, and the sensor is used to identify the positioning notch at the edge of the wafer.

[0008] Furthermore, the lifting assembly includes a vacuum suction cup and a lifting unit extending in a vertical direction. The vacuum suction cup is arranged on the top of the lifting unit, and the vacuum suction cup is away from the top surface of the lifting unit for supporting the wafer.

[0009] Furthermore, the base includes: a base and a mounting plate arranged in a vertical direction, the mounting plate is arranged on the top of the base, and the top surface of the mounting plate away from the base serves as the top surface of the base.

[0010] Furthermore, the driving assembly includes a cylinder, which includes a telescopic rod and a fixed part connected to each other. The fixed part is fixed to the top surface of the base, and the end of the telescopic rod away from the fixed part is connected to an end of the push handle assembly away from the lifting assembly. The length of the telescopic rod relative to the fixed part in the first direction is adjustable.

[0011] Furthermore, the push handle assembly includes a stabilizing member, a floating joint, a slider and a guide rail. The push handle, the stabilizing member and the floating joint are connected in sequence in a direction away from the lifting assembly, and the end of the floating joint away from the stabilizing member is connected to the telescopic rod; the side of the stabilizing member facing the base is fixed to the slider, and the side of the slider away from the stabilizing member is arranged on the guide rail, and the guide rail is arranged on the top surface of the base.

[0012] Furthermore, the stabilizing member includes: a connected stabilizing block and a stabilizing plate, the opposite ends of the stabilizing plate in the first direction are respectively connected to the push handle and the stabilizing block, and the end of the stabilizing block away from the stabilizing plate is connected to the floating joint; the top surface of the base has a groove, the stabilizing block has a protrusion, and the protrusion extends toward the groove; the adjustable damper is arranged in the groove, and the free end of the adjustable damper is connected to the protrusion.

[0013] Furthermore, the top surface of the base has two grooves, which are arranged at intervals in a direction perpendicular to the first direction; the guide rail is arranged on the top surface of the base between the two grooves; each centering unit includes two adjustable dampers, which are symmetrically arranged in the corresponding grooves on both sides of the guide rail.

[0014] Furthermore, the fixed end is arranged on the top surface of the base through a fixing part, the fixing part has a limiting hole that passes through the fixing part along a first direction, the inner wall of the limiting hole has a first thread, and the outer surface of the fixed end has a second thread that matches the first thread. The fixed end passes through the limiting hole to be screwed into the fixing part, and the fixed end rotates relative to the limiting hole to adjust the position of the fixed end relative to the base along the first direction.

[0015] Furthermore, the edge shape of the pusher away from the pusher assembly is an arc shape that matches the edge shape of the wafer.

[0016] On the other hand, the present invention further provides a semiconductor processing device, which includes: the above-mentioned wafer centering mechanism.

[0017] Compared with the prior art, the present invention can achieve the following beneficial effects: after the wafer is transferred to the top of the lifting assembly, the lifting assembly lifts the wafer and then drops it to a position consistent with the horizontal height of the pusher. The driving assembly in the two relatively arranged centering units drives the pusher assembly to move the two relatively arranged pushers toward the wafer, clamp and center the wafer, and adjust the center of the wafer to the required positioning position. The adjustable damping is used to buffer the force of the driving assembly. In addition, the position of the fixed end of the adjustable damping is adjustable. By adjusting the position of the fixed end of the adjustable damping, the minimum distance between the two relatively arranged pushers can be adjusted. The smaller the minimum distance between the two pushers, the smaller the wafer size that can be centered and clamped by the pushers, thereby realizing centering operations on wafers of various models. After the wafer is centered, the lifting assembly drives the wafer to rotate, and the sensor recognizes the positioning notch of the wafer to realize edge-finding operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which constitute part of the present invention, are intended to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are intended to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings:

[0019] Figure 1 This is a schematic structural diagram of the wafer centering mechanism according to an embodiment of the present utility model;

[0020] Figure 2 This is a structural diagram of the centering unit according to an embodiment of the present utility model;

[0021] Figure 3 This is an exploded view of the centering unit according to an embodiment of the present utility model;

[0022] Figure 4 This is a schematic structural diagram of the adjustable damping and fixing member described in an embodiment of the present utility model.

[0023] Explanation of the accompanying drawings: 300, lifting assembly; X, first direction; 100, push handle assembly; 160, adjustable damping; 200, driving assembly; 120, base; 110, push handle; 162, free end; 161, fixed end; 400, sensor; 310, vacuum suction cup; 320, lifting unit; 122, base; 121, mounting plate; 210, telescopic rod; 220, fixing part; 230, cylinder bracket; 130, stabilizing member; 140, floating joint; 150, guide rail; 151, slider; 132, stabilizing block; 131, stabilizing plate; 123, groove; 170, fixing member; 171, nut; 172, mounting member. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and do not constitute a limitation of the present invention.

[0025] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein can be combined with each other.

[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0027] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0028] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0029] refer to Figures 1 to 4On the one hand, the utility model provides a wafer centering mechanism, which includes: a lifting assembly 300 extending in the vertical direction, the top of the lifting assembly 300 is used to carry the wafer, and the lifting assembly 300 is used to drive the wafer to rotate and perform lifting movements; two centering units are arranged opposite to each other, and the two centering units are located on opposite sides of the lifting assembly 300 in the first direction X; each centering unit includes: a pusher assembly 100, an adjustable damper 160, a drive assembly 200 and a base 120, the pusher assembly 100, the adjustable damper 160 and the drive assembly 200 are arranged on the top surface of the base 120, the pusher assembly 100 has a pusher 110 at one end facing the lifting assembly 300, and the pusher assembly 100 is away from the lifting assembly One end of the component 300 is connected to the driving component 200, and the driving component 200 can drive the pushing hand component 100 to move along the first direction X to adjust the distance between the two pushing hands 110. The free end 162 of the adjustable damper 160 is connected to the pushing hand component 100, and the fixed end 161 of the adjustable damper 160 is fixed on the top surface of the base 120. The direction in which the free end 162 points to the fixed end 161 is the direction in which the driving component 200 points to the pushing hand component 100. The position of the fixed end 161 relative to the base 120 in the first direction X is adjustable to adjust the minimum distance between the two pushing hands 110; the sensor 400, the sensor 400 is located on one side of the lifting component 300, and the sensor 400 is used to identify the positioning notch at the edge of the wafer.

[0030] Usually, a robot is used to transfer the wafer to the top of the lifting assembly 300, the lifting assembly 300 lifts the wafer, the robot moves away, and the lifting assembly 300 falls to a position consistent with the horizontal height of the pusher 110. The driving assembly 200 in the two centering units arranged opposite to each other drives the pusher assembly 100, and then drives the two opposite pushers 110 to move the two opposite pushers 110 toward the wafer, centering and clamping the wafer, so that the center of the wafer is adjusted to the required positioning position. The adjustable damper 160 can buffer the thrust of the driving assembly 200 to prevent the pusher 110 from contacting the wafer too quickly and causing damage to the wafer. In addition, the position of the fixed end 161 of the adjustable damper 160 is adjustable. By adjusting the position of the fixed end 161 of the adjustable damper 160, The minimum distance between the two relatively set pushers 110 can be adjusted. The smaller the minimum distance between the two pushers 110, the smaller the wafer size that the pushers 110 can achieve centering and clamping operations. The larger the minimum distance between the two pushers 110, the larger the wafer size that the pushers 110 can achieve centering and clamping operations, thereby realizing centering operations on wafers of various models. After the wafer is centered, the pushers 110 move away from the wafer, the lifting assembly 300 drives the wafer to rotate, and the sensor 400 identifies the positioning notch of the wafer and performs edge-finding operations. The edge-finding operation refers to: rotating the wafer so that the positioning notch of the wafer faces a fixed direction, and performing the same operation on other wafers so that the positioning notches of all wafers are adjusted to the same direction.

[0031] Furthermore, the lifting assembly 300 includes a vacuum chuck 310 and a lifting unit 320 extending in a vertical direction. The vacuum chuck 310 is disposed on top of the lifting unit 320, away from the top surface of the lifting unit 320, and is used to support the wafer. The lifting unit 320 is used to drive the vacuum chuck 310 up and down. The vacuum chuck 310 can vacuum-absorb the wafer it supports, thereby fixing the wafer to the top surface of the vacuum chuck 310. The vacuum chuck 310 can drive the wafer to rotate, thereby realizing the edge-finding operation of the wafer using the sensor 400.

[0032] In some embodiments of the present invention, the lifting unit 320 can drive the vacuum chuck 310 to move up and down. The structure of the lifting unit 320 will not be described in detail here; it is sufficient to ensure that the lifting unit 320 can drive the vacuum chuck 310 to move up and down. The lifting unit 320 also includes a spline and a rotary motor. After the wafer is centered, the rotary motor drives the spline to rotate, and the vacuum chuck 310 is screwed onto the upper end of the spline. The rotation of the vacuum chuck 310 rotates the wafer. The sensor 400 is a photoelectric sensor. When the photoelectric sensor recognizes the wafer's positioning notch, the vacuum chuck 310 stops rotating.

[0033] Furthermore, the base 120 includes a base 122 and a mounting plate 121 arranged in a vertical direction. The mounting plate 121 is disposed on top of the base 122, and the top surface of the mounting plate 121 away from the base 122 serves as the top surface of the base 120. The base 122 is used to mount the push handle 110 at a desired installation height, and the mounting plate 121 is used to mount the push handle 110, the push handle assembly 100, the drive assembly 200, and the adjustable damper 160. The mounting plate 121 and the base 122 are detachably connected to facilitate installation and removal of components such as the push handle 110, the push handle assembly 100, the drive assembly 200, and the adjustable damper 160.

[0034] Furthermore, the drive assembly 200 is a pneumatic cylinder comprising a telescopic rod 210 and a fixed portion 220 connected to each other. The fixed portion 220 is fixed to the top surface of the base 120. The end of the telescopic rod 210 away from the fixed portion 220 is connected to the end of the pusher assembly 100 away from the lifting assembly 300. The length of the telescopic rod 210 relative to the fixed portion 220 in the first direction X is adjustable. In other words, the telescopic rod 210 is retractable relative to the fixed portion 220 to provide a push or pull force to the pusher assembly 100, thereby moving the pusher 110 toward the wafer or away from the wafer.

[0035] In some embodiments of the present invention, the fixing portion 220 is fixed to the top surface of the base 120 via a cylinder bracket 230 .

[0036] Furthermore, the push handle assembly 100 includes a stabilizing member 130, a floating joint 140, a slider 151 and a guide rail 150. The push handle 110, the stabilizing member 130 and the floating joint 140 are connected in sequence in a direction away from the lifting assembly 300, and the end of the floating joint 140 away from the stabilizing member 130 is connected to the telescopic rod 210; the side of the stabilizing member 130 facing the base 120 is fixed to the slider 151, and the side of the slider 151 away from the stabilizing member 130 is set on the guide rail 150, and the guide rail 150 is set on the top surface of the base 120.

[0037] The floating joint 140 is in a non-contact state with the top surface of the base 120 and the guide rail 150, so it is in a floating state. The stabilizing member 130 is fixed to the slider 151, and the slider 151 is set on the guide rail 150. When the telescopic rod 210 drives the stabilizing member 130 to move through the floating joint 140, and then drives the push handle 110 to move, the slider 151 under the stabilizing member 130 slides accordingly on the guide rail 150. This is beneficial to improving the movement stability of the push handle assembly 100, and thus helps to alleviate the shaking phenomenon of the push handle 110.

[0038] Furthermore, the stabilizing member 130 includes: a connected stabilizing block 132 and a stabilizing plate 131, the opposite ends of the stabilizing plate 131 in the first direction X are respectively connected to the push handle 110 and the stabilizing block 132, and the end of the stabilizing block 132 away from the stabilizing plate 131 is connected to the floating joint 140; the top surface of the base 120 has a groove 123, the stabilizing block 132 has a protrusion, and the protrusion extends toward the groove 123; the adjustable damper 160 is arranged in the groove 123, and the free end 162 of the adjustable damper 160 is connected to the protrusion. The protrusion and the groove 123 provide an installation area for the adjustable damper 160. Installing the adjustable damper 160 in the groove 123 is conducive to avoiding the installation position of the adjustable damper 160 from conflicting with the push handle assembly 100. The push handle assembly 100 is arranged above the adjustable damper 160 away from the base 120, but the operation or position change of the adjustable damper 160 does not interfere with the operation of the push handle 110. By extending the protrusion into the groove 123 and connecting with the adjustable damper 160, the tension or thrust provided by the telescopic rod 210 can be transmitted to the free end 162 of the adjustable damper 160 through the protrusion.

[0039] Furthermore, the top surface of the base 120 has two grooves 123 spaced apart in a direction perpendicular to the first direction X. The guide rail 150 is disposed on the top surface of the base 120 between the two grooves 123. Each centering unit includes two adjustable dampers 160 symmetrically disposed within corresponding grooves 123 on either side of the guide rail 150. The symmetrical arrangement of the two adjustable dampers 160 on either side of the guide rail 150 provides a more uniform and stable force buffering effect on the push handle assembly 100.

[0040] Furthermore, the fixed end 161 is set on the top surface of the base 120 through the fixing member 170, and the fixing member 170 has a limiting hole that passes through the fixing member 170 along the first direction X. The inner wall of the limiting hole has a first thread, and the outer surface of the fixed end 161 has a second thread that matches the first thread. The fixed end 161 passes through the limiting hole to be screwed into the fixing member 170, and the fixed end 161 rotates relative to the limiting hole to adjust the position of the fixed end 161 relative to the base 120 along the first direction X.

[0041] In some embodiments of the present invention, reference Figure 4 and Figure 2 The fixing member 170 includes two nuts 171 and a mounting member 172. The first thread is a thread within the screw hole of the nut 171. The mounting member 172 is fixed to the top surface of the base 120. The mounting member 172 has a mounting hole that passes through the mounting member 172 along the first direction X. The adjustable damper 160 passes through the mounting hole. The two nuts 171 are screwed onto the outer ring of the fixing member 170. The two nuts 171 are located on opposite sides of the mounting member 172 in the first direction X and contact the mounting member 172. When the position of the fixing member 170 needs to be adjusted in the first direction X, the position of the fixing member 170 relative to the two nuts 171 is adjusted, and the position of the fixing member 170 in the first direction X can be adjusted relative to the base. The greater the distance between the fixing member 170 and the fixing portion 220, the smaller the minimum distance between the two opposing pushers 110, and the smaller the corresponding wafer size.

[0042] Furthermore, the edge shape of the pusher 110 away from the pusher assembly 100 is an arc shape that matches the edge shape of the wafer.

[0043] On the other hand, the present invention further provides a semiconductor processing device, which includes: the above-mentioned wafer centering mechanism.

[0044] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this disclosure can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution disclosed in this disclosure can be achieved. This is not a limitation herein.

[0045] The above specific embodiments do not limit the scope of protection of this utility model. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model shall be included within the scope of protection of this utility model.

Claims

1. A wafer centering mechanism, characterized in that: include: A lifting assembly extending in a vertical direction, wherein the top of the lifting assembly is used to support the wafer, and the lifting assembly is used to drive the wafer to rotate and perform lifting motion; Two centering units are arranged opposite to each other, and the two centering units are located on opposite sides of the lifting assembly in the first direction; Each of the centering units includes: a push handle assembly, an adjustable damper, a drive assembly and a base, the push handle assembly, the adjustable damper and the drive assembly are arranged on the top surface of the base, the push handle assembly has a push handle at one end facing the lifting assembly, the push handle assembly is connected to the drive assembly at one end away from the lifting assembly, the drive assembly can drive the push handle assembly to move along the first direction to adjust the distance between the two push hands, the free end of the adjustable damper is connected to the push handle assembly, the fixed end of the adjustable damper is fixed to the top surface of the base, the direction of the free end pointing to the fixed end is the direction of the drive assembly pointing to the push handle assembly, and the position of the fixed end relative to the base in the first direction is adjustable to adjust the minimum distance between the two push hands; A sensor is located on one side of the lifting assembly and is used to identify the positioning notch at the edge of the wafer.

2. The wafer centering mechanism according to claim 1, characterized in that: The lifting assembly includes a vacuum suction cup and a lifting unit extending in a vertical direction. The vacuum suction cup is arranged on the top of the lifting unit. The vacuum suction cup is away from the top surface of the lifting unit and is used to carry the wafer.

3. The wafer centering mechanism according to claim 1, wherein: The base includes: a base and a mounting plate arranged in a vertical direction, the mounting plate is arranged on the top of the base, and the top surface of the mounting plate away from the base serves as the top surface of the base.

4. The wafer centering mechanism according to claim 1, wherein: The driving assembly includes a cylinder, which includes a telescopic rod and a fixed part connected to each other. The fixed part is fixed to the top surface of the base, and the end of the telescopic rod away from the fixed part is connected to the end of the push handle assembly away from the lifting assembly. The length of the telescopic rod relative to the fixed part in the first direction is adjustable.

5. The wafer centering mechanism according to claim 4, characterized in that: The push handle assembly includes a stabilizing member, a floating joint, a slider, and a guide rail. The push handle, the stabilizing member, and the floating joint are sequentially connected in a direction away from the lifting assembly, and an end of the floating joint away from the stabilizing member is connected to the telescopic rod. The side of the stabilizing member facing the base is fixed to the sliding block, and the side of the sliding block away from the stabilizing member is arranged on the guide rail, and the guide rail is arranged on the top surface of the base.

6. The wafer centering mechanism according to claim 5, characterized in that: The stabilizing member includes: a stabilizing block and a stabilizing plate connected to each other, wherein opposite ends of the stabilizing plate in the first direction are respectively connected to the push handle and the stabilizing block, and an end of the stabilizing block away from the stabilizing plate is connected to the floating joint; The top surface of the base has a groove, and the stabilizing block has a protrusion, and the protrusion extends toward the groove; The adjustable damper is arranged in the groove, and the free end of the adjustable damper is connected to the protrusion.

7. The wafer centering mechanism according to claim 6, characterized in that: The top surface of the base has two grooves, and the two grooves are spaced apart in a direction perpendicular to the first direction; The guide rail is arranged on the top surface of the base between the two grooves; Each centering unit includes two adjustable dampers, and the two adjustable dampers are symmetrically arranged in the corresponding grooves on both sides of the guide rail.

8. The wafer centering mechanism according to claim 1, 6 or 7, characterized in that: The fixed end is arranged on the top surface of the base through a fixing piece, and the fixing piece has a limiting hole that passes through the fixing piece along the first direction, the inner wall of the limiting hole has a first thread, and the outer surface of the fixed end has a second thread that matches the first thread, the fixed end passes through the limiting hole to be screwed into the fixing piece, and the fixed end rotates relative to the limiting hole to adjust the position of the fixed end relative to the base along the first direction.

9. The wafer centering mechanism according to claim 1, wherein: The edge shape of the pusher away from the pusher assembly is an arc shape that matches the edge shape of the wafer.

10. A semiconductor processing equipment, characterized in that: include: The wafer centering mechanism according to any one of claims 1 to 9.

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