Rotating mechanism for alkali etching of semiconductor

Abstract

The utility model relates to the technical field of semiconductor etching, in particular to a rotating mechanism for semiconductor alkali etching, which comprises a base, a lifting device is arranged on the upper surface of the base, the lifting device is connected with a rotating device, an output shaft of the rotating device is connected with fixing grooves, and the fixing grooves are symmetrically arranged on two sides of the output end of the rotating device. According to the utility model, the defects in the prior art are overcome, the fixed grooves are symmetrically arranged by taking the axis of the output end of the rotating device as the reference, the two symmetrical fixed grooves rotate around the output end of the rotating device, alkali liquor at each point of the fixed grooves is stirred in the same way, and the concentration of the alkali liquor at each point is kept consistent; the problem that when the fixing groove rotates with the fixing groove as the axis, the concentration of alkali liquor nearby the rotating axis is different from the edge is solved, the uniformity of all points of semiconductor alkali etching is improved, and the product quality is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor etching, in particular to a rotating mechanism used for semiconductor alkali etching. Background Art

[0002] Wafers produced by semiconductor manufacturing processes can be widely used in various application fields. The yield rate of wafers can directly determine the quality of the end products. Therefore, all parties have invested a lot of research in the materials and production methods of wafers to ensure their quality. Regardless of the application field, the wafers must undergo multiple processing steps before they can be used as electronic components or optoelectronic components. One of the wafer processing processes is to etch away the oxide film on the wafer surface. With the increase in the difficulty and processing requirements of wafer processing and the increase in demand for wafers, fully automatic etching equipment has emerged to improve the efficiency and yield of wafer etching. This etching equipment requires a lifting cylinder to automatically extend the semiconductor into the etching solution to achieve automatic etching of the semiconductor. However, most current etching equipment can only place the semiconductor in the etching solution, making it difficult to fully etch the semiconductor.

[0003] Chinese Patent: CN217158133U discloses a rotating device for semiconductor alkali etching, comprising a base, a structure which also includes a lifting cylinder and a rotating motor, a fixed plate parallel to the horizontal plane being provided on the top of the base, a fixed block movable up and down being provided below the fixed plate, the lifting cylinder being fixed on the fixed plate and the output end being fixedly connected to the fixed block, a hollow groove being provided inside the fixed block, a rotating shaft being provided at the bottom of the hollow groove, a rotating motor being fixed inside the hollow groove, the output end of the rotating motor being fixedly connected to the top of the rotating shaft, and a fixed groove for the semiconductor being provided at the bottom of the rotating shaft. However, since the fixed groove is provided at the bottom of the rotating shaft and the fixed groove rotates about the rotating shaft, the angular velocity of the edge of the fixed groove is increased compared to that along the rotating shaft of the fixed groove, the alkali solution is subjected to different stirring effects, and as the etching proceeds, the concentration of the alkali solution at each point is different, which easily leads to the problem of uneven etching at each point during semiconductor alkali etching. Utility Model Content

[0004] In view of the deficiencies of the prior art, the utility model provides a rotating mechanism for semiconductor alkaline etching, which overcomes the deficiencies of the prior art and aims to solve the problem of uneven etching of various parts in the prior art for semiconductor alkaline etching.

[0005] To achieve the above-mentioned purpose, the present utility model provides the following technical solution: a rotating mechanism for semiconductor alkaline etching, comprising: a base, the upper surface of which is provided with a lifting device, the lifting device is connected to a rotating device, the output shaft of the rotating device is connected to a fixed groove, and the fixed groove is symmetrically arranged on both sides of the output end of the rotating device.

[0006] During operation, the semiconductor is installed into the fixed groove, the lifting device moves, driving the rotating device to move downward, and the rotating device pushes the fixed groove downward until the fixed groove is completely inserted a distance below the alkaline etching liquid surface. The rotating device starts to rotate, and the output end of the rotating device drives the fixed groove to rotate.

[0007] As an optimal technical solution of the present invention, the output shaft of the rotating device is provided with a fixed block, and the fixed block is provided with a threaded hole perpendicular to the output shaft direction of the rotating device. The threaded hole is connected to the support rod screw, and the support rod and the output end of the rotating device are on the same axis, and the support rod is connected to the fixing groove.

[0008] As an optimal technical solution of the present invention, a connecting shaft is provided on the outer surface of the support rod, the connecting shaft is perpendicular to the outer surface of the support rod, a first positioning hole is provided on the upper surface of the connecting shaft, the connecting shaft is connected to the mounting sleeve outside the shaft sleeve, the mounting sleeve is provided with a second positioning hole, the first positioning hole and the second positioning hole are connected by screws, and the end of the mounting sleeve away from the support rod is connected to the back of the fixing groove.

[0009] As a preferred technical solution of the present invention, two connecting shafts are provided and are symmetrically distributed with respect to the axis of the support rod; two groups of the mounting sleeves, the screws and the fixing grooves are provided and are symmetrically distributed with respect to the axis of the support rod.

[0010] As an optimal technical solution of the present invention, the rotating device is connected to a connecting plate, the connecting plate is perpendicular to the axis of the output end of the rotating device, the end of the connecting plate away from the rotating device is fixedly connected to a push block, the push block is connected to the push rod of the lifting device, and the lifting device is fixedly connected to the base.

[0011] As a preferred technical solution of the present invention, the length of the connecting plate is L1, the distance from the outer surface of the fixing groove to the axis of the support rod is L2, and L1>L2.

[0012] As an optimal technical solution of the present invention, it also includes a control system, which connects the lifting device and the rotating device. The rotating device is a servo motor. The lifting device includes: a cylinder, an air reversing valve, an air source and an air pipe. The cylinder is fixedly mounted on the base. The surface of the cylinder away from the base is connected to the push rod. The cylinder is connected to the air reversing valve via the air pipe, and the air reversing valve is connected to the air source.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] The utility model arranges the fixed groove symmetrically with the axis line of the output end of the rotating device as the reference, and the two symmetrical fixed grooves rotate around the output end of the rotating device. The alkali solution at each point of the fixed groove is subjected to the same stirring effect, and the concentration of the alkali solution at each point is kept consistent, avoiding the problem of difference in alkali solution concentration near the rotating axis and the edge when the fixed groove rotates with itself as the axis, which is beneficial to improving the uniformity of each point of semiconductor alkali etching and further improving product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the support rod structure of the present utility model;

[0017] Figure 3 This is a schematic diagram of the fixing groove structure of the utility model;

[0018] Figure 4 It is a front view of the utility model;

[0019] In the figure: 1. Base; 2. Lifting device; 201. Push rod; 202. Cylinder; 203. Air reversing valve; 204. Air source; 205. Air pipe; 3. Rotating device; 4. Fixing groove; 5. Fixing block; 6. Threaded hole; 7. Support rod; 701. Connecting shaft; 702. First positioning hole; 8. Mounting sleeve; 801. Second positioning hole; 9. Screw; 10. Connecting plate; 11. Push block. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] See also Figure 1-4 The utility model provides the following technical solution: a rotating mechanism for semiconductor alkaline etching, comprising a base 1, a lifting device 2 is provided on the upper surface of the base 1, the lifting device 2 is connected to the rotating device 3, the output shaft of the rotating device 3 is connected to the fixed groove 4, and the fixed groove 4 is symmetrically arranged on both sides of the output end of the rotating device 3.

[0022] During operation, the semiconductor is installed into the fixed groove 4, the lifting device 2 moves, driving the rotating device 3 to move downward, and the rotating device 3 pushes the fixed groove 4 downward until the fixed groove 4 is completely inserted into a distance below the alkaline etching liquid surface. The rotating device 3 starts to rotate, and the output end of the rotating device 3 drives the fixed groove 4 to rotate.

[0023] The fixed groove 4 is arranged in this way so that the fixed groove 4 is symmetrical with respect to the axis of the output end of the rotating device 3. The two symmetrical fixed grooves 4 rotate around the output end of the rotating device 3. The alkali solution at each point of the fixed groove 4 is subjected to the same stirring effect, and the concentration of the alkali solution at each point is kept consistent. This avoids the problem of difference in alkali solution concentration near the rotating axis and the edge when the fixed groove 4 rotates about itself, which is beneficial to improving the uniformity of each point of semiconductor alkali etching and further improving product quality.

[0024] Specifically, the output shaft of the rotating device 3 is provided with a fixing block 5. The fixing block 5 is provided with a threaded hole 6 perpendicular to the output shaft of the rotating device 3. The threaded hole 6 is screwed to a support rod 7. The support rod 7 is coaxial with the output end of the rotating device 3 and is connected to the fixing slot 4. This connection method of the rotating device 3 and the fixing slot 4 has a simple overall structure and high reliability, which is conducive to ensuring transmission accuracy, reducing device costs, and facilitating subsequent maintenance.

[0025] Specifically, a connecting shaft 701 is provided on the outer surface of the support rod 7, and the connecting shaft 701 is perpendicular to the outer surface of the support rod 7. A first positioning hole 702 is provided on the upper surface of the connecting shaft 701. The connecting shaft 701 is connected to the shaft sleeve of the mounting sleeve 8. The mounting sleeve 8 is provided with a second positioning hole 801. The first positioning hole 702 and the second positioning hole 801 are connected by screws 9. The end of the mounting sleeve 8 away from the support rod 7 is connected to the back of the fixing groove 4. This detachable connection between the support rod 7 and the fixing groove 4 allows for quick replacement of the next set of semiconductors after semiconductor etching is completed, reducing the time required to install and fix semiconductors, shortening production preparation time, and improving production efficiency.

[0026] Specifically, two connecting shafts 701 are provided and symmetrically distributed around the axis of the support rod 7. Two sets of mounting sleeves 8, screws 9, and fixing slots 4 are provided and symmetrically distributed around the axis of the support rod 7. This arrangement of two fixing slots 4 ensures that the fixing slots 4 rotate around the axis of the support rod 7. The alkaline solution on the surface of the fixing slots 4 is uniformly affected, preventing uneven alkaline solution concentration at different points on the surface of the fixing slots 4 due to chemical reactions, which could cause uneven etching of different points on the semiconductor, thereby improving product quality.

[0027] Specifically, rotating device 3 is connected to connecting plate 10, which is perpendicular to the axis of the output end of rotating device 3. The end of connecting plate 10, away from rotating device 3, is fixedly connected to push block 11. Push block 11 is connected to push rod 201 of lifting device 2, which is fixedly connected to base 1. This arrangement of lifting device 2 and mounting device 3, with the lifting device mounted on base 1 and push rod 201 moving upward, lowers the overall center of gravity of the device, helping to improve the structural stability and reliability of the device.

[0028] Specifically, the length of the connecting plate 10 is L1, and the distance from the outer surface of the fixing groove 4 to the axis of the support rod 7 is L2, where L1>L2. This arrangement of the connecting plate 10 allows the fixing groove 4 to move away from the base 1 during the upward and downward movement, ensuring that the fixing groove 4 can smoothly enter the alkali solution and achieve smooth operation of the device.

[0029] Specifically, the system also includes a control system, which connects the lifting device 2 and the rotating device 3. The rotating device 3 is a servo motor. The lifting device 2 includes: a cylinder 202, an air reversing valve 203, an air source 204, and an air pipe 205. The cylinder 202 is fixedly mounted on the base 1. The surface of the cylinder 202 away from the base 1 is connected to the push rod 201. The cylinder 202 is connected to the air reversing valve 203 via the air pipe 205. The air reversing valve 203 is connected to the air source 204. This configuration of the rotating device allows various parameters to be adjusted according to semiconductor processing requirements, meeting semiconductor processing requirements and improving semiconductor etching uniformity.

[0030] Working principle: During operation, the semiconductor is installed into the fixed groove 4, the lifting device 2 moves, driving the rotating device 3 to move downward, and the rotating device 3 pushes the fixed groove 4 downward until the fixed groove 4 is completely inserted into a distance below the alkaline etching liquid surface. The rotating device 3 starts to rotate, and the output end of the rotating device 3 drives the fixed groove 4 to rotate.

[0031] Finally, it should be noted that in the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as a limitation on the present invention.

[0032] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0033] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A rotating mechanism for semiconductor alkali etching, characterized in that: The invention comprises a base (1), wherein a lifting device (2) is provided on the upper surface of the base (1), wherein the lifting device (2) is connected to a rotating device (3), wherein an output shaft of the rotating device (3) is connected to a fixing groove (4), and wherein the fixing groove (4) is symmetrically arranged on both sides of the output end of the rotating device (3).

2. The rotating mechanism for semiconductor alkali etching according to claim 1, characterized in that: The output shaft of the rotating device (3) is provided with a fixing block (5), the fixing block (5) is provided with a threaded hole (6) perpendicular to the output shaft direction of the rotating device (3), the threaded hole (6) is screw-connected to a support rod (7), the support rod (7) and the output end of the rotating device (3) are on the same axis, and the support rod (7) is connected to the fixing groove (4).

3. The rotating mechanism for semiconductor alkali etching according to claim 2, characterized in that: The outer surface of the support rod (7) is provided with a connecting shaft (701), the connecting shaft (701) is perpendicular to the outer surface of the support rod (7), the upper surface of the connecting shaft (701) is provided with a first positioning hole (702), the connecting shaft (701) is connected to the shaft sleeve of the mounting sleeve (8), the mounting sleeve (8) is provided with a second positioning hole (801), the first positioning hole (702) and the second positioning hole (801) are connected via a screw (9), and the end of the mounting sleeve (8) away from the support rod (7) is connected to the back of the fixing groove (4).

4. The rotating mechanism for semiconductor alkali etching according to claim 3, characterized in that: Two connecting shafts (701) are provided and are symmetrically distributed with the axis of the support rod (7) as a reference; two groups of the mounting sleeves (8), the screws (9) and the fixing slots (4) are provided and are symmetrically distributed with the axis of the support rod (7) as a reference.

5. The rotating mechanism for semiconductor alkali etching according to claim 4, characterized in that: The rotating device (3) is connected to a connecting plate (10), the connecting plate (10) is perpendicular to the axis of the output end of the rotating device (3), the end of the connecting plate (10) away from the rotating device (3) is fixedly connected to a push block (11), the push block (11) is connected to a push rod (201) of the lifting device (2), and the lifting device (2) is fixedly connected to the base (1).

6. The rotating mechanism for semiconductor alkali etching according to claim 5, characterized in that: The length of the connecting plate (10) is L1, the distance from the outer surface of the fixing groove (4) to the axis of the support rod (7) is L2, and L1>L2.

7. The rotating mechanism for semiconductor alkali etching according to claim 5, characterized in that: The invention also includes a control system, which is connected to the lifting device (2) and the rotating device (3). The rotating device (3) is a servo motor. The lifting device (2) includes: a cylinder (202), an air reversing valve (203), an air source (204) and an air pipe (205). The cylinder (202) is fixedly mounted on the base (1). The surface of the cylinder (202) away from the base (1) is connected to the push rod (201). The cylinder (202) is connected to the air reversing valve (203) via the air pipe (205). The air reversing valve (203) is connected to the air source (204).

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