Circuit board assembly and electronic equipment
By using connecting vias and signal isolation layers in the laminated circuit board structure, the problems of electronic equipment space occupation and component interference are solved, and the lightweight and performance improvement of circuit board components are achieved.
Patent Information
- Application Number
- CN202421712997.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-18
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-07-18
AI Technical Summary
Electronic devices on a single motherboard are limited in the overall plan layout, making it difficult to reduce space occupation, which is not conducive to lightweight and miniaturization. At the same time, the stacked circuit board structure is likely to cause mutual interference between electronic components and affect working performance.
Using a laminated circuit board structure, by providing a connecting via and a pad group on the first circuit board, the second circuit board and the first recess form a receiving cavity to accommodate the second electronic components, and a signal isolation layer is provided on the side wall of the receiving cavity close to the connecting via to avoid interference.
It reduces the overall thickness of circuit board components, improves the working performance of electronic devices, reduces mutual interference between components, and improves signal transmission quality.
Smart Images
Figure CN223274277U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of electronic technology, and in particular to circuit board components and electronic equipment. Background Art
[0002] Electronic devices with a single motherboard are restricted in their overall planar layout, making it difficult to further reduce space occupancy, which is not conducive to lightweighting and miniaturization of electronic devices.
[0003] However, the stacked circuit board structure has a layout problem in which electronic components overlap in the thickness direction, which is more likely to cause mutual interference between electronic components, affecting the working performance of the circuit board assembly and the electronic equipment. Utility Model Content
[0004] The present disclosure provides a circuit board assembly and an electronic device to solve related technical problems.
[0005] A first aspect of the present disclosure provides a circuit board assembly, comprising:
[0006] a first circuit board, wherein a first pad group and a first recess are provided on one side of the first circuit board, and a first electronic component is provided on the other side of the first circuit board; the first circuit board is provided with a connecting via, and the pads of the first pad group are conductively connected to the first electronic component through the connecting via;
[0007] A second circuit board is stacked with the first circuit board to form a receiving cavity with the first recess; a second electronic component and a second pad group are provided on the side of the second circuit board facing the first circuit board, at least one second electronic component is accommodated in the receiving cavity, and the first pad group is connected to the second pad group; a signal isolation layer is provided on the side wall of the receiving cavity near the connecting via.
[0008] Optionally, in the arrangement direction of the first pad group and the first recess, the first pad group is provided with two rows of pads;
[0009] The pads include radio frequency signal transmission pads and ground pads. The radio frequency signal transmission pads are arranged in a row close to the first recess, and the ground pads are arranged around the radio frequency signal transmission pads.
[0010] Optionally, the signal isolation layer includes an electroplating layer.
[0011] Optionally, the circuit board assembly further includes a shielding layer, and the shielding layer covers the inner wall surrounding the accommodating cavity.
[0012] Optionally, the shielding layer includes a shielding film, and the shielding film is fixed to the inner wall of the accommodating cavity by bonding with conductive adhesive.
[0013] Optionally, in the depth direction of the connecting via, the connecting via includes a first section close to one side of the first circuit board, a second section close to the other side of the first circuit board, and a third section located between the first section and the second section; the aperture of the third section is larger than that of the first section and the second section.
[0014] Optionally, in a thickness direction of the first circuit board, the first circuit board includes substrate layers and circuit layers that are alternately arranged;
[0015] The base material layer includes a first functional layer and a second functional layer having a thickness greater than that of the first functional layer, and at least a portion of the second functional layer overlaps with the first recess in a depth direction of the first circuit board.
[0016] Optionally, the depth of the first recess is equal to half the thickness of the first circuit board.
[0017] Optionally, a second recess is provided on a side of the second circuit board facing the first circuit board; the first recess and the second recess are aligned and matched to form the accommodating cavity.
[0018] According to a second aspect of the present disclosure, an electronic device is provided, comprising: any circuit board assembly described in the first aspect.
[0019] The technical solution provided by the present disclosure can achieve at least the following beneficial effects:
[0020] The first circuit board of the present disclosure is provided with connection vias for electrically connecting the first electronic components on both sides to the first pad groups, and a first recessed portion that forms a housing cavity with the second circuit board. At least one second electronic component of the second circuit board can be accommodated within the housing cavity, thereby helping to reduce the overall thickness of the circuit board assembly. Furthermore, a signal isolation layer is provided on the sidewalls of the housing cavity near the connection vias to prevent interference between the second electronic component within the housing cavity and external electronic components and the first electronic component caused by the connection via structure, thereby helping to improve the operating performance of the circuit board assembly and the electronic device while reducing the thickness of the circuit board assembly.
[0021] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.
[0023] Figure 1 is a schematic cross-sectional structural diagram of a circuit board assembly in an exemplary embodiment of the present disclosure;
[0024] Figure 2 is a partial structural diagram of a side of a first circuit board facing a second circuit board in an exemplary embodiment of the present disclosure;
[0025] Figure 3 is a schematic cross-sectional structural diagram of a circuit board assembly in an exemplary embodiment of the present disclosure;
[0026] Figure 4 is a schematic diagram of a partial cross-sectional structure of a circuit board assembly in an exemplary embodiment of the present disclosure;
[0027] Figure 5 3 is a partial cross-sectional schematic diagram of the first circuit board at the third section in an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION
[0028] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with this specification. Rather, they are merely examples of apparatus and methods consistent with certain aspects of this specification, as detailed in the appended claims.
[0029] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. Unless otherwise defined, technical or scientific terms used in this specification should have the same ordinary meaning as those understood by persons of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and similar terms used in this specification and the claims do not denote any order, quantity, or importance, but are simply used to distinguish one component from another. Similarly, terms such as "a" or "an" do not denote a limitation of quantity, but rather indicate the presence of one. "Multiple" or "several" means two or more. Unless otherwise indicated, terms such as "front," "rear," "lower," and / or "upper" are used for convenience only and are not intended to limit the scope of the disclosure to a specific location or spatial orientation. Terms such as "include" or "comprising" mean that the elements or objects listed before "include" or "comprising" include the elements or objects listed after "include" or "comprising" and their equivalents, and do not exclude other elements or objects. Terms such as "connected" or "connected" are not limited to physical or mechanical connections and can include electrical connections, whether direct or indirect.
[0030] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit the present disclosure. As used in this specification and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
[0031] Electronic devices with a single motherboard are limited in their overall layout, making it difficult to further reduce space usage, hindering lightweighting and miniaturization. Furthermore, stacked circuit board structures present layout issues where electronic components overlap in the thickness direction, increasing the risk of interference between components and affecting the performance of the circuit board assembly and the electronic device.
[0032] The present disclosure provides a circuit board assembly. Figure 1 is a schematic cross-sectional view of a circuit board assembly in an exemplary embodiment of the present disclosure. Figure 1 As shown, the circuit board assembly 1 includes a first circuit board 11 and a second circuit board 12. A first solder pad group 16 and a first recess 111 are provided on one side of the first circuit board 11, and a first electronic component 14 is provided on the other side of the first circuit board 11. The first circuit board 11 is provided with a connecting via 112, and the solder pads of the first solder pad group 16 are conductively connected to the first electronic component 14 through the connecting via 112. The second circuit board 12 and the first circuit board 11 are stacked to form a accommodating cavity 13 with the first recess 111. A second electronic component 15 and a second solder pad group are provided on the side of the second circuit board 12 facing the first circuit board 11, and at least one second electronic component 15 is accommodated in the accommodating cavity 13, and the first solder pad group 16 is connected to the second solder pad group. A signal isolation layer 17 is provided on the side wall of the accommodating cavity 13 near the connecting via 112.
[0033] Because the first circuit board 11 is provided with connection vias 112 that electrically connect the first electronic components 14 and the first pad groups 16 on both sides, and a first recess 111 that forms a housing cavity 13 with the second circuit board 12, at least one second electronic component 15 of the second circuit board 12 can be accommodated within the housing cavity 13, helping to reduce the overall thickness of the circuit board assembly 1. Furthermore, a signal isolation layer 17 is provided on the sidewall of the housing cavity 13 near the connection vias 112 to prevent interference between the second electronic component 15 within the housing cavity 13 and external electronic components and the first electronic component 14 due to the structure of the connection vias 112. This helps to improve the operating performance of the circuit board assembly 1 and the electronic device while reducing the thickness of the circuit board assembly 1.
[0034] In some embodiments, in the arrangement direction of the first pad group 16 and the first recess 111, the first pad group 16 has two rows of pads, including RF signal transmission pads 161 and ground pads 162. The RF signal transmission pads 161 are arranged in a row close to the first recess 111, and the ground pads 162 are arranged around the RF signal transmission pads 161. This arrangement can utilize the shielding performance of the ground pads 162 to prevent mutual interference between RF signals.
[0035] For example Figure 2 As shown, first pad group 16 and first recess 111 are arranged along the length of first circuit board 11. First pad group 16 includes two rows of pads arranged along the length. RF signal transmission pad 161 is located in the middle of one row near first recess 111. Within this row of pads, ground pads 162 are located on either side of RF signal transmission pad 161. The other row of pads contains ground pads 162, thereby providing shielding around RF signal transmission pad 161.
[0036] In some embodiments, the signal isolation layer 17 may be an electroplating layer, or a coating layer, a film layer, etc., and the present disclosure is not limited thereto, as long as it can achieve shielding of radio frequency signals.
[0037] In some embodiments, the circuit board assembly 1 may further include a shielding layer 18, which covers the inner wall of the accommodating cavity 13 to shield the entire inner wall of the accommodating cavity 13, further avoiding mutual interference between the RF signal in the accommodating cavity 13 and the external RF signal.
[0038] For example Figure 3 As shown, the signal isolation layer 17 is an electroplating layer, which is arranged on the side wall of the accommodating cavity 13 near the connecting via 112, and forms the inner wall of the accommodating cavity 13 together with the other side walls of the accommodating cavity 13. The shielding layer 18 covers the above inner wall to avoid mutual interference between the radio frequency signal in the accommodating cavity 13 and the external radio frequency signal passing through the connecting via 112 or the substrate of the first circuit board 11.
[0039] The shielding layer 18 may be a shielding film, which is bonded to the inner wall of the accommodating cavity 13 by a conductive adhesive 19. It should be noted that the material of the electroplating layer may be gold, silver, nickel, or other alloys, and the material of the shielding film may be metal, ferrite, carbon fiber, conductive polymer, etc., and this disclosure is not limited thereto.
[0040] In some embodiments, as Figure 4 、 Figure 5As shown, in the depth direction of connection via 112, connection via 112 includes a first section 1121 near one side of first circuit board 11, a second section 1122 near the other side of first circuit board 11, and a third section 1123 located between first section 1121 and second section 1122. The aperture of third section 1123 is larger than that of first section 1121 and second section 1122. Signals travel from second circuit board 12 to first circuit board 11, toward first pad group 16 of second circuit board 12, from first pad group 16 through second section 1122, third section 1123, and first section 1121 to the top surface of first circuit board 11. The aperture of third section 1123 is larger than that of first section 1121 and second section 1122, helping to improve spatial layout efficiency and signal transmission quality.
[0041] like Figure 3 As shown, in the thickness direction of first circuit board 11, first circuit board 11 may include alternating substrate layers 114 and circuit layers 113. Substrate layer 114 includes a first functional layer 1141 and a second functional layer 1142 having a thickness greater than that of first functional layer 1141. At least a portion of second functional layer 1142 overlaps with first recess 111 in the depth direction of first circuit board 11. This relatively increased thickness of second functional layer 1142 enhances shielding effects for signals inside and outside accommodating cavity 13. The thickness of second functional layer 1142 may be between 450 μm and 550 μm, for example, 500 μm.
[0042] In some embodiments, the depth of the first recess 111 may be equal to half the thickness of the first circuit board 11 , so as to reduce the overall thickness of the circuit board assembly 1 while ensuring the structural strength of the first circuit board 11 .
[0043] In some embodiments, a second recess may be provided on the side of the second circuit board 12 facing the first circuit board 11 , and the first recess 111 and the second recess align and cooperate to form an accommodating cavity 13 to further reduce the overall thickness of the circuit board assembly 1 .
[0044] In the thickness direction of the second circuit board 12, the above-mentioned second circuit board 12 may also include alternating substrate layers 114 and circuit layers 113, the substrate layer 114 includes a third functional layer and a fourth functional layer having a thickness greater than the third functional layer, and at least a portion of the fourth functional layer overlaps with the second recess in the depth direction of the second circuit board 12, so as to enhance the shielding effect of the signal between the inside and outside of the accommodating cavity 13 by relatively increasing the thickness of the fourth functional layer.
[0045] The depths of the first recess 111 and the second recess can be the same or different, and can be set according to the specific depth requirements of the accommodating cavity 13. When the depths of the first recess 111 and the second recess are the same, the thickness of the fourth functional layer can be 450 μm-550 μm, for example, the thickness of the fourth functional layer can be 500 μm.
[0046] In the above embodiment, substrate layer 114 may be a copper-free substrate. The first recess 111 and the second recess forming accommodating cavity 13 may be formed by milling to reduce processing difficulty. Accommodating cavity 13 may be a closed cavity or an open cavity located on one side of the edge region of circuit board assembly 1, and this disclosure is not limited thereto.
[0047] In some embodiments, circuit board assembly 1 may include a multi-layer circuit board, which may be formed by a second circuit board 12 and multiple layers of first circuit boards 11 stacked on second circuit board 12. Alternatively, the multi-layer circuit board may be formed by alternating first circuit boards 11 and second circuit boards 12. The present disclosure does not limit the stacking method of first circuit boards 11 and second circuit boards 12.
[0048] The present disclosure further provides an electronic device, which includes the above-mentioned circuit board assembly 1.
[0049] Because the first circuit board 11 of the circuit board assembly 1 is provided with connection vias 112 that electrically connect the first electronic components 14 and the first pad groups 16 on both sides, and a first recess 111 that forms a housing cavity 13 with the second circuit board 12, at least one second electronic component 15 of the second circuit board 12 can be accommodated within the housing cavity 13, which helps reduce the overall thickness of the circuit board assembly 1. Furthermore, a signal isolation layer 17 is provided on the sidewall of the housing cavity 13 near the connection vias 112 to prevent interference between the second electronic component 15 within the housing cavity 13 and external electronic components and the first electronic component 14 due to the structure of the connection vias 112. This helps improve the operating performance of the circuit board assembly 1 and the electronic device while reducing the thickness of the circuit board assembly 1.
[0050] It should be noted that the electronic device can be a mobile phone, tablet computer, wearable device, vehicle terminal, medical terminal, etc. The circuit board assembly 1 can be applied to the radio frequency module of the electronic device or to other functional modules of the electronic device, and the present disclosure does not limit this.
[0051] The above description is merely a preferred embodiment of the present disclosure and does not constitute any form of limitation to the present disclosure. Although the present disclosure has been disclosed as a preferred embodiment as above, it is not intended to limit the present disclosure. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of the technical content disclosed above without departing from the scope of the technical solution of the present disclosure. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present disclosure without departing from the content of the technical solution of the present disclosure are still within the scope of the technical solution of the present disclosure.
Claims
1. A circuit board assembly, characterized in that: include: a first circuit board, wherein a first pad group and a first recess are provided on one side of the first circuit board, and a first electronic component is provided on the other side of the first circuit board; the first circuit board is provided with a connecting via, and the pads of the first pad group are conductively connected to the first electronic component through the connecting via; A second circuit board is stacked with the first circuit board to form a receiving cavity with the first recess; a second electronic component and a second pad group are provided on the side of the second circuit board facing the first circuit board, at least one second electronic component is accommodated in the receiving cavity, and the first pad group is connected to the second pad group; a signal isolation layer is provided on the side wall of the receiving cavity near the connecting via.
2. The circuit board assembly according to claim 1, wherein: In the arrangement direction of the first pad group and the first recess, the first pad group is provided with two rows of pads; The pads include radio frequency signal transmission pads and ground pads. The radio frequency signal transmission pads are arranged in a row close to the first recess, and the ground pads are arranged around the radio frequency signal transmission pads.
3. The circuit board assembly according to claim 1, wherein: The signal isolation layer includes an electroplating layer.
4. The circuit board assembly according to claim 1, wherein: It also includes a shielding layer, which covers the inner wall of the accommodating cavity.
5. The circuit board assembly according to claim 4, wherein: The shielding layer includes a shielding film, and the shielding film is fixed to the inner wall of the accommodating cavity by means of conductive adhesive.
6. The circuit board assembly according to claim 1, wherein: In the depth direction of the connecting via, the connecting via includes a first section close to one side of the first circuit board, a second section close to the other side of the first circuit board, and a third section located between the first section and the second section; the aperture of the third section is larger than that of the first section and the second section.
7. The circuit board assembly according to claim 1, wherein: In the thickness direction of the first circuit board, the first circuit board includes substrate layers and circuit layers that are alternately arranged; The base material layer includes a first functional layer and a second functional layer having a thickness greater than that of the first functional layer, and at least a portion of the second functional layer overlaps with the first recess in a depth direction of the first circuit board.
8. The circuit board assembly according to claim 1, wherein: The depth of the first recess is equal to half the thickness of the first circuit board.
9. The circuit board assembly according to claim 1, wherein: A second recess is provided on a side of the second circuit board facing the first circuit board; the first recess and the second recess are aligned and cooperated to form the accommodating cavity.
10. An electronic device, characterized in that: include: A circuit board assembly as claimed in any one of claims 1 to 9.