Electronic device

Abstract

The utility model discloses an electronic device which comprises an electronic element, a first shell and a second shell. The first shell is located between the electronic component and the second shell, and the first shell and the electronic component are located in the second shell.

Description

Technical Field

[0001] The utility model relates to an electronic device. Background Art

[0002] The increasing popularity of consumer electronics and the current demand for environmentally friendly, energy-saving, and high-efficiency equipment are driving the market towards the use of compact, high-power-density fast chargers (PD chargers). This increases the technical difficulty in the research and development process. The high power density leads to localized high temperatures in the charger, making heat dissipation a challenge. Utility Model Content

[0003] The present invention relates to an electronic device and a manufacturing method thereof, which can improve the above-mentioned conventional problems.

[0004] One embodiment of the present invention provides an electronic device comprising an electronic component, a first housing, and a second housing. The first housing is located between the electronic component and the second housing, and the first housing and the electronic component are located within the second housing.

[0005] Another embodiment of the present invention provides a method for manufacturing an electronic device. The method includes the following steps: electrically connecting an electronic component to a connection module, wherein the electronic component and the connection module form a first pre-assembly; placing the first pre-assembly within a first housing, wherein the first pre-assembly and the first housing form a second pre-assembly; placing the second pre-assembly within a second housing, wherein the first housing is located between the electronic component and the second housing; and combining the connection module and the second housing.

[0006] Another embodiment of the present invention provides an electronic device. The electronic device includes an electronic component, a first housing, a second housing, an encapsulation material, and a connection module. The first housing and the electronic component are located within the second housing. The encapsulation material is disposed within the first housing and covers at least a portion of the electronic component. The connection module is connected to the second housing, and the first housing has an end surface facing the connection module.

[0007] In order to better understand the above and other aspects of the present invention, the following embodiments are specifically described in detail with reference to the accompanying drawings: BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 A schematic diagram of an electronic device according to an embodiment of the present invention;

[0009] Figure 2 for Figure 1 Exploded view of the electronic device;

[0010] Figure 3 for Figure 1 Exploded view of the electronic module;

[0011] Figure 4A for Figure 1 A cross-sectional view of the electronic device along direction 4A-4A';

[0012] Figure 4B for Figure 1 A cross-sectional view of the electronic device along direction 4B-4B';

[0013] Figure 4C for Figure 1 A cross-sectional view of the electronic device along direction 4C-4C';

[0014] Figure 4D for Figure 1 A cross-sectional view of the electronic device along direction 4D-4D';

[0015] Figure 5 is a schematic diagram of an electronic device according to another embodiment of the present invention;

[0016] Figure 6 for Figure 5 Exploded view of the electronic device;

[0017] Figure 7 for Figure 5 Another exploded view of the electronic device;

[0018] Figure 8A for Figure 5 A cross-sectional view of the electronic device along direction 8A-8A';

[0019] Figure 8B for Figure 5 A cross-sectional view of the electronic device along direction 8B-8B';

[0020] Figure 8C for Figure 5 A cross-sectional view of the electronic device along direction 8C-8C';

[0021] Figure 8D for Figure 5 A cross-sectional view of the electronic device along direction 8D-8D';

[0022] Figures 9A to 9F for Figure 1 Figure 1 shows the manufacturing process of an electronic device.

[0023] Wherein, the reference numerals:

[0024] 10,20: electronic module;

[0025] 30: plug;

[0026] 100S1, 200S1: first side;

[0027] 100S2, 200S2: second side;

[0028] 100S3, 200S3: third side;

[0029] 100S4, 200S4: fourth side;

[0030] 100,200: electronic devices;

[0031] 100A: The first pre-assembled component;

[0032] 100B: The second pre-assembled component;

[0033] 111,121: connector;

[0034] 110,210: connection module;

[0035] 111A: first electrode;

[0036] 111B: second electrode;

[0037] 112,212: cover plate;

[0038] 112b, 212b: bottom surface;

[0039] 111C: first connecting line;

[0040] 111D: second connecting line;

[0041] 120,220: electronic components;

[0042] 130: packaging material;

[0043] 140,240: first shell;

[0044] 140a: first opening;

[0045] 140b: bottom surface;

[0046] 140e, 240e: end face;

[0047] 141,241: first shell;

[0048] 141a, 241a: first through hole;

[0049] 141r, 241r: gap;

[0050] 1411,2411:Part 1;

[0051] 1412,2412:Part II;

[0052] 1413,2413:first bottom;

[0053] 141s1,141s2,151s,241s,251s: surface;

[0054] 142,242: first junction;

[0055] 140r: isolation department;

[0056] 150,250: second shell;

[0057] 150a: second opening;

[0058] 150p, 250p: storage tank;

[0059] 150e, 250e: end face;

[0060] 150r, 250r: groove;

[0061] 150b, 250b: groove bottom surface;

[0062] 151,251: second shell;

[0063] 151a, 251a: second through hole;

[0064] 1511,2511:Part 3;

[0065] 1512,2512:Part 4;

[0066] 1513,2513: second bottom;

[0067] 152,252: second junction;

[0068] 160: thermal conductive layer;

[0069] 160a: hollow portion;

[0070] 200S5: connection surface;

[0071] g1,g2: gap. DETAILED DESCRIPTION

[0072] Please refer to Figures 1 to 4D , Figure 1 is a schematic diagram of an electronic device 100 according to an embodiment of the present invention. Figure 2 for Figure 1 An exploded view of the electronic device 100 , Figure 3 for Figure 1 An exploded view of the electronic module 10, Figure 4A for Figure 1 A cross-sectional view of the electronic device 100 along direction 4A-4A', Figure 4B for Figure 1 A cross-sectional view of the electronic device 100 taken along direction 4B-4B', Figure 4C for Figure 1 The electronic device 100 is a cross-sectional view along the direction 4C-4C', and Figure 4D for Figure 1 To avoid over-complication, Figures 4A to 4D The packaging material 130 is not shown.

[0073] like Figure 1 As shown, in this embodiment, the electronic device 100 has a first surface 100S1 and a second surface 100S2 opposite to each other, and a third surface 100S3 and a fourth surface 100S4 opposite to each other, wherein the first surface 100S1 and the second surface 100S2 are connected to the third surface 100S3 and the fourth surface 100S4. In this embodiment, the first surface 100S1 and the second surface 100S2 are, for example, planes, while the third surface 100S3 and the fourth surface 100S4 are, for example, curved surfaces, such as elliptical surfaces, arc surfaces, etc.

[0074] like Figures 1 to 3 As shown, the electronic device 100 includes a connection module 110 and an electronic module 10. In this embodiment, the electronic device 100 is described as a charger (e.g., a small fast charger with high power density), wherein the connection module 110 is a plug module that can be plugged into a socket (which is electrically connected to a power source). This power (not shown) can be transmitted to the electronic module 10 through the connection module 110, and then transmitted to an external electronic device (not shown) connected to the electronic device 100, wherein the external electronic device is, for example, a computer, a smart phone, a home appliance, etc.

[0075] like Figures 1 to 3As shown, the electronic module 10 includes an electronic component 120, a packaging material 130, a first shell 140, a second shell 150, and a thermally conductive layer (or thermally conductive material) 160. The first shell 140 is located between the electronic component 120 and the second shell 150, and the first shell 140 and the electronic component 120 are located within the second shell 150. In this way, the first shell 140 can increase the thermal resistance of heat transfer from the electronic component 120 to the second shell 150, preventing the second shell 150 from overheating. In other words, the first shell 140 can act as a thermal resistor between the electronic component 120 and the second shell 150, hindering heat transfer from the electronic component 120 and preventing the second shell 150 from overheating. Due to the thermal resistance design of the electronic module 10, when the electronic device 100 is in operation, the temperature difference between the maximum temperature of the second shell 150 and the ambient temperature is no greater than a regulatory limit. Depending on the regulations, the regulatory limit is, for example, 52 degrees Celsius, but may be higher or lower. Furthermore, due to the thermal resistance design of the electronic module 10, the electronic device 100 is suitable for high-power density energy transmission. For example, if the power density of the electronic device 100 is equal to or greater than 0.8 watts per cubic centimeter (W / cc), it can still comply with the aforementioned temperature regulations. In other words, even if the electronic device 100 is designed as a high-power output device or a small device, it can still meet the regulatory temperature requirements.

[0076] As shown in Table 1 below, it presents the temperature performance of the electronic device of the comparative example and the electronic device 100 of the present embodiment after thermal flow simulation (for example, using Flotherm XT software). The difference between the electronic device of the comparative example and the electronic device 100 of the present embodiment is that the shell of the electronic device of the comparative example is a single-layer shell. The unit of the temperature in Table 1 is, for example, Celsius. The highest measured temperature in Table 1 is, for example, the highest temperature value of the temperature distribution on the surface, and the temperature difference is, for example, the temperature difference between the highest measured temperature and the ambient temperature (for example, 35 degrees Celsius). Taking the regulatory limit value of 42 degrees Celsius as an example, compared to the electronic device of the comparative example, which has three surfaces that failed verification, all six surfaces of the electronic device 100 of the present embodiment ( Figure 1 The six outer surfaces of the electronic device 100 have passed the verification, which shows that the thermal resistance design of the electronic device 100 according to the embodiment of the present invention can effectively reduce the temperature of the outer shell of the electronic device 100 (for example, the second shell 150).

[0077] Table 1

[0078]

[0079] like Figure 2As shown, the connection module 110 includes a connector 111 and a cover 112, wherein the connector 111 is fixed to the cover 112. The connector 111 includes a first electrode 111A, a second electrode 111B, a first connecting wire 111C, and a second connecting wire 111D. The first electrode 111A and the second electrode 111B are disposed through the cover 112 and are rotatable relative to the cover 112. The first connecting wire 111C and the second connecting wire 111D are electrically connected to the first electrode 111A and the second electrode 111B, respectively. The first connecting wire 111C and the second connecting wire 111D can be electrically connected to the electronic component 120, so that the power transmitted to the first electrode 111A and the second electrode 111B can be transmitted to the electronic component 120 via the first connecting wire 111C and the second connecting wire 111D.

[0080] like Figure 2 and 4A As shown, the electronic component 120 is, for example, a circuit board assembly (PCBA), but the present invention is not limited thereto. In addition, the electronic component 120 may also be referred to as a movement. The electronic component 120 includes at least one connector 121, which can be exposed from the first shell 140 and the second shell 150, so that the connector of the external electronic device can be connected to the connector 121. The connector 121 is, for example, a connector that complies with the Universal Serial Bus (USB) specification, such as USB-C, but the embodiments of the present invention are not limited thereto. When the electronic device 100 is a charger, the electronic component 120 may include a voltage conversion circuit (for example, step-down or step-up) to convert the voltage of the power supply into a voltage suitable for the operation of the external electronic device.

[0081] like Figures 2-3 As shown, the packaging material 130 is disposed in the first shell 140 and encapsulates or covers at least a portion of the electronic component 120. The packaging material 130 can conduct the heat of the electronic component 120. In detail, the packaging material 130 has a certain volume and can provide sufficient thermal capacity to absorb the heat of the electronic component 120, thereby preventing the temperature of the electronic component 120 from being too high and preventing the temperature of the second shell 150 from being too high. In addition, the packaging material 130 can contact at least a portion of the surface 141s2 (for example, the inner surface) of the first shell 140 to more evenly distribute the heat in the first shell 140 and avoid heat concentration in a specific location. In addition, the packaging material 130 is, for example, a potting compound, and its material may include epoxy resin, polyurethane (PU) or silicone. In other embodiments, the electronic device 100 may also omit the packaging material 130.

[0082] like Figures 2-3 As shown, the first shell 140 has a first opening 140a facing the connection module 110. Figure 2Partial components of the connection module 110 can enter the first shell 140 through the first opening 140a. The first shell 140 is disposed within the second shell 150, and therefore the first shell 140 can be referred to as the inner shell. The second shell 150, for example, is the outermost layer of the electronic device 100, and therefore the second shell 150 can be referred to as the outer shell. In this embodiment, the first shell 140 and the second shell 150 form a multi-layer shell. In another embodiment, the multi-layer shell may include N or more layers, where N is, for example, a positive integer equal to or greater than 3.

[0083] like Figure 3 、 4A As shown in Figures 4C and 4C , the first shell 140 includes a first shell 141 and at least one first connecting portion 142, wherein the first connecting portion 142 is connected to the first shell 141. The first connecting portion 142 is not coplanar with a surface of the first shell 141. For example, the first shell 141 has a surface 141s1 (e.g., an outer surface), and the first connecting portion 142 protrudes relative to the surface 141s1 (the first connecting portion 142 acts like a rib). The surface 141s1 is, for example, the outer surface of the first shell 141. In one embodiment, the first shell 141 and the first connecting portion 142 may form an integrally formed structure.

[0084] like Figure 2 and 4A As shown, the first shell 141 of the first shell 140 has at least one first through hole 141a. The first through hole 141a and the end surface 140e are located on different sides of the first shell 140. The connector 121 of the electronic component 120 can be exposed through the first through hole 141a, so that the connector of an external electronic device can be connected to the connector 121 through the first through hole 141a.

[0085] like Figure 3 and 4C As shown, the first shell 140 further includes at least one insulating portion 140r. The insulating portion 140r is recessed relative to the surface 141s1 to form a gap H1 between the second shell 151 and the first shell 140 (the gap between the second shell 151 and the bottom surface 140b of the insulating portion 140r). In one embodiment, a gap is defined between the first shell 140 and the second shell 150 in an area outside the insulating portion 140r. The gap H1 may be larger than the aforementioned gap. The gap H1 increases the thermal resistance between the first shell 140 and the second shell 150, thereby locally enhancing the thermal barrier effect for high-power electronic components and preventing the second shell 150 from overheating. In one embodiment, the insulating portion 140r may be positioned corresponding to a high-temperature point on the second shell 150 (e.g., a point that is higher or the highest temperature compared to the overall temperature of the electronic device 100) to mitigate heat transfer from this hot spot to the corresponding surface of the second shell 150.

[0086] like Figure 4BAs shown, the first shell 140 has an end surface 140e. A gap is defined between the end surface 140e and the connection module 110, i.e., the two are spaced apart. In this embodiment, a gap g2 is defined between the end surface 140e and the cover plate 112 of the connection module 110. This gap g2 increases the thermal resistance between the first shell 140 and the connection module 110, preventing the connection module 110 from overheating. Furthermore, the gap g2 can absorb assembly tolerances, preventing interference between the first shell 140 and the connection module 110 caused by these tolerances.

[0087] like Figure 2 As shown, the first shell 141 of the first shell 140 has a notch 141r, which is recessed relative to the end surface 140e of the first shell 140. When the first shell 140 is assembled with the connection module 110, the notch 141r can accommodate the connector 111 of the connection module 110, thereby preventing interference between the solid material of the first shell 141 and the connector 111.

[0088] like Figure 2 and 4A As shown, the second shell 150 has a second opening 150a, and the connecting module 110 can be disposed in the second opening 150a. For example, the cover plate 112 of the connecting module 110 can be configured in the second opening 150a. The second shell 150 has a receiving groove 150p, an end surface 150e, and a groove 150r, wherein the groove 150r extends from the end surface 150e to the bottom of the receiving groove 150p to form a groove bottom surface 150b. The aforementioned second opening 150a is, for example, an opening where the receiving groove 150p is exposed from the end surface 150e. The second shell 150 is connected to the connecting module 110, for example, the second shell 150 and the cover plate 112 of the connecting module 110 have an abutment portion. For example, the second shell 150 and the cover plate 112 can be fixed to each other by, for example, ultrasonic processing. The cover plate 112 has a bottom surface 112b that abuts (e.g., at abutment) the groove bottom surface 150b of the second shell 150, for example, by ultrasonic welding. The ultrasonic welding process melts the abutting portions of the cover plate 112 and the second shell 150, securing them to each other.

[0089] like Figure 2 and 4CAs shown, the second shell 150 includes a second shell 151 and at least one second connecting portion 152, wherein the second connecting portion 152 is located on the second shell 151. The second shell 151 has the aforementioned first surface 100S1, second surface 100S2, third surface 100S3, and fourth surface 100S4. The second connecting portion 152 is not coplanar with a surface of the second shell 151, and the first connecting portion 142 and the second connecting portion 152 are arranged correspondingly. For example, the second shell 151 has a surface 151s, and the second connecting portion 152 is recessed relative to the surface 151s (i.e., not coplanar). The surface 151s is, for example, the inner wall surface of the aforementioned receiving groove 150p. In one embodiment, the second shell 151 and the second connecting portion 152 can form an integral structure. In other embodiments, the second shell 150 can omit the aforementioned second connecting portion 152, so that the first connecting portion 142 of the first shell 140 can abut or contact a portion of the surface of the second shell 150, such as the surface 151s.

[0090] like Figure 4C and 4D As shown, the second joining portion 152 of the second shell 150 and the first joining portion 142 of the first shell 141 can be joined together to fix the relative position between the first shell 140 and the second shell 150. The second joining portion 152 of the second shell 150 and the first joining portion 142 of the first shell 141 match in appearance, making it easier for the first and second joining portions 142 and 152 to join. The first and second joining portions 142 and 152 provide positioning and guidance functions. Thus, during the manufacturing process of the electronic device 100, the first and second shells 140 and 150 can be quickly joined by aligning the second joining portion 152 with the first joining portion 142. In one embodiment, the second joining portion 152 and the first joining portion 142 are configured as a loose fit or a transition fit. Compared to an interference fit, a loose fit or a transition fit allows for easier joining of the first and second shells 140 and 150.

[0091] like Figure 2 and 4A As shown, the second shell 151 of the second housing 150 has at least one second through hole 151 a , and the connector 121 of the electronic component 120 can be exposed from the second through hole 151 a , so that the connector of an external electronic device can be connected to the connector 121 through the second through hole 151 a .

[0092] like Figure 4AAs shown, the second shell 150 and the first shell 140 may be at least partially separated. For example, the first shell 141 includes a first portion 1411 (e.g., an upper portion) and a second portion 1412 (e.g., a lower portion) connected to each other, while the second shell 151 includes a third portion 1511 (e.g., an upper portion) and a fourth portion 1512 (e.g., a lower portion) connected to each other. In this embodiment, the first portion 1411 of the first shell 140 and the third portion 1511 of the second shell 150 are separated by a gap g1. The gap g1 can increase the thermal resistance between the first shell 140 and the second shell 150, thereby preventing the second shell 150 from overheating. In another embodiment, the first portion 1411 of the first shell 140 and the third portion 1511 of the second shell 150 may also contact each other.

[0093] like Figure 4A As shown, the second portion 1412 of the first shell 140 and the fourth portion 1512 of the second shell 150 may be spaced apart from each other. For example, the second portion 1412 of the first shell 140 and the fourth portion 1512 of the second shell 150 may be spaced apart from each other by a thermally conductive layer 160. In another embodiment, if the thermally conductive layer 160 is omitted, the second portion 1412 of the first shell 140 and the fourth portion 1512 of the second shell 150 may be in direct contact. In one embodiment, at least a portion of the first portion 1411 may be disconnected from the second portion 1412. In other words, the first shell 140 does not necessarily need to be a complete, multi-faceted, continuous shell.

[0094] like Figure 4A As shown, the first housing 141 further includes a first bottom 1413 connecting the first portion 1411 and the second portion 1412, while the second housing 151 further includes a second bottom 1513 connecting the third portion 1511 and the fourth portion 1512. The first bottom 1413 and the second bottom 1513 may be separated by a thermally conductive layer 160. If the thermally conductive layer 160 is omitted, the first bottom 1413 and the second bottom 1513 may be in direct contact. In other embodiments, the first bottom 1413 and the second bottom 1513 may be spaced apart to increase the thermal resistance between the first housing 140 and the second housing 150, thereby preventing the second housing 150 from overheating.

[0095] In summary, the first shell 141 of the first shell 140 and the second shell 151 of the second shell 150 may be at least partially in contact and / or at least partially spaced apart. The aforementioned space may be filled with an air layer, which has a heat-insulating effect and forms a thermal resistance. In addition, the first shell 140 and / or the second shell 150 may be made of, for example, an electrically insulating material or a fire-resistant material, such as plastic, rubber, etc., wherein the plastic may include, for example, polycarbonate (PC), polypropylene (PP), acrylonitrile butadiene styrene (ABS), or nylon. In another embodiment, the first shell 140 and / or the second shell 150 may be made of, for example, a material with better heat conduction, such as metal, ceramic material, graphite, etc. In addition, the first shell 140 and the second shell 150 may be made of the same or different materials. For example, the first shell 140 and the second shell 150 may be made of plastic, which can provide insulation and fire-proof effects. For another example, the first shell 140 is made of metal, and the second shell 150 is made of plastic. The first shell 140 can conduct heat evenly, thereby reducing the temperature difference between the highest temperature and the lowest temperature of the second shell 150.

[0096] like Figure 2 and 3 As shown, the thermal conductive layer 160 can be disposed on the first shell 140. When the first shell 140, the second shell 150, and the thermal conductive layer 160 are assembled, the thermal conductive layer 160 is located between the first shell 140 and the second shell 150. In one embodiment, the thermal conductive layer 160 covers at least 50% of the surface of the first shell 140. The thermal conductive layer 160 provides uniform heat conduction, distributing heat more evenly within the first shell 140 and preventing heat from being concentrated in a specific location. Specifically, the thermal conductive layer 160 prevents heat from being concentrated in a specific location within the first shell 140, thereby preventing the corresponding location (positionally corresponding to the specific location) of the second shell 150 from being overheated. In terms of material, the thermal conductive layer 160 can be made of a metal such as aluminum, copper, gold, iron, or a combination thereof. In one embodiment, the thermal conductive layer 160 can be aluminum foil. In terms of process, the thermal conductive layer 160 can be formed on the first shell 140 using methods such as lamination, bonding, coating, electroplating, electroless plating, and deposition. The heat conducting layer 160 has, for example, at least one hollow portion 160a, which corresponds to the first connecting portion 142 in position to prevent the solid portion of the heat conducting layer 160 from interfering with or overlapping the first connecting portion 142. In other embodiments, the electronic device 100 may omit the heat conducting layer 160.

[0097] Please refer to Figures 5-8C , Figure 5 is a schematic diagram of an electronic device 200 according to another embodiment of the present invention. Figure 6 for Figure 5 An exploded view of the electronic device 200, Figure 7 for Figure 5 Another exploded view of the electronic device 200, Figure 8A for Figure 5 A cross-sectional view of the electronic device 200 along direction 8A-8A', Figure 8B for Figure 5 A cross-sectional view of the electronic device 200 taken along direction 8B-8B', Figure 8C for Figure 5 The electronic device 200 is a cross-sectional view taken along direction 8C-8C', and Figure 8D for Figure 5 To avoid over-complication, Figures 5 to 8D The packaging material 130 is not shown in the figure.

[0098] like Figures 5-7 As shown, the electronic device 200 includes a connection module 210 and an electronic module 20. In this embodiment, the electronic device 200 is described by taking a charger as an example, wherein the connection module 210 is a plug module that can be plugged into a socket (which is electrically connected to a power source). This power (not shown) can be transmitted to the electronic module 20 through the connection module 210, and then transmitted to an external electronic device (not shown) connected to the electronic device 200, wherein the external electronic device is, for example, a computer, a smart phone, a home appliance, etc.

[0099] like Figures 5-7 As shown, the electronic module 20 includes an electronic component 220, an encapsulating material 130 (not shown), a first shell 240, a second shell 250, and a thermally conductive layer 160 (not shown). The first shell 240 is located between the electronic component 220 and the second shell 250, and the first shell 240 and the electronic component 220 are located within the second shell 250. This prevents the heat from the electronic component 220 from being transferred to the second shell 250, thus preventing the second shell 250 from overheating. In other words, the first shell 240 acts as a thermal barrier between the electronic component 220 and the second shell 250, preventing the second shell 250 from overheating. Due to the thermal resistance design of the electronic module 20, when the electronic device 200 is in operation, the temperature difference between the maximum temperature of the second shell 250 and the ambient temperature is no greater than a regulatory limit. Depending on the regulations, the regulatory limit may be 52 degrees Celsius, for example, but may be higher or lower.

[0100] The electronic device 200 includes the same or similar technical features as the electronic device 100, with at least one difference being that the appearance of the electronic device 200 is different from that of the electronic device 100. For example, the electronic device 200 has a first surface 200S1 and a second surface 200S2 that are opposite to each other, a third surface 200S3 and a fourth surface 200S4 that are opposite to each other, and at least one connecting surface 200S5, wherein two of the first surface 200S1, the second surface 200S2, the third surface 200S3, and the fourth surface 200S4 can be connected via the connecting surface 200S5 or directly connected to each other. Unlike the appearance of the aforementioned electronic device 100, the third surface 200S3 and the fourth surface 200S4 of the electronic device 200 of this embodiment are, for example, flat surfaces, while the connecting surface 200S5 is, for example, a curved surface, such as an elliptical surface or an arc surface.

[0101] like Figure 6 As shown, the connection module 110 includes a connector 111 and a cover 212, wherein the connector 111 is fixed to the cover 212. The connector 111 includes a first electrode 111A, a second electrode 111B, a first connecting wire 111C, and a second connecting wire 111D. The first electrode 111A and the second electrode 111B are disposed through the cover 212 and are rotatable relative to the cover 212. The first connecting wire 111C and the second connecting wire 111D are electrically connected to the first electrode 111A and the second electrode 111B, respectively. The first connecting wire 111C and the second connecting wire 111D can be electrically connected to the electronic component 120, so that power transmitted to the first electrode 111A and the second electrode 111B can be transmitted to the electronic component 120 via the first connecting wire 111C and the second connecting wire 111D.

[0102] like Figure 6 and 8A As shown, the electronic component 120 is, for example, a circuit board assembly (PCBA), but the present invention is not limited thereto. In addition, the electronic component 120 can also be called a movement. The electronic component 120 includes at least one connector 121, which can be exposed from the first shell 240 and the second shell 250, so that the connector of the external electronic device can be connected to the connector 121. The connector 121 is, for example, a connector that complies with the Universal Serial Bus (USB) specification, such as USB-C, but the embodiments of the present invention are not limited thereto. When the electronic device 200 is a charger, the electronic component 120 may include a voltage conversion circuit (for example, step-down or step-up) to convert the voltage of the power supply into a voltage suitable for the operation of the external electronic device.

[0103] Although not shown, in another embodiment, the packaging material 130 (shown in FIG. Figure 2) can be disposed within the first housing 240 and encapsulate at least a portion of the electronic component 120. The encapsulation material 130 can conduct heat from the electronic component 120. Specifically, the encapsulation material 130 has a certain volume, thus providing sufficient thermal capacity to absorb heat from the electronic component 120, thereby preventing the electronic component 120 from overheating and preventing the second housing 150 from overheating. In other embodiments, the electronic device 200 may omit the encapsulation material 130.

[0104] like Figures 6-7 As shown, the first shell 240 is disposed within the second shell 250, and therefore the first shell 240 can be referred to as the inner shell. The second shell 250, for example, is the outermost layer of the electronic device 200, and therefore the second shell 250 can be referred to as the outer shell. In this embodiment, the first shell 240 and the second shell 250 form a multi-layer shell. In another embodiment, the multi-layer shell can include N or more layers, where N is, for example, a positive integer equal to or greater than 3.

[0105] like Figure 7 and 8B As shown, the first housing 240 includes a first shell 241 and at least one first connecting portion 242, wherein the first connecting portion 242 is connected to the first shell 241. For example, the first shell 241 has a surface 241s, and the first connecting portion 242 protrudes relative to the surface 241s (the first connecting portion 242 acts like a rib). The surface 241s is, for example, the outer surface of the first shell 241. In one embodiment, the first shell 241 and the first connecting portion 242 are, for example, an integrally formed structure.

[0106] like Figure 7 As shown, the first shell 241 of the first housing 240 has at least one first through hole 241a, through which the connector 121 of the electronic component 120 can be exposed. A connector of an external electronic device can be connected to the connector 121 through the first through hole 241a.

[0107] Although not shown, the first shell 240 may further include at least one insulating portion similar to the aforementioned insulating portion 140r. The insulating portion is recessed relative to the surface 241s to form a gap between the second shell 250 and the first shell 240. This gap increases the thermal resistance between the first shell 240 and the second shell 250, thereby preventing the second shell 250 from overheating. In one embodiment, the insulating portion may be positioned corresponding to a high-temperature point (e.g., a relatively high temperature point or the highest temperature point) of the second shell 250 to reduce the temperature of the hot spot.

[0108] like Figure 8A and 8BAs shown, the first shell 240 has an end surface 240e, which is spaced apart from the connection module 210. In this embodiment, the first portion 2411 of the first housing 241 of the first shell 240 has the aforementioned end surface 240e, with a gap g2 separating the end surface 240e from the cover plate 212 of the connection module 210. This gap g2 increases the thermal resistance between the first shell 240 and the connection module 210, preventing the second shell 250 from overheating. Furthermore, the gap g2 can absorb assembly tolerances, preventing interference between the first shell 240 and the connection module 210 caused by these tolerances.

[0109] like Figure 7 As shown, the first shell 241 of the first shell 240 has a notch 241r, which is recessed relative to the end surface 240e of the first shell 240. When the first shell 240 is assembled with the connection module 210, the notch 241r can accommodate the connector 111 of the connection module 210, thereby preventing interference between the solid material of the first shell 241 and the connector 111.

[0110] like Figure 7 and 8A As shown, the second shell 250 has a receiving groove 250p, an end surface 250e, and a groove 250r, wherein the groove 250r extends from the end surface 250e to the bottom of the receiving groove 250p to form a groove bottom surface 250b. In addition, the second shell 250 is connected to the cover plate 212. For example, the second shell 250 and the cover plate 212 can be fixed to each other by, for example, an ultrasonic process. The cover plate 212 has a bottom surface 212b, and the bottom surface 212b of the cover plate 212 abuts the groove bottom surface 250b of the second shell 250, for example, by an ultrasonic process. The ultrasonic process melts the abutting portions of the cover plate 212 and the second shell 250, thereby enabling them to be fixed to each other.

[0111] like Figure 7 and 8C As shown, the second shell 250 includes a second housing 251 and at least one second coupling portion 252, wherein the second coupling portion 252 is located on the second housing 251. The second housing 251 has the aforementioned first surface 200S1, second surface 200S2, third surface 200S3, and fourth surface 200S4. Furthermore, the second housing 251 has a surface 251s, and the second coupling portion 252 is recessed relative to the surface 251s. Surface 251s is, for example, the inner wall surface of the aforementioned accommodating groove 250p. In one embodiment, the second housing 251 and the second coupling portion 252 may form an integrally formed structure.

[0112] like Figure 8C and 8DAs shown, the second joining portion 252 of the second shell 250 and the first joining portion 242 of the first shell 241 can be joined together to fix the relative position between the first shell 240 and the second shell 250. The second joining portion 252 of the second shell 250 and the first joining portion 242 of the first shell 241 match in appearance, making it easier for the first and second joining portions 242 and 252 to join. The first and second joining portions 242 and 252 can provide positioning and guidance functions. In this way, during the manufacturing process of the electronic device 200, the first and second shells 240 and 250 can be quickly joined by aligning the second joining portion 252 with the first joining portion 242. In one embodiment, the second joining portion 252 and the first joining portion 242 are, for example, loosely fitted or transitionally fitted. Compared to an interference fit, a loose fit or transitionally fitted fit allows for easier joining of the first and second shells 240 and 250.

[0113] like Figure 7 As shown, the second shell 251 of the second housing 250 has at least one second through hole 251 a , and the connector 121 of the electronic component 120 can be exposed from the second through hole 251 a , so that the connector of an external electronic device can be connected to the connector 121 through the second through hole 251 a .

[0114] like Figure 8B and 8C As shown, in this embodiment, the second shell 251 of the second shell 250 and the first shell 241 of the first shell 240 may be at least partially separated, for example, completely separated. For example, the first shell 241 includes a first portion 2411 (e.g., an upper portion) and a second portion 2412 (e.g., a lower portion) connected to each other, while the second shell 251 includes a third portion 2511 (e.g., an upper portion) and a fourth portion 2512 (e.g., a lower portion) connected to each other. In this embodiment, the first portion 2411 of the first shell 240 and the third portion 2511 of the second shell 250 are separated from each other, which can increase the thermal resistance between the first shell 240 and the second shell 250, thereby preventing the second shell 250 from overheating. In addition, the second portion 2412 of the first shell 240 and the fourth portion 2512 of the second shell 250 are separated from each other, thereby increasing the thermal resistance between the first shell 240 and the second shell 250, thereby preventing the second shell 250 from overheating. Furthermore, the first housing 241 further includes a first bottom 2413 connecting the first portion 2411 and the second portion 2412, and the second housing 251 further includes a second bottom 2513 connecting the third portion 2511 and the fourth portion 2512. The first bottom 2413 and the second bottom 2513 are spaced apart from each other to increase the thermal resistance between the first housing 240 and the second housing 250, thereby preventing the second housing 250 from overheating.

[0115] In another embodiment, the third part 2511 of the second shell 251 of the second shell 250 and the first part 2411 of the first shell 241 of the first shell 240 may contact each other, the fourth part 2512 of the second shell 251 of the second shell 250 and the second part 2412 of the first shell 241 of the first shell 240 may contact each other and / or the second bottom 2513 of the second shell 251 of the second shell 250 and the first bottom 2413 of the first shell 241 of the first shell 240 may contact each other.

[0116] In summary, the first shell 241 of the first shell 240 and the second shell 251 of the second shell 250 may be at least partially in contact and / or at least partially spaced apart from each other. Furthermore, the first shell 240 and / or the second shell 250 may be made of, for example, an electrically insulating material such as plastic or rubber. However, in another embodiment, the first shell 240 and / or the second shell 250 may be made of, for example, a conductive material. Furthermore, the first shell 240 and the second shell 250 may be made of the same or different materials.

[0117] Please refer to Figures 9A to 9F , which is Figure 1 FIG. 1 is a diagram illustrating a manufacturing process of the electronic device 100 .

[0118] like Figure 9A As shown, the electronic component 120 is electrically connected to the connection module 110, wherein the electronic component 120 and the connection module 110 form a first pre-assembly 100A. In this embodiment, the connection module 110 is connected to the electronic component 120 via its first connection line 111C and second connection line 111D.

[0119] like Figure 9B As shown, the first shell 140 may be formed by, for example, injection molding technology. Then, a bonding technology may be used to form a heat conducting layer 160 covering at least a portion of the surface 141s1 of the first housing 141 of the first shell 140.

[0120] like Figure 9C As shown, Figure 9A The first pre-assembled part 100A is arranged on Figure 9B The first pre-assembled component 100A and the first shell 140 form a second pre-assembled component 100B.

[0121] like Figure 9D As shown, at least one plug 30 is disposed on (or blocks) the connector 121 of the electronic component 120 (the connector 121 is Figure 9C ) to avoid the subsequent formation of the packaging material 130 (the packaging material 130 is Figure 9E) into the interior of connector 121. In one embodiment, plug 30 is made of, for example, rubber or plastic. However, the present invention is not limited to the material, shape, and / or size of plug 30, as long as it covers the opening of connector 121 to prevent overflow of the packaging material in subsequent steps.

[0122] like Figure 9E As shown, the packaging material 130 can be formed by injection, potting or coating technology. Figure 9D In the first shell 140. Figure 9E In the embodiment, the encapsulation material 130 covers at least a portion of the electronic component 120. In one embodiment, the top surface of the encapsulation material 130 does not extend beyond the end surface 140e of the first shell 140. In one embodiment, a gap is provided between the top surface of the encapsulation material 130 and the end surface 140e of the first shell 140. Because the plug 30 is disposed in the opening of the connector 121 of the electronic component 120, the encapsulation material 130 is prevented from entering the interior of the connector 121 through the opening.

[0123] The plug 30 can then be removed from the connector 121 .

[0124] like Figure 9F As shown, Figure 9D The assembled components (with the plug 30 removed) are disposed in the second shell 150 , wherein the first shell 140 is located between the electronic component 120 and the second shell 150 .

[0125] Then, ultrasonic technology may be used to combine the connection module 110 and the second shell 150 to form a Figure 1 The electronic device 100 is shown.

[0126] The manufacturing method of the electronic device 200 includes steps that are the same as or similar to the manufacturing method of the aforementioned electronic device 100 , and will not be further described herein.

[0127] In summary, embodiments of the present invention provide an electronic module, an electronic device using the same, and a manufacturing method thereof. The electronic module includes a housing and an electronic component, wherein the electronic component is disposed within the housing. In one embodiment, the housing is a multi-layer housing, which may include at least one inner housing and an outer housing (e.g., the outermost layer of the housing). In another embodiment, at least one inner housing of the housing can increase the thermal resistance of heat transfer from the electronic component to the outer housing, thereby preventing the outer housing from overheating. In another embodiment, two of the multiple housings of the housing can be at least partially in contact and / or at least partially spaced apart. The spacer between the multiple housings of the housing is, for example, an air layer, which can form a thermal resistance, thereby preventing the outer housing temperature (a certain point temperature or an average temperature) from being too high. In other embodiments, the inner housing of the housing has an isolating portion, which can increase the distance between the inner housing and the outer housing, thereby increasing the thermal resistance of heat transfer from the electronic component to the outer housing, thereby preventing the outer housing temperature (a certain point temperature or an average temperature) from being too high.

[0128] In summary, although the present invention has been disclosed above with reference to the embodiments, these are not intended to limit the present invention. Persons skilled in the art of the present invention may make various modifications and alterations without departing from the spirit and scope of the present invention. These modifications and alterations are not limited by the embodiments and remain within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. An electronic device, characterized in that: include: an electronic component; a first shell; as well as a second shell; The first shell is located between the electronic component and the second shell, and the first shell and the electronic component are located inside the second shell.

2. The electronic device according to claim 1, wherein The first shell is at least partially spaced from the second shell.

3. The electronic device according to claim 1, wherein: The first shell is at least partially in contact with the second shell.

4. The electronic device according to claim 1, wherein: The first shell includes a first coupling portion, and the first coupling portion contacts a portion of a surface of the second shell.

5. The electronic device according to claim 1, wherein: The first shell includes a first shell and a first combining portion, the first combining portion is not coplanar with a surface of the first shell, the second shell includes a second shell and a second combining portion, the second combining portion is not coplanar with a surface of the second shell, and the first combining portion and the second combining portion are arranged correspondingly.

6. The electronic device according to claim 1, wherein: Also includes: A heat-conducting layer is disposed between the first shell and the second shell.

7. The electronic device according to claim 1, wherein: The first shell has an outer surface and an isolation portion, the isolation portion is recessed relative to the outer surface, there is a spacing between the first shell and the second shell corresponding to the isolation portion, and there is a gap between the first shell and the second shell corresponding to the area outside the isolation portion, wherein the spacing is larger than the gap.

8. The electronic device according to any one of claims 1 to 7, wherein: Also includes: A packaging material is disposed in the first shell and covers at least a portion of the electronic component, wherein the packaging material contacts a portion of the inner surface of the first shell.

9. The electronic device according to any one of claims 1 to 7, wherein: Also includes: A connection module is electrically connected to the electronic component and combined with the second shell, wherein the first shell has a first opening facing the connection module, the second shell has a second opening, and the connection module is disposed at the second opening.

10. The electronic device according to claim 9, wherein: The first shell has an end surface, and a gap is formed between the end surface and the connecting module.

11. An electronic device, characterized in that: include: an electronic component; a first shell; a second housing, wherein the first housing and the electronic component are located within the second housing; a packaging material, disposed in the first shell and covering at least a portion of the electronic component; as well as A connecting module is provided, wherein the connecting module is connected to the second shell, and the first shell has an end surface facing the connecting module.

12. The electronic device according to claim 11, wherein: The second shell and the connection module have an abutting portion, and a gap is formed between the end surface and the abutting portion.

13. The electronic device according to claim 11, wherein: The packaging material contacts a portion of the inner surface of the first shell, and a top surface of the packaging material does not exceed the end surface of the first shell.

14. The electronic device according to claim 11, wherein: Part of the outer surface of the first shell has a heat-conducting material.

15. The electronic device according to claim 11, wherein: The first shell has a through hole, and the through hole and the end surface are located on different sides of the first shell.

16. The electronic device according to any one of claims 11 to 15, wherein: The first shell includes a first portion, a second portion, and a first opening facing the connection module, and at least a portion of the first portion is not connected to the second portion.

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