Wire laser peeler

Abstract

The utility model relates to the technical field of wire rod peeling, in particular to a wire rod laser peeling machine which comprises a first clamping mechanism, a second clamping mechanism, a clamping transverse movement driving mechanism, a clamping laser cutting mechanism and a clamping rotary peeling mechanism. The first clamping mechanism and the second clamping mechanism are both used for clamping a wire rod, and the second clamping mechanism is located on one side of the clamping laser cutting mechanism and the clamping rotary peeling mechanism; the clamping laser cutting-off mechanism is used for clamping the wire and conducting laser cutting on the wire at the same time. The clamping transverse movement driving mechanism is used for driving the first clamping mechanism to move from the clamping laser cutting mechanism to the clamping rotary peeling mechanism; and the clamping and rotating peeling mechanism is used for peeling the cut wire rod. The utility model aims to provide the laser peeling machine for the wire rod, which is higher in peeling efficiency and higher in precision.

Description

Technical Field

[0001] The utility model relates to the technical field of wire peeling, in particular to a wire laser peeling machine. Background Art

[0002] Currently, with existing technologies, most companies use manual labor or cutters to strip power cords, which is not only labor-intensive but also inefficient. In addition, it is difficult for humans to accurately control the stripping force. During the entire stripping process, the power cord cannot be well fixed, often resulting in damage to the power cord. Summary of the Invention

[0003] In order to overcome the shortcomings and deficiencies in the prior art, the purpose of the present invention is to provide a wire laser peeling machine with faster peeling efficiency and higher precision.

[0004] The utility model is realized through the following technical solutions:

[0005] A wire laser peeling machine includes a first clamping mechanism, a second clamping mechanism, a clamping transverse driving mechanism, a clamping laser cutting mechanism and a clamping rotary peeling mechanism; the first clamping mechanism and the second clamping mechanism are both used to clamp the wire, and the second clamping mechanism is located on one side of the clamping laser cutting mechanism and the clamping rotary peeling mechanism; the clamping laser cutting mechanism is used to clamp the wire and laser cut the wire at the same time; the clamping transverse driving mechanism is used to drive the first clamping mechanism to move from the clamping laser cutting mechanism to the clamping rotary peeling mechanism; the clamping rotary peeling mechanism is used to peel the wire that has been cut.

[0006] Wherein, the first clamping mechanism includes a first base and a first clamping claw mounted on the first base, and the first base is located on one side of the clamping laser cutting mechanism and the clamping rotary peeling mechanism;

[0007] The second clamping mechanism includes a second base and a second clamping claw installed on the second base, and the second base is connected to the output end of the clamping transverse movement driving mechanism.

[0008] The clamping laser cutting mechanism includes a first machine, a first rotating drive component installed on the first machine, a laser generating device, and a cutting clamp installed on the output end of the first rotating drive component. The laser generating device is located on one side of the cutting clamp.

[0009] Among them, the clamping and rotating peeling mechanism includes a second machine, a peeling transverse movement mechanism that drives the second machine away from or close to the clamping mechanism, a second rotating drive installed on the second machine, and a peeling clamping member installed on the output end of the second rotating drive member.

[0010] Wherein, a buffer column is provided on one side of the second machine platform close to the second clamping mechanism.

[0011] Wherein, the peeling transverse movement mechanism and the clamping transverse movement drive mechanism are both linear motors.

[0012] Beneficial effects of the utility model:

[0013] The present invention relates to a wire laser peeling machine. The machine is provided with a first clamping mechanism, a second clamping mechanism, a clamping transverse drive mechanism, a clamping laser cutting mechanism, and a clamping rotary peeling mechanism. When in use, the wire to be peeled is placed on the first clamping mechanism for clamping and limiting. The clamping transverse drive mechanism then drives the first clamping mechanism to move the wire transversely to the corresponding position of the clamping laser cutting mechanism. The second clamping mechanism clamps the wire for secondary limiting. The clamping laser cutting mechanism clamps the wire and drives the wire to rotate according to a certain pattern. During this process, the laser is used to cut the part of the wire to be cut. The second clamping mechanism and the clamping laser cutting mechanism then release the wire respectively. The clamping transverse drive mechanism drives the wire transversely to the corresponding position of the clamping rotary peeling mechanism. The clamping rotary peeling mechanism clamps, rotates, and pulls out the cut wire to achieve the effect of automatic peeling. Due to the high precision and fast action time of the laser, the present invention has faster peeling efficiency and higher precision compared with the existing technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention is further described with reference to the accompanying drawings. However, the embodiments in the accompanying drawings do not constitute any limitation to the present invention. A person skilled in the art can obtain other drawings based on the following drawings without creative effort.

[0015] Figure 1 It is a structural diagram of the present utility model.

[0016] Reference numerals

[0017] First clamping mechanism--100, first base--101, first clamping claw--102,

[0018] Second clamping mechanism--200, second base--201, second clamping claw--202,

[0019] Clamping and traverse drive mechanism--300,

[0020] Clamping laser cutting mechanism--401, first machine--402, laser generating device--404, cutting clamp--405,

[0021] Clamping and rotating peeling mechanism--500, second machine--501, peeling transverse movement mechanism--502, peeling clamping piece--504, buffer column--505. DETAILED DESCRIPTION

[0022] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0023] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0025] Currently, with existing technologies, most companies use manual labor or cutters to strip power cords, which is not only labor-intensive but also inefficient. In addition, it is difficult for humans to accurately control the stripping force. During the entire stripping process, the power cord cannot be well fixed, often resulting in damage to the power cord.

[0026] In order to solve the above problems, this embodiment discloses a wire laser peeling machine, the structure of which is as follows: Figure 1As shown, the laser peeling machine includes a first clamping mechanism 100, a second clamping mechanism 200, a clamping transverse driving mechanism 300, a clamping laser cutting mechanism 401 and a clamping rotary peeling mechanism 500; the first clamping mechanism 100 and the second clamping mechanism 200 are both used to clamp the wire, and the second clamping mechanism 200 is located on one side of the clamping laser cutting mechanism 401 and the clamping rotary peeling mechanism 500; the clamping laser cutting mechanism 401 is used to clamp the wire and perform laser cutting on the wire at the same time; the clamping transverse driving mechanism 300 is used to drive the first clamping mechanism 100 to move from the clamping laser cutting mechanism 401 to the clamping rotary peeling mechanism 500; the clamping rotary peeling mechanism 500 is used to peel the wire that has been cut.

[0027] Specifically, a wire laser peeling machine of this embodiment is provided with a first clamping mechanism 100, a second clamping mechanism 200, a clamping transverse driving mechanism 300, a clamping laser cutting mechanism 401 and a clamping rotary peeling mechanism 500. When in use, the wire to be peeled is placed on the first clamping mechanism 100 for clamping and limiting, and then the clamping transverse driving mechanism 300 drives the first clamping mechanism 100 to drive the wire to move transversely to the corresponding position of the clamping laser cutting mechanism 401, and the second clamping mechanism 200 The wire is clamped for secondary position limiting. The clamping laser cutting mechanism 401 clamps the wire and drives it to rotate according to a certain pattern. During this process, the laser is used to cut the portion of the wire to be cut. Then, the second clamping mechanism 200 and the clamping laser cutting mechanism 401 respectively loosen the wire. The clamping transverse drive mechanism 300 drives the wire transversely to the corresponding position of the clamping and rotating peeling mechanism 500. The clamping and rotating peeling mechanism 500 clamps, rotates, and pulls out the cut wire to achieve the effect of automatic peeling. Due to the high precision and fast action time of the laser, the laser peeling machine of this embodiment has faster peeling efficiency and higher precision compared to the existing technology.

[0028] Specifically, the first clamping mechanism 100 includes a first base 101 and a first clamping claw 102 installed on the first base 101, and the first base 101 is located on one side of the clamping laser cutting mechanism 401 and the clamping rotary peeling mechanism 500; the second clamping mechanism 200 includes a second base 201 and a second clamping claw 202 installed on the second base 201, and the second base 201 is connected to the output end of the clamping transverse driving mechanism 300.

[0029] Specifically, the clamping laser cutting mechanism 401 includes a first machine 402, a first rotating drive component installed on the first machine 402, a laser generating device 404 and a cutting clamp 405 installed on the output end of the first rotating drive component, and the laser generating device 404 is located on one side of the cutting clamp 405.

[0030] Specifically, the clamping and rotating peeling mechanism 500 includes a second machine 501, a peeling transverse movement mechanism 502 that drives the second machine 501 away from or toward the clamping mechanism, a second rotating drive mounted on the second machine 501, and a peeling clamp 504 mounted at the output end of the second rotating drive. In this embodiment, the first and second rotating drives are preferably motors. Furthermore, the first rotating drive, the cutting clamp 405, the second rotating drive, and the peeling clamp 504 are present in at least two pieces, thereby enabling simultaneous peeling of more wires and improving peeling efficiency.

[0031] In addition, a buffer column 505 is provided on a side of the second platform 501 close to the second clamping mechanism 200 to prevent the second platform 501 from colliding with the second clamping mechanism 200 during movement.

[0032] Preferably, the peeling transverse movement mechanism 502 and the clamping transverse movement drive mechanism 300 are both linear motors, and the first rotating drive member and the second rotating drive member are preferably servo motors.

[0033] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit the scope of protection of the utility model. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the utility model.

Claims

1. A wire laser peeling machine, characterized in that: It includes a first clamping mechanism, a second clamping mechanism, a clamping transverse driving mechanism, a clamping laser cutting mechanism and a clamping rotary peeling mechanism; The first clamping mechanism and the second clamping mechanism are both used to clamp the wire, and the second clamping mechanism is located on one side of the clamping laser cutting mechanism and the clamping rotary peeling mechanism; The clamping laser cutting mechanism is used to clamp the wire and simultaneously perform laser cutting on the wire; The clamping and transverse driving mechanism is used to drive the first clamping mechanism to move from the clamping laser cutting mechanism to the clamping and rotating peeling mechanism; The clamping and rotating peeling mechanism is used for peeling the wire rod that has been cut.

2. A wire laser peeling machine according to claim 1, characterized in that: The first clamping mechanism includes a first base and a first clamping claw mounted on the first base, wherein the first base is located on one side of the clamping laser cutting mechanism and the clamping rotary peeling mechanism; The second clamping mechanism includes a second base and a second clamping claw installed on the second base, and the second base is connected to the output end of the clamping transverse movement driving mechanism.

3. A wire laser peeling machine according to claim 1, characterized in that: The clamping laser cutting mechanism includes a first machine, a first rotating driving member installed on the first machine, a laser generating device and a cutting clamping member installed on the output end of the first rotating driving member, and the laser generating device is located on one side of the cutting clamping member.

4. A wire laser peeling machine according to claim 1, characterized in that: The clamping and rotating peeling mechanism includes a second machine, a peeling transverse movement mechanism that drives the second machine away from or close to the clamping mechanism, a second rotating drive installed on the second machine, and a peeling clamping member installed on the output end of the second rotating drive member.

5. A wire laser peeling machine according to claim 4, characterized in that: A buffer column is provided on one side of the second platform close to the second clamping mechanism.

6. A wire laser peeling machine according to claim 4, characterized in that: The peeling transverse movement mechanism and the clamping transverse movement drive mechanism are both linear motors.

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