Wafer processing device

Abstract

The wafer processing device comprises a loading and unloading assembly and a first polishing assembly, the loading and unloading assembly is provided with a containing groove used for containing the wafer, the groove wall of the containing groove is provided with at least one cleaning agent spraying opening, and the first polishing assembly is arranged opposite to the containing groove in the depth direction of the containing groove. The polishing device is used for chemically and mechanically polishing the axial second end of the wafer. According to the utility model, the wafer is carried and fixed through the loading and unloading assembly, and the back surface of the wafer on the loading and unloading assembly is polished through the first polishing assembly, so that the smoothness of the back surface of the wafer is improved. The loading and unloading assembly is provided with a cleaning agent spraying opening for spraying a cleaning agent to the wafer, so that when the back face of the wafer is polished, the front face of the wafer is synchronously cleaned, the wafer CMP efficiency is improved, the wafer back face polishing equipment is replaced by the first polishing assembly capable of being integrated in the CMP equipment, and the cleaning function is integrated on the loading and unloading assembly; extra equipment does not need to be purchased, and the cost can be saved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a wafer processing device. Background Art

[0002] This section merely provides background information related to the present disclosure and is not necessarily prior art.

[0003] Particles on the back of the wafer are prone to poor focusing during calibration operations on the lithography equipment, leading to reduced production efficiency.

[0004] Therefore, before the photolithography process, front-side polishing and back-side polishing are required in CMP (Chemical Mechanical Polishing). The existing CMP equipment workflow involves unloading the front-side polishing equipment to a cleaning station and then transporting it to another CMP equipment station for back-side polishing and cleaning. This process is lengthy and results in low production efficiency.

[0005] Furthermore, adding a CMP step for backside polishing requires the purchase of additional equipment, which increases costs and reduces productivity and competitiveness. Utility Model Content

[0006] The purpose of the present invention is to at least solve the technical problem of low production efficiency of existing wafer processing devices. This purpose is achieved through the following technical solutions:

[0007] The utility model provides a wafer processing device for wafers, comprising:

[0008] a loading and unloading assembly having a receiving tank for receiving the wafer, wherein at least one cleaning agent injection port is provided on a tank wall of the receiving tank, the cleaning agent injection port being arranged to spray cleaning agent toward an opening of the receiving tank, and the cleaning agent injection port being used to spray cleaning agent toward a first axial end of the wafer;

[0009] The first polishing assembly is arranged opposite to the accommodating groove along the depth direction of the accommodating groove and is used for performing chemical mechanical polishing on the second axial end of the wafer.

[0010] The wafer processing device proposed in the utility model transports and fixes the wafer via a loading and unloading assembly, and polishes the back side of the wafer on the loading and unloading assembly via a first polishing assembly, thereby improving the smoothness of the back side of the wafer. The loading and unloading assembly also has a cleaning agent injection port for injecting cleaning agent into the wafer, so that the front side of the wafer is cleaned simultaneously while the back side of the wafer is polished, thereby improving the efficiency of the wafer CMP. In addition, the wafer back side polishing equipment is replaced by the first polishing assembly that can be integrated into the CMP equipment. The cleaning function is integrated into the loading and unloading assembly, eliminating the need to purchase additional equipment and thus saving costs.

[0011] In addition, the wafer processing device according to the present invention may also have the following additional technical features:

[0012] In some embodiments of the present invention, the loading and unloading assembly includes a loading and unloading chuck, the loading and unloading chuck includes a base and a mounting portion, the mounting portion is arranged in an annular manner on the side of the base facing the first polishing assembly, the accommodating groove is defined between the inner circumferential side of the mounting portion and the side of the base facing the first polishing assembly, the cleaning agent injection port is arranged on the base, and at least one cleaning agent channel is also provided in the base, one end of the cleaning agent channel is connected to the cleaning agent injection port, and the other end of the cleaning agent channel is used to connect to the cleaning agent supply device.

[0013] In some embodiments of the present invention, the loading and unloading assembly also includes a flexible pad arranged in the accommodating groove, the flexible pad is attached to the base, a connecting hole is provided on the flexible pad, the connecting hole passes through the flexible pad, and the connecting hole is connected to the cleaning agent injection port.

[0014] In some embodiments of the present invention, the receiving tank is cylindrical, the first polishing assembly includes a polishing head and a first driving device, the first driving device is transmission-connected to the polishing head, the first driving device is used to drive the polishing head to rotate, the rotating axis of the polishing head is parallel to the axis of the receiving tank, and the end of the polishing head facing the base is used to perform chemical-mechanical polishing on the wafer.

[0015] In some embodiments of the present invention, at least one polishing liquid injection port is provided at one end of the polishing head facing the base, and the polishing liquid injection port is used to spray polishing liquid onto the wafer. At least one polishing liquid channel is provided inside the polishing head, and one end of the polishing liquid channel is connected to the polishing liquid injection port, and the other end of the polishing liquid channel is used to connect to the polishing liquid supply device.

[0016] In some embodiments of the present invention, the first polishing assembly further includes a control arm and a second drive device, wherein one end of the control arm along its own length direction is connected to the first drive device, and the other end of the control arm along its own length direction is transmission-connected to the second drive device, and the second drive device is used to drive the control arm to rotate relative to the polishing head to adjust the relative position of the polishing head and the loading and unloading assembly.

[0017] In some embodiments of the present invention, the number of the polishing liquid injection ports is greater than or equal to three, one of the polishing liquid injection ports is located on the rotating axis of the polishing head, and the remaining polishing liquid injection ports are arranged at intervals along the circumference of the rotating axis.

[0018] In some embodiments of the present invention, the number of the cleaning agent injection ports is greater than or equal to three, one of the cleaning agent injection ports is located on the axis of the receiving tank, and the remaining polishing liquid injection ports are arranged at intervals along the circumference of the receiving tank.

[0019] In some embodiments of the present invention, the receiving groove is cylindrical in shape, and the end of the mounting portion facing away from the base is provided with a chamfer or a rounded corner, and the chamfer or the rounded corner is located on the side of the mounting portion facing the receiving groove.

[0020] In some embodiments of the present invention, the wafer processing device also includes a second polishing assembly and a transport robot, the second polishing assembly is used to perform chemical mechanical polishing on the first axial end of the wafer, and the transport robot is used to transport the loading and unloading assembly from the position of the second polishing assembly to the position of the first polishing assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present invention. The same reference numerals are used throughout the accompanying drawings to denote the same components. In the accompanying drawings:

[0022] Figure 1 Schematically shows a structural diagram of a wafer processing device according to an embodiment of the present utility model;

[0023] The symbols in the accompanying drawings represent the following:

[0024] 100, wafer processing device; 101, loading and unloading assembly; 102, first polishing assembly; 103, wafer

[0025] 10. Receiving groove; 11. Base; 12. Mounting portion; 13. Flexible pad; 14. Cleaning agent injection port; 15. First main channel; 16. First branch channel; 17. Chamfer;

[0026] 20. Control arm; 21. First drive device; 22. Polishing head; 23. Polishing plate; 24. Polishing pad; 25. Polishing liquid injection port; 26. Second main channel; 27. Second branch channel. DETAILED DESCRIPTION

[0027] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0028] It should be understood that the terms used herein are for the purpose of describing specific example embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "comprise", "include", "contain" and "have" are inclusive and therefore specify the presence of stated features, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring them to be performed in the specific order described or illustrated, unless the order of execution is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0029] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates otherwise, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0030] For ease of description, spatially relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figures, such as "inside," "outside," "inside," "outside," "below," "beneath," "above," and the like. Such spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is flipped, an element described as "below" or "below" another element or feature would then be oriented as "above" or "above" another element or feature. Thus, the example term "below" can include both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or in other orientations) and the spatially relative descriptors used herein are interpreted accordingly.

[0031] like Figure 1 As shown, Figure 1 The direction A in the middle represents the axial direction of the wafer 103 and the receiving tank 10. The utility model proposes a wafer processing device 100, including a loading and unloading component 101 and a first polishing component 102. The loading and unloading component 101 has a receiving tank 10 for placing the wafer 103. At least one cleaning agent injection port 14 is provided on the tank wall of the receiving tank 10. The injection direction of the cleaning agent injection port 14 is set toward the opening of the receiving tank 10. The cleaning agent injection port 14 is used to spray cleaning agent toward the first axial end of the wafer 103. The first polishing component 102 is arranged opposite to the receiving tank 10 along the depth direction of the receiving tank 10, and is used to perform chemical mechanical polishing on the second axial end of the wafer 103.

[0032] It is understood that the loading and unloading assembly 101 is a structure used to carry the wafer 103. The loading and unloading device can be basin-shaped with a receiving groove 10 provided thereon. The receiving groove 10 can be circular to match the shape of the wafer 103. The loading and unloading assembly 101 can have a clamping or loosening function, which can be achieved specifically by movable claws or retaining rings. The driving mechanism drives the claws or retaining rings to move radially along the wafer 103 to clamp or loosen the wafer 103, thereby loading or unloading the wafer 103 during wafer processing. The loading and unloading assembly 101 can also cooperate with a robot or other transmission mechanism to achieve transportation between different workstations. For details, reference can be made to the robots configured in existing CMP equipment. The receiving tank 10 of the loading and unloading assembly 101 can be an integrated structure or formed by a combination of multiple structures. The bottom end of the receiving tank 10, that is, the end of the receiving tank 10 that contacts the first axial end of the wafer 103, is provided with at least one cleaning agent injection port 14. The injection direction of the cleaning agent injection port 14 is toward the first axial end of the wafer 103. In addition, a cleaning agent channel is provided inside the loading and unloading assembly 101. The cleaning agent channel connects the cleaning agent injection port 14 and an external cleaning agent supply device, such as a cleaning agent storage box and a cleaning agent delivery pump. The cleaning agent can be an existing cleaning agent for wafers 103, and the specific details are not limited. The cleaning agent is sprayed toward the first axial end of the wafer 103 through the cleaning agent injection port 14, and the first polishing assembly 102 cooperates to drive the wafer 103 to rotate to achieve cleaning of the first axial end of the wafer 103. During the specific CMP process of wafer 103, the cleaning of wafer 103 by loading and unloading assembly 101 can correspond to the preliminary cleaning of the front side of wafer 103 after polishing, that is, the preliminary cleaning of the front side of wafer 103 before unloading and transporting for overall cleaning after polishing, so as to improve the cleaning effect of wafer 103. First polishing assembly 102 is arranged opposite loading and unloading assembly 101, so that first polishing assembly 102 can face the second axial end of wafer 103. First polishing assembly 102 has a rotatable polishing pad 24 and a polishing liquid injection port 25 for spraying polishing liquid. After loading and unloading assembly 101 is in place, polishing liquid injection port 25 sprays polishing liquid toward the second axial end of wafer 103. Polishing pad 24 is driven to rotate and press against the second axial end of wafer 103, driving wafer 103 to rotate. There is a speed difference between polishing pad 24 and wafer 103 to achieve polishing. At the same time, the first axial end of wafer 103 is also synchronously friction-cleaned.

[0033] The wafer processing apparatus 100 proposed in the present invention transports and secures a wafer 103 via a loading and unloading assembly 101, and polishes the backside of the wafer 103 on the loading and unloading assembly 101 via a first polishing assembly 102, thereby improving the smoothness of the backside of the wafer 103. Furthermore, the loading and unloading assembly 101 includes a cleaning agent injection port 14 for injecting cleaning agent onto the wafer 103, so that while the backside of the wafer 103 is being polished, the frontside of the wafer 103 is also cleaned simultaneously, thereby improving the efficiency of the CMP process of the wafer 103. Furthermore, the backside polishing equipment of the wafer 103 is replaced by the first polishing assembly 102, which can be integrated into the CMP equipment. The cleaning function is integrated into the loading and unloading assembly 101, eliminating the need for additional equipment and thus saving costs.

[0034] In some embodiments of the present invention, the loading and unloading assembly 101 includes a loading and unloading chuck, which includes a base 11 and a mounting portion 12. The mounting portion 12 is arranged in a ring on the side of the base 11 facing the first polishing assembly 102. A receiving groove 10 is defined between the inner circumferential side of the mounting portion 12 and the side of the base 11 facing the first polishing assembly 102. The cleaning agent injection port 14 is provided on the base 11. At least one cleaning agent channel is also provided in the base 11. One end of the cleaning agent channel is connected to the cleaning agent injection port 14, and the other end of the cleaning agent channel is used to connect to the cleaning agent supply device.

[0035] It is understood that the base 11 is cylindrical and the mounting portion 12 is annular. The mounting portion 12 is annularly arranged on the base 11 and forms a receiving groove 10 between the mounting portion 12 and the base 11. The cleaning agent channel is provided inside the base 11 for supplying the cleaning agent to the cleaning agent injection port 14, and then spraying it onto the wafer 103 to improve the cleaning effect. Specifically, the mounting portion 12 is detachably connected to the base, and the mounting portion 12 can be extended and retracted along the radial direction of the wafer 103, so that the mounting portion 12 can clamp the wafer 103 under the action of the robot gripper. The robot gripper can grab the mounting portion 12 and the wafer 103 and move them to other locations to realize the loading and unloading of the wafer 103 during the CMP process.

[0036] In some embodiments of the present invention, the loading and unloading assembly 101 further includes a flexible pad 13 disposed in the accommodating groove 10 , the flexible pad 13 is attached to the base 11 , and a connecting hole is provided on the flexible pad 13 , which passes through the flexible pad 13 and is connected to the cleaning agent injection port 14 .

[0037] It is understood that the structure of the flexible pad 13 can refer to the existing flexible pad 13 used for friction cleaning of the wafer 103. The flexible pad 13 can be snap-fitted or rotatably connected to the base, so that the first polishing assembly 102 drives the wafer 103 to rotate when polishing the wafer 103. There is a speed difference between the wafer 103 and the flexible pad 13, allowing the flexible pad 13 to frictionally clean the first axial end of the wafer 103. In addition, the connecting hole in the flexible pad 13 is connected to the cleaning agent injection port 14, so that the cleaning agent can be sprayed onto the wafer 103 from the side of the flexible pad 13 that contacts the wafer 103, and the first axial end of the wafer 103 is cleaned in conjunction with the rotational friction. Specifically, the flexible pad 13 can be circular and have a plate-shaped structure.

[0038] In some embodiments of the present invention, the receiving tank 10 is cylindrical, and the first polishing assembly 102 includes a polishing head 22 and a first driving device 21. The first driving device 21 can be a motor, and the rotating shaft of the motor is transmission-connected to the polishing head 22. The first driving device 21 is used to drive the polishing head 22 to rotate. The rotating axis of the polishing head 22 is parallel to the axis of the receiving tank 10, and the end of the polishing head 22 facing the base 11 is used to perform chemical mechanical polishing on the wafer 103.

[0039] It is understood that the receiving tank 10 is cylindrical to adapt to the shape of the wafer 103. The polishing head 22 is cylindrical to facilitate rotation for polishing the wafer 103. The polishing head 22 may include a polishing head 22 body, a polishing plate 23, and a polishing pad 24, which are sequentially connected along its axis. The polishing head 22 body is in driving connection with the first drive device 21. The polishing plate 23 is coaxially arranged and connected to the polishing head 22 body and is used to fix the polishing pad 24. The polishing pad 24 is used to polish the wafer 103. For details about the polishing pad 24, reference may be made to the existing polishing pad 24 structure.

[0040] In some embodiments of the present invention, at least one polishing liquid injection port 25 is provided at one end of the polishing head 22 facing the base 11, and the polishing liquid injection port 25 is used to spray polishing liquid onto the wafer 103. At least one polishing liquid channel is provided inside the polishing head 22, and one end of the polishing liquid channel is connected to the polishing liquid injection port 25, and the other end of the polishing liquid channel is used to connect to the polishing liquid supply device.

[0041] It is understood that the polishing liquid injection port 25 can be provided on the polishing pad 24, and a corresponding hole is also provided at the polishing plate 23, penetrating the polishing plate 23 and communicating with the polishing liquid injection port 25. A polishing liquid channel is provided within the polishing head 22 and communicates with a polishing liquid supply device, such as a polishing liquid storage tank and a polishing liquid delivery pump, so that the polishing liquid is supplied to the first polishing assembly 102 and sprayed onto the wafer 103, thereby improving the polishing effect and efficiency. Specifically, the polishing liquid channel may include a second main channel 26 and a plurality of second branch channels 27 communicating with the second main channel 26. The second branch channels 27 are connected to the polishing liquid injection port 25 at one end away from the second main channel 26.

[0042] In some embodiments of the present invention, the first polishing assembly 102 also includes a control arm 20 and a second drive device, one end of the control arm 20 along its own length direction is connected to the first drive device 21, and the other end of the control arm 20 along its own length direction is transmission-connected to the second drive device, and the second drive device is used to drive the control arm 20 to rotate to adjust the position of the polishing head 22 relative to the loading and unloading assembly 101.

[0043] It will be appreciated that the polishing head 22 is integrally mounted on a control arm 20, which is a rotating arm structure. The control arm 20 is rotatable under the control of a second drive mechanism. For details, reference may be made to the rotating arm mechanisms of existing semiconductor processing equipment. The control arm 20 rotates under the drive of a second drive mechanism, such as a motor, causing the polishing head 22 to follow the movement. When the loading and unloading assembly 101 is not in place, the first polishing assembly 102 can be rotated to a position that does not affect the movement of the loading and unloading assembly 101. After the loading and unloading assembly 101 is in place, the first polishing assembly 102 rotates to the loading and unloading assembly 101 and begins polishing the second axial end of the wafer 103.

[0044] In some embodiments of the present invention, the number of the polishing liquid injection ports 25 is greater than or equal to three, one of the polishing liquid injection ports 25 is located on the rotation axis of the polishing head 22, and the remaining polishing liquid injection ports 25 are spaced apart along the circumference of the rotation axis.

[0045] It can be understood that the polishing liquid injection port 25 can be distributed in a circular array on the polishing pad 24, with one polishing liquid injection port 25 located at the center of the circle and the remaining polishing liquid injection ports 25 arranged at intervals along the circumference. The polishing liquid injection port 25 can be arranged and multiple layers can be arranged along the radial direction of the polishing pad 24, so that the polishing liquid sprayed onto the wafer 103 is more evenly distributed, the blind area of ​​the spraying is reduced, and the polishing effect is improved.

[0046] In some embodiments of the present invention, the number of cleaning agent injection ports 14 is greater than or equal to three, one of which is located on the axis of the receiving tank 10 , and the remaining polishing liquid injection ports 25 are spaced apart along the circumference of the receiving tank 10 .

[0047] It is understood that the cleaning agent injection ports 14 can be distributed in a circular array on the bottom surface of the receiving tank 10, with one cleaning agent injection port 14 located at the center of the circle and the remaining cleaning agent injection ports 14 spaced apart along the circumference. The cleaning agent injection ports 14 can be arranged in multiple layers along the radial direction of the receiving tank 10, so that the cleaning agent sprayed onto the wafer 103 is more evenly distributed, blind spots of the injection are reduced, and the cleaning effect is improved. Specifically, the cleaning agent channel can include a first main channel 15 and a plurality of first branch channels 16 connected to the first main channel 15, and the first branch channels 16 are connected to the cleaning agent injection ports 14 at one end away from the first main channel 15.

[0048] In some embodiments of the present invention, the receiving groove 10 is cylindrical in shape, and the end of the mounting portion 12 facing away from the base 11 is provided with a chamfer 17 or a rounded corner, and the chamfer 17 or the rounded corner is located on the side of the mounting portion 12 facing the receiving groove 10 .

[0049] It can be understood that the receiving groove 10 is cylindrical to match the shape of the wafer 103, the mounting portion 12 is annular, and the cross-section of the mounting portion 12 along the axial direction of the receiving groove 10 is rectangular, and a rounded corner or chamfer 17 can be set at the top corner of the inner circumference of the mounting portion 12, so that the first polishing component 102 has less obstruction when moving toward the receiving groove 10, and can smoothly extend into the receiving groove 10 to polish the wafer 103.

[0050] In some embodiments of the present invention, the wafer processing apparatus 100 further includes a second polishing assembly and a handling robot. The second polishing assembly is configured to perform chemical mechanical polishing on the first axial end of the wafer 103. The handling robot is configured to transport the loading and unloading assembly 101 from the second polishing assembly to the first polishing assembly 102. The handling robot may refer to a handling robot within a conventional CMP apparatus. The second polishing assembly may refer to a polishing device within a conventional CMP apparatus. The second polishing assembly includes a liquid spraying device, a polishing friction pad, and a motor connected to the polishing friction pad. During the front-side polishing process, the polishing friction pad is pressed against the front side of the wafer. The motor drives the polishing friction pad to rotate, and the liquid spraying device sprays polishing liquid onto the front side of the wafer. The friction of the polishing friction pad achieves front-side polishing of the wafer. After the front side of the wafer 103 is polished by the second polishing assembly, the handling robot grasps the mounting portion 12 and carries the wafer 103 to the base for backside polishing.

[0051] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A wafer processing device, characterized in that: include: a loading and unloading assembly having a receiving tank for receiving the wafer, wherein at least one cleaning agent injection port is provided on a tank wall of the receiving tank, the cleaning agent injection port being arranged to spray cleaning agent toward an opening of the receiving tank, and the cleaning agent injection port being used to spray cleaning agent toward a first axial end of the wafer; a first polishing assembly, disposed opposite to the receiving groove along a depth direction of the receiving groove, and configured to perform chemical mechanical polishing on the second axial end of the wafer; In which, the loading and unloading assembly includes a loading and unloading chuck, and the loading and unloading chuck includes a base and a mounting portion. The mounting portion is arranged in an annular manner on the side of the base facing the first polishing assembly. The accommodating groove is defined between the inner circumferential side of the mounting portion and the side of the base facing the first polishing assembly. The cleaning agent injection port is arranged on the base, and at least one cleaning agent channel is also provided in the base. One end of the cleaning agent channel is connected to the cleaning agent injection port, and the other end of the cleaning agent channel is used to connect to the cleaning agent supply device.

2. The wafer processing device according to claim 1, wherein: The loading and unloading assembly further includes a flexible pad disposed in the receiving groove, the flexible pad being attached to the base, a connecting hole being provided on the flexible pad, the connecting hole penetrating the flexible pad, and the connecting hole being connected to the cleaning agent injection port.

3. The wafer processing device according to claim 1, wherein: The receiving tank is cylindrical, and the first polishing assembly includes a polishing head and a first driving device. The first driving device is transmission-connected to the polishing head and is used to drive the polishing head to rotate. The rotating axis of the polishing head is parallel to the axis of the receiving tank, and the end of the polishing head facing the base is used to perform chemical mechanical polishing on the wafer.

4. The wafer processing device according to claim 3, wherein: The polishing head is provided with at least one polishing liquid injection port at one end facing the base, and the polishing liquid injection port is used to spray polishing liquid onto the wafer. The polishing head is provided with at least one polishing liquid channel inside, one end of the polishing liquid channel is connected to the polishing liquid injection port, and the other end of the polishing liquid channel is used to connect to the polishing liquid supply device.

5. The wafer processing device according to claim 3, wherein: The first polishing assembly also includes a control arm and a second drive device, one end of the control arm along its own length direction is connected to the first drive device, and the other end of the control arm along its own length direction is transmission-connected to the second drive device, and the second drive device is used to drive the control arm to rotate relative to the polishing head to adjust the relative position of the polishing head and the loading and unloading assembly.

6. The wafer processing device according to claim 4, wherein: The number of the polishing liquid injection ports is greater than or equal to three, one of the polishing liquid injection ports is located on the rotating shaft of the polishing head, and the remaining polishing liquid injection ports are arranged at intervals along the circumference of the rotating shaft.

7. The wafer processing device according to claim 4, wherein: The number of the cleaning agent injection ports is greater than or equal to three, one of the cleaning agent injection ports is located on the axis of the receiving tank, and the remaining polishing liquid injection ports are arranged at intervals along the circumference of the receiving tank.

8. The wafer processing apparatus according to claim 1, wherein: The outer shape of the receiving groove is cylindrical, and the end of the mounting portion facing away from the base is provided with a chamfer or a rounded corner, and the chamfer or the rounded corner is located on the side of the mounting portion facing the receiving groove.

9. The wafer processing apparatus according to any one of claims 1 to 8, wherein: The wafer processing device also includes a second polishing assembly and a transport robot. The second polishing assembly is used to perform chemical mechanical polishing on the first axial end of the wafer. The transport robot is used to transport the loading and unloading assembly from the position of the second polishing assembly to the position of the first polishing assembly.

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