Electroplating hanger transferring mechanism

Abstract

The utility model relates to an electroplating hanger transferring mechanism which comprises a driving assembly, the hanging tool assembly comprises a hanging frame, a clamping piece and a hanging tool, the clamping piece is used for clamping the hanging tool, the hanging tool is configured to be capable of bearing a wafer, and the hanging frame can be driven by the driving assembly to drive the wafer on the hanging tool to move in the vertical direction; the containing assembly is located below the hanger assembly and comprises a containing disc, the containing disc is used for containing liquid on the hanger, and the containing disc can move relative to the hanger assembly under the action of external force so as to have a first position and a second position; when the hanging tool transferring mechanism is located at the first position, the orthographic projection of the hanging tool on the horizontal plane is covered by the orthographic projection of the containing disc on the horizontal plane, electroplating liquid dripping when the hanging tool transferring mechanism leaves the electroplating liquid can be contained, and therefore cross contamination of different types of electroplating liquid is prevented; and when the hanging tool is at the second position, the orthographic projection of the hanging tool on the horizontal plane is not overlapped with the orthographic projection of the accommodating disc on the horizontal plane, namely, the accommodating disc cannot interfere with the hanging tool, so that the hanging tool can drive the wafer to be immersed in the electroplating liquid conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to an electroplating rack transfer mechanism. Background Art

[0002] With the continuous development of semiconductor technology, the processing of wafers has received increasing attention. In processes such as wafer electroplating, a rack is required to carry the wafers for operation. However, during the electroplating process, the wafer plating rack is required to move the wafers through different electroplating processes in different electroplating solutions. When the plating rack is lifted and transferred from the plating solution, a large amount of plating solution will adhere to the plating rack, leading to the problem of cross-contamination between the plating solutions.

[0003] Therefore, it is necessary to improve the prior art to overcome the above defects. Utility Model Content

[0004] In view of this, the present invention provides an electroplating rack transfer mechanism to solve at least one problem in the background art, including:

[0005] frame;

[0006] A drive assembly is mounted on the frame;

[0007] A rack assembly includes a rack, a clamp connected to the rack, and a rack, wherein the clamp is used to clamp the rack, the rack is configured to carry wafers, and the rack can be driven by the drive assembly to move the wafers on the rack in an up and down direction;

[0008] a receiving assembly, located below the hanger assembly, comprising a receiving tray for receiving liquid on the hanger, wherein the receiving tray is movable relative to the hanger assembly under an external force to have a first position and a second position;

[0009] When in the first position, the orthographic projection of the hanger on the horizontal plane is covered by the orthographic projection of the receiving tray on the horizontal plane;

[0010] When in the second position, the orthographic projection of the hanger on the horizontal plane does not overlap with the orthographic projection of the receiving tray on the horizontal plane.

[0011] Optionally, in the above-mentioned electroplating rack transfer mechanism, the receiving assembly further includes a cylinder assembly connected to at least one of the receiving trays, and the cylinder assembly is used to drive at least one of the receiving trays to move along a first direction so that the receiving tray switches between the first position and the second position.

[0012] Optionally, in the above-mentioned electroplating rack transfer mechanism, the receiving tray has a receiving groove, the receiving groove includes a bottom wall and side walls surrounding the bottom wall, and the side walls are inclined.

[0013] Optionally, in the above-mentioned electroplating rack transfer mechanism, the receiving tray further includes a liquid drain port provided at one end of the receiving tank.

[0014] Optionally, in the above-mentioned electroplating rack transfer mechanism, the receiving tray includes a connecting portion connected to the cylinder assembly and a receiving portion, and the receiving groove is located in the receiving portion;

[0015] The receiving portion is detachably connected to the connecting portion.

[0016] Optionally, in the above-mentioned electroplating rack transfer mechanism, the length of the receiving tray in the second direction is greater than or equal to the rack;

[0017] In the horizontal direction, the first direction and the second direction are perpendicular to each other.

[0018] Optionally, in the above-mentioned electroplating rack transfer mechanism, at least two receiving trays are provided, and at least two receiving trays are arranged in the height direction.

[0019] Optionally, in the above-mentioned electroplating rack transfer mechanism, the cylinder assembly includes at least a first cylinder and a second cylinder, and the first cylinder and the second cylinder are respectively connected to the two receiving trays.

[0020] Optionally, in the above-mentioned electroplating rack transfer mechanism, the receiving assembly further comprises a shell installed below the frame, and the shell has a receiving space for receiving the cylinder assembly;

[0021] The housing is further provided with an escape gap, and when the receiving tray is in the second position, at least a portion of the receiving tray is located in the escape gap.

[0022] Optionally, in the above-mentioned electroplating rack transfer mechanism, the accommodating space includes a first space and a second space separated along the height direction, the first cylinder is located in the first space, and the second cylinder is located in the second space.

[0023] Compared with the prior art, the present application has the following beneficial effects: by arranging a receiving tray under the hanger assembly, and the receiving tray can move relative to the hanger assembly under the action of external force, so that the receiving tray has a first position and a second position, and when it is in the first position, the orthographic projection of the hanger on the horizontal plane is covered by the orthographic projection of the receiving tray on the horizontal plane, and when the receiving tray is in the second position, the orthographic projection of the hanger on the horizontal plane and the orthographic projection of the receiving tray on the horizontal plane do not overlap, that is, when it is in the second position, the receiving tray will not interfere with the hanger, which facilitates the hanger to drive the wafer to immerse in the electroplating solution; and when it is in the first position, the receiving groove is located directly below the hanger, and can accommodate the electroplating solution dripping when the hanger transfer mechanism leaves the electroplating solution, thereby preventing cross-contamination of different types of electroplating solutions. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic diagram of the structure of the electroplating rack transfer mechanism shown in this embodiment;

[0025] Figure 2 is a schematic structural diagram of the receiving assembly shown in this embodiment;

[0026] Figure 3 yes Figure 2 A cross-sectional view of the receiving assembly is shown.

[0027] Reference numerals:

[0028] 1-frame;

[0029] 2-Drive assembly;

[0030] 3-hanger assembly, 31-hanging rack, 32-clamping piece, 33-hanger;

[0031] 4-housing assembly, 41-housing tray, 411-housing groove, 4111-bottom wall, 4112-side wall, 412-drain port, 413-connecting portion, 4131-second guide slide portion, 414-housing portion, 4141-first guide slide portion, 42-cylinder assembly, 421-first cylinder, 422-second cylinder, 43-housing, 431-avoidance gap, 432-accommodating space, 4321-first space, 4322-second space. DETAILED DESCRIPTION

[0032] The exemplary embodiments disclosed in the present application will be described in more detail below. In the description below, a large number of specific details are given in order to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features well known in the art are not described; that is, all features of the actual embodiments are not described here, and well-known functions and structures are not described in detail.

[0033] It should be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" another element or layer, it may be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer, or part discussed below may be represented as a second element, component, region, layer, or part. And when the second element, component, region, layer, or part is discussed, it does not necessarily mean that the first element, component, region, layer, or part is present in the present application.

[0034] Spatially relative terms such as "below," "beneath," "beneath," "beneath," "above," "upper," etc., may be used herein for convenience to describe the relationship of one element or feature to other elements or features shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientations depicted in the figures.

[0035] The purpose of the terms used herein is only to describe specific embodiments and is not intended to limit the present application. When used herein, the singular forms "a", "an", and " / the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, identify the presence of features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0036] In order to fully understand the present application, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present application. The preferred embodiments of the present application are described in detail below. However, in addition to these detailed descriptions, the present application may also have other implementation methods.

[0037] Please refer to Figure 1-Figure 3 As shown, a plating rack transfer mechanism shown in a preferred embodiment of the present application includes a frame 1, a drive component 2 installed on the frame 1, a rack component 3 and a receiving component 4. The rack component 3 can carry wafers, the drive component 2 is used to drive the rack component 3 to move the wafers to electroplate the wafers, and the receiving component 4 is used to receive the plating liquid attached to the rack component 3 when it leaves the plating liquid, so as to prevent cross-contamination between different types of plating liquids and facilitate the subsequent unified treatment of the plating liquid. It should be noted that, in this embodiment, the drive component 2 includes a first drive component that can drive the rack component 3 to move in the height direction and a second drive component that can drive the rack component to move in the horizontal direction.

[0038] Specifically, the rack assembly 3 includes a rack 31, a clamping member 32 connected to the rack 31, and a rack 33. The clamping member 32 is used to clamp the rack 33, and the rack 33 is configured to carry wafers. The rack 31 can be driven by the driving assembly 2 to move the wafers on the rack 33 in the vertical direction, so as to bring the wafers into contact with the electroplating solution or complete the electroplating process.

[0039] The receiving assembly 4 includes a receiving tray 41, which is used to receive the liquid on the hanger 33. The receiving tray 41 can move relative to the hanger assembly 3 under the action of external force to have a first position and a second position; when in the first position, the orthographic projection of the hanger 33 on the horizontal plane is covered by the orthographic projection of the receiving tray 41 on the horizontal plane, that is, the receiving tray 41 is located directly below the hanger 33 to achieve the reception of the electroplating liquid attached to the hanger 33; when in the second position, the orthographic projection of the hanger 33 on the horizontal plane has no overlap with the orthographic projection of the receiving tray 41 on the horizontal plane, that is, the receiving tray 41 is not in the descending movement trajectory of the hanger 33, thereby preventing the receiving tray 41 from interfering with the hanger 33 and affecting the hanger 33 driving the wafer to immerse in the electroplating liquid.

[0040] In this embodiment, the receiving assembly 4 also includes a cylinder assembly 42 connected to at least one receiving tray 41. The cylinder assembly 42 is used to drive at least one receiving tray 41 to move along a first direction so that the receiving tray 41 switches between a first position and a second position, thereby quickly and accurately driving the receiving tray 41 to switch between the first position and the second position, thereby improving production efficiency.

[0041] Furthermore, the receiving tray 41 has a receiving groove 411, which includes a bottom wall 4111 and a side wall 4112 surrounding the bottom wall 4111. The side wall 4112 is tilted so that the plating solution dripping from the hanger 33 flows more smoothly into the receiving groove 411, thereby achieving a guiding effect.

[0042] In an optional embodiment, the receiving tray 41 further includes a drain port 412 disposed at one end of the receiving tank 411 to facilitate timely discharge of the electroplating liquid in the receiving tank 411 to avoid excessive electroplating liquid affecting the receiving effect, such as splashing of the electroplating liquid.

[0043] In an optional embodiment, the receiving tray 41 includes a connecting portion 413 and a receiving portion 414 connected to the cylinder assembly 42, and the receiving groove 411 is located in the receiving portion 414; the receiving portion 414 is detachably connected to the connecting portion 413. The advantage of this arrangement is that when the receiving tray 41 is damaged or needs to be cleaned, the receiving portion 414 can be conveniently and directly maintained or replaced. In this embodiment, the receiving portion 414 and the connecting portion 413 are detachably connected in a sliding manner. Specifically, a first guide slide 4141 is provided on the receiving portion 414, and a second guide slide 4131 adapted to the first guide slide 4141 is provided on the connecting portion 413. The receiving portion 414 and the connecting portion 413 can be slidably connected under the action of the first guide slide 4141 and the second guide slide 4131.

[0044] In an optional embodiment, the length of the receiving tray 41 in the second direction is greater than or equal to the hanger 33; in the horizontal direction, the first direction and the second direction are perpendicular to each other. The advantage of this arrangement is that it can ensure the receiving effect of the receiving tray 41 and improve the liquid receiving capacity.

[0045] In an optional embodiment, at least two receiving trays 41 are provided, and at least two receiving trays 41 are arranged in the height direction. By providing at least two receiving trays 41, on the one hand, when one of the receiving trays 41 needs to be replaced, another receiving tray 41 can be used to receive the electroplating liquid, thereby realizing non-stop reception of the electroplating liquid and improving work efficiency; on the other hand, at least two receiving trays 41 are provided and arranged in the height direction, and different receiving trays 41 can be selected as needed to collect different types of electroplating liquids to prevent different electroplating liquids from contacting and reacting.

[0046] In an optional embodiment, the cylinder assembly 42 includes at least a first cylinder 421 and a second cylinder 422, each of which is connected to the two receiving trays 41. Specifically, the receiving assembly 4 also includes a housing 43 mounted below the frame 1. The housing 43 has a receiving space 432 for accommodating the cylinder assembly 42. The housing 43 also has an escape notch 431. When the receiving tray 41 is in the second position, at least a portion of the receiving tray 41 is located within the escape notch 431. This ensures that the receiving tray 41 does not occupy excessive space in the second position, and the rational layout facilitates other operations.

[0047] Furthermore, the accommodating space 432 includes a first space 4321 and a second space 4322 separated along the height direction. The first cylinder 421 is located in the first space 4321, and the second cylinder 422 is located in the second space 4322. The structure is more compact and the space is used rationally.

[0048] The above is only a specific implementation of the present application. Any other improvements made based on the concept of the present application are considered to be within the scope of protection of the present application.

Claims

1. A plating rack transfer mechanism, characterized in that: include: frame; A drive assembly is mounted on the frame; A rack assembly includes a rack, a clamp connected to the rack, and a rack, wherein the clamp is used to clamp the rack, the rack is configured to carry wafers, and the rack can be driven by the drive assembly to move the wafers on the rack in an up and down direction; a receiving assembly, located below the hanger assembly, comprising a receiving tray for receiving liquid on the hanger, wherein the receiving tray is movable relative to the hanger assembly under an external force to have a first position and a second position; When in the first position, the orthographic projection of the hanger on the horizontal plane is covered by the orthographic projection of the receiving tray on the horizontal plane; When in the second position, the orthographic projection of the hanger on the horizontal plane does not overlap with the orthographic projection of the receiving tray on the horizontal plane.

2. The electroplating rack transfer mechanism according to claim 1, characterized in that: The receiving assembly further includes a cylinder assembly connected to at least one of the receiving trays, and the cylinder assembly is used to drive at least one of the receiving trays to move along a first direction so that the receiving tray switches between the first position and the second position.

3. The electroplating rack transfer mechanism according to claim 2, characterized in that: The receiving tray has a receiving groove, and the receiving groove includes a bottom wall and side walls surrounding the bottom wall, and the side walls are inclined.

4. The electroplating rack transfer mechanism according to claim 3, characterized in that: The receiving tray further includes a liquid drain port arranged at one end of the receiving groove.

5. The electroplating rack transfer mechanism according to claim 3, characterized in that: The receiving tray includes a connecting portion connected to the cylinder assembly and a receiving portion, and the receiving groove is located in the receiving portion; The receiving portion is detachably connected to the connecting portion.

6. The electroplating rack transfer mechanism according to claim 2, characterized in that: The length of the receiving tray in the second direction is greater than or equal to the hanger; In the horizontal direction, the first direction and the second direction are perpendicular to each other.

7. The electroplating rack transfer mechanism according to claim 1, characterized in that: At least two receiving trays are provided, and the at least two receiving trays are arranged in a height direction.

8. The electroplating rack transfer mechanism according to claim 2, characterized in that: The cylinder assembly at least includes a first cylinder and a second cylinder, and the first cylinder and the second cylinder are respectively connected to the two receiving trays.

9. The electroplating rack transfer mechanism according to claim 8, characterized in that: The receiving assembly further comprises a housing mounted below the frame, the housing having a receiving space for receiving the cylinder assembly; The housing is further provided with an escape gap, and when the receiving tray is in the second position, at least a portion of the receiving tray is located in the escape gap.

10. The electroplating rack transfer mechanism according to claim 9, characterized in that: The accommodating space includes a first space and a second space separated along a height direction. The first cylinder is located in the first space, and the second cylinder is located in the second space.

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