Compact electroplating hanger

Abstract

The utility model relates to a compact electroplating hanger which comprises the following components: a hanging plate mechanism which comprises a hanging plate for bearing a wafer; the driving mechanism comprises a first driving motor, a synchronizing wheel assembly and a lead screw assembly, the lead screw assembly comprises a lead screw shaft and a transmission part matched with the lead screw shaft, the synchronizing wheel assembly is used for connecting the first driving motor and the lead screw shaft, the transmission part is connected with the hanging plate mechanism, and the first driving motor drives the synchronizing wheel assembly to rotate so as to drive the lead screw shaft to rotate; the transmission part can convert the rotary motion of the lead screw shaft into the linear motion of the hanging plate mechanism; the central axis of the first driving motor is parallel to the lead screw shaft, and the first driving motor and the lead screw assembly are located on the same side of the synchronous wheel assembly, so that the extension length of a transmission link in the vertical direction is effectively shortened, the electroplating hanger is more compact, the overall height of the electroplating hanger is reduced, and the electroplating hanger is more convenient to use. The device can better adapt to the production environment with the limited space height, the space utilization rate of a plant is increased, and the construction cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a compact electroplating rack. Background Art

[0002] Wafer electroplating is a critical step in semiconductor manufacturing and related electroplating processes. Traditional electroplating racks have an irrational layout of drive and plate mechanisms, resulting in a high degree of redundancy across the entire system. This creates significant compatibility challenges in space-constrained production environments or within automated production line integration scenarios with strict equipment constraints, limiting the flexible application and efficient implementation of electroplating processes in diverse scenarios.

[0003] Therefore, it is necessary to improve the prior art to overcome the above defects. Utility Model Content

[0004] In view of this, the present invention provides a compact electroplating rack to solve at least one problem in the background art, including:

[0005] A hanging plate mechanism, comprising a hanging plate for carrying wafers;

[0006] A drive mechanism includes a first drive motor, a synchronous wheel assembly, and a screw assembly. The screw assembly includes a screw shaft and a transmission component adapted to the screw shaft. The synchronous wheel assembly is used to connect the first drive motor and the screw shaft. The transmission component is connected to the hanging plate mechanism. The first drive motor drives the synchronous wheel assembly to rotate, thereby driving the screw shaft to rotate. The transmission component can convert the rotational motion of the screw shaft into linear motion of the hanging plate mechanism.

[0007] Wherein, the central axis of the first drive motor is arranged parallel to the screw shaft, and the first drive motor and the screw assembly are located on the same side of the synchronous wheel assembly.

[0008] Optionally, in the above-mentioned compact electroplating rack, the synchronous wheel assembly includes a first synchronous wheel, a second synchronous wheel and a synchronous belt, the first synchronous wheel is connected to the first drive motor, the second synchronous wheel is connected to the screw shaft, and the synchronous belt connects the first synchronous wheel and the second synchronous wheel.

[0009] Optionally, the above-mentioned compact electroplating rack further includes a shell, which is divided into a first accommodating chamber, a second accommodating chamber and a third accommodating chamber, the third accommodating chamber is located above the first accommodating chamber and the second accommodating chamber, the first drive motor is suitable for being installed in the first accommodating chamber, the screw assembly is suitable for being installed in the second accommodating chamber, and the synchronous wheel assembly is suitable for being installed in the third accommodating chamber.

[0010] Optionally, the above-mentioned compact electroplating rack further includes a connecting plate, which includes a first connecting part, a second connecting part connected to the first connecting part, and a third connecting part, the first connecting part is connected to the transmission part, and the second connecting part is used to connect to the hanging plate mechanism.

[0011] Optionally, the above-mentioned compact electroplating rack further includes a detection mechanism, and the detection mechanism includes a first detection member provided on the connecting plate and a second detection member provided on the housing.

[0012] Optionally, in the above-mentioned compact electroplating rack, a first guide rail is provided on the connecting plate, and a second guide rail adapted to the first guide rail is provided on the outer shell, and the connecting plate can drive the hanging plate mechanism to move up and down along the first guide rail and the second guide rail.

[0013] Optionally, in the above-mentioned compact electroplating rack, there is a distance between the two third connecting portions; the housing further comprises a guide plate, and the guide plate is adapted to extend into the distance;

[0014] The third connecting portion is provided with a third guide rail adapted to the edge of the guide plate.

[0015] Optionally, in the above-mentioned compact electroplating rack, the guide plate includes a main body portion and a guide portion whose thickness gradually decreases from the main body portion toward the edge, and the guide portion is arc-shaped.

[0016] Optionally, the above-mentioned compact electroplating rack is further provided with a second drive motor and a gear connected to the second drive motor on the housing, and the gear is suitable for engaging with the rack to drive the electroplating rack to move in the horizontal direction.

[0017] Compared with the prior art, the present application has the following beneficial effects: by arranging the central axis of the first drive motor parallel to the screw shaft, and locating the first drive motor and the screw assembly on the same side of the synchronous wheel assembly, the extension length of the transmission link in the vertical direction is effectively shortened, making the electroplating rack more compact, and reducing the overall height of the electroplating rack, so that it can better adapt to the production environment with limited space height, improve the utilization rate of the factory space, and reduce construction costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of the electroplating rack structure shown in this embodiment;

[0019] Figure 2 yes Figure 1 A partial enlarged view of the electroplating rack shown;

[0020] Figure 3 yes Figure 1 A schematic cross-sectional view of the electroplating rack shown;

[0021] Figure 4 yes Figure 1 A schematic cross-sectional view of the electroplating rack in another direction is shown.

[0022] Reference numerals:

[0023] 1- hanging plate mechanism, 11- hanging plate;

[0024] 2-driving mechanism, 21-first driving motor, 2-transmission component, 23-second driving motor;

[0025] 3-housing, 31-first accommodating chamber, 32-second accommodating chamber, 33-third accommodating chamber, 34-second guide rail, 35-guide plate, 351-body, 352-guide portion;

[0026] 4-connecting plate, 41-first connecting part, 42-second connecting part, 43-third connecting part, 431-third guide rail, 44-first guide rail;

[0027] 5-detection mechanism, 51-first detection component, 52-second detection component. DETAILED DESCRIPTION

[0028] The exemplary embodiments disclosed in the present application will be described in more detail below. In the description below, a large number of specific details are given in order to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features well known in the art are not described; that is, all features of the actual embodiments are not described here, and well-known functions and structures are not described in detail.

[0029] It should be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" another element or layer, it may be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer, or part discussed below may be represented as a second element, component, region, layer, or part. And when the second element, component, region, layer, or part is discussed, it does not necessarily mean that the first element, component, region, layer, or part is present in the present application.

[0030] Spatially relative terms such as "below," "beneath," "beneath," "beneath," "above," "upper," etc., may be used herein for convenience to describe the relationship of one element or feature to other elements or features shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientations depicted in the figures.

[0031] The purpose of the terms used herein is only to describe specific embodiments and is not intended to limit the present application. When used herein, the singular forms "a", "an", and " / the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, identify the presence of features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0032] In order to fully understand the present application, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present application. The preferred embodiments of the present application are described in detail below. However, in addition to these detailed descriptions, the present application may also have other implementation methods.

[0033] Please refer to Figure 1-Figure 4 As shown, a compact electroplating rack shown in a preferred embodiment of the present application is suitable for use in wafer electroplating processing equipment, and is used to carry wafers to drive the wafers to contact the electroplating solution to achieve electroplating of the wafers.

[0034] The electroplating rack includes a hanging plate mechanism 1 and a drive mechanism 2. The hanging plate mechanism 1 includes a hanging plate 11 for carrying wafers. The drive mechanism 2 includes a first drive motor 21, a synchronous wheel assembly, and a screw assembly. The screw assembly includes a screw shaft and a transmission component 2 adapted to the screw shaft. The synchronous wheel assembly is used to connect the first drive motor 21 to the screw shaft. The transmission component 2 is connected to the hanging plate mechanism 1. The first drive motor 21 drives the synchronous wheel assembly to rotate, thereby driving the screw shaft to rotate. The transmission component 2 can convert the rotational motion of the screw shaft into linear motion of the hanging plate mechanism 1, thereby enabling the hanging plate 11 to drive the wafers to rise or fall.

[0035] It is worth noting that in this embodiment, the central axis of the first drive motor 21 is arranged parallel to the screw shaft, and the first drive motor 21 and the screw assembly are located on the same side of the synchronous wheel assembly, so that the entire electroplating rack has a reasonable layout and a compact structure, which reduces the height of the rack, improves space utilization, and is suitable for environments with limited space.

[0036] In this embodiment, the synchronous wheel assembly includes a first synchronous wheel, a second synchronous wheel and a synchronous belt. The first synchronous wheel is connected to the first drive motor 21, the second synchronous wheel is connected to the screw shaft, and the synchronous belt connects the first synchronous wheel and the second synchronous wheel to realize power transmission between the first drive motor 21 and the screw shaft. The transmission ratio can be flexibly adjusted according to different process requirements to ensure precise control of the operating speed of the hanging plate mechanism 1 and improve the adaptability and reliability of the electroplating process.

[0037] In an optional embodiment, the compact electroplating rack further includes a housing 3, which is divided into a first accommodating chamber 31, a second accommodating chamber 32, and a third accommodating chamber 33. The third accommodating chamber 33 is located above the first accommodating chamber 31 and the second accommodating chamber 32. The first drive motor 21 is adapted to be installed in the first accommodating chamber 31, the lead screw assembly is adapted to be installed in the second accommodating chamber 32, and the synchronous wheel assembly is adapted to be installed in the third accommodating chamber 33. The provision of the housing 3 protects the internal components from the external environment, reduces dust deposition, and increases the service life of the electroplating rack. Furthermore, the partitioned design of the housing 3 allows for the rational distribution of the components, preventing mutual interference and collision, and contributes to a compact and standardized overall structure, facilitating assembly, maintenance, and management.

[0038] In an alternative embodiment, reference Figure 2 As shown, the compact electroplating rack also includes a connecting plate 4, which includes a first connecting part 41, a second connecting part 42 connected to the first connecting part 41, and a third connecting part 43. The first connecting part 41 is connected to the transmission part 2, and the second connecting part 42 is used to connect to the hanging plate mechanism 1.

[0039] Furthermore, a first guide rail 44 is provided on the connecting plate 4, and a second guide rail 34 adapted to the first guide rail 44 is provided on the outer shell 3. The connecting plate 4 can drive the hanging plate mechanism 1 to move up and down along the first guide rail 44 and the second guide rail 34, so that the connecting plate 4 drives the hanging plate mechanism 1 to move up and down more smoothly and accurately, reduces friction and shaking, ensures the straightness and stability of the wafer movement in the vertical direction, is conducive to precise operation at different electroplating liquid levels or process links, and improves the uniformity and effect of electroplating.

[0040] Furthermore, there is a gap between the two third connecting parts 43; the housing 3 also includes a guide plate 35, which is suitable for extending into the gap; the third connecting part 43 is provided with a third guide rail 431 adapted to the edge of the guide plate 35, and the connecting plate 4 drives the hanging plate mechanism 1 to move up and down along the first guide rail 44, the second guide rail 34 and the third guide rail 431 and the guide plate 35 at the same time, further constraining the movement direction of the connecting plate 4, enhancing the stability and guidance of the up and down movement of the hanging plate mechanism 1, preventing deviation caused by external force or high-speed movement, ensuring that the wafer is always in the ideal electroplating position under complex working conditions, and improving process reliability.

[0041] In this embodiment, the guide plate 35 comprises a main body 351 and a guide portion 352 that tapers gradually from the main body 351 toward the edge. The guide portion 352 is arc-shaped. This arrangement facilitates smooth movement of the connecting plate 4 into and out of the guide plate 35, minimizing contact collisions, reducing wear and the risk of jamming, and improving the long-term reliability and durability of the rack, thereby ensuring continuous electroplating production.

[0042] In this embodiment, the compact electroplating rack further includes a detection mechanism 5, which comprises a first detection member 51 disposed on the connecting plate 4 and a second detection member 52 disposed on the housing 3. The connecting plate 4 drives the hanging plate mechanism 1 to move up and down, thereby driving the first detection member 51 to move up and down relative to the second detection member 52, thereby determining the height position of the hanging plate mechanism 1. In this embodiment, the first detection member 51 is a baffle, and the second detection member 52 is a photoelectric sensor. In other embodiments, the types of the first detection member 51 and the second detection member 52 are not specifically limited, as long as they can achieve the effect of position detection.

[0043] As described above, in this embodiment, the housing 3 is further provided with a second drive motor 23 and a gear connected to the second drive motor 23. The gear is adapted to mesh with the rack to drive the horizontal movement of the electroplating rack. Specifically, the second drive motor 23 rotates the gear to mesh with the rack, thereby driving the hanging plate mechanism 1 to move horizontally. Meanwhile, the first drive motor 21 rotates the first gear to mesh with the second gear, thereby driving the vertical movement of the hanging plate mechanism 1. This allows wafers to be transported within the wafer electroplating equipment and perform various processes.

[0044] The above is only a specific implementation of the present application. Any other improvements made based on the concept of the present application are considered to be within the scope of protection of the present application.

Claims

1. A compact electroplating rack, characterized in that: include: A hanging plate mechanism, comprising a hanging plate for carrying wafers; A drive mechanism includes a first drive motor, a synchronous wheel assembly, and a screw assembly. The screw assembly includes a screw shaft and a transmission component adapted to the screw shaft. The synchronous wheel assembly is used to connect the first drive motor and the screw shaft. The transmission component is connected to the hanging plate mechanism. The first drive motor drives the synchronous wheel assembly to rotate, thereby driving the screw shaft to rotate. The transmission component can convert the rotational motion of the screw shaft into linear motion of the hanging plate mechanism. Wherein, the central axis of the first drive motor is arranged parallel to the screw shaft, and the first drive motor and the screw assembly are located on the same side of the synchronous wheel assembly.

2. The compact electroplating rack according to claim 1, characterized in that: The synchronous wheel assembly includes a first synchronous wheel, a second synchronous wheel and a synchronous belt. The first synchronous wheel is connected to the first drive motor, the second synchronous wheel is connected to the screw shaft, and the synchronous belt connects the first synchronous wheel and the second synchronous wheel.

3. The compact electroplating rack according to claim 2, characterized in that: The compact electroplating rack also includes a shell, which is divided into a first accommodating chamber, a second accommodating chamber and a third accommodating chamber. The third accommodating chamber is located above the first accommodating chamber and the second accommodating chamber. The first drive motor is suitable for being installed in the first accommodating chamber, the screw assembly is suitable for being installed in the second accommodating chamber, and the synchronous wheel assembly is suitable for being installed in the third accommodating chamber.

4. The compact electroplating rack according to claim 3, characterized in that: The compact electroplating rack also includes a connecting plate, which includes a first connecting part, a second connecting part connected to the first connecting part, and a third connecting part. The first connecting part is connected to the transmission component, and the second connecting part is used to connect to the hanging plate mechanism.

5. The compact electroplating rack according to claim 4, characterized in that: The compact electroplating rack further comprises a detection mechanism, which comprises a first detection member arranged on the connecting plate and a second detection member arranged on the housing.

6. The compact electroplating rack according to claim 4, characterized in that: The connecting plate is provided with a first guide rail, and the outer shell is provided with a second guide rail adapted to the first guide rail. The connecting plate can drive the hanging plate mechanism to move up and down along the first guide rail and the second guide rail.

7. The compact electroplating rack according to claim 6, characterized in that: There is a gap between the two third connecting portions; the housing further comprises a guide plate, the guide plate being adapted to extend into the gap; The third connecting portion is provided with a third guide rail adapted to the edge of the guide plate.

8. The compact electroplating rack according to claim 7, characterized in that: The guide plate includes a main body and a guide portion whose thickness gradually decreases from the main body to the edge, and the guide portion is in an arc shape.

9. The compact electroplating rack according to claim 3, characterized in that: The housing is also provided with a second drive motor and a gear connected to the second drive motor. The gear is suitable for engaging with a rack to drive the electroplating rack to move in a horizontal direction.

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