Heat exchanger

Abstract

The heat exchanger comprises a core body, the core body comprises at least two sets of chip assemblies which are sequentially arranged in a stacked mode in the first direction, each chip assembly comprises a first chip and a second chip which are sequentially arranged in a stacked mode in the first direction, and a medium flow channel is defined between each first chip and the corresponding second chip; the first chip and the second chip are correspondingly provided with an inflow port and an outflow port which are both communicated with the medium flow channel, at least one group of chip assemblies is the first chip assembly, the first chip assembly comprises at least one middle chip stacked with the first chip, at least part of the middle chip is located in the medium flow channel, and at least part of the middle chip is located in the medium flow channel. The medium flow channel is divided into at least two branch flow channels which are sequentially arranged in the first direction and communicate with one another, at least a middle chip in the first chip assembly is provided with an uneven turbulent flow structure, and the turbulent flow structure is located in the area where the branch flow channels are located. By means of the arrangement, a good heat exchange effect is achieved.

Description

Technical Field

[0001] The present application relates to the field of heat exchange technology, and in particular to a heat exchanger. Background Art

[0002] The plate heat exchanger in the heat exchanger is made up of a series of stacked chips. There is a gap between any two adjacent chips to form a flow channel. The medium flows in the flow channel and exchanges heat through the chips.

[0003] In order to increase the heat exchange area and improve the heat exchange efficiency, existing plate heat exchangers usually set fins between the two chips. However, the fins are prone to accumulate impurities, and the fins will have burrs and debris because they need to have windows. This will affect the cleanliness of the medium and may affect the operation of the plate heat exchanger. Utility Model Content

[0004] Based on this, it is necessary to provide a heat exchanger that improves heat exchange efficiency while avoiding affecting the cleanliness of the medium.

[0005] The present application provides a heat exchanger, which includes a core body, and the core body includes at least two groups of chip assemblies stacked in sequence along a first direction, the first direction being the height direction of the heat exchanger, the chip assembly including a first chip and a second chip stacked in sequence along the first direction, a medium flow channel for medium flow is defined between the first chip and the second chip, the first chip and the second chip are respectively provided with an inlet and an outlet both connected to the medium flow channel, and along the fluid flow path, the outlet is located downstream of the inlet; at least one group of chip assemblies is a first chip assembly, the first chip assembly includes at least one intermediate chip stacked with the first chip, at least part of the intermediate chip is located in the medium flow channel, and the medium flow channel is divided into at least two branch channels arranged in sequence and connected along the first direction, and in the first chip assembly, at least the intermediate chip is provided with a spoiler structure, and the spoiler structure is located in the area where the branch channel is located.

[0006] It can be understood that the flow-disturbing structure is a flow-disturbing structure that disturbs the fluid in the branch channel.

[0007] In one embodiment, each group of chip components is the first chip component.

[0008] In one embodiment, the flow direction of the medium in the branch channel is defined as a second direction, the first chip, the middle chip and the second chip all include a plate body arranged along the second direction, and at least the plate body of the middle chip in the first chip assembly is provided with the spoiler structure.

[0009] In one embodiment, the board body of at least one of the first chip and the second chip includes the spoiler structure.

[0010] In one embodiment, the board body of at least one of the first chip and the second chip is in the shape of a flat plate.

[0011] In one embodiment, the spoiler structure is an uneven first spoiler unit; or an uneven second spoiler unit; or a mixed structure of the first spoiler unit and the second spoiler unit, and the structures of the first spoiler unit and the second spoiler unit are different.

[0012] In one embodiment, the first spoiler unit includes a raised portion and a recessed portion, and the plate surface of the plate body provided with the spoiler structure is defined as the first plate surface. There are multiple raised portions distributed on the first plate surface, and the multiple raised portions are arranged at intervals along the second direction. The recessed portion is defined and formed between the first plate surface and the multiple raised portions.

[0013] In one embodiment, the cross-section of the second spoiler unit along the first direction is wavy, and the second spoiler unit includes ridges and grooves, the ridges are formed by a part of the plate body protruding upward or downward along the first direction, and there are multiple ridges, and the multiple ridges are arranged at intervals along the second direction, and the groove is formed between two adjacent ridges.

[0014] In one embodiment, the convex strip is V-shaped, herringbone-shaped or arc-shaped.

[0015] In one embodiment, the plate body of the first chip is defined as a first plate body, the plate body of the second chip is defined as a second plate body, and the plate body of the middle chip is defined as a third plate body. The first chip also includes a first flange provided on the periphery of the first plate body, and the second chip also includes a second flange provided on the periphery of the second plate body and extending in the same direction as the first flange. The first flange and the second flange are stacked and welded along the first direction. The third plate body is partially in contact with the first chip and the second chip at the heat exchange position to form a flow channel barrier. The inlet and the outlet are provided on the first plate body and the second plate body, and are located on the periphery of the third plate body.

[0016] In one embodiment, the intermediate chip also includes a third flange provided on the periphery of the third plate body and extending in the same direction as the first flange. The first flange, the third flange and the second flange are stacked along the first direction and connected by welding. The third plate body is provided with an inlet at a position corresponding to the inlet and an outlet at a position corresponding to the outlet.

[0017] Compared with the prior art, in the heat exchanger provided in the present application, an intermediate chip is arranged in at least one medium flow channel to divide the medium flow channel into at least two interconnected branch channels, and a turbulent flow structure is provided on at least the intermediate chip. The medium in the medium flow channel can flow in the two branch channels, thereby extending the flow path of the medium, strengthening the flow and improving the heat exchange capacity, achieving a better heat exchange effect, and avoiding the problem of affecting the cleanliness of the medium due to the use of fins in the background technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 A three-dimensional diagram of a heat exchanger according to an embodiment of the present application;

[0020] Figure 2 for Figure 1 A cross-sectional view of a heat exchanger is shown;

[0021] Figure 3 for Figure 2 A partial enlarged view of the heat exchanger at point A is shown;

[0022] Figure 4 for Figure 2 A partial enlarged view of point B in the heat exchanger shown;

[0023] Figure 5 for Figure 1 The three-dimensional exploded structural diagram of the heat exchanger shown;

[0024] Figure 6 for Figure 1 A schematic structural diagram of a first chip is shown;

[0025] Figure 7 This is a schematic diagram of the exploded structure of a first chip assembly according to another embodiment of the present application;

[0026] Figure 8 For this application Figure 7 The heat exchange structure of the middle chip in the first chip assembly shown adopts a structural schematic diagram of the first heat exchange unit;

[0027] Figure 9 This is a schematic diagram of a three-dimensional exploded structure in which each heat exchange structure in the first chip assembly in one embodiment of the present application adopts a first heat exchange unit;

[0028] Figure 10This is a schematic diagram of a three-dimensional exploded structure of another first chip component in one embodiment of the present application;

[0029] Figure 11 This is a schematic diagram of a three-dimensional exploded structure in which neither the first chip nor the second chip of the first chip assembly is provided with a heat exchange structure in one embodiment of the present application;

[0030] Figure 12 This is a schematic diagram of a three-dimensional exploded structure in which a first chip assembly includes two intermediate chips in one embodiment of the present application.

[0031] Figure numerals: 1. core body; 2. first chip assembly; 21. first chip; 210. first plate body; 211. first flange; 22. second chip; 220. second plate body; 221. second flange; 23. medium flow channel; 231. branch channel; 24. intermediate chip; 240. third plate body; 2401. inlet; 2402. outlet; 241. third flange; 200. inlet; 201. outlet; 3. first spoiler unit; 31. raised portion; 32. recessed portion; 4. second spoiler unit; 41. ridge; 42. groove; 5. first plate surface; 6. top plate; 61. inlet pipe; 62. outlet pipe; 7. bottom plate; 8. barrier portion. DETAILED DESCRIPTION

[0032] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0033] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0035] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.

[0036] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more of the relevant listed items.

[0037] See Figures 1 to 12 The present application provides a heat exchanger. The heat exchanger is a plate heat exchanger and includes a core 1, a top plate 6, and a bottom plate 7. The top plate 6, the core 1, and the bottom plate 7 are stacked in sequence along a first direction. The core 1 includes at least two groups of chip assemblies stacked in sequence along the first direction. The first direction is the height direction of the heat exchanger and also the stacking direction of the chip assemblies. In one embodiment, the cross-section of the core 1 is circular or elliptical. In this embodiment, the cross-section of the core 1 is rectangular.

[0038] like Figure 2 and Figure 4 As shown, the chip assembly includes a first chip 21 and a second chip 22 stacked in sequence along a first direction. A medium flow channel 23 for medium flow is defined between the first chip 21 and the second chip 22. The first chip 21 and the second chip 22 are respectively provided with an inlet 200 and an outlet 201, both connected to the medium flow channel 23. Along the fluid flow path, the outlet 201 is located downstream of the inlet 200. The top plate 6 is installed with an inlet pipe 61 at a position corresponding to the inlet, and an outlet pipe 62 at a position corresponding to the outlet 201.

[0039] At least one chip assembly group is a first chip assembly 2, which includes at least one intermediate chip 24 stacked with the first chip 21. In one embodiment, one chip assembly group is a first chip assembly 2, and the other chip assemblies are second chip assemblies. In another embodiment, two or more chip assemblies are first chip assemblies 2. In this embodiment, each chip assembly group is a first chip assembly 2.

[0040] In this embodiment, if Figure 2 、 Figure 5 、 Figures 7 to 11 As shown, each group of first chip components 2 includes an intermediate chip 24. In one embodiment, as shown in FIG. Figure 12 As shown, the first chip assembly 2 includes two intermediate chips 24. In another embodiment, the first chip assembly 2 includes more than two intermediate chips 24.

[0041] At least a portion of the intermediate chip 24 is located in the medium flow channel 23, dividing the medium flow channel 23 into at least two branch flow channels 231 arranged sequentially along a first direction and interconnected. In the first chip assembly 2, at least the intermediate chip 24 is provided with a flow-disturbing structure located in the region where the branch flow channels 231 are located. In other words, the flow-disturbing structure disturbs the medium within the branch flow channels 231.

[0042] It is understood that at least one of the medium flow channels 23 is provided with an intermediate chip 24. Since the intermediate chip 24 is provided with a flow disturbance structure, the intermediate chip 24 divides the medium flow channel 23 into at least two interconnected branch channels 231. The medium flowing into the medium flow channel 23 through the inlet 200 can flow in the two branch channels 231 and finally flow out through the outlet 201, thereby extending the flow path of the medium, increasing the heat exchange area, strengthening the flow and improving the heat exchange capacity, and achieving a better heat exchange effect. For the flow path of the above-mentioned fluid, see Figures 2 to 4 The direction indicated by the arrow.

[0043] The direction substantially perpendicular to the first direction is defined as the second direction, and the second direction is the flow direction of the medium in the branch channel 231. Figure 1 and Figure 2 As shown, the inlet 200 and the outlet 201 are spaced apart along the second direction. The first chip 21, the intermediate chip 24 and the second chip 22 all include a plate body arranged along the second direction. In the first chip assembly 2, at least the plate body of the intermediate chip 24 is provided with the above-mentioned spoiler structure. In one embodiment, in addition to providing the spoiler structure on the intermediate chip 24, the plate body of one of the first chip 21 and the second chip 22 is also provided with the above-mentioned spoiler structure. In this embodiment, as Figure 4 、 Figures 7 to 10As shown, the first chip 21, the middle chip 24 and the second chip 22 all include the above-mentioned spoiler structure. Figure 11 and Figure 12 As shown, only the plate body of the middle chip 24 includes the above-mentioned spoiler structure, and the plates of the first chip 21 and the second chip 22 both adopt a flat plate structure, that is, the plates of the first chip 21 and the second chip 22 are in a flat plate shape.

[0044] The above-mentioned spoiler structure is a first spoiler unit 3; or a second spoiler unit 4; or a mixed structure including the first spoiler unit 3 and the second spoiler unit 4. The above-mentioned first spoiler unit 3 and the second spoiler unit 4 are both uneven, and the structures of the first spoiler unit 3 and the second spoiler unit 4 are different. Among them, the first spoiler unit 3 includes a protrusion 31 and a recessed portion 32, and the plate surface of the plate body provided with the spoiler structure is defined as the first plate surface 5. The above-mentioned protrusions 31 are multiple and distributed on the first plate surface 5. The multiple protrusions 31 are arranged at intervals along the second direction, and the recessed portion 32 is defined and formed between the first plate surface 5 and the multiple protrusions 31. In one embodiment, the cross-section of the protrusion 31 is circular, elliptical or other shapes. In other words, the above-mentioned first spoiler unit 3 adopts a dot wave form.

[0045] The second spoiler unit 4 has a wavy cross-section along the first direction and includes ridges 41 and grooves 42. In this embodiment, the first direction is used as the vertical direction. The ridges 41 are formed by portions of the plate protruding upward or downward along the first direction. There are multiple ridges 41, which are spaced apart along the second direction, with the grooves 42 formed between adjacent ridges 41. In one embodiment, the ridges 41 are wavy and include V-shaped, herringbone-shaped, or curved ridges.

[0046] As can be seen from the above, the spoiler structures of the first chip 21, the middle chip 24 and the second chip 22 can adopt the same structure, or at least two of them can adopt the same structure, or the spoiler structures of the first chip 21, the middle chip 24 and the second chip 22 can all be different. Figure 5 and Figure 7 As shown, the first chip 21, the middle chip 24, and the second chip 22 have the same spoiler structure and all use the second spoiler unit 4. However, the shapes of the ridges 41 in the second spoiler units 4 used by the three chips (i.e., the first chip 21, the middle chip 24, and the second chip 22) can be exactly the same, partially the same (e.g., the ridges 41 of the first chip 21 are V-shaped, and the ridges 41 of the second chip 22 are herringbone-shaped, etc.), or completely different.

[0047] like Figure 9As shown, the first chip 21, the middle chip 24 and the second chip 22 have the same spoiler structure and all use the first spoiler unit 3. However, the shapes of the protrusions 31 used by the three chips (i.e., the first chip 21, the middle chip 24 and the second chip 22) can be exactly the same, partially the same (e.g., the cross section of the protrusion 31 of the first chip 21 is circular, while the cross section of the protrusion 31 of the middle chip 24 is elliptical), or completely different. Figure 10 As shown, the spoiler structure of the middle chip 24 adopts the second spoiler unit 4, the spoiler structures of the first chip 21 and the second chip 22 are the same, and both adopt the first spoiler unit 3, but the shapes of the protrusions 31 adopted by the first chip 21 and the second chip 22 can be the same or different. In another embodiment, the spoiler structure of the middle chip 24 adopts the first spoiler unit 3, and the spoiler structures of the first chip 21 and the second chip 22 both adopt the second spoiler unit 4, but the shapes of the ridges 41 adopted by the first chip 21 and the second chip 22 can be the same or different (e.g., the second spoiler unit 4 of the first chip 21 is a herringbone wave, the second spoiler unit 4 of the second chip 22 is a V-shaped wave, etc.).

[0048] like Figure 11 and Figure 12 As shown, the spoiler structure of the middle chip 24 uses the second spoiler unit 4. In one embodiment, the spoiler structure of the middle chip 24 uses the first spoiler unit 3. In addition, in one embodiment, only one of the first chip 21 and the second chip 22 has a spoiler structure on its plate, while the other has a flat plate. The spoiler structure is either the first spoiler unit 3 or the second spoiler unit 4. In one embodiment, at least one of the first chip 21, the second chip 22, and the middle chip 24 has the first spoiler unit 3 and the second spoiler unit 4 on its plate.

[0049] In one embodiment, openings are provided on the middle chip 24. The openings allow the medium to pass through the openings, thereby increasing the flow path of the medium and improving the heat exchange capacity.

[0050] The plate body of the first chip 21 is defined as the first plate body 210, the plate body of the second chip 22 is defined as the second plate body 220, and the plate body of the intermediate chip 24 is defined as the third plate body 240. The inlet 200 and outlet 201 of the first chip 21 and the second chip 22 are both located on the first plate body 210 and the second plate body 220. The first chip 21 also includes a first flange 211 provided on the periphery of the first plate body 210, and the second chip 22 also includes a second flange 221 provided on the periphery of the second plate body 220 and extending in the same direction as the first flange 211. The first flange 211 and the second flange 221 are stacked and arranged along a first direction and welded together. In this way, the first plate body 210, the first flange 211, the second plate body 220, and the second flange 221 collectively define the above-mentioned medium flow channel 23. The third plate body 240 partially contacts the first plate body 210 and the second plate body 220 at the heat exchange structure, thereby forming a flow channel blocking portion 8. In this embodiment, if Figure 2 As shown, the portion where the heat exchange structure of the intermediate chip 24 is connected to the heat exchange structure of the first plate body 210 and the portion where the heat exchange structure of the intermediate chip 24 is connected to the heat exchange structure of the second plate body 220 both form a flow channel blocking portion 8. In this embodiment, the connection is achieved by welding. The flow channel blocking portion can block the flow of the medium to limit the medium flowing in from the inlet 200 from concentrating on flowing to the outlet 201 through the medium flow channel 23. In one embodiment, the intermediate chip 24 only includes the above-mentioned third plate body 240. The above-mentioned inlet 200 and outlet 201 are located on the periphery of the third plate body 240. That is to say, in this embodiment, the intermediate chip 24 is located as a whole in the above-mentioned medium flow channel 23. In addition, in addition to setting the above-mentioned spoiler structure on the plate body of the corresponding chip, the above-mentioned spoiler structure can also be selected according to actual needs in the areas other than the welding position of the above-mentioned first flange 211 and the second flange 221.

[0051] In another embodiment, the intermediate chip 24 includes, in addition to the third plate 240, a third flange 241 provided on the periphery of the third plate 240 and extending in the same direction as the first flange 211. Figure 4As shown, the first flange 211, the third flange 241, and the second flange 221 are stacked and arranged along a first direction and connected by welding. In this way, the third flange 241 participates in the welding fixation with the first flange 211 and the second flange 221. Then, in this embodiment, the third plate 240 is located in the medium flow channel 23. In addition, the third plate 240 is provided with an inlet 2401 at the position corresponding to the inlet 200, and an outlet 2402 is provided at the position corresponding to the outlet 201. The two adjacent branch channels 231 are connected through the inlet 2401 and the outlet 2402. In this embodiment, the first flange 211, the third flange 241, and the second flange 221 are all gradually inclined outward from bottom to top. In addition, in addition to setting the above-mentioned spoiler structure on the plate body corresponding to the chip, the above-mentioned spoiler structure can also be selected to be set in the area other than the welding position of the first flange 211, the third flange 241, and the second flange 221 according to actual needs.

[0052] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0053] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of patent protection for the present application shall be determined by the appended claims.

Claims

1. A heat exchanger, characterized in that: The heat exchanger comprises a core (1), wherein the core (1) comprises at least two groups of chip assemblies stacked in sequence along a first direction, wherein the first direction is the height direction of the heat exchanger, wherein the chip assemblies comprise a first chip (21) and a second chip (22) stacked in sequence along the first direction, wherein a medium flow channel (23) for medium flow is defined between the first chip (21) and the second chip (22), and wherein the first chip (21) and the second chip (22) are respectively provided with an inlet (200) and an outlet (201) both of which are connected to the medium flow channel (23); At least one group of chip components is a first chip component (2), the first chip component (2) comprising at least one intermediate chip (24) stacked with the first chip (21), at least a portion of the intermediate chip (24) being located in the medium flow channel (23), and dividing the medium flow channel (23) into at least two branch channels (231) arranged in sequence and connected along the first direction, and in the first chip component (2), at least the intermediate chip (24) is provided with a flow-disturbing structure, and the flow-disturbing structure is located in the region where the branch channel (231) is located.

2. The heat exchanger according to claim 1, characterized in that: Each group of chip components is the first chip component (2).

3. The heat exchanger according to claim 1 or 2, characterized in that: The flow direction of the medium in the branch channel (231) is defined as a second direction, the first chip (21), the middle chip (24) and the second chip (22) all include a plate body arranged along the second direction, and at least the plate body of the middle chip in the first chip assembly (2) is provided with the spoiler structure.

4. The heat exchanger according to claim 3, characterized in that: The board body of at least one of the first chip (21) and the second chip (22) includes the spoiler structure.

5. The heat exchanger according to claim 3, characterized in that: The plate body of at least one of the first chip (21) and the second chip (22) is in the shape of a flat plate.

6. The heat exchanger according to claim 3, characterized in that: The spoiler structure is an uneven first spoiler unit (3); or an uneven second spoiler unit (4); or a mixed structure including the first spoiler unit (3) and the second spoiler unit (4), wherein the first spoiler unit (3) and the second spoiler unit (4) have different structures.

7. The heat exchanger according to claim 6, characterized in that: The first spoiler unit (3) comprises a raised portion (31) and a recessed portion (32), and the plate surface of the plate body provided with the spoiler structure is defined as a first plate surface (5). There are a plurality of raised portions (31) distributed on the first plate surface (5), and the plurality of raised portions (31) are arranged at intervals along the second direction. The recessed portion (32) is defined and formed between the first plate surface (5) and the plurality of raised portions (31).

8. The heat exchanger according to claim 6, characterized in that: The cross section of the second spoiler unit (4) along the first direction is wavy, and the second spoiler unit (4) comprises a convex strip (41) and a groove (42), wherein the convex strip (41) is formed by a part of the plate body protruding upward or downward along the first direction, and there are a plurality of the convex strips (41), and the plurality of the convex strips (41) are arranged at intervals along the second direction, and the groove (42) is formed between two adjacent convex strips (41).

9. The heat exchanger according to claim 8, characterized in that: The convex strips (41) are V-shaped, herringbone-shaped or arc-shaped.

10. The heat exchanger according to claim 3, characterized in that: The plate body of the first chip (21) is defined as a first plate body (210), the plate body of the second chip (22) is defined as a second plate body (220), and the plate body of the intermediate chip (24) is defined as a third plate body (240). The first chip (21) further includes a first flange (211) provided on the periphery of the first plate body (210), and the second chip (22) further includes a first flange (211) provided on the periphery of the second plate body (220) and extending in the same direction as the first flange (211). The first flange (211) and the second flange (221) are stacked and arranged along the first direction and welded together. The third plate (240) is partially in contact with the first plate (210) and the second plate (220) at the spoiler structure to form a flow channel blocking portion (8). The inlet (200) and the outlet (201) are provided on the first plate (210) and the second plate (220), and are located on the periphery of the third plate (240).

11. The heat exchanger according to claim 10, characterized in that: The intermediate chip (24) also includes a third flange (241) provided on the periphery of the third plate body (240) and extending in the same direction as the first flange (211); the first flange (211), the third flange (241) and the second flange (221) are stacked and arranged along the first direction and connected by welding; the third plate body (240) is provided with an inlet at a position corresponding to the inlet (200) and an outlet at a position corresponding to the outlet (201).

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