LPDDR bonding test device

Abstract

The utility model discloses an LPDDR bonding test device. The LPDDR bonding test device comprises a test assembly, a honeycomb platform and a supporting plate, an LPDDR jointed board is arranged on the supporting plate; a test assembly is arranged on the inner side of the honeycomb platform; a plurality of honeycomb holes are evenly distributed in the side face of the honeycomb platform, positioning pin holes are formed in the supporting plate, and after the positioning pin holes are aligned with the honeycomb holes, the supporting plate is connected to the honeycomb holes of the honeycomb platform in a screwed mode through positioning pins. On the basis of the honeycomb platform, the contact position of the testing device and the LPDDR jointed board can be adjusted by adjusting the mounting position of the supporting plate, for the large-size LPDDR jointed board, all testing units of the LPDDR jointed board can be respectively detected by one testing assembly, the testing flexibility is improved, and the testing cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of equipment testing, in particular to an LPDDR bonding testing device. Background Art

[0002] LPDDR (Low Power Double Data Rate SDRAM), also known as low-power double data rate synchronous dynamic random access memory, is a memory technology characterized by low power consumption and small size. It is widely used in various low-power devices such as mobile phones, game consoles, and tablets.

[0003] In the packaging process of LPDDR panels, bonding is one of the key processes. This process can complete the semi-finished product, and its function can be tested to determine whether the bonding procedure and process are qualified. Secondly, after the bonding process, it enters the plastic sealing process. After the plastic sealing, any functional abnormalities found, especially the quality problems of the bonding (broken wires, open circuits, short circuits, wrong wires, etc.), have been covered by the plastic sealant and cannot be repaired. Therefore, the testing of the bonding process is extremely important, but traditional testing has the following technical problems: First, some LPDDR chips are large in size and there is no space for pressing down on the edges. Using conventional test pin insertion method, there is a risk of damaging the LPDDR chip and bonding wires; second, the test position cannot be adjusted during the test process, which places high requirements on the configuration of the test equipment and increases the cost. Utility Model Content

[0004] In view of the above problems, the present invention is proposed to provide an LPDDR bonding test device that overcomes the above problems or at least partially solves the above problems.

[0005] The utility model provides an LPDDR bonding test device, which includes: a test component, a honeycomb platform and a support plate; an LPDDR panel is arranged on the support plate; a test component is arranged on the inner side of the honeycomb platform, and the test component extends to the outer side of the honeycomb platform; a plurality of honeycomb holes are evenly distributed on the side of the honeycomb platform, and a positioning pin hole is provided on the support plate. After the positioning pin hole is aligned with the honeycomb hole, the support plate is screwed to the honeycomb hole of the honeycomb platform through the positioning pin, and the position of the support plate is directly opposite to the test component.

[0006] Optionally, the test component includes a conductive adhesive circuit board, a lining board, a connector terminal and a BGA adapter board; the connector terminal is inserted into the honeycomb platform and extends to the outside of the honeycomb platform, the lining board is sleeved on the outside of the connector terminal, and the lining board is arranged to fit on the inner side of the honeycomb platform; the outer end of the connector terminal is provided with a conductive adhesive circuit board, and the conductive adhesive circuit board is fitted to the LPDDR panel; the inner end of the connector terminal is provided with a BGA adapter board.

[0007] Optionally, the connector terminal is further provided with an air pump connection end.

[0008] Optionally, a penetrating vacuum adsorption hole is provided in the middle of the conductive adhesive circuit board, and the vacuum adsorption hole is communicated with the air pump connection end.

[0009] Optionally, a vacuum groove is further provided on the outside of the vacuum adsorption hole.

[0010] Optionally, the support plate includes a support frame and a test hole hollowed out in the support frame, the size of the test hole matches the cross-sectional size of the conductive adhesive circuit board, and the conductive adhesive circuit board of the test device passes through the test hole and contacts the LPDDR panel.

[0011] Optionally, a plurality of positioning columns are provided on the support frame, and the LPDDR panels are fixed on the support plate through the positioning columns.

[0012] Optionally, the support frame is sprayed with rubber paint, and a sealing ring is provided at the connection between the support frame and the connector terminal to improve the air tightness of the connection between the two and enhance the vacuum adsorption effect.

[0013] Optionally, an operating platform is also provided on the honeycomb platform, and the operating platform is provided with a display component, a digital display, a button component and a circuit main board, wherein the circuit main board is respectively connected to the display component, the digital display and the button component through cables, and the circuit main board is welded to the BGA adapter board.

[0014] The technical solution provided in the embodiments of the present invention has at least the following technical effects or advantages:

[0015] The LPDDR bonding test device described in the embodiment of the utility model is based on a honeycomb platform. By adjusting the installation position of the support plate, the contact position between the test device and the LPDDR panel can be adjusted. For large-sized LPDDR panels, one test component can be used to test all test units of the LPDDR panel separately, thereby improving test flexibility and reducing test costs.

[0016] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 This is a schematic structural diagram of the LPDDR bonding test device of the present invention;

[0019] Figure 2 This is a schematic diagram of the installation of the test components;

[0020] Figure 3 It is a structural diagram of a conductive adhesive circuit board;

[0021] Figure 4 A partial schematic diagram of the pallet.

[0022] Description of reference numerals:

[0023] 1. Test component; 2. Honeycomb platform; 3. Pallet; 4. LPDDR panel; 5. Operating platform; 11. Conductive adhesive circuit board; 12. Liner; 13. Connector terminal; 14. Air pump connection end; 15. BGA adapter board; 16. Sealing ring; 17. Vacuum groove; 18. Vacuum adsorption hole; 20. Honeycomb hole; 31. Locating pin hole; 32. Locating column; 33. Support frame; 34. Test hole; 51. Display component; 52. Digital display; 53. Key assembly; 54. Circuit board; 55. Flex cable. DETAILED DESCRIPTION

[0024] Exemplary embodiments of the present disclosure will be described below in more detail with reference to the accompanying drawings.

[0025] In order to enable those skilled in the art to better understand the present invention, the following will be combined with the accompanying drawings of the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. The accompanying drawings show preferred embodiments of the present invention. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0026] Unless otherwise specified, various raw materials, instruments and equipment used in the present invention can be purchased from the market or prepared by existing methods.

[0027] Figure 1 This is a structural diagram of an LPDDR bonding test device provided by an embodiment of the utility model. Figure 2 For the installation diagram of test component 1, refer to Figure 1-2 As shown, the LPDDR bonding test device includes a test component 1, a honeycomb platform 2 and a support plate 3; an LPDDR panel 4 to be tested is arranged on the support plate 3; a test component 1 is arranged on the inner side of the honeycomb platform 2, and the test component 1 extends to the outer side of the honeycomb platform 2; a plurality of honeycomb holes 20 are evenly distributed on the side of the honeycomb platform 2, and a positioning pin hole 31 is provided on the support plate 3. After the positioning pin hole 31 is aligned with the honeycomb hole 20, the support plate 3 can be screwed on the honeycomb hole 20 of the honeycomb platform 2 by a positioning pin, and the position of the support plate 3 is opposite to the test component 1. By disassembling and assembling the positioning pin, the support plate 3 is moved, so that the position of the support plate 3 and the LPDDR panel 4 facing the test component 1 can be adjusted, so that each test unit on the LPDDR panel 4 can be tested one by one.

[0028] In the embodiment of the present invention, the LPDDR panel 4 is a combination of multiple LPDDR chips. During the test, each LPDDR chip belongs to an independent test unit. The test component 1 tests each test unit of the LPDDR panel 4 one by one.

[0029] The test assembly 1 includes a conductive rubber circuit board 11, a lining board 12, a connector terminal 13, an air pump connection end 14 and a BGA adapter board 15; the connector terminal 13 is inserted into the honeycomb platform 2 and extends to the outside of the honeycomb platform 2, the lining board 12 is sleeved on the outside of the connector terminal 13, and the lining board 12 is arranged to fit on the inside of the honeycomb platform 2 to stabilize the lateral direction of the connector terminal 13, avoid lateral deviation during the test, and improve the stability of the test; the outer end of the connector terminal 13 is provided with a conductive rubber circuit board 11, the conductive rubber circuit board 12 is provided with a conductive rubber circuit board 11, the conductive rubber circuit board 13 ... The conductive adhesive circuit board 11 is used to fit the LPDDR panel 4 to obtain test data; the inner end of the connector terminal 13 is provided with a BGA adapter board 15, and is electrically connected to the operating platform 5 through the BGA adapter board 15; the connector terminal 13 is also provided with an air pump connection end 14, and is connected to an external air source through the air pump connection end 14 to provide adsorption force, thereby adsorbing the LPDDR panel 4 on the conductive adhesive circuit board 11 to achieve stable fitting, avoiding the test pin insertion method in the prior art, and improving the safety and stability of the test.

[0030] Combine Figure 3 As shown, Figure 3 This is a structural diagram of the conductive adhesive circuit board 11. A penetrating vacuum adsorption hole 18 is provided in the middle position of the conductive adhesive circuit board 11. The vacuum adsorption hole 18 is connected to the air pump connection end 14 to provide adsorption force to stably adsorb the LPDDR panel 4 on the conductive adhesive circuit board 11; a vacuum groove 17 can also be provided on the outside of the vacuum adsorption hole 18 to provide an adsorption area and improve the stability of adsorption.

[0031] Combine Figure 4 As shown, Figure 4 This is a partial schematic diagram of a pallet 3, which includes a support frame 33 and a test hole 34 hollowed out in the support frame 33. The support frame 33 is used to provide physical support. The size of the test hole 34 matches the cross-sectional size of the conductive adhesive circuit board 11. The test hole 34 is used to provide space so that the conductive adhesive circuit board 11 of the test device can pass through the test hole 34 and contact the LPDDR panel 4, thereby collecting test data.

[0032] In the embodiment of the present invention, a plurality of positioning posts 32 are provided on the support frame 33 , and the LPDDR panels 4 are fixed on the support plate 3 via the positioning posts 32 .

[0033] The support frame 33 is sprayed with rubber paint, and a sealing ring 16 is provided at the connection between the support frame 33 and the connector terminal 13 to improve the airtightness of the connection between the two and enhance the vacuum adsorption effect.

[0034] An operating platform 5 is also provided on the honeycomb platform 2. The operating platform 5 is provided with a display component 51, a digital display 52, a button component 53 and a circuit main board 54. The circuit main board 54 is connected to the display component 51, the digital display 52 and the button component 53 respectively through a flat cable 55. The circuit main board 54 is welded to the BGA adapter board 15, so that the test data obtained by the test component 1 is transmitted to the display component 51 or the digital display 52 through the flat cable 55, and the test function is controlled by the button component 53, such as turning the test on and off or controlling the test parameters. The display component 51 can be, for example, a display screen.

[0035] The LPDDR bonding test device described in the embodiment of the present invention has the following advantages compared to the prior art:

[0036] 1. Based on the honeycomb platform 2, the contact position between the test device and the LPDDR panel 4 can be adjusted by adjusting the installation position of the support plate 3. For large-sized LPDDR panels 4, one test component 1 can be used to test all test units of the LPDDR panel 4, thereby improving test flexibility and reducing test costs.

[0037] 2. By setting vacuum adsorption holes 18 on the test device, based on the principle that vacuum generates negative pressure to provide adsorption force, the LPDDR panel 4 is adsorbed and fitted to the test device, thereby realizing the collection of test data. Compared with the existing test pin connection method, it avoids damage caused during the test process, improves test efficiency and stability, and reduces costs.

[0038] In the description provided herein, numerous specific details are described. However, it is understood that embodiments of the present invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0039] Similarly, it should be understood that in order to streamline the present disclosure and aid in understanding one or more of the various invention aspects, in the above description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, this disclosed approach should not be interpreted as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the claims, the invention aspects lie in less than all of the features of the individual embodiments previously disclosed. Accordingly, the claims that follow the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of the invention.

[0040] It should be noted that the above-mentioned embodiments illustrate rather than limit the invention and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims.

Claims

1. A LPDDR bonding test device, characterized in that: The LPDDR bonding test device includes: a test component, a honeycomb platform and a pallet; an LPDDR panel is arranged on the pallet; a test component is arranged on the inner side of the honeycomb platform, and the test component extends to the outer side of the honeycomb platform; a plurality of honeycomb holes are evenly distributed on the side of the honeycomb platform, and a positioning pin hole is provided on the pallet. After the positioning pin hole is aligned with the honeycomb hole, the pallet is screwed to the honeycomb hole of the honeycomb platform through the positioning pin, and the position of the pallet is directly opposite to the test component.

2. The LPDDR bonding test device according to claim 1, wherein: The test component includes a conductive adhesive circuit board, a lining board, a connector terminal and a BGA adapter board; the connector terminal is inserted into the honeycomb platform and extends to the outside of the honeycomb platform, the lining board is sleeved on the outside of the connector terminal, and the lining board is arranged to fit on the inner side of the honeycomb platform; the outer end of the connector terminal is provided with a conductive adhesive circuit board, and the conductive adhesive circuit board is fitted with the LPDDR panel; the inner end of the connector terminal is provided with a BGA adapter board.

3. The LPDDR bonding test device according to claim 2, wherein: The connector terminal is also provided with an air pump connection end.

4. The LPDDR bonding test device according to claim 3, wherein: A penetrating vacuum adsorption hole is provided in the middle of the conductive adhesive circuit board, and the vacuum adsorption hole is communicated with the air pump connection end.

5. The LPDDR bonding test device according to claim 4, wherein: A vacuum groove is further provided on the outer side of the vacuum adsorption hole.

6. The LPDDR bonding test device according to claim 2, wherein: The support plate includes a support frame and a test hole hollowed out in the support frame. The size of the test hole matches the cross-sectional size of the conductive adhesive circuit board. The conductive adhesive circuit board of the test device passes through the test hole and contacts the LPDDR panel.

7. The LPDDR bonding test device according to claim 6, wherein: The support frame is provided with a plurality of positioning posts, and the LPDDR panels are fixed on the support plate through the positioning posts.

8. The LPDDR bonding test device according to claim 6, wherein: The support frame is sprayed with rubber paint, and a sealing ring is provided at the connection between the support frame and the connector terminal to improve the air tightness of the connection between the two and enhance the vacuum adsorption effect.

9. The LPDDR bonding test device according to claim 2, wherein: An operating platform is also provided on the honeycomb platform. The operating platform is provided with a display component, a digital display, a button component and a circuit main board. The circuit main board is connected to the display component, the digital display and the button component respectively through cables, and the circuit main board is welded to the BGA adapter board.

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