Silicon wafer transfer device

Abstract

The utility model relates to the technical field of automatic tooling instruments, and discloses a silicon wafer transfer device, which comprises a first transfer unit, a second transfer unit, a third transfer unit and a fourth transfer unit, the second transfer unit comprises an electroplating basket and a second lifting structure; the conveying main body is arranged between the first transfer unit and the second transfer unit and is suitable for transferring the silicon wafers from the silicon wafer flower basket to the electroplating flower basket; the first calibration structure is at least arranged on the second lifting structure, and the second lifting structure is suitable for being correspondingly connected with the electroplating flower basket in a limiting manner under the action of the first calibration structure; and the second calibration structure is arranged adjacent to the second lifting structure and is suitable for clamping and limiting the silicon wafers in the same row so as to calibrate the positions of the silicon wafers in the arrangement direction and in the direction perpendicular to the arrangement direction. Therefore, the calibration effect and the installation precision of the flower basket and the silicon wafer are effectively improved, and the actual requirements can be met.

Description

Technical Field

[0001] The utility model relates to the technical field of automated tooling equipment, in particular to a silicon wafer transfer device. Background Art

[0002] When the electroplating equipment tooling is performing the electroplating process, it is usually necessary to use a tooling fixture to pass the cathode into the silicon wafer, and through the probe on the tooling fixture, contact with the exposed area of ​​the mask on the surface of the silicon wafer, that is, the reserved clamping point, so as to contact with the copper seed layer under the insulating mask for conductivity, and then contact with the electroplating solution to achieve electroplating.

[0003] Before the electroplating process begins, silicon wafers need to be loaded and unloaded from the wafer basket into the electroplating basket. Since there are multiple conductive points on the silicon wafer, the clamping points in the fixture need to correspond to the conductive points. For a basket fixture with a high load capacity, dozens of silicon wafers need to be quickly and accurately placed in the target position of the electroplating basket after transfer.

[0004] At present, the tooling commonly used in electroplating equipment has poor calibration effect and low accuracy for placing silicon wafers after batch transfer, which makes it difficult to meet actual needs. Utility Model Content

[0005] In view of this, the utility model provides a silicon wafer transfer device to solve the problem that the tooling commonly used in electroplating equipment has poor calibration effect and low accuracy in placing silicon wafers after batch transfer, which is difficult to meet actual needs.

[0006] In the first aspect, the utility model provides a silicon wafer transfer device, comprising: a first transfer unit, comprising a silicon wafer basket and a first lifting structure, the silicon wafer basket being suitable for carrying at least one column of silicon wafers and moving under the action of the first lifting structure; a second transfer unit, comprising an electroplating basket and a second lifting structure, the electroplating basket being suitable for carrying at least one column of silicon wafers and moving under the action of the second lifting structure; a conveying body, arranged between the first transfer unit and the second transfer unit, suitable for transferring silicon wafers from the silicon wafer basket to the electroplating basket; a first calibration structure, at least arranged on the second lifting structure, the second lifting structure being suitable for correspondingly limiting the connection of the electroplating basket under the action of the first calibration structure; a second calibration structure, arranged adjacent to the second lifting structure, suitable for clamping and limiting the silicon wafers in the same column to calibrate the positions of the silicon wafers in their arrangement direction and perpendicular to their arrangement direction.

[0007] Beneficial effects:

[0008] By providing a conveyor body, the loading and conveying of silicon wafers during transport can be achieved. Meanwhile, lifting structures are provided on both the silicon wafer basket and the electroplating basket, respectively, to drive the two baskets to rise and fall relative to the conveyor body, facilitating the gradual removal and placement of silicon wafers within the baskets. Furthermore, a first calibration structure and a second calibration structure, each located on or adjacent to the second lifting structure, can be used to precisely position and install the electroplating basket, as well as calibrate and correct the arrangement of silicon wafers within the basket in different directions, ensuring the stability of the electroplating basket and the precise positioning of the silicon wafers after transport. This arrangement effectively improves the calibration and installation accuracy of the baskets and silicon wafers, meeting practical needs.

[0009] In an optional embodiment, the electroplating basket includes: a pair of basket substrates, which are arranged opposite to each other and with the accommodating space provided therebetween, the extension direction of the silicon wafers in each column is in the same direction as the connection direction of the basket substrates, and at least two first limiting portions are correspondingly provided on the basket substrates, and the first limiting portions are suitable for being connected to the second lifting structure in a limiting manner under the action of the first calibration structure; a limiting rod group, the two ends of which are respectively connected to the pair of basket substrates, with the basket substrates as the top and bottom sides, and the limiting rod group is arranged in the circumference of the silicon wafers in each column.

[0010] In an optional embodiment, the second lifting structure includes: a second lifting rod, on which is disposed a second lifting guide rail and a second lifting drive, the second lifting guide rail being arranged vertically; a second supporting cage, disposed on the second lifting guide rail, housing the electroplating basket, the second supporting cage being adapted to be lifted and lowered along the second lifting guide rail under the action of the second lifting drive, and a second clamping drive being disposed on the top side of the second supporting cage; a pair of clamping baseplates, one of which is disposed on the bottom side of the second supporting cage and adapted to correspondingly limit the position of the basket baseplate on one side, and the other of which is disposed between the basket baseplate on the other side and the inner top of the second supporting cage and adapted to move toward the basket baseplate on the other side under the action of the second clamping drive to clamp or release the electroplating basket; and a second limiting portion, disposed on the side of each clamping baseplate facing the corresponding basket baseplate, adapted to be aligned with the first limiting portion and mutually limitedly connected under the action of the first alignment structure.

[0011] In an optional embodiment, the first calibration structure includes: a pair of clamping pliers, arranged on the bottom side of the second supporting cage, and the connection direction between the two is perpendicular to the conveying direction of the silicon wafers conveyed by the conveying body toward the electroplating basket; a clamp body driving member, connected to the pair of clamping pliers, and the clamping pliers are suitable for clamping and limiting the electroplating basket under the drive of the clamp body driving member, and driving the first limiting portion of the basket substrate on the electroplating basket to move to align with the second limiting portion corresponding to the clamping substrate.

[0012] In an optional embodiment, the second calibration structure includes: at least one plug-in structure, which is arranged adjacent to the second supporting cage of the second lifting structure, and the plug-in structure is arranged at least on the side of the second supporting cage facing away from the conveying body, and the plug-in structure includes a plurality of correction columns arranged side by side, and the length direction of the correction columns is arranged in the same direction as the arrangement direction of the silicon wafers in the electroplating basket, and each of the correction columns is alternately distributed with each column of silicon wafers in the electroplating basket, and the number of correction columns included in the plug-in structure exceeds the number of silicon wafer columns in the electroplating basket. a plurality of first column driving members, each of which is connected to the corresponding correction column, and the correction column is suitable for being driven by the first column driving member to synchronously move toward the second supporting cage direction to abut the silicon wafers in the same column and correct the position of the silicon wafers along their arrangement direction; a plurality of second column driving members, each of which is connected to the corresponding correction column, and the correction column is suitable for being driven by the second column driving member to move toward or away from the adjacent correction column to abut the silicon wafers in the same column and correct the position of the silicon wafers perpendicular to their arrangement direction.

[0013] In an optional embodiment, the correction column is arranged in a convex shape on a side facing the second supporting cage.

[0014] In an optional embodiment, the second calibration structure includes a pair of plug-in structures, the two plug-in structures are arranged opposite to each other and are located on both sides of the second supporting cage, one of the plug-in structures is arranged away from the conveying body relative to the second supporting cage, and the other is arranged toward the conveying body relative to the second supporting cage and is away from the conveying body.

[0015] In an optional embodiment, the conveying body includes: a conveyor belt group, arranged between the first transfer unit and the second transfer unit, suitable for carrying silicon wafers and moving from the first transfer unit to the second transfer unit; a tongue module, arranged at both ends of the conveyor belt group facing the first transfer unit and the second transfer unit respectively, the tongue modules at both ends respectively having a wafer taking state of extending toward the silicon wafer basket and taking out silicon wafers from the silicon wafer basket, and a wafer inserting state of extending toward the electroplating basket and placing silicon wafers in the electroplating basket; a clamping module, correspondingly arranged at both ends of the conveyor belt group facing the first transfer unit and the second transfer unit respectively, including a plurality of clamping members, correspondingly arranged on the side of the conveying direction of the conveyor belt group, the clamping members are suitable for moving toward each other and clamping and correcting the placement position of the silicon wafer on the conveyor belt group.

[0016] In an optional embodiment, the conveyor belt group includes: a first conveyor belt, one end of which faces the first transfer unit, suitable for carrying the silicon wafers in the silicon wafer basket taken out by the tongue module; a second conveyor belt, one end of which faces the second transfer unit, suitable for conveying the silicon wafers to be inserted to another tongue module adjacent to the electroplating basket; a transfer structure, arranged between the first conveyor belt and the second conveyor belt, suitable for transferring silicon wafers.

[0017] In an optional embodiment, the transfer structure includes: a transfer conveyor belt, arranged between the first conveyor belt and the second conveyor belt, suitable for receiving silicon wafers from the first conveyor belt; a transport structure, including a transport drive and transport teeth with the same number as the number of silicon wafer rows in the electroplating basket, and the transport teeth are suitable for clamping the silicon wafers on the transfer conveyor belt to the second conveyor belt under the drive of the transport drive. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 This is a schematic diagram of the three-dimensional structure of a silicon wafer transfer device according to an embodiment of the present utility model;

[0020] Figure 2 for Figure 1 A schematic diagram of the three-dimensional structure of the second transfer unit of the silicon wafer transfer device shown in another angle;

[0021] Figure 3 for Figure 1 A schematic diagram of the three-dimensional structure of the silicon wafer transfer device from another angle is shown;

[0022] Figure 4 for Figure 1 A schematic diagram of a portion of the structure of the conveying body of the silicon wafer transfer device shown;

[0023] Figure 5 for Figure 1 A schematic diagram of the three-dimensional structure of the upper side of the second transfer unit of the silicon wafer transfer device shown;

[0024] Figure 6 for Figure 1 A schematic diagram of the three-dimensional structure of the lower side of the second transfer unit of the silicon wafer transfer device shown;

[0025] Figure 7 for Figure 1A schematic diagram of the three-dimensional structure of the silicon wafer transfer device shown in FIG. 1 , where the electroplating basket is not shown at the lower side of the second transfer unit;

[0026] Description of reference numerals:

[0027] 1. Silicon wafer basket; 2. First lifting structure; 3. Electroplating basket; 31. Basket substrate; 32. First limiting part; 33. Limiting rod group; 4. Second lifting structure; 41. Second lifting rod; 42. Second supporting cage; 43. Clamping substrate; 44. Second limiting part; 5. Conveyor belt group; 51. First conveyor belt; 52. Second conveyor belt; 53. Transfer conveyor belt; 54. Transport structure; 6. Tongue module; 7. Clamping module; 8. First calibration structure; 81. Clamping pliers; 9. Second calibration structure; 91. Correction column. DETAILED DESCRIPTION

[0028] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of the present invention.

[0029] like Figure 1-Figure 7 This embodiment provides a silicon wafer transfer device, including: a first transfer unit, a second transfer unit, a conveying body, a first calibration structure 8 and a second calibration structure 9.

[0030] The first transfer unit includes a wafer basket 1 and a first lifting structure 2. The wafer basket 1 carries at least one row of wafers. In this embodiment, two rows are provided, but the number of rows can also be a single row or more. Specifically, the wafer basket 1 is mounted on the first lifting structure 2 and moves, specifically vertically, under the drive of the first lifting structure 2. In this embodiment, when the wafer basket 1 is mounted on the first lifting structure 2, the wafers therein are arranged in a vertical direction. As a convertible embodiment, when the wafer basket 1 is mounted on the first lifting structure 2 and the wafers therein are arranged in a horizontal or inclined direction, the movement direction under the drive of the first lifting structure 2 is correspondingly horizontal or inclined, and a limiting structure can be used to prevent the wafers from sliding.

[0031] The second transfer unit includes an electroplating basket 3 and a second lifting structure 4. The electroplating basket 3 is suitable for carrying at least one row of silicon wafers. In this embodiment, three rows are provided, but one, two, or more rows are also possible. Specifically, the electroplating basket 3 is mounted on the second lifting structure 4 and is driven by the second lifting structure 4 to move, specifically, vertically. Similarly, the silicon wafers within the electroplating basket 3 are arranged in a vertical direction. As an alternative embodiment, when the electroplating basket 3 is mounted on the second lifting structure 4 and the silicon wafers within the basket are arranged in a horizontal or inclined direction, the movement direction under the drive of the second lifting structure 4 is correspondingly horizontal or inclined, and a limiting structure can be used to prevent the silicon wafers from sliding.

[0032] The conveyor body is positioned between the first and second transfer units and is suitable for transferring silicon wafers from wafer basket 1 to electroplating basket 3. In this embodiment, the conveyor body transports the silicon wafers using a conveyor belt coupled with a retractable tongue structure. As an alternative embodiment, the conveyor body can also transport the silicon wafers using a multi-axis manipulator coupled with a suction cup structure and a buffer structure.

[0033] In this embodiment, the first calibration structure 8 is disposed on the second lifting structure 4. The second lifting structure 4 is adapted to be positioned relative to the electroplating basket 3 under the action of the first calibration structure 8. Furthermore, the first calibration structure 8 can be disposed not only on the second lifting structure 4 but also on the first lifting structure 2 to calibrate the position-limiting connection between the first lifting structure 2 and the wafer basket 1.

[0034] The second calibration structure 9 is disposed adjacent to the second lifting structure 4 and is suitable for clamping and limiting the silicon wafers in the same row to calibrate the positions of the silicon wafers in their arrangement direction and perpendicular to their arrangement direction.

[0035] By providing a conveying body, the loading and conveying of silicon wafers during transport can be achieved. Meanwhile, lifting structures are provided on the wafer basket 1 and the electroplating basket 3, respectively, to drive the two baskets to rise and fall relative to the conveying body, facilitating the gradual removal and placement of silicon wafers within the baskets. Furthermore, a first calibration structure 8 and a second calibration structure 9 are provided, each positioned on or adjacent to the second lifting structure 4, to precisely position and install the electroplating basket 3 and to calibrate and correct the arrangement of the silicon wafers within the electroplating basket 3 in different directions, ensuring the stability of the electroplating basket 3 and the precise positioning of the silicon wafers after transport. This arrangement effectively improves the calibration and installation accuracy of the baskets and silicon wafers, meeting practical needs.

[0036] The electroplating basket 3 includes a pair of basket base plates 31 and a limiting rod set 33 .

[0037] The two basket substrates 31 are arranged opposite each other with a storage space between them. The extension direction of each row of silicon wafers is in the same direction as the connection direction of the basket substrates 31. At least two first limiting portions 32 are correspondingly provided on the basket substrates 31. The first limiting portions 32 are suitable for being connected to the second lifting structure 4 under the action of the first calibration structure 8.

[0038] The two ends of the limiting rod group 33 are respectively connected to a pair of basket substrates 31, with the basket substrates 31 as the top and bottom sides, and the limiting rod group 33 is arranged in the circumference of each column of silicon wafers.

[0039] In this embodiment, the limiting rod group 33 includes: a fixed rod and a movable rod. The two ends of the fixed rod are respectively connected to a pair of basket base plates 31 for limiting position, which can be screwed or welded. The fixed rod is provided with a plurality of first extension ends on the side facing the accommodating space. The first extension ends are placed in the accommodating space and are suitable for being inserted between two adjacent silicon wafers. The first extension ends are bent toward the direction of one silicon wafer. The two ends of the movable rod are respectively connected to the pair of basket base plates 31 for movability. The movable rod is provided with a plurality of second extension ends on the side facing the accommodating space. The second extension ends are placed in the accommodating space and are suitable for being inserted between two adjacent silicon wafers. The second extension ends are arranged in a one-to-one correspondence with the first extension ends. The second extension ends and the corresponding first extension ends are arranged relative to each other. Preferably, the portion of the second extension end bent toward the silicon wafer is provided with an elastic structure, which can be made of metal, alloy, plastic, silicone, rubber or other polymer elastic composite materials.

[0040] A spring member is connected to the end of the movable rod, and the movable rod can be driven to move manually or by other external structures, so that the second extension end on the movable rod and the corresponding first extension end move toward each other and clamp the silicon wafer, or the second extension end on the movable rod and the corresponding first extension end move away from each other and loosen the silicon wafer.

[0041] Preferably, a first limiting portion 32 may also be provided on the silicon wafer basket 1 , and a second limiting portion 44 may be provided correspondingly on the first lifting structure 2 .

[0042] The second lifting structure 4 includes a second lifting rod 41 , a second carrying cage 42 , a pair of clamping base plates 43 and a second limiting portion 44 .

[0043] The second lifting rod 41 is provided with a second lifting guide rail and a second lifting drive member. The second lifting guide rail is arranged vertically and can be a screw structure, etc. The second lifting drive member can be a motor or a hydraulic cylinder, etc.;

[0044] The second supporting cage 42 is arranged on the second lifting guide rail and has the electroplating flower basket 3 built in. The second supporting cage 42 is adapted to move up and down along the second lifting guide rail under the action of the second lifting drive member. A second clamping drive member is provided on the top side of the second supporting cage 42. The second clamping drive member is specifically a motor or an electric cylinder.

[0045] One of the two clamping substrates 43 is arranged on the bottom side of the second supporting cage 42, which can limit the position of the basket substrate 31 on one side. The other clamping substrate 43 is arranged between the basket substrate 31 on the other side and the inner top of the second supporting cage 42, and is suitable for moving toward the basket substrate 31 on the other side under the action of the second clamping drive component to clamp or release the electroplating basket 3.

[0046] The second limiting portion 44 is disposed on the side of each clamping base plate 43 facing the corresponding basket base plate 31 and is adapted to align with the first limiting portion 32 under the action of the first alignment structure 8 and to be mutually limitedly connected. In this embodiment, the first limiting portion 32 comprises at least two limiting holes or limiting slots, and the second limiting portion 44 comprises at least two limiting protrusions, the number and arrangement of the first limiting portion 32 and the second limiting portion 44 matching each other. As an alternative embodiment, the first limiting portion 32 may be a limiting protrusion, and the second limiting portion 44 may be a limiting hole or limiting slot. Furthermore, both may be a mixture of holes and protrusions.

[0047] As a convertible embodiment, the clamping base plate 43 and the second supporting cage 42 are the same component, and the top plate of the second supporting cage 42 serves as a clamping base plate 43 and can be raised and lowered under the drive of the second clamping driving member.

[0048] The first calibration structure 8 includes a pair of clamping pliers 81 and a pliers driving member.

[0049] A pair of clamping pliers 81 is disposed on the bottom side of the second carrier cage 42, and the connection direction of the two clamping pliers is perpendicular to the conveying direction of the conveying body toward the electroplating basket 3 to convey the silicon wafers.

[0050] The clamp body driving member is connected to a pair of clamping pliers 81. The clamping pliers 81 are suitable for clamping and limiting the electroplating flower basket 3 under the drive of the clamp body driving member, and driving the first limiting portion 32 of the basket substrate 31 on the electroplating flower basket 3 to move to align with the second limiting portion 44 of the corresponding clamping substrate 43.

[0051] The provision of the first calibration structure 8 can achieve auxiliary limiting alignment of the first limiting portion 32 and the second limiting portion 44 , thereby avoiding positioning deviation and improving the limiting stability of the electroplating flower basket 3 and the second lifting structure 4 .

[0052] Preferably, a sensor for detecting the positions of the first limiting portion 32 and the second limiting portion 44 may be provided and electrically connected to the clamp driving member to further improve the accuracy of alignment.

[0053] The second calibration structure 9 includes: at least one plug-in structure, a plurality of first column driving components and a plurality of second column driving components.

[0054] When the insert structure is set up individually, the insert structure is arranged adjacent to the second supporting cage 42 of the second lifting structure 4, and the insert structure is arranged on the side of the second supporting cage 42 facing away from the conveying body. The insert structure includes a number of correction columns 91 arranged side by side. The length direction of the correction columns 91 is arranged in the same direction as the arrangement direction of the silicon wafers in the electroplating basket 3. The correction columns 91 are alternately distributed with the columns of silicon wafers in the electroplating basket 3. The number of correction columns 91 included in the insert structure exceeds the number of silicon wafer columns in the electroplating basket 3 by one. As a convertible embodiment, the number of correction columns 91 can also be equal to or one less than the number of silicon wafer columns in the electroplating basket 3.

[0055] The number of first column driving members corresponds to that of each correction column 91 and they are connected to each other. The correction columns 91 are suitable for synchronously moving toward the second supporting cage 42 under the drive of the first column driving members to abut against the silicon wafers in the same column and correct the position of the silicon wafers along their arrangement direction. As a convertible embodiment, the first column driving member can be set individually and connected to each correction column 91 at the same time.

[0056] The number of second column driving members corresponds to that of each correction column 91 and they are connected to each other. The correction columns 91 are suitable for moving toward or away from adjacent correction columns 91 in pairs under the drive of the second column driving members to abut against silicon wafers in the same column and correct the position of the silicon wafers along the direction perpendicular to their arrangement.

[0057] The simultaneous arrangement of the first column driving member and the second column driving member can respectively drive the correction column 91 to move in different directions, and respectively calibrate and correct in the direction of silicon wafer arrangement and in the direction perpendicular to the direction.

[0058] In this embodiment, the correction column 91 is arranged in a "convex" shape on the side facing the second supporting cage 42. Further preferably, the cross section of the correction column 91 is arranged in a cross shape.

[0059] In this embodiment, the second calibration structure 9 includes a pair of plug-in structures, which are arranged opposite to each other and are located on both sides of the second supporting cage 42. One of the plug-in structures is arranged away from the conveying body relative to the second supporting cage 42, and the other is arranged toward the conveying body relative to the second supporting cage 42 and is away from the conveying body.

[0060] Preferably, at the same time, only one side of the plug-in structure is in contact with the silicon wafer to avoid the problem of fragmentation that may occur when the two side plug-in structures face each other to clamp the silicon wafer.

[0061] The conveying body includes a conveying belt group 5, a tongue module 6 and a clamping module 7.

[0062] The conveyor belt group 5 is disposed between the first transfer unit and the second transfer unit, and is suitable for carrying silicon wafers and moving from the first transfer unit to the second transfer unit;

[0063] Two tongue modules 6 are provided, one at each end of the conveyor belt group 5 facing the first transfer unit and the other at the second transfer unit. The tongue modules 6 at the two ends respectively have a state of extending toward the silicon wafer basket 1 to remove silicon wafers from the silicon wafer basket 1, and a state of extending toward the electroplating basket 3 to place silicon wafers in the electroplating basket 3;

[0064] The clamping modules 7 are disposed at both ends of the conveyor belt assembly 5, facing the first transfer unit and the second transfer unit, respectively. The clamping modules 7 include a plurality of clamping members disposed laterally along the conveying direction of the conveyor belt assembly 5. The clamping members are adapted to move toward each other and clamp and correct the placement of the silicon wafer on the conveyor belt assembly 5. Preferably, the clamping modules 7 may also be disposed at other locations on the conveyor belt assembly 5.

[0065] In addition, the conveyor belt group 5 includes a first conveyor belt 51, a second conveyor belt 52 and a transfer structure.

[0066] One end of the first conveyor belt 51 faces the first transfer unit and is suitable for carrying the silicon wafers in the silicon wafer basket 1 taken out by the tongue module 6;

[0067] One end of the second conveyor belt 52 faces the second transfer unit, and is suitable for conveying silicon wafers to be inserted to another tongue module 6 adjacent to the electroplating basket 3.

[0068] The transfer structure is arranged between the first conveyor belt 51 and the second conveyor belt 52, and is suitable for transferring silicon wafers. In this embodiment, there is a height difference between the first conveyor belt 51 and the second conveyor belt 52. The transfer structure may include a lifting belt to transfer silicon wafers of different heights.

[0069] The transfer structure further includes a transfer conveyor belt 53 and a transport structure 54 .

[0070] The transfer conveyor belt 53 is disposed between the first conveyor belt 51 and the second conveyor belt 52 and is adapted to receive the silicon wafers from the first conveyor belt 51;

[0071] The transport structure 54 includes a transport drive and transport teeth having the same number as the number of silicon wafers in the electroplating basket 3. The transport teeth can be suction cups or manipulators, etc., which are suitable for clamping the silicon wafers corresponding to the transfer conveyor belt 53 to the second conveyor belt 52 under the drive of the transport drive.

[0072] Although the embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations shall fall within the scope defined by the appended claims.

Claims

1. A silicon wafer transport device, characterized in that: include: A first transfer unit comprises a silicon wafer basket (1) and a first lifting structure (2), wherein the silicon wafer basket (1) is suitable for carrying at least one row of silicon wafers and moves under the action of the first lifting structure (2); A second transfer unit comprises an electroplating basket (3) and a second lifting structure (4), wherein the electroplating basket (3) is suitable for carrying at least one row of silicon wafers and moves under the action of the second lifting structure (4); A conveying body, arranged between the first transfer unit and the second transfer unit, adapted to transfer silicon wafers from the silicon wafer basket (1) to the electroplating basket (3); A first calibration structure (8) is at least arranged on the second lifting structure (4), and the second lifting structure (4) is suitable for correspondingly limiting connection with the electroplating flower basket (3) under the action of the first calibration structure (8); The second calibration structure (9) is arranged adjacent to the second lifting structure (4) and is suitable for clamping and limiting the silicon wafers in the same row to calibrate the positions of the silicon wafers in their arrangement direction and perpendicular to their arrangement direction.

2. The silicon wafer transfer device according to claim 1, characterized in that: The electroplated flower basket (3) comprises: A pair of basket substrates (31) are arranged opposite to each other with a storage space provided therebetween, the extension direction of each row of silicon wafers being in the same direction as the connection direction of the basket substrates (31), at least two first limiting portions (32) being correspondingly provided on the basket substrates (31), the first limiting portions (32) being adapted to be positionally connected to the second lifting structure (4) under the action of the first calibration structure (8); The limiting rod group (33) has two ends respectively connected to the pair of basket substrates (31), with the basket substrates (31) as the top side and the bottom side, and the limiting rod group (33) is arranged in the circumference of each row of the silicon wafers.

3. The silicon wafer transfer device according to claim 2, wherein: The second lifting structure (4) comprises: A second lifting rod (41) is provided with a second lifting guide rail and a second lifting drive member, wherein the second lifting guide rail is arranged vertically; a second supporting cage (42) disposed on the second lifting guide rail and having the electroplating basket (3) built therein; the second supporting cage (42) being adapted to perform lifting motion along the second lifting guide rail under the action of the second lifting drive member; and a second clamping drive member being disposed on the top side of the second supporting cage (42); A pair of clamping substrates (43), one of which is arranged on the bottom side of the second supporting cage (42) and is suitable for correspondingly limiting the flower basket substrate (31) on one side, and the other clamping substrate (43) is arranged between the flower basket substrate (31) on the other side and the inner top of the second supporting cage (42), and is suitable for moving toward the flower basket substrate (31) on the other side under the action of the second clamping driving member to clamp or release the electroplating flower basket (3); The second limiting portion (44) is arranged on the side of each of the clamping substrates (43) facing the corresponding basket substrate (31), and is suitable for being aligned with the first limiting portion (32) under the action of the first calibration structure (8) and being mutually limitedly connected.

4. The silicon wafer transfer device according to claim 3, characterized in that: The first calibration structure (8) comprises: A pair of clamping pliers (81) are arranged on the bottom side of the second supporting cage (42), and the connection direction between the two is perpendicular to the conveying direction of the conveying body toward the electroplating basket (3) to convey the silicon wafers; The clamp body driving member is connected to a pair of the clamping pliers (81), and the clamping pliers (81) are suitable for clamping and limiting the electroplating flower basket (3) under the drive of the clamp body driving member, and driving the first limiting portion (32) of the flower basket substrate (31) on the electroplating flower basket (3) to move to align with the second limiting portion (44) corresponding to the clamping substrate (43).

5. The silicon wafer transfer device according to claim 3 or 4, characterized in that: The second calibration structure (9) comprises: At least one insert structure is arranged adjacent to the second supporting cage (42) of the second lifting structure (4), the insert structure is at least arranged on the side of the second supporting cage (42) facing away from the conveying body, the insert structure includes a plurality of correction columns (91) arranged side by side, the length direction of the correction columns (91) is arranged in the same direction as the arrangement direction of the silicon wafers in the electroplating basket (3), each of the correction columns (91) and each column of silicon wafers in the electroplating basket (3) is arranged alternately, and the number of correction columns (91) included in the insert structure exceeds the number of silicon wafer columns in the electroplating basket (3) by one; A plurality of first column driving members are connected to the respective correction columns (91) in a corresponding manner, and the correction columns (91) are adapted to be driven by the first column driving members to synchronously move toward the second supporting cage (42) to abut against the silicon wafers in the same row and correct the positions of the silicon wafers along their arrangement direction; A plurality of second column driving members are correspondingly connected to each of the correction columns (91), and the correction columns (91) are suitable for moving toward or away from the adjacent correction columns (91) under the drive of the second column driving members to abut against the silicon wafers in the same column and correct the position of the silicon wafers along the direction perpendicular to their arrangement.

6. The silicon wafer transport device according to claim 5, characterized in that: The correction column (91) is arranged in a convex shape on one side facing the second supporting cage (42).

7. The silicon wafer transporting device according to claim 5, characterized in that: The second calibration structure (9) includes a pair of plug-in structures, the two plug-in structures are arranged opposite to each other and are respectively placed on both sides of the second supporting cage (42), one of which is arranged away from the conveying body relative to the second supporting cage (42), and the other is arranged towards the conveying body relative to the second supporting cage (42) and is away from the conveying body.

8. The silicon wafer transporting device according to any one of claims 1-4, 6-7, characterized in that: The conveying body comprises: a conveyor belt group (5), arranged between the first transfer unit and the second transfer unit, suitable for carrying silicon wafers and moving from the first transfer unit to the second transfer unit; Tongue modules (6) are arranged at both ends of the conveyor belt group (5) facing the first transfer unit and the second transfer unit, respectively. The tongue modules (6) at both ends respectively have a wafer taking state of extending toward the wafer basket (1) to take out the wafer from the wafer basket (1), and a wafer inserting state of extending toward the electroplating basket (3) to place the wafer in the electroplating basket (3); A clamping module (7) is correspondingly arranged at the two ends of the conveyor belt group (5) facing the first transfer unit and the second transfer unit respectively, and includes a plurality of clamping members, which are correspondingly arranged on the sides of the conveyor belt group (5) along the conveying direction. The clamping members are suitable for moving toward each other and clamping and correcting the placement position of the silicon wafer on the conveyor belt group (5).

9. The silicon wafer transporting device according to claim 8, characterized in that: The conveyor belt group (5) comprises: A first conveyor belt (51), one end of which faces the first transfer unit and is suitable for carrying silicon wafers in the silicon wafer basket (1) taken out by the tongue module (6); A second conveyor belt (52), one end of which faces the second transfer unit, is suitable for conveying silicon wafers to be inserted to another tongue module (6) adjacent to the electroplating basket (3); The transfer structure is arranged between the first conveyor belt (51) and the second conveyor belt (52) and is suitable for transferring silicon wafers.

10. The silicon wafer transporting device according to claim 9, characterized in that: The transfer structure includes: A transfer conveyor belt (53) is arranged between the first conveyor belt (51) and the second conveyor belt (52), and is suitable for receiving silicon wafers from the first conveyor belt (51); The transport structure (54) includes a transport drive and transport teeth having the same number as the number of silicon wafers in the electroplating basket (3). The transport teeth are suitable for clamping the silicon wafers corresponding to the transfer conveyor belt (53) to the second conveyor belt (52) under the drive of the transport drive.

Images