Cleaning equipment and cleaning system
By setting up a SOC heat dissipation device in the cleaning equipment, the heat of the SOC chip is transferred to the water tank, which solves the heat dissipation problem of the SOC chip with high computing power, and improves the cleaning ability and liquid heating effect of the equipment.
Patent Information
- Application Number
- CN202422115414.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-09-02
- Estimated Expiration
- 2034-08-29
AI Technical Summary
The high computing power SOC chips equipped on the cleaning equipment have poor heat dissipation effect, which affects the performance of the equipment.
A SOC heat dissipation device is provided in the cleaning device, and the heat generated by the SOC chip is transferred to the water tank through the first heat transfer member to achieve a water cooling effect, and the liquid in the water tank is heated using the heat generated by the operation of the SOC chip.
It improves the heat dissipation effect of the SOC chip, enhances the cleaning ability of the cleaning equipment, and improves the heating effect of the tank liquid, and improves the overall performance of the cleaning equipment.
Smart Images
Figure CN223287091U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of cleaning, in particular to a cleaning device and a cleaning system. Background Art
[0002] As cleaning equipment like mopping robots and sweeping and mopping machines become increasingly powerful, they require more and more powerful sensor components, which in turn necessitates the installation of higher-computing System-on-Chip (SOC) chips to calculate and control the data collected by these sensor components. For example, cleaning equipment equipped with binocular cameras requires a high-computing SOC chip behind the binocular cameras to control them. However, using only natural heat dissipation to dissipate the heat effectively results in poor heat dissipation. Utility Model Content
[0003] The utility model solves the technical problem of poor heat dissipation effect of a high-computing-power SOC chip carried on the cleaning equipment to at least a certain extent by providing a cleaning equipment and a cleaning system.
[0004] In a first aspect of the present invention, a cleaning device is provided, comprising: a SOC chip, a water tank and a SOC heat dissipation device, wherein the SOC heat dissipation device comprises a first heat transfer component, and the first heat transfer component is configured to transfer heat generated by the SOC chip to the water tank.
[0005] In combination with the first aspect, in some embodiments, the water tank is a clean water tank, and the first heat transfer component is configured to transfer the heat generated by the SOC chip to the clean water in the clean water tank.
[0006] In combination with the first aspect, in some embodiments, the first heat transfer component includes a pipe for circulating liquid, the pipe is connected to the water tank, and the pipe is thermally connected to the SOC chip.
[0007] In combination with the first aspect, in some embodiments, the pipeline includes: a heat exchange pipe section, which is thermally connected to the SOC chip; a liquid supply pipe section and a liquid return pipe section respectively connected to the heat exchange pipe section, and the liquid supply pipe section and the liquid return pipe section are both connected to the water tank.
[0008] In combination with the first aspect, in some embodiments, the heat exchange pipe section includes: a bent pipe section arranged around a surface of one side of the SOC chip; or a bent pipe section arranged around the SOC chip.
[0009] In combination with the first aspect, in some embodiments, the first heat transfer component includes a metal heat conductor, and the metal heat conductor is thermally connected to the water tank and the SOC chip respectively.
[0010] In combination with the first aspect, in some embodiments, the metal heat conductor includes: a heat absorbing portion, thermally connected to the SOC chip; a heat releasing portion, disposed in the water tank; and a connecting portion, connecting the heat absorbing portion and the heat releasing portion.
[0011] In combination with the first aspect, in some embodiments, the connecting part is a strip metal structure; the heat absorbing part is a metal plate structure, or a strip metal structure wrapped around one side surface of the SOC chip; the heat releasing part is a metal plate structure arranged in the water tank or a strip metal structure wrapped around the water tank.
[0012] In combination with the first aspect, in some embodiments, the SOC heat dissipation device further includes: a flexible heat conductive member, wherein the flexible heat conductive member is in contact with a side surface of the SOC chip and the first heat transfer component respectively.
[0013] In combination with the first aspect, in some embodiments, the flexible heat conductive member includes: thermal grease coated on the surface of the SOC chip, and / or a thermal silicone sheet arranged between the SOC chip and the first heat transfer component.
[0014] In combination with the first aspect, in some embodiments, the cleaning device further includes: a motor; a second heat transfer component, the motor is thermally connected to the water tank through the second heat transfer component, and the second heat transfer component is configured to transfer the heat generated by the motor to the water tank.
[0015] In combination with the first aspect, in some embodiments, the cleaning device further includes a binocular camera electrically connected to the SOC chip.
[0016] In a second aspect of the present invention, a cleaning system is further provided, comprising: a cleaning base station and the cleaning device described in any embodiment of the first aspect.
[0017] One or more technical solutions provided in the embodiments of the present invention have at least the following technical effects or advantages:
[0018] By providing an SOC heat dissipation device for the SOC chip of the cleaning equipment, and the SOC heat dissipation device including a first heat transfer component that transfers the heat generated by the SOC chip to the water tank of the cleaning equipment, the heat dissipation effect of the SOC chip can be improved, thereby solving the technical problem of poor heat dissipation effect of the large-computing-power SOC chip carried on the cleaning equipment. In addition, the heat generated by the SOC chip can be used to continuously heat the liquid in the water tank during the operation of the cleaning equipment, so that the liquid in the water tank is more soluble after being heated, thereby also improving the cleaning ability of the cleaning equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0020] Figure 1 Shows a schematic structural diagram of a cleaning device according to some embodiments of the present utility model;
[0021] Figure 2a Shown Figure 1 A schematic structural diagram of the first heat transfer component in some embodiments;
[0022] Figure 2b Shown Figure 1 A schematic structural diagram of the first heat transfer component in other embodiments;
[0023] Figure 2c Shown Figure 1 A schematic structural diagram of the first heat transfer component in some further embodiments;
[0024] Figure 2d Shown Figure 1 A schematic structural diagram of the first heat transfer component in some further embodiments;
[0025] Figure 2e Shown Figure 2d A schematic diagram of the structure of a metal heat conductor in some embodiments;
[0026] Figure 3 Shown Figure 1 Schematic diagram of the position of the first heat transfer component, the SOC chip and the flexible heat conductive member stacked;
[0027] Figure 4 Shown are structural schematic diagrams of cleaning devices according to other embodiments of the present utility model. DETAILED DESCRIPTION
[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0029] It should be noted that all directional indications in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.
[0030] In this utility model, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.
[0031] In addition, in this utility model, the descriptions of "first" and "second" are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features specified as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this utility model.
[0032] The utility model provides a cleaning device, which can be a mopping robot or a sweeping and mopping all-in-one machine or other cleaning device with a built-in water tank.
[0033] like Figure 1 As shown, Figure 1 A structural schematic diagram of a cleaning device according to some embodiments of the present invention is shown, which includes: an SOC chip 11, a water tank 12 and an SOC heat dissipation device 13, wherein the SOC heat dissipation device 13 includes a first heat transfer component 131, and the first heat transfer component 131 is configured to transfer the heat generated by the SOC chip 11 to the water tank 12.
[0034] It is understood that the SOC chip 11, water tank 12, and SOC heat sink 13 are all disposed on the cleaning device body 14. The heat generated by the SOC chip 11 is transferred to the water tank 12 via the first heat transfer component 131, thereby improving the heat dissipation effect of the SOC chip 11. Furthermore, the heat generated by the SOC chip 11 can be used to continuously heat the liquid in the water tank 12 during operation of the cleaning device, thereby improving the cleaning ability of the cleaning device.
[0035] In some embodiments, a clean water tank, a sewage tank and a cleaning liquid tank are installed on the body 14 of the cleaning device. The water tank 12 can be a clean water tank. The first heat transfer component 131 is configured to transfer the heat generated by the SOC chip 11 to the clean water tank to heat the clean water in the clean water tank for cleaning the surface to be cleaned or the cleaning parts, thereby improving the cleaning effect of the cleaning device.
[0036] It is understood that the water tank 12 and the SOC chip 11 are thermally connected via the first heat transfer component 131, which can transfer the heat generated by the SOC chip 11 to the water tank 12. In actual implementation, there can be various embodiments of the first heat transfer component 131 to achieve the transfer of heat generated by the SOC chip 11 to the water tank 12:
[0037] like Figure 2a 、 Figure 2b or Figure 2c As shown, in some embodiments, the first heat transfer component 131 includes a pipe 131a for circulating liquid, the pipe 131a is connected to the water tank 12, and the pipe 131a is thermally connected to the SOC chip 11, so that the heat generated by the operation of the SOC chip 11 is transferred to the water tank 12 through the water channel, thereby achieving a water cooling effect on the SOC chip 11 and heating of the liquid in the water tank 12.
[0038] like Figure 2a 、 Figure 2b As shown, in some embodiments, the pipe 131a for circulating liquid includes: a heat exchange pipe section 1311, a liquid supply pipe section 1312 and a liquid return pipe section 1313 respectively connected to the heat exchange pipe section 1311. The heat exchange pipe section 1311 is thermally connected to the SOC chip 11. The liquid supply pipe section 1312 and the liquid return pipe section 1313 are both connected to the water tank 12, so that the water tank 12 and the pipe 131a form a liquid circulation loop. The liquid in the water tank 12 can reach the heat exchange pipe section 1311 through the liquid supply pipe section 1312. After the heat exchange pipe section 1311 absorbs the heat generated by the operation of the SOC chip 11 through heat exchange, it returns to the water tank 12 through the liquid return pipe section 1313, achieving cyclic heating of the liquid in the water tank 12, and can heat the liquid in the water tank 12 to a higher temperature, thereby improving the heating effect of the liquid in the water tank 12.
[0039] like Figure 2a and Figure 3 As shown, in some embodiments, the heat exchange pipe section 1311 is an expanded pipe section provided on one side surface of the SOC chip 11 .
[0040] In other embodiments, the heat exchange pipe section 1311 is a bent pipe section arranged around the SOC chip 11. Figure 2b and Figure 3As shown, in some embodiments, the bent pipe section may be wound around one side surface of the SOC chip 11 (for example, the bent pipe section is wound around one side surface of the SOC chip 11 in an S-shape). In other embodiments, the bent pipe section may be disposed around the SOC chip 11, so that the SOC chip 11 is wrapped by the bent pipe section, thereby increasing the heat exchange area.
[0041] like Figure 2c As shown, in other embodiments, in order to achieve a better water cooling effect, the pipe 131a for circulating liquid includes: a heat exchange pipe section 1311, and a liquid delivery pipe section 1312 and a liquid spraying pipe section 1314 respectively connected to the heat exchange pipe section 1311. The liquid delivery pipe section 1312 is connected to the water tank 12, and the liquid in the water tank 12 is transported to the heat exchange pipe section 1311 through the liquid delivery pipe section 1312. After the heat exchange pipe section 1311 absorbs the heat generated by the operation of the SOC chip 11 through heat exchange, the heat is sprayed onto the surface to be cleaned or the cleaning part through the liquid spraying pipe section 1314.
[0042] In some embodiments, the outer surfaces of the liquid delivery pipe section 1312 , the liquid return pipe section 1313 and the liquid spraying pipe section 1314 may be wrapped with an insulation layer (not shown), which is beneficial to improving the heating effect of the liquid in the water tank 12 .
[0043] like Figure 2d and Figure 2e As shown, in some embodiments, the first heat transfer component 131 includes a metal heat conductor 131 b , and the metal heat conductor 131 b is thermally connected to the water tank 12 and the SOC chip 11 respectively.
[0044] In some embodiments, one end of the metal heat conductor 131b extends into the water tank 12, and the other end of the metal heat conductor 131b is thermally connected to the SOC chip 11. It is understood that the metal heat conductor 131b can be integrally formed from a metal material with good thermal conductivity, such as copper or aluminum. The thermal conductivity of the metal heat conductor 131b absorbs heat generated by the SOC chip 11 and transfers it to the water tank 12, thereby heating the liquid in the water tank 12.
[0045] In some embodiments, the metal heat conducting member 131b made of metal material includes a heat absorbing portion 1315, a heat releasing portion 1316 and a connecting portion 1317. Figure 3As shown, the heat absorbing portion 1315 is thermally connected to the SOC chip 11 and is configured to absorb heat generated by the operation of the SOC chip 11. The heat releasing portion 1316 is disposed within the water tank 12 and is configured to release heat to the liquid within the water tank 12. A connecting portion 1317 extends from the location of the SOC chip 11 to the location of the water tank 12. The heat absorbing portion 1315 and the heat releasing portion 1316 are connected by the connecting portion 1317. The connecting portion 1317 transfers the heat absorbed from the SOC chip 11 by the heat absorbing portion 1315 to the heat releasing portion 1316 disposed within the water tank 12, where the heat is then absorbed by the liquid within the water tank 12, thereby dissipating heat from the SOC chip 11 and heating the liquid within the water tank 12.
[0046] In some embodiments, the connection portion 1317 is a strip-shaped metal structure, which can reduce the impact on the size of the cleaning equipment and improve the heat conduction effect.
[0047] like Figure 2d As shown, in some embodiments, both the heat absorbing portion 1315 and the heat releasing portion 1316 are metal plate structures that are wider than the connecting portion 1317 of the strip-shaped metal structure. This increases the contact area between the heat releasing portion 1316 and the liquid in the water tank 12, as well as the heat transfer area between the heat absorbing portion 1315 and the SOC chip 11. This increases the heat absorbing and heat releasing areas and reduces the impact on the size of the cleaning device. It is understood that the heat absorbing portion 1315 is a metal plate structure that is adapted to the size of one side surface of the SOC chip 11, wherein the surface area of the heat absorbing portion 1315 of the metal plate structure is greater than or equal to the area of one side surface of the SOC chip 11.
[0048] like Figure 2e As shown, in other embodiments, the heat absorbing portion 1315 is a strip-shaped metal structure wound around one side of the SOC chip 11, and the heat releasing portion 1316 is a strip-shaped metal structure wound inside the water tank 12. In other words, the metal heat conducting member 131b can be a strip-shaped metal wire with two ends bent and coiled.
[0049] like Figure 3 As shown, in some embodiments, in order to improve the heat dissipation effect of the first heat transfer component 131 on the SOC chip 11 and avoid structural interference caused by contact between the first heat transfer component 131 and the SOC chip 11, the SOC heat dissipation device 13 provided by the present invention may also include a flexible heat conductive member 132, and the flexible heat conductive member 132 is in contact with the SOC chip 11 and the first heat transfer component 131 respectively, so as to realize the thermal connection between the first heat transfer component 131 and the SOC chip 11, and the flexible heat conductive member 132 can effectively conduct the heat generated by the operation of the SOC chip 11 to the first heat transfer component 131.
[0050] In some embodiments, the flexible thermally conductive member 132 may include thermally conductive silicone grease applied to the surface of the SOC chip 11 and / or a thermally conductive silicone sheet disposed between the SOC chip 11 and the first heat transfer component 131. It is understood that when a thermally conductive silicone sheet is disposed between the SOC chip 11 and the first heat transfer component 131, the thermally conductive silicone sheet contacts the outer surface of the heat exchange tube section 1311 of the pipe 131a or contacts the heat absorbing portion 131 of the metal thermally conductive member 131b.
[0051] like Figure 4 As shown, in some embodiments, the cleaning device also has other components that generate large amounts of heat, such as a motor 16. In order to improve the overall heat dissipation effect of the cleaning device and the heating effect of the liquid in the water tank 12, the cleaning device provided by the present invention may also include a second heat transfer component 17. The motor 16 is thermally connected to the water tank 12 through the second heat transfer component 17. The second heat transfer component 17 is configured to transfer the heat generated by the motor 16 to the water tank 12, thereby achieving heat dissipation of the motor 16 and further heating of the liquid in the water tank 12.
[0052] It should be noted that the second heat transfer component 17 and the first heat transfer component 131 can adopt the same or similar structural design, see Figures 1 to 3 As shown, for the sake of brevity of the specification, it will not be repeated here, and another flexible heat conductive member (not shown) can be provided between the motor 16 and the second heat transfer component 17 to improve the heat conduction effect of the motor 16 to the second heat transfer component 17 and prevent structural interference.
[0053] like Figure 1 、 Figure 2d and Figure 4 As shown, in some embodiments, the cleaning device provided by the present invention may further include a binocular camera 15, which is electrically connected to the SOC chip 11. The SOC chip 11 is arranged near the binocular camera 15, and the SOC chip 11 is a chip for controlling the binocular camera 15.
[0054] Based on the same utility model concept, the present utility model also provides a cleaning system, including a cleaning base station and the cleaning device described in any one of the above embodiments.
[0055] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.
[0056] Obviously, those skilled in the art may make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include such modifications and variations.
Claims
1. A cleaning device, characterized in that: include: An SOC chip, a water tank, and an SOC heat dissipation device, wherein the SOC heat dissipation device includes a first heat transfer component, and the first heat transfer component is configured to transfer heat generated by the SOC chip to the water tank.
2. The cleaning device according to claim 1, wherein The water tank is a clean water tank, and the first heat transfer component is configured to transfer heat generated by the SOC chip to clean water in the clean water tank.
3. The cleaning device according to claim 1, wherein The first heat transfer component includes a pipe for circulating liquid, the pipe is connected to the water tank, and the pipe is thermally connected to the SOC chip.
4. The cleaning device according to claim 3, characterized in that The pipeline includes: A heat exchange pipe section, thermally connected to the SOC chip; A liquid delivery pipe section and a liquid return pipe section are respectively connected to the heat exchange pipe section, and the liquid delivery pipe section and the liquid return pipe section are both connected to the water tank.
5. The cleaning device according to claim 4, characterized in that The heat exchange tube section comprises: A bent tube section wound around one side surface of the SOC chip; or A bent pipe section is arranged around the SOC chip.
6. The cleaning device according to claim 1, wherein The first heat transfer component includes a metal heat conductor, and the metal heat conductor is thermally connected to the water tank and the SOC chip respectively.
7. The cleaning device according to claim 6, characterized in that The metal heat conducting member comprises: a heat absorbing portion, thermally connected to the SOC chip; a heat release portion, disposed in the water tank; The connecting portion connects the heat absorbing portion and the heat releasing portion.
8. The cleaning device according to claim 7, wherein: The connecting portion is a strip-shaped metal structure; The heat absorption part is a metal plate structure, or a strip-shaped metal structure wound around one side surface of the SOC chip; The heat radiation part is a metal plate structure arranged in the water tank or a strip metal structure wound in the water tank.
9. The cleaning device according to claim 1, wherein The SOC heat dissipation device further includes: A flexible heat-conducting member is in contact with a surface of one side of the SOC chip and the first heat transfer component respectively.
10. The cleaning device according to claim 9, wherein The flexible heat-conducting member comprises: Thermal conductive silicone grease applied to the surface of the SOC chip, and / or A thermally conductive silicone sheet is provided between the SOC chip and the first heat transfer component.
11. The cleaning device according to any one of claims 1 to 10, characterized in that: Also includes: Motor; The motor is thermally connected to the water tank via the second heat transfer component, and the second heat transfer component is configured to transfer heat generated by the motor to the water tank.
12. The cleaning device according to any one of claims 1 to 10, characterized in that: It also includes a binocular camera electrically connected to the SOC chip.
13. A cleaning system comprising: A cleaning base station and a cleaning device according to any one of claims 1 to 12.