Silicon wafer transmission device

Abstract

The utility model discloses a silicon wafer transmission device, which comprises a transmission bottom plate provided with a plurality of first mounting positions; and the transmission part is used for transmitting silicon wafers, a plurality of second mounting positions matched with the first mounting positions are arranged at the bottom of the transmission part, and the specification of the second mounting positions is larger than that of the first mounting positions, so that the transmission part is adjustably mounted on the transmission bottom plate. According to the embodiment of the utility model, the corresponding mounting positions are arranged on the transmission bottom plate and the transmission part, and the specification of the second mounting position on the transmission part is larger than that of the first mounting position on the transmission bottom plate; in this way, the effect of simplifying the structure of the silicon wafer conveying device can be achieved through the installation mode between the first installation position and the second installation position, the position of the silicon wafer conveying device can be flexibly adjusted based on the specification of the second installation position, the effect of improving the flexibility of the silicon wafer conveying device is achieved, the fragment rate in the silicon wafer conveying process is reduced, and the production efficiency is improved. And product integrity is provided.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing equipment, in particular to a silicon wafer transmission device. Background Art

[0002] During the production and processing of photovoltaic cell silicon wafers, they are transported to the processing steps via conveyor lines. Existing wafer transport devices utilize multiple belt modules for coordinated transmission. However, these belt modules are fixed, making it impossible to adjust the spacing and angles between the modules based on actual needs. Consequently, existing wafer transport devices are unable to adjust the belt modules' transport status based on actual transport scenarios, resulting in increased wafer fragmentation. Utility Model Content

[0003] The embodiment of the present utility model provides a silicon wafer transmission device, which aims to simplify the structure of the silicon wafer transmission device, improve the flexibility of the silicon wafer transmission device, and thus reduce the fragmentation rate during the silicon wafer transmission process.

[0004] The present invention provides a silicon wafer transfer device, which includes:

[0005] A transmission base plate, wherein a plurality of first mounting positions are provided on the transmission base plate;

[0006] The transmission part is used to transmit silicon wafers. The bottom of the transmission part is provided with multiple second mounting positions that cooperate with the first mounting positions, and the specifications of the second mounting positions are larger than those of the first mounting positions, so that the transmission part can be adjusted and installed on the transmission base plate.

[0007] Furthermore, a plurality of the transmission parts are arranged side by side, and a plurality of the first installation positions are arranged side by side.

[0008] Furthermore, the transmission part includes a transmission module for transmitting silicon wafers and a transmission base for fixing the transmission module.

[0009] Furthermore, the first mounting positions are provided in multiple rows, and every two rows of the first mounting positions form a mounting position group for mounting the transmission unit, and a first spacing exists between two rows of the first mounting positions in the mounting position group.

[0010] Furthermore, a plurality of second mounting positions are arranged side by side at the front end and the rear end of the transmission base, and a second spacing is provided between the second mounting positions at the front end of the transmission base and the second mounting positions at the rear end of the transmission base; wherein the first spacing is equal to the second spacing.

[0011] Furthermore, a plurality of positioning members are provided on the transmission base plate, and each of the positioning members is provided on the outside of the installation position group.

[0012] Furthermore, the positioning member is a positioning baffle laterally fixed on the transmission base plate.

[0013] Furthermore, the first mounting position is a circular mounting hole, and the second mounting position is a waist-shaped mounting hole.

[0014] Furthermore, the length, width and semicircular arc diameters at both ends of the waist-shaped mounting hole are all greater than the diameter of the circular mounting hole.

[0015] Furthermore, the transmission module includes a transmission assembly and a drive assembly. The transmission assembly is fixed above the transmission base through a support rod, and the drive assembly is fixedly mounted on the support rod.

[0016] The embodiment of the present utility model provides a silicon wafer transfer device, comprising: a transfer base plate, on which a plurality of first mounting positions are provided; a transfer portion for transferring silicon wafers, wherein a plurality of second mounting positions cooperating with the first mounting positions are provided at the bottom of the transfer portion, and the specifications of the second mounting positions are larger than those of the first mounting positions, so that the transfer portion can be adjusted and installed on the transfer base plate. The embodiment of the present utility model provides corresponding mounting positions on the transfer base plate and the transfer portion, and makes the specifications of the second mounting positions on the transfer portion larger than those of the first mounting positions on the transfer base plate. In this way, not only can the structure of the silicon wafer transfer device be simplified through the installation method between the first mounting positions and the second mounting positions, but the position itself can also be flexibly adjusted based on the specifications of the second mounting positions, thereby improving the flexibility of the silicon wafer transfer device, thereby reducing the fragmentation rate during silicon wafer transmission and providing product integrity. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 A schematic structural diagram of a silicon wafer transfer device provided in an embodiment of the present utility model;

[0019] Figure 2 A schematic structural diagram of a silicon wafer transfer device provided by an embodiment of the present invention from another angle;

[0020] Figure 3 A schematic structural diagram of a silicon wafer transfer device provided by an embodiment of the present invention from another angle;

[0021] Figure 4 This is a schematic diagram of the result of transferring a base plate in a silicon wafer transfer device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] It will be understood that when used in this specification and the appended claims, the terms “comprises” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0024] It should also be understood that the terms used in this utility model specification are only for the purpose of describing specific embodiments and are not intended to limit the utility model. As used in this utility model specification and the appended claims, the singular forms "a", "an" and "the" are intended to include plural forms unless the context clearly indicates otherwise.

[0025] It should be further understood that the term “and / or” used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0026] See below Figures 1 to 3 , an embodiment of the utility model provides a silicon wafer transfer device, comprising:

[0027] A transmission base plate 1, wherein a plurality of first mounting positions 11 are provided on the transmission base plate 1;

[0028] The transmission part 2 is used to transmit the silicon wafer 3. The bottom of the transmission part 2 is provided with multiple second mounting positions 211 that cooperate with the first mounting positions 11, and the specifications of the second mounting positions 211 are larger than the specifications of the first mounting positions 11, so that the transmission part 2 can be adjusted and installed on the transmission base plate 1.

[0029] In this embodiment, the silicon wafer transmission device includes a transmission base plate 1 and a transmission part 2 installed on the transmission base plate 1. By setting corresponding mounting positions on the transmission base plate 1 and the transmission part 2, and making the specifications of the second mounting position 211 on the transmission part 2 larger than the specifications of the first mounting position 11 on the transmission base plate 1, not only can the structure of the silicon wafer transmission device be simplified through the installation method between the first mounting position 11 and the second mounting position 211, but its own position can also be flexibly adjusted based on the specifications of the second mounting position 211, thereby achieving the effect of improving the flexibility of the silicon wafer transmission device, thereby reducing the fragmentation rate during silicon wafer transmission and providing product integrity.

[0030] In one embodiment, a plurality of transmission parts 2 are arranged side by side, and a plurality of first installation positions 11 are arranged side by side.

[0031] In this embodiment, by arranging multiple first installation positions 11 side by side on the transmission base plate 1, the transmission unit 2 can flexibly select the first installation position 11 to be installed according to actual transportation needs, thereby achieving the effect of flexibly adjusting the spacing between the transmission units 2 arranged side by side. Figure 1 As shown, five first installation positions 11 are left between the two transmission parts 2 at the front end, while three first installation positions 11 are left between the two transmission parts 2 at the rear end, that is, the distance between the two transmission parts 2 at the front end is greater than the distance between the two transmission parts 2 at the rear end.

[0032] In addition, since the specifications of the second mounting position 211 in this embodiment are larger than those of the first mounting position 11, when the transmission unit 2 is installed and fixed based on the first mounting position 11 and the second mounting position 211, the angle of the transmission unit 2 can be flexibly rotated to meet different transmission requirements. In other words, this embodiment can adjust both the spacing and angle of the transmission unit 2 used to transmit the silicon wafer 3. It should also be noted that the front end (front side) and the rear end (rear side) described in this embodiment are based on the direction of silicon wafer transmission, that is, the silicon wafer 3 is transmitted from the front end (front side) to the rear end (rear side) through the silicon wafer transmission device.

[0033] In one embodiment, the transmission unit 2 includes a transmission module 22 for transmitting the silicon wafer 3 and a transmission base 21 for fixing the transmission module 22 .

[0034] In a specific embodiment, the transmission module 22 includes a transmission assembly 221 and a drive assembly 222 . The transmission assembly 221 is fixed above the transmission base 21 through a support rod 23 , and the drive assembly 222 is fixedly mounted on the support rod 23 .

[0035] In this embodiment, the transmission module 22 includes a transmission assembly 221 and a drive assembly 222, wherein both the transmission assembly 221 and the drive assembly 222 are fixedly mounted via a support rod 23. Specifically, the transmission assembly 221 may include a belt mounting plate 2211, an idler pulley 2212, a synchronous pulley 2213, an elastic belt 2214, and a synchronous belt 2215. The belt mounting plate 2211 is fixedly mounted above the support rod 23, the idler pulley 2212 is mounted at the front and rear ends of the belt mounting plate 2211, the elastic belt 2214 is mounted on the left and right sides of the belt mounting plate 2211, and the synchronous belt 2215 is mounted on the synchronous pulley 2213. The synchronous pulley 2213 is positioned in the region of the belt mounting plate 2211 between the left and right elastic belts 2214. The drive assembly 222 may include a servo motor connected to the synchronous pulley 2213 to drive the synchronous pulley 2213 to rotate the synchronous belt 2215. In addition, the transmission module 22 can also include a capacitive sensor 223, which can be specifically arranged on the belt mounting plate 2211, so that the properties of the silicon wafer transmission device or the parameters of the environment can be sensed and detected by measuring the changes in capacitance, thereby adjusting the position and angle of the transmission part 2 accordingly according to the detection results of the capacitive sensor 223.

[0036] In one embodiment, the first mounting positions 11 are provided in multiple rows, and every two rows of the first mounting positions 11 form a mounting position group for mounting the transmission unit 2 , and a first spacing exists between two rows of the first mounting positions 11 in the mounting position group.

[0037] In addition, a plurality of second mounting positions 211 are respectively arranged side by side at the front end and the rear end of the transmission base 21, and a second spacing is provided between the second mounting position 211 at the front end of the transmission base 21 and the second mounting position 211 at the rear end of the transmission base 21; wherein the first spacing is equal to the second spacing.

[0038] Combine Figure 4 The transmission base plate 1 is provided with multiple rows of first mounting positions 11, each row comprising multiple first mounting positions 11. Two adjacent rows of first mounting positions 11 form a mounting position group, and each transmission unit 2 is installed and adjusted according to the mounting position group. Simultaneously, the transmission base 21 of the transmission unit 2 is provided with second mounting positions 211 at the front and rear ends corresponding to the two rows of first mounting positions 11 in the mounting position group. The spacing between the second mounting positions 211 at the front and rear ends matches the spacing between the two rows of first mounting positions 11 in the mounting position group. This allows the transmission unit 2 to be precisely installed and fixed on the transmission base plate 1.

[0039] In one embodiment, a plurality of positioning members 12 are further provided on the transmission base plate 1 , and each positioning member 12 is provided on the outside of the installation position group.

[0040] This embodiment utilizes positioning members 12 to precisely position the transmission unit 2 during installation and adjustment, preventing it from exceeding the installation position or adjustment area. Specifically, the positioning members 12 are positioning baffles that are laterally fixed to the transmission base plate 1. In practical applications, positioning baffles can be installed on both the front and rear sides of the installation position group, or only on the front or rear side. Furthermore, positioning baffles can be installed on a portion of the transmission unit 2 and omitted on another portion, depending on the needs.

[0041] In one embodiment, the first mounting position 11 is a circular mounting hole, and the second mounting position 211 is a waist-shaped mounting hole.

[0042] Furthermore, the length, width and semicircular arc diameters at both ends of the waist-shaped mounting hole are all greater than the diameter of the circular mounting hole.

[0043] This embodiment uses a circular mounting hole as the first mounting position 11, and a waist-shaped mounting hole as the second mounting hole, and the length, width, and semicircular arc diameter of the waist-shaped mounting hole at both ends and other specification parameters are set to be larger than the diameter of the circular mounting hole. In this way, the transmission part 2 can adjust its own transmission angle based on the specifications of the waist-shaped mounting hole, and control the position of the waist-shaped mounting hole and the circular mounting hole, thereby adjusting the spacing between adjacent transmission parts 2.

[0044] In actual application scenarios, one end of the transmission base 21 is first controlled to be close to the positioning baffle to achieve installation and positioning. Then, the spacing between the transmission parts 2 in the same row is adjusted, as well as the respective inclination angles of the transmission parts 2 in the same row. Then, the first mounting position 11 and the second mounting position 211 are used to achieve installation and fixation. In this way, the purpose of adjusting the spacing and adjusting the angle can be achieved. Furthermore, after the angle of the transmission part 2 is adjusted, it can be locked and fixed through the waist-shaped hole.

[0045] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referred to each other. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the scope of protection of the claims of this application.

[0046] It should also be noted that, in this specification, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element.

Claims

1. A silicon wafer transfer device, characterized in that: include: A transmission base plate, wherein a plurality of first installation positions are provided on the transmission base plate; The transmission part is used to transmit silicon wafers. The bottom of the transmission part is provided with multiple second mounting positions that cooperate with the first mounting positions, and the specifications of the second mounting positions are larger than those of the first mounting positions, so that the transmission part can be adjusted and installed on the transmission base plate.

2. The silicon wafer transfer device according to claim 1, wherein: A plurality of the transmission parts are arranged side by side, and a plurality of the first installation positions are arranged side by side.

3. The silicon wafer transfer device according to claim 2, wherein: The transmission part includes a transmission module for transmitting silicon wafers and a transmission base for fixing the transmission module.

4. The silicon wafer transfer device according to claim 3, wherein: The first mounting positions are arranged in multiple rows, and every two rows of the first mounting positions form a mounting position group for mounting the transmission part. There is a first distance between the two rows of the first mounting positions in the mounting position group.

5. The silicon wafer transfer device according to claim 4, characterized in that: The front end and the rear end of the transmission base are respectively provided with a plurality of second installation positions arranged side by side, and a second distance is provided between the second installation positions at the front end of the transmission base and the second installation positions at the rear end of the transmission base; wherein the first distance is equal to the second distance.

6. The silicon wafer transfer device according to claim 4, characterized in that: A plurality of positioning members are further provided on the transmission bottom plate, and each of the positioning members is provided on the outside of the installation position group.

7. The silicon wafer transfer device according to claim 6, wherein: The positioning member is a positioning baffle fixed laterally on the transmission bottom plate.

8. The silicon wafer transfer device according to claim 1, wherein: The first mounting position is a circular mounting hole, and the second mounting position is a waist-shaped mounting hole.

9. The silicon wafer transfer device according to claim 8, characterized in that: The length, width and semicircular arc diameters at both ends of the waist-shaped mounting hole are all greater than the diameter of the circular mounting hole.

10. The silicon wafer transfer device according to claim 3, wherein: The transmission module includes a transmission assembly and a drive assembly. The transmission assembly is fixed above the transmission base through a support rod, and the drive assembly is fixedly installed on the support rod.

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