Crystal grain carrier plate mounting jig and laser bonding equipment

Abstract

The utility model discloses a crystal grain support plate installation tool and a laser bonding device, a support is provided with a through hole, an adsorption plate covers the through hole, the adsorption plate can be exposed from the through hole, the adsorption plate is provided with a plurality of adsorption holes, and each adsorption hole can adsorb a crystal grain support plate on the adsorption plate. As the output end of the light path adjusting part faces the adsorption plate, and the adsorption plate is a light-transmitting plate, the light path adjusting part is aligned with the crystal grains, and the laser reaches the crystal grains through the adsorption plate, so that the crystal grains are bonded on the carrier plate. Laser can penetrate through the whole adsorption plate, large-area bonding is facilitated, the adsorption plate directly adsorbs the carrier plate, the carrier plate with a larger area can be machined, the area of a machinable area is greatly increased, and the machining efficiency is improved. And in the subsequent pressing process, the adsorption plate can uniformly abut against each crystal grain on the carrier plate, so that the flatness of the pressed carrier plate is ensured.

Description

Technical Field

[0001] The utility model relates to the field of LED crystal grain fixing, and in particular to a crystal grain carrier plate mounting fixture and laser bonding equipment. Background Art

[0002] During the MicroLED production process, lasers are required to secure the die to the substrate. Existing techniques often use mechanical clamps or metal hollow jigs to secure the substrate. These support only partially protect the substrate, making it difficult to guarantee flatness after subsequent compression. Furthermore, during laser processing, only a small area is transparent to the laser. Only the areas that can be laser-bonded can be used for die bonding, resulting in low processing efficiency. Utility Model Content

[0003] In order to overcome the deficiencies of the prior art, the utility model provides a die carrier mounting fixture and a laser bonding device.

[0004] The technical solution adopted by the present invention to solve its technical problems is: on the one hand, a chip carrier mounting fixture is provided, including a bracket and an adsorption plate, the bracket is provided with a through hole, the adsorption plate covers the through hole, the adsorption plate is a light-transmitting plate, and a plurality of adsorption holes are provided on the adsorption plate, each of the adsorption holes is used to adsorb the chip carrier.

[0005] As a further improvement of the above technical solution, it also includes a vacuum generator, which is installed on the bracket, and a connecting head is provided on the adsorption plate, and the vacuum generator is connected to the connecting head through a connecting pipe.

[0006] As a further improvement of the above technical solution, the adsorption plate is connected to a vacuum pressure gauge, which is installed on the bracket and is used to detect the negative pressure of the adsorption hole.

[0007] As a further improvement of the above technical solution, the adsorption plate is connected to a solenoid valve, which is installed on the bracket and is used to adjust the negative pressure of the adsorption hole.

[0008] As a further improvement of the above technical solution, a polishing surface is provided on the adsorption plate, and a plurality of the adsorption holes are arranged around the edge of the polishing surface.

[0009] As a further improvement of the above technical solution, the adsorption holes are provided in two groups, wherein one group of the adsorption holes surrounds the outside of the other group of the adsorption holes, and the inner group of the adsorption holes is provided around the polishing surface.

[0010] As a further improvement of the above technical solution, a plurality of fixing holes are provided on the edge of the adsorption plate, and the plurality of fixing holes surround the edge of the adsorption plate.

[0011] As a further improvement of the above technical solution, the adsorption plate is a quartz glass plate.

[0012] On the other hand, a laser bonding device is also provided, including a laser, an optical path adjustment component and the aforementioned chip carrier mounting fixture, wherein the optical path adjustment component is installed on the bracket, the output end of the optical path adjustment component faces the adsorption plate, the optical path adjustment component is used to adjust the laser light path, and the laser is used to provide laser to the optical path adjustment component.

[0013] As a further improvement of the above technical solution, it also includes a conveying mechanism, which is used to transport the chip carrier.

[0014] The beneficial effects of the present invention are as follows: since the bracket is provided with a through hole, the adsorption plate covers the through hole, the adsorption plate can be exposed from the through hole, and a number of adsorption holes are provided on the adsorption plate, each of which can adsorb the grain carrier onto the adsorption plate. Since the adsorption plate is a light-transmitting plate, by aiming the laser at the grain, the laser passes through the adsorption plate to the grain, so that the grain is bonded to the carrier. The entire adsorption plate can pass through the laser, which is convenient for large-area bonding, and the adsorption plate directly adsorbs the carrier, which can process a larger carrier, and the area of ​​the processable area is greatly increased, thereby improving processing efficiency. In the subsequent pressing process, the adsorption plate can evenly press each grain on the carrier to ensure the flatness of the carrier after being pressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0016] Figure 1 This is a structural diagram of a die carrier mounting fixture provided by a preferred embodiment of the present invention;

[0017] Figure 2 This is a structural schematic diagram of the die carrier mounting fixture provided by the preferred embodiment of the present invention from another angle;

[0018] Figure 3 This is a structural diagram of the die carrier mounting jig provided by the preferred embodiment of the present invention when adsorbing the die carrier;

[0019] Figure 4 It is a structural schematic diagram of the adsorption plate of the die carrier mounting fixture provided in the preferred embodiment of the present utility model.

[0020] Reference numerals: 1, bracket, 2, optical path adjustment member, 3, adsorption plate, 4, vacuum generator, 5, vacuum pressure gauge, 6, solenoid valve, 7, die carrier;

[0021] 11. Through hole, 31. Adsorption hole, 32. Connector, 33. Polished surface, 34. Fixing hole. DETAILED DESCRIPTION

[0022] The following will clearly and completely describe the concept, specific structure and technical effects of the present invention in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the embodiments described are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative work are all within the scope of protection of the present invention. In addition, all the connection / connection relationships involved in the patent do not simply refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation. For example, fixed connection / fixed installation can be selected from screw connection, bolt connection, pin connection, key connection, bonding, mortise and tenon connection, welding, riveting and other methods as needed. For detachable connection, screw connection, bolt connection, threaded connection, snap connection, mortise and tenon connection, Velcro connection and other methods can be selected as needed. The various technical features in the creation of the present invention can be combined interchangeably without conflicting with each other.

[0023] See Figure 1-3 The preferred embodiment of the present invention provides a die carrier mounting jig, including a bracket 1 and an adsorption plate 3. The bracket 1 is provided with a through hole 11, and the adsorption plate 3 covers the through hole 11. The adsorption plate 3 is a light-transmitting plate, and a plurality of adsorption holes 31 are provided on the adsorption plate 3. Each adsorption hole 31 is used to adsorb the die carrier 7. Since the bracket 1 is provided with a through hole 11 and the adsorption plate 3 covers the through hole 11, the adsorption plate 3 can be exposed from the through hole 11, and the adsorption plate 3 is provided with a plurality of adsorption holes 31. Each adsorption hole 31 can adsorb the die carrier 7 on the adsorption plate 3. Since the adsorption plate 3 is a light-transmitting plate, by aiming the laser at the die, the laser passes through the adsorption plate 3 to reach the die, so that the die is bonded to the carrier. The entire adsorption plate 3 can pass through the laser, which is convenient for large-area bonding. The adsorption plate 3 directly adsorbs the carrier, so that a carrier with a larger area can be processed, and the area of ​​the processable area is greatly increased, thereby improving the processing efficiency. In the subsequent pressing process, the adsorption plate 3 can evenly press each die on the carrier plate to ensure the flatness of the carrier plate after being pressed.

[0024] The die carrier mounting fixture also includes a vacuum generator 4, a vacuum pressure gauge 5, and a solenoid valve 6. The vacuum generator 4 is mounted on the bracket 1. A connector 32 is provided on the adsorption plate 3. The vacuum generator 4 is connected to the connector 32 via a connecting tube (not shown). Connecting the vacuum generator 4 to a positive pressure air source creates a negative pressure in the adsorption holes 31 on the adsorption plate 3. The vacuum generator 4 is a highly efficient, clean, economical, compact, and easy-to-use vacuum component.

[0025] The adsorption plate 3 is connected to a vacuum pressure gauge 5, specifically, the two are connected by a pipe (not shown). The vacuum pressure gauge 5 is mounted on the bracket 1 and is used to detect the negative pressure of the adsorption hole 31. The vacuum pressure gauge 5 can obtain a certain value for the negative pressure of the adsorption hole 31, which facilitates more accurate control of the negative pressure.

[0026] The adsorption plate 3 is connected to a solenoid valve 6 mounted on the bracket 1. The solenoid valve 6 is used to adjust the negative pressure in the adsorption holes 31. The negative pressure in the adsorption holes 31 is kept within an appropriate range to prevent the adsorption plate 3 from being unable to stably hold the carrier due to too low a negative pressure, or from being difficult to remove after processing, which could affect subsequent processing.

[0027] See Figure 4 The adsorption plate 3 is provided with a polished surface 33, and a plurality of adsorption holes 31 are arranged around the edge of the polished surface 33. The polished surface 33 further increases light transmittance and avoids weakening the laser intensity. Because the adsorption holes 31 are arranged around the edge of the polished surface 33, the central area of ​​the carrier plate with the die is located on the polished surface 33. The four edges of the carrier plate are adsorbed on the adsorption plate 3, which improves the stability of the connection between the carrier plate and the adsorption plate 3.

[0028] There are two groups of adsorption holes 31, one of which surrounds the outside of the other group of adsorption holes 31, and the inner group of adsorption holes 31 surrounds the polishing surface 33. These two groups of adsorption holes 31 can be used to adsorb carriers of different sizes, expanding the scope of application.

[0029] The edge of the adsorption plate 3 is provided with a plurality of fixing holes 34, which surround the edge of the adsorption plate 3. By providing connecting members (not shown in the figure), such as bolts, in the fixing holes 34, the four edges of the adsorption plate 3 can be connected to the bracket 1, so that the adsorption plate 3 and the bracket 1 are firmly connected.

[0030] The adsorption plate 3 is a quartz glass plate. Quartz glass has an extremely low thermal expansion coefficient, high temperature resistance, excellent chemical stability, optimal ultraviolet spectrum transmission performance, and visible light and near-infrared spectrum transmission performance. It can withstand the high temperature of the laser while avoiding weakening the laser intensity and is strong and durable.

[0031] The preferred embodiment of the present invention also provides a laser bonding device, including a laser, an optical path adjustment member 2, a conveying mechanism, and a die carrier mounting fixture of the above embodiment. The optical path adjustment member 2 is mounted on a bracket 1, with the output end of the optical path adjustment member 2 facing the adsorption plate 3. The optical path adjustment member 2 is used to adjust the laser light path, the laser is used to provide laser light to the optical path adjustment member 2, and the conveying mechanism is used to transport the die carrier 7. After the conveying mechanism transports the die carrier 7 to the bottom of the adsorption plate 3, under the action of negative pressure, the die carrier 7 is connected to the adsorption plate 3, the optical path adjustment member 2 is aligned with the die, and the laser provides laser light to the optical path adjustment component. The laser light passes through the adsorption plate 3 to reach the die, so that the die is bonded to the carrier. The entire adsorption plate 3 can transmit the laser light, which facilitates large-area bonding. The adsorption plate 3 directly adsorbs the carrier, which can process a larger carrier, and the area of ​​the processable area is greatly increased, thereby improving processing efficiency.

[0032] The above is a specific description of the preferred implementation of the present invention, but the invention of the present invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A die carrier mounting fixture, characterized by: It includes a bracket and an adsorption plate. The bracket is provided with a through hole. The adsorption plate covers the through hole. The adsorption plate is a light-transmitting plate. The adsorption plate is provided with a plurality of adsorption holes. Each of the adsorption holes is used to adsorb the die carrier.

2. The die carrier mounting jig according to claim 1, wherein: It also includes a vacuum generator, which is installed on the bracket. A connecting head is provided on the adsorption plate, and the vacuum generator is connected to the connecting head through a connecting pipe.

3. The die carrier mounting jig according to claim 1, wherein: The adsorption plate is connected to a vacuum pressure gauge, which is installed on the bracket and is used to detect the negative pressure of the adsorption hole.

4. The die carrier mounting jig according to claim 1, wherein: The adsorption plate is connected to a solenoid valve, which is installed on the bracket and is used to adjust the negative pressure of the adsorption hole.

5. The die carrier mounting jig according to claim 1, wherein: The adsorption plate is provided with a polishing surface, and a plurality of the adsorption holes are arranged around the edge of the polishing surface.

6. The die carrier mounting jig according to claim 5, wherein: The adsorption holes are provided in two groups, wherein one group of the adsorption holes surrounds the outside of the other group of the adsorption holes, and the inner group of the adsorption holes surrounds the polishing surface.

7. The die carrier mounting jig according to claim 1, wherein: A plurality of fixing holes are provided on the edge of the adsorption plate, and the plurality of fixing holes surround the edge of the adsorption plate.

8. The die carrier mounting jig according to claim 1, wherein: The adsorption plate is a quartz glass plate.

9. A laser bonding device, characterized in that: It comprises a laser, an optical path adjustment component and the die carrier mounting fixture according to any one of claims 1 to 8, wherein the optical path adjustment component is mounted on the bracket, the output end of the optical path adjustment component faces the adsorption plate, the optical path adjustment component is used to adjust the laser light path, and the laser is used to provide laser to the optical path adjustment component.

10. The laser bonding device according to claim 9, characterized in that: It also includes a conveying mechanism, which is used to transport the die carrier.

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