Refrigeration plate and power conversion system

Abstract

The utility model discloses a refrigeration plate and a power conversion system, and relates to the technical field of heat dissipation, the refrigeration plate comprises at least one semiconductor refrigeration part and a liquid cooling plate, the semiconductor refrigeration part is provided with a refrigeration surface and a heating surface, and the refrigeration surface is used for cooling a part to be cooled; the liquid cooling plate is provided with a liquid cooling channel, and the interior of the liquid cooling channel is used for introducing refrigerating liquid to cool the semiconductor refrigerating part and the to-be-cooled part. Dual-mode refrigeration can be achieved through the arrangement of the semiconductor refrigeration part and the liquid cooling plate, when the heat dissipation requirement of the to-be-cooled part is low, only the liquid cooling plate is used for cooling the to-be-cooled part, when the heat dissipation requirement of the to-be-cooled part is high, the semiconductor refrigeration part and the liquid cooling plate can be started at the same time for cooling, the heat dissipation effect is higher, and the heat dissipation efficiency is improved. And under the condition that the semiconductor refrigeration part and the liquid cooling plate are started at the same time, the liquid cooling plate can dissipate heat of the semiconductor refrigeration part through the refrigeration liquid, and the temperature of the semiconductor refrigeration part is prevented from being too high.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and more particularly to a refrigeration plate and a power conversion system. Background Art

[0002] Currently, energy storage battery pack cooling methods on the market primarily include liquid cooling and forced air cooling. Liquid cooling uses circulating coolant to absorb and remove heat generated by the battery pack, while forced air cooling uses fan-generated airflow to reduce the battery pack temperature. However, due to the diverse distribution and installation locations of battery packs, as well as customer needs, a single cooling method often fails to meet diverse usage scenarios.

[0003] Therefore, how to improve the versatility of the refrigeration plate has become a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0004] In view of this, an object of the present application is to provide a refrigeration plate to improve the versatility of the refrigeration plate.

[0005] Another object of the present application is to provide a power conversion system including the above-mentioned refrigeration plate.

[0006] To achieve the above objectives, this application provides the following technical solutions:

[0007] A refrigeration plate, comprising:

[0008] There is at least one semiconductor refrigeration element having a cooling surface and a heating surface, wherein the cooling surface is used to dissipate heat from the heat dissipation component;

[0009] The liquid cooling plate is provided with a liquid cooling channel, wherein the liquid cooling channel is used to pass a refrigerant to dissipate heat for the semiconductor refrigeration element and the components to be dissipated.

[0010] Optionally, in the above-mentioned refrigeration plate, an avoidance hole is provided on the liquid cooling plate, and the semiconductor refrigeration element is provided in the avoidance hole.

[0011] Optionally, in the above-mentioned refrigeration plate, the cooling surface of the semiconductor refrigeration element is used to face the component to be heat-dissipated, and the heating surface of the semiconductor refrigeration element faces the side wall of the avoidance hole.

[0012] Optionally, in the above-mentioned refrigeration plate, a heat conductive agent is filled between the heating surface of the semiconductor refrigeration element and the side wall of the avoidance hole.

[0013] Optionally, in the above-mentioned refrigeration plate, the liquid cooling channel is arranged around part or all of the circumferential side wall of at least one of the semiconductor refrigeration elements.

[0014] Optionally, in the above-mentioned refrigeration plate, along the flow direction of the cooling liquid, the cross-sectional area of ​​the liquid cooling channel increases gradually or increases section by section; and / or,

[0015] Along the flow direction of the coolant, the area of ​​the cooling surface of each semiconductor refrigeration element gradually increases.

[0016] Optionally, in the above-mentioned refrigeration plate, a partition plate is provided inside the liquid cooling plate, and the partition plate divides the inner cavity of the liquid cooling plate into the bent liquid cooling channels; or,

[0017] A plurality of liquid cooling channels are arranged in parallel on the liquid cooling plate.

[0018] Optionally, the above-mentioned refrigeration plate further comprises a base plate, and the semiconductor refrigeration element and the liquid cooling plate are both arranged on the base plate;

[0019] Each of the semiconductor refrigeration components is energized by a wire, and a wiring portion for the wire to pass through is provided on the substrate.

[0020] Optionally, in the above-mentioned refrigeration plate, the cooling surface of the semiconductor refrigeration element is flush with the liquid cooling surface of the liquid cooling plate, and the heat dissipation component is used to be placed on the cooling surface of the semiconductor refrigeration element and the liquid cooling surface of the liquid cooling plate.

[0021] A power conversion system comprises a component to be cooled and a refrigeration plate according to any one of claims 1 to 3, wherein the component to be cooled is in contact with the refrigeration plate and comprises a battery and a power conversion device.

[0022] The refrigeration plate provided in this application includes a semiconductor refrigeration element and a liquid cooling plate. There is at least one semiconductor refrigeration element having a cooling surface and a heating surface. The cooling surface is used to dissipate heat from the heat dissipation component. The liquid cooling plate is provided with a liquid cooling channel, and the liquid cooling channel is used to pass refrigerant to dissipate heat from the semiconductor refrigeration element and the heat dissipation component. The arrangement of the semiconductor refrigeration element and the liquid cooling plate can achieve dual-mode refrigeration. When the heat dissipation requirements of the heat dissipation component are low, only the liquid cooling plate can be used to dissipate heat from the heat dissipation component. When the heat dissipation requirements of the heat dissipation component are high, the semiconductor refrigeration element and the liquid cooling plate can be activated simultaneously to dissipate heat, resulting in a stronger heat dissipation effect. In addition, when the semiconductor refrigeration element and the liquid cooling plate are activated simultaneously, the liquid cooling plate can also dissipate heat from the semiconductor refrigeration element through the refrigerant to prevent the temperature of the semiconductor refrigeration element from being too high.

[0023] Compared with the existing technology, the refrigeration plate provided in this application can realize the switching between two refrigeration modes. Among them, the use of semiconductor refrigeration has the advantages of rapid cooling, simple operation, and strong reliability. Semiconductor refrigeration does not require refrigerant and mechanical devices, and the refrigeration process does not generate noise and pollutants, which is in line with the future product trends of energy storage battery packs.

[0024] The power conversion system provided herein includes a component to dissipate heat and the aforementioned cooling plate. The component to dissipate heat is disposed on and in contact with the cooling plate. The component to dissipate heat includes a battery and a power conversion device. Due to the inclusion of the aforementioned cooling plate, the system also exhibits the aforementioned beneficial effects. Other structural features refer to prior art and are not further described here. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0026] Figure 1 A schematic diagram of the structure of the power conversion system disclosed in an embodiment of the present application;

[0027] Figure 2 This is an exploded diagram of the power conversion system disclosed in an embodiment of the present application.

[0028] Figure 3 A schematic diagram of mode switching of a power conversion system disclosed in an embodiment of the present application;

[0029] Figure 4 A cross-sectional view of a power conversion system disclosed in an embodiment of the present application;

[0030] Figure 5 A schematic diagram of a refrigeration plate disclosed in an embodiment of the present application;

[0031] Figure 6 This is a schematic diagram of the installation of the substrate and semiconductor refrigeration unit disclosed in the embodiment of this application;

[0032] Figure 7 A schematic diagram of the wiring arrangement of the semiconductor refrigeration unit disclosed in the embodiment of this application;

[0033] Figure 8 A schematic diagram of the cooling surface and heating surface of the I-type semiconductor refrigeration element disclosed in an embodiment of the present application;

[0034] Figure 9 A schematic diagram of the cooling surface and heating surface of an L-shaped semiconductor refrigeration element disclosed in an embodiment of the present application;

[0035] Figure 10 This is a schematic diagram of the internal structure of the first liquid cooling plate disclosed in the embodiment of the present application;

[0036] Figure 11 This is a schematic structural diagram of the first refrigeration plate disclosed in the embodiment of this application;

[0037] Figure 12 This is a schematic structural diagram of the second refrigeration plate disclosed in the embodiments of this application;

[0038] Figure 13 This is a schematic structural diagram of the third refrigeration plate disclosed in the embodiments of this application;

[0039] Figure 14 This is a schematic structural diagram of the fourth refrigeration plate disclosed in the embodiments of the present application;

[0040] Figure 15 This is a schematic structural diagram of the fifth refrigeration plate disclosed in the embodiments of this application;

[0041] Figure 16 This is a schematic structural diagram of the second liquid cooling plate disclosed in the embodiments of this application;

[0042] Figure 17 for Figure 16 Cross-section at AA in the middle;

[0043] Figure 18 for Figure 16 Cross-section at the middle BB;

[0044] Figure 19 This is a schematic structural diagram of the sixth refrigeration plate disclosed in the embodiments of this application;

[0045] Figure 20 This is a schematic structural diagram of the seventh refrigeration plate disclosed in the embodiments of this application.

[0046] Among them, 100 is the substrate, 101 is the protrusion;

[0047] 200 is a semiconductor refrigeration element, 201 is a cooling surface, 202 is a heating surface, and 203 is a wire;

[0048] 300 is a liquid cooling plate, 301 is a liquid cooling channel, 302 is a liquid inlet, 303 is a liquid outlet, 304 is an avoidance hole, 3041 is a avoidance hole wall, 310 is a partition plate, 320 is a top plate, and 330 is a bottom plate;

[0049] 400 is a component to be cooled. DETAILED DESCRIPTION

[0050] The core of the present disclosure is to disclose a refrigeration plate to improve the versatility of the refrigeration plate.

[0051] Another core of the present disclosure is to disclose a power conversion system including the above-mentioned refrigeration plate.

[0052] The following describes the embodiments with reference to the accompanying drawings. In addition, the embodiments shown below do not limit the contents of the utility model described in the claims. In addition, the entire contents of the structures represented by the following embodiments are not limited to those necessary for the solutions of the utility model described in the claims. It should be noted that, for ease of description, only the parts related to the relevant utility model are shown in the accompanying drawings. The embodiments in this disclosure and the features in the embodiments can be combined with each other unless there is a conflict.

[0053] Combine Figures 1-12 The refrigeration plate disclosed in the present invention includes a semiconductor refrigeration element 200 and a liquid cooling plate 300. There is at least one semiconductor refrigeration element 200, and it has a cooling surface 201 and a heating surface 202. The cooling surface 201 is used to dissipate heat from the heat dissipation component 400; the liquid cooling plate 300 is provided with a liquid cooling channel 301, and the liquid cooling channel 301 is used to pass refrigerant to dissipate heat from the semiconductor refrigeration element 200 and the heat dissipation component 400.

[0054] Among them, the component 400 to be heat-dissipated can specifically be a packaged power device (for example, it can be an IGBT (insulated gate bipolar transistor), a MOS tube (metal-oxide-semiconductor field-effect transistor)), a temperature spreader, a metal plate or ceramic plate for carrying one or more power devices, a battery pack, etc.

[0055] The arrangement of the above-mentioned semiconductor refrigeration component 200 and the liquid cooling plate 300 can realize dual-mode cooling. When the heat dissipation requirement of the component to be dissipated 400 is low, only the liquid cooling plate 300 can be used to dissipate heat for the component to be dissipated 400. When the heat dissipation requirement of the component to be dissipated 400 is high, the semiconductor refrigeration component 200 and the liquid cooling plate 300 can be started at the same time for heat dissipation, and the heat dissipation effect is stronger. In addition, when the semiconductor refrigeration component 200 and the liquid cooling plate 300 are started at the same time, the liquid cooling plate 300 can also dissipate heat for the semiconductor refrigeration component 200 through the refrigerant to avoid the temperature of the semiconductor refrigeration component 200 being too high.

[0056] Compared with the existing technology, the refrigeration plate disclosed in the present invention can realize switching between two refrigeration modes. Among them, the use of semiconductor refrigeration has the advantages of rapid refrigeration, simple operation, and strong reliability. Semiconductor refrigeration does not require refrigerant and mechanical devices, and the refrigeration process does not generate noise and pollutants, which is in line with the future product trend of energy storage battery pack products.

[0057] The aforementioned semiconductor cooler 200 can be mounted directly on the liquid cooling plate 300 by means of clipping or bonding, which minimizes space usage, increases integration, and improves the energy density of the power conversion system. Alternatively, the semiconductor cooler 200 and the liquid cooling plate 300 can be mounted on the same substrate 100, facilitating wiring and assembly and disassembly. The following description assumes that the semiconductor cooler 200 is mounted directly on the liquid cooling plate 300.

[0058] In some embodiments, the liquid cooling plate 300 is provided with a avoidance hole 304. Figure 10 Each semiconductor cooling element 200 is disposed in a corresponding manner within the avoidance hole 304, or multiple semiconductor cooling elements 200 can be disposed within a single avoidance hole 304. This interlaced arrangement of the semiconductor cooling elements 200 and the liquid cooling plate 300 makes the cooling plate structure more compact, improves space utilization, and enhances heat dissipation efficiency compared to a single cooling mode.

[0059] Preferably, the cooling surface 201 of the semiconductor refrigeration element 200 is flush with the liquid cooling surface of the liquid cooling plate 300, and the component to be dissipated 400 is used to be placed on the cooling surface 201 of the semiconductor refrigeration element 200 and the liquid cooling surface of the liquid cooling plate 300, that is, the semiconductor refrigeration element 200 and the liquid cooling plate 300 are in direct contact with the component to be dissipated 400 for cooling.

[0060] If the semiconductor refrigeration component 200 is located in the avoidance hole 304 and the cooling surface 201 of the semiconductor refrigeration component 200 is lower than the liquid cooling surface of the liquid cooling plate 300, during cooling, a thermal conductive agent can be filled between the cooling surface 201 of the semiconductor refrigeration component 200 and the component to be dissipated 400 to reduce the air thermal resistance and improve the heat conduction efficiency.

[0061] The semiconductor refrigeration element 200 can be specifically an L-type semiconductor refrigeration element (semiconductor patch) or an I-type semiconductor refrigeration element. Figure 8 and Figure 9 , wherein N-type and P-type are two different types of semiconductor materials. The semiconductor refrigeration element 200 forms a Peltier effect through conduction, so that the semiconductor refrigeration element 200 can form a cooling surface 201 that absorbs heat on one side and a heating surface 202 that releases heat on the other side.

[0062] Combine Figure 8 and Figure 9 The heating surface 202 and the cooling surface 201 of the L-type semiconductor refrigeration element are mutually perpendicular sides of the semiconductor refrigeration element 200, and the heating surface 202 and the cooling surface 201 of the I-type semiconductor refrigeration element are opposite sides of the semiconductor refrigeration element 200. When the semiconductor refrigeration element 200 is assembled with the substrate 100, the surface of the semiconductor refrigeration element 200 facing away from the substrate 100 is the cooling surface 201 for dissipating heat to the heat dissipation component 400. Therefore, compared with the heating surface 202 of the I-type semiconductor refrigeration element being attached to the substrate 100, the heating surface 202 of the L-type semiconductor refrigeration element can be attached to the side wall of the avoidance hole 304 ( Figure 18The avoidance hole wall 3041 is relative, so that the liquid cooling channel 301 arranged around the semiconductor refrigeration component 200 can take away the heat from the heating surface 202 of the semiconductor refrigeration component 200, reducing the impact on the heat dissipation component 400, and when the product encounters extreme cold conditions, the heat generated by the semiconductor heating surface 202 will continue to heat the liquid cooling channel 301, preventing the internal coolant from freezing and causing thermal expansion and contraction to cause the liquid cooling channel 301 to burst or block, and avoid damage to related accessories of the liquid cooling plate 300; at the same time, it can also avoid the capacity attenuation of the battery pack waiting for the heat dissipation component 400 under low temperature conditions, thereby improving system safety and energy utilization.

[0063] Preferably, the heating surface 202 of the semiconductor refrigeration component 200 is arranged to fit the side wall of the avoidance hole 304, and the semiconductor refrigeration component 200 can be directly snap-fitted and installed in the avoidance hole 304. In order to facilitate installation, a certain installation gap can be reserved between the semiconductor refrigeration component 200 and the avoidance hole 304. After the liquid cooling plate 300 and the semiconductor refrigeration component 200 are assembled, thermal conductive agents such as thermal grease and thermal interface materials are filled between the semiconductor refrigeration component 200 and the avoidance hole 304 to reduce the air thermal resistance and enhance the heat dissipation effect of the liquid cooling plate 300 on the semiconductor refrigeration component 200.

[0064] A liquid inlet 302 and a liquid outlet 303 are provided on the liquid cooling plate 300. The two ends of the liquid cooling channel 301 are respectively connected to the liquid inlet 302 and the liquid outlet 303, so that liquid can enter and exit from the liquid inlet 302 and the liquid outlet 303 respectively. In order to ensure the heat dissipation effect of the semiconductor refrigeration component 200, the liquid cooling channel 301 is arranged around part or all of the circumferential side wall of at least one avoidance hole 304 (semiconductor refrigeration component 200), or the side wall of the avoidance hole 304 can be directly used as the side wall of the liquid cooling channel 301 to shorten the heat conduction path and optimize the heat conduction effect.

[0065] Specifically, the liquid cooling channel 301 can be arranged only around each avoidance hole 304 to dissipate heat for each semiconductor refrigeration element 200. Correspondingly, according to the specific arrangement of the semiconductor refrigeration element 200 on the substrate 100, the liquid cooling channel 301 can be one or more, for example Figure 11 In the embodiment, when the semiconductor refrigeration elements 200 are arranged in an array on the substrate 100, the liquid cooling channels 301 may be a plurality of channels arranged in parallel and corresponding to the number of rows of the semiconductor refrigeration elements 200, or as shown in FIG. Figure 14 and Figure 15 A liquid cooling channel 301 is arranged on each side of a row of semiconductor refrigeration components 200 shown in FIG. Figure 16 When there is one liquid cooling channel 301 , the liquid cooling channel 301 can be arranged around at least a portion of the circumferential side wall of at least one semiconductor refrigeration component 200 to ensure the heat exchange effect.

[0066] The liquid cooling channel 301 can be arranged around the avoidance hole 304 (semiconductor refrigeration element 200) in various ways, for example Figure 10 As shown in FIG, a certain liquid cooling channel 301 is divided into two branch channels when flowing through the avoidance hole 304, which respectively surround the two sides of the semiconductor refrigeration component 200 and then merge into a whole liquid cooling channel 301. Alternatively, Figure 13 and Figure 20 The liquid cooling channel 301 does not split during the flow process, but instead surrounds a portion of the circumference of the avoidance hole 304 in sequence before flowing to the liquid outlet 303.

[0067] In the above embodiment, the liquid cooling channel 301 on the liquid cooling plate 300 and the liquid cooling plate 300 may be integrally formed.

[0068] In one embodiment, combining Figure 16 The liquid cooling plate 300 is provided with a partition plate 310 inside. The partition plate 310 divides the inner cavity of the liquid cooling plate 300 into a curved (e.g., serpentine) liquid cooling channel 301 and ensures that refrigerant can flow through each position of the liquid cooling plate 300 for heat exchange. In other words, each position of the liquid cooling surface of the liquid cooling plate 300 can directly contact the component to be cooled 400 for heat exchange, while ensuring the heat dissipation effect of the liquid cooling plate 300 on the semiconductor refrigeration element 200 and the component to be cooled 400.

[0069] Specifically, combined Figure 17 and Figure 18 The partition plates 310 are parallel to each other and perpendicular to the top plate 320 and the bottom plate 330 of the liquid cooling plate 300 (the surface of the top plate 320 facing away from the bottom plate 330 serves as the liquid cooling surface). The avoidance holes 304 are arranged in the liquid cooling channels 301 formed by the partition plates 310 to ensure that the refrigerant can flow through the avoidance holes 304.

[0070] Combine Figure 11 When the cross-sectional dimensions of the liquid cooling channel 301 are consistent at all locations and the dimensions of the cooling surfaces 201 of the semiconductor refrigeration components 200 are also consistent, along the flow direction of the coolant, the water inlet of the liquid cooling channel 301 has a fast flow rate and a low temperature. After absorbing the heat from the heat dissipation component 400 and the heating surface 202 of the semiconductor refrigeration component 200, the temperature of the water outlet of the liquid cooling channel 301 rises, which will lead to inconsistent local heat dissipation effects of the refrigeration plate. Therefore, further optimization scheme is combined with Figure 15 ( Figure 15 , the liquid cooling channel 301 is tapered) and Figure 12, it is set that the cross-sectional area of ​​the liquid cooling channel 301 is gradually increased or increased in sections along the flow direction of the coolant, and at the same time, it is set that the size of the cooling surface 201 of the semiconductor refrigeration component 200 is gradually increased along the flow direction of the coolant, so as to change the pressure by means of the change in the size of the cross-sectional size of the liquid cooling channel 301. The area with high pressure (the inlet end of the liquid cooling channel 301) has a fast flow rate and low temperature, and the area with low pressure (the outlet end of the liquid cooling channel 301) has a slow flow rate, thereby extending the residence time of the coolant at the outlet end of the liquid cooling channel 301, that is, extending the heat exchange time with the component 400 to be dissipated heat, so that the cooling effect of the inlet and outlet areas of the liquid cooling channel 301 remains consistent.

[0071] Since each semiconductor refrigeration element 200 needs to be powered by the wire 203 to perform the refrigeration operation, Figure 7 To facilitate the wiring arrangement of the semiconductor refrigeration element 200, the refrigeration plate also includes a substrate 100. The semiconductor refrigeration element 200 and the liquid cooling plate 300 are both arranged on the same side of the substrate 100. The substrate 100 supports the semiconductor refrigeration element 200 and the liquid cooling plate 300 and can also conduct heat. When the refrigeration plate is dissipating heat normally, the substrate 100 can increase the heat dissipation area of ​​the semiconductor refrigeration element 200 and improve the heat dissipation efficiency. Under extremely cold conditions, the substrate 100 can conduct the heat of the semiconductor refrigeration element 200 into the liquid cooling channel 301 to prevent the refrigerant from freezing. Corresponding wiring portions are provided on the substrate 100 for the installation and passage of each wire 203 to avoid confusion in the wiring of the wires 203. The relative positional relationship between the conductor refrigeration element 200 and the liquid cooling plate 300 on the substrate 100 can be the same as that in the aforementioned embodiment where the conductor refrigeration element 200 is directly arranged on the liquid cooling plate 300, and will not be repeated here.

[0072] Specifically, the substrate 100 may be provided with an interlayer, which serves as a routing portion for the wires 203 to pass through, or a routing groove may be provided on the side of the substrate 100 facing the semiconductor refrigeration component 200, and each wire 203 is arranged in the routing groove and fixed by a wire bundle structure.

[0073] The liquid cooling plate 300 and the base plate 100 can be connected by screwing, plugging, bonding, etc. The liquid cooling plate 300 is preferably detachably connected to the base plate 100. Figure 3 During the production process, each semiconductor refrigeration component 200 can be installed on the substrate 100 first, and then the liquid cooling plate 300 can be assembled on the substrate 100. Alternatively, during the production process, the liquid cooling plate 300 can be installed on the substrate 100 first, and then the semiconductor refrigeration component 200 can be assembled on the substrate 100.

[0074] Combine Figure 5 and Figure 6In one embodiment, multiple semiconductor cooling elements 200 are spaced apart and arranged flatly on the substrate 100. Preferably, the semiconductor cooling elements 200 are arranged in an array and spaced apart on the substrate 100 to facilitate the layout of components such as the wires 203 and the installation of the liquid cooling plate 300. The flat arrangement of the semiconductor cooling elements 200 ensures that the cooling surfaces 201 of each semiconductor are on the same plane, thereby facilitating the support and heat dissipation of larger components 400 to be cooled. A gap is left between adjacent semiconductor cooling elements 200. The spacing of the semiconductor cooling elements 200 facilitates the liquid cooling channel 301 to pass through the gap between the two adjacent semiconductor cooling elements 200, thereby improving the heat dissipation effect of the liquid cooling plate 300 on each semiconductor cooling element 200.

[0075] In one embodiment, combining Figure 19 ( Figure 19 The yellow boxes in the figure represent liquid cooling plates 300. Semiconductor cooling elements 200 are arranged in a regular matrix on the base plate 100. Multiple liquid cooling plates 300 are provided on either side of each row of semiconductor cooling elements 200 (one liquid cooling plate 300 is provided between two adjacent rows of semiconductor cooling elements 200) to provide cooling for each semiconductor cooling element 200. The structure of the liquid cooling plates 300 in this embodiment is simpler and less costly than a solution with avoidance holes 304 formed in the liquid cooling plates 300. However, this requires piping to supply refrigerant to each liquid cooling plate 300, making the associated piping and fittings more complex.

[0076] The refrigeration plate disclosed in the present invention can be modularized as a single unit, which is convenient for users to install products later. Figure 11 Corresponding protrusions 101 and grooves can be provided at the edge of the base plate 100 to facilitate the insertion and splicing between different refrigeration panels and improve the flexibility of product use.

[0077] Combine Figures 1-4 The power conversion system disclosed herein includes a heat dissipation component 400 and the aforementioned cooling plate. The heat dissipation component 400 is disposed on and in contact with the cooling plate. The heat dissipation component 400 includes a battery and a power conversion device. Due to the inclusion of the aforementioned cooling plate, the system also exhibits the aforementioned beneficial effects. Other structural details refer to the prior art and will not be further described here.

[0078] The heat dissipation component 400 can be directly welded to the cooling plate, or the heat dissipation component 400 can be coupled to the cooling plate through a heat conductive material such as silicone grease. In addition, the cooling plate can be the side wall of the packaging shell of the heat dissipation component 400. Figure 5 The cooling plate has a plate-like structure as a whole, so it can be used as the side wall of the shell of the power conversion system. In order to ensure the heat dissipation effect of the heat dissipation component 400, the cooling plate usually serves as the bottom wall of the shell and directly contacts the heat dissipation component 400 for heat dissipation.

[0079] The above description of the disclosed embodiments enables professionals and technicians in this field to implement or use the present application. Various modifications to these embodiments will be obvious to professionals and technicians in this field, and the general principles defined in this article can be implemented in other embodiments without departing from the spirit or scope of this application. The specific technical means in some embodiments may be incorporated into another embodiment in part or in whole, unless expressly excluded by another embodiment. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A refrigeration panel, characterized in that: include: There is at least one semiconductor refrigeration element (200) having a cooling surface (201) and a heating surface (202), wherein the cooling surface (201) is used to dissipate heat from the heat dissipation component (400); The liquid cooling plate (300) is provided with a liquid cooling channel (301), wherein the liquid cooling channel (301) is used to pass a refrigerant to dissipate heat for the semiconductor refrigeration element (200) and the component to be dissipated (400).

2. The refrigeration plate according to claim 1, wherein The liquid cooling plate (300) is provided with an avoidance hole (304), and the semiconductor refrigeration component (200) is arranged in the avoidance hole (304).

3. The refrigeration plate according to claim 2, wherein: The cooling surface (201) of the semiconductor refrigeration element (200) is used to face the component to be cooled (400), and the heating surface (202) of the semiconductor refrigeration element (200) faces the side wall of the avoidance hole (304).

4. The refrigeration plate according to claim 3, wherein: A heat conducting agent is filled between the heating surface (202) of the semiconductor refrigeration component (200) and the side wall of the avoidance hole (304).

5. The refrigeration plate according to claim 1, wherein The liquid cooling channel (301) is arranged around part or all of the circumferential side wall of at least one semiconductor refrigeration component (200).

6. The refrigeration panel according to claim 1, wherein: Along the flow direction of the cooling liquid, the cross-sectional area of ​​the liquid cooling channel (301) increases gradually or increases section by section; and / or, Along the flow direction of the cooling liquid, the area of ​​the cooling surface (201) of each semiconductor cooling element (200) gradually increases.

7. The refrigeration panel according to claim 1, wherein: A partition plate (310) is provided inside the liquid cooling plate (300), and the partition plate (310) divides the inner cavity of the liquid cooling plate (300) into the bent liquid cooling channels (301); or, A plurality of liquid cooling channels (301) are arranged in parallel on the liquid cooling plate (300).

8. The refrigeration plate according to any one of claims 1 to 7, characterized in that: It also includes a base plate (100), on which the semiconductor refrigeration element (200) and the liquid cooling plate (300) are both arranged; Each of the semiconductor refrigeration components (200) is energized via a wire (203), and a wiring portion for the wire (203) to pass through is provided on the substrate (100).

9. The refrigeration plate according to any one of claims 1 to 7, characterized in that: The cooling surface (201) of the semiconductor cooling element (200) is flush with the liquid cooling surface of the liquid cooling plate (300), and the heat dissipation component (400) is used to be placed on the cooling surface (201) of the semiconductor cooling element (200) and the liquid cooling surface of the liquid cooling plate (300).

10. A power conversion system, characterized in that: The device comprises a component to be cooled (400) and a refrigeration plate according to any one of claims 1 to 9, wherein the component to be cooled (400) is in contact with the refrigeration plate, and the component to be cooled (400) comprises a battery and a power conversion device.

Images