High-heat-dissipation intensive bus duct
By opening partition grooves on the aluminum alloy base of the busbar trough and setting current-carrying grooves on both sides of the busbar trough, the current-carrying copper row is arranged inside the current-carrying groove and heat dissipation fins on the outside, and the grounded copper row is arranged below the partition groove, the problem of unsatisfactory heat dissipation effect of the dense busbar trough is solved, and efficient heat dissipation and compact structure are achieved.
Patent Information
- Application Number
- CN202422541281.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-21
- Publication Date
- 2025-09-02
- Estimated Expiration
- 2034-10-21
AI Technical Summary
The existing intensive bus duct has poor heat dissipation effect, and it is difficult to produce aluminum alloy shells.
A partition groove is opened on the aluminum alloy base, and current-carrying grooves are arranged on both sides of it. The current-carrying copper row is arranged in the current-carrying groove, and the heat dissipation fins are arranged on the outside. The grounding copper row is arranged under the partition groove, so as to optimize the layout of the busbar groove to improve heat dissipation efficiency.
It improves the heat dissipation efficiency of the busbar duct, ensures that the temperature is effectively controlled under long-term high-load operation, prevents performance degradation or damage, and is compact and durable.
Smart Images

Figure CN223297317U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of bus ducts, in particular to a high-heat dissipation intensive bus duct. Background Art
[0002] Bus duct is a closed metal device composed of copper and aluminum busbar columns. It has increasingly replaced wires and cables in indoor low-voltage power transmission trunk line projects. Bus duct has emerged as a new type of distribution conductor. Compared with traditional cables, bus duct fully demonstrates its superiority when transmitting large currents. At the same time, due to the use of new technologies and new processes, the contact resistance and temperature rise at the connection points at both ends of the bus duct and the branch port plug-in points are greatly reduced. High-quality insulating materials are used in the bus duct, thereby improving the safety and reliability of the bus duct.
[0003] Existing dense busbars achieve rapid heat dissipation by closely arranging conductive bars within an aluminum alloy housing. Leveraging the excellent thermal conductivity of aluminum alloy, these bars dissipate heat generated by the bars, achieving rapid heat dissipation. For example, Chinese Patent Publication No. CN221509074U discloses an aluminum alloy busbar. This dense busbar design suffers from an unsuitable internal layout, with large overlaps between conductive bars. This results in suboptimal heat dissipation, and the overly complex aluminum alloy housing presents production challenges.
[0004] Therefore, it is urgent to design a dense bus duct with good heat dissipation effect to solve the problem of poor heat dissipation of dense bus duct. Summary of the Invention
[0005] In order to solve the above problems, the technical solution provided by the present invention is as follows:
[0006] A high heat dissipation intensive bus duct, comprising an aluminum alloy base, an aluminum alloy cover plate and a conductive bar, the aluminum alloy cover plate being connected to the aluminum alloy base, the conductive bar comprising a current-carrying copper bar and a grounding copper bar; a partition groove is provided on the aluminum alloy base, the width of the partition groove is less than half the width of the aluminum alloy base, current-carrying grooves are provided on both lateral sides of the partition groove, the outer wall of the outer current-carrying groove is provided with a plurality of heat dissipation fins, an opening is provided on the side of the partition groove close to the aluminum alloy cover plate, and a grounding channel is provided on the side of the partition groove away from the aluminum alloy cover plate; the current-carrying copper bar comprises a main body and a power-carrying part, the main body is connected in the current-carrying groove, the power-carrying part extends to the outside of the aluminum alloy base, the power-carrying parts are arranged parallel to each other, the grounding copper bar is fixedly connected in the grounding channel, and the grounding copper bar is located below the current-carrying copper bar.
[0007] The utility model is further configured such that two current-carrying slots are opened on each side of the partition slot, and the current-carrying copper bar includes an A-phase copper bar, a B-phase copper bar, a C-phase copper bar and an N-phase copper bar, and the A-phase copper bar, the B-phase copper bar, the C-phase copper bar and the N-phase copper bar are respectively connected in the current-carrying slots.
[0008] The utility model is further configured such that the current-carrying trough includes an inner current-carrying trough and an outer current-carrying trough, the inner current-carrying trough is arranged close to the partition trough, the outer current-carrying trough is arranged away from the partition trough, a partition wall is provided between the inner current-carrying trough and the outer current-carrying trough, the inner current-carrying troughs on both sides are symmetrically arranged with the partition trough as the center, and the outer current-carrying troughs on both sides are symmetrically arranged with the partition trough as the center.
[0009] The utility model is further configured such that a positioning groove is provided on one side of the main body close to the aluminum alloy cover plate, and a positioning protrusion is provided on the aluminum alloy cover plate opposite to the positioning groove; when the aluminum alloy cover plate is connected to the aluminum alloy base, the positioning protrusion is snapped into the positioning groove.
[0010] The utility model is further configured such that a plurality of grooves are provided on the side walls of the partition groove, and the grooves are arranged parallel to the main body.
[0011] The present invention is further configured such that a bending portion is provided between the main body and the conducting portion, and the exteriors of the main body and the bending portion are both covered with an insulating layer.
[0012] The utility model is further configured such that a through hole is opened on the bottom surface of the partition groove, a positioning hole is opened on the grounding copper busbar, a conductive fastener is connected to the partition groove, and the conductive fastener passes through the through hole and the positioning hole in sequence and is connected to the grounding copper busbar.
[0013] The utility model is further configured such that the gap between adjacent conductive parts on the same side is 12 mm to 15 mm.
[0014] The utility model is further configured such that convex strips are provided on the top and the bottom of the aluminum alloy cover plate.
[0015] Compared with the prior art, the technical solution provided by this utility model has the following beneficial effects:
[0016] The intensive bus duct of this technical solution is achieved by opening a partition groove with a certain width on the aluminum alloy base, arranging current-carrying grooves on both sides of the partition groove, and arranging the current-carrying copper bars responsible for power transmission in the current-carrying grooves respectively, so as to avoid the problem of local overheating caused by excessive overlap of the heat dissipation parts due to the close fit of the current-carrying copper bars. At the same time, the heat dissipation fins on the outer wall of the current-carrying groove and the opening of the partition groove can effectively conduct the heat generated inside the bus duct to the external environment, thereby improving the heat dissipation efficiency of the bus duct, ensuring that the temperature of the bus duct is effectively controlled under long-term, high-load operation, and preventing performance degradation or damage due to overheating; arranging the grounding copper bar below the partition groove instead of aligning it with the current-carrying groove can allow the current-carrying copper bar to better conduct heat to the aluminum alloy base, making the layout of the bus duct more reasonable, the structure more compact and durable. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is an exploded view of the bus duct in an embodiment of the present utility model.
[0018] Figure 2 This is a three-dimensional diagram of the bus duct after removing the aluminum alloy cover plate of the embodiment of the utility model.
[0019] Figure 3 This is a three-dimensional diagram of the aluminum alloy base of an embodiment of the utility model.
[0020] Figure 4 This is a three-dimensional diagram of the current-carrying copper busbar according to an embodiment of the present utility model.
[0021] Figure 5 This is a cross-sectional view of the aluminum alloy base of an embodiment of the present utility model.
[0022] Figure 6 This is a cross-sectional view of the bus duct according to an embodiment of the present utility model.
[0023] Figure 7 This is a three-dimensional diagram of the aluminum alloy cover plate according to an embodiment of the present utility model. DETAILED DESCRIPTION
[0024] In order to further understand the content of the present invention, the present invention is described in detail with reference to the accompanying drawings and embodiments.
[0025] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein can be combined with each other.
[0026] In the description of the present utility model, it should be noted that, unless otherwise clearly stipulated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, an integral connection, or a detachable connection; it can be a mechanical connection or an electrical connection, or it can be the internal communication between two components; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.
[0027] Combined with attachment Figure 1 To the attached Figure 7 The technical solution of the utility model is a high heat dissipation intensive bus duct, comprising an aluminum alloy base 1, an aluminum alloy cover plate 2 and a conductive bar 3, wherein the aluminum alloy cover plate 2 is connected to the aluminum alloy base 1, and the conductive bar 3 comprises a current-carrying copper bar 31 and a grounding copper bar 32; a partition groove 11 is provided on the aluminum alloy base 1, and the width W1 of the partition groove 11 is less than half of the width W2 of the aluminum alloy base 1, and current-carrying grooves 12 are provided on both sides of the partition groove 11, and the outer wall of the outer current-carrying groove 12 is provided with a plurality of heat dissipation fins 13, so An opening 111 is provided on the side of the partition groove 11 close to the aluminum alloy cover plate 2, and a grounding channel 14 is provided on the side of the partition groove 11 away from the aluminum alloy cover plate 2; the current-carrying copper bus 31 includes a main body 31a and a power-carrying part 31b, the main body 31a is connected to the current-carrying groove 12, the power-carrying part 31b extends to the outside of the aluminum alloy base 1, and the power-carrying parts 31b are arranged parallel to each other, the grounding copper bus 32 is fixedly connected to the grounding channel 14, and the grounding copper bus 32 is located below the current-carrying copper bus 31.
[0028] In the above embodiment, as shown in the attached Figure 5 As shown, the width W1 of the partition groove 11 is less than half of the width W2 of the aluminum alloy base 1, so that the overall size of the bus duct is smaller.
[0029] In this embodiment, the transverse direction of the partition groove 11 is Figure 3 The X-axis direction in .
[0030] In this embodiment, the bus duct is installed as follows: first, the grounding copper busbar 32 is inserted into the grounding channel 14, and the grounding copper busbar 32 is fixed to the aluminum alloy base 1 by using a conductive fastener to pass through the bottom plate of the partition groove 11; then the current-carrying copper busbar 31 is respectively connected to the current-carrying groove 12; finally, the aluminum alloy cover plate 2 is fixed to the aluminum alloy base 1 to realize the positioning of the current-carrying copper busbar 31.
[0031] In this embodiment, the opening 111 facilitates the fixing operation of the grounding copper busbar 32 .
[0032] The dense bus duct of this embodiment is formed by opening a partition groove 11 with a certain width on the aluminum alloy base 1, and arranging current-carrying grooves 12 on both sides of the partition groove 11, and arranging the current-carrying copper busbars 31 responsible for power transmission in the current-carrying grooves 12 respectively, so as to avoid the problem of local overheating caused by excessive overlap of the heat dissipation parts due to the close fit of the current-carrying copper busbars 31. At the same time, the heat dissipation fins 13 on the outer wall of the current-carrying groove 12 and the opening of the partition groove 11 can effectively conduct the heat generated inside the bus duct to the external environment, thereby improving the heat dissipation efficiency of the bus duct, ensuring that the temperature of the bus duct is effectively controlled under long-term, high-load operation, and preventing performance degradation or damage due to overheating; arranging the grounding copper busbar 32 below the partition groove 11 instead of aligning with the current-carrying groove 12 can allow the current-carrying copper busbar 31 to better conduct heat to the aluminum alloy base 1, making the layout of the bus duct more reasonable, the structure more compact and durable.
[0033] In this embodiment, as shown in the attached Figure 1 To the attached Figure 3 As shown, two current-carrying slots 12 are provided on each side of the partition slot 11. The current-carrying copper bars 31 include an A-phase copper bar 311, a B-phase copper bar 312, a C-phase copper bar 313, and an N-phase copper bar 314. The A-phase copper bar 311, the B-phase copper bar 312, the C-phase copper bar 313, and the N-phase copper bar 314 are respectively connected to the current-carrying slots 12. When the bus duct is used, the A-phase copper bar 311, the B-phase copper bar 312, the C-phase copper bar 313, and the N-phase copper bar 314 are basically responsible for power transmission. Therefore, the current-carrying copper bars 31 are arranged in pairs on both sides of the partition slot 11 to effectively improve the heat dissipation effect.
[0034] In this embodiment, as shown in the attached Figure 3 and attached Figure 5 As shown, the current-carrying groove 12 includes an inner current-carrying groove 121 and an outer current-carrying groove 122. The inner current-carrying groove 121 is arranged close to the partition groove 11, and the outer current-carrying groove 122 is arranged away from the partition groove 11. A partition wall 123 is provided between the inner current-carrying groove 121 and the outer current-carrying groove 122. The inner current-carrying grooves 121 on both sides are symmetrically arranged with the partition groove 11 as the center, and the outer current-carrying grooves 122 on both sides are symmetrically arranged with the partition groove 11 as the center.
[0035] In this embodiment, as shown in the attached Figure 4 and attached Figure 6 As shown, a positioning groove 31d is provided on one side of the main body 31a close to the aluminum alloy cover plate 2, and a positioning protrusion 21 is provided on the aluminum alloy cover plate 2 facing the positioning groove 31d; when the aluminum alloy cover plate 2 is connected to the aluminum alloy base 1, the positioning protrusion 21 is clamped in the positioning groove 31d.
[0036] In this embodiment, a plurality of grooves 112 are formed on the sidewalls of the partition groove 11 , and the grooves 112 are arranged parallel to the main body 31 a .
[0037] In this embodiment, a bent portion 31 c is provided between the main portion 31 a and the conducting portion 31 b , and the exteriors of the main portion 31 a and the bent portion 31 c are both covered with an insulating layer 31 e .
[0038] In this embodiment, a through hole 113 is provided on the bottom surface of the partition groove 11, a positioning hole 321 is provided on the grounding copper bus 32, and a conductive fastener 33 is connected to the partition groove 11. The conductive fastener 33 passes through the through hole 113 and the positioning hole 321 in sequence and is connected to the grounding copper bus 32.
[0039] In this embodiment, the gap between the adjacent conductive parts 31b on the same side is 12mm to 15mm. Figure 1 As shown, the gap between the conductive portion of the A-phase copper busbar 311 and the conductive portion of the B-phase copper busbar 312 is 12 mm to 15 mm, so as to ensure the creepage distance between adjacent current-carrying copper buses 31 .
[0040] In this embodiment, ridges 22 are provided on the top and bottom of the aluminum alloy cover plate 2 . The ridges 22 can further increase the contact area with the inner cavity of the partition groove 11 , thereby improving heat dissipation efficiency.
[0041] The above is a schematic description of the present invention and its embodiments, which is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. Therefore, if a person skilled in the art is inspired by this and, without departing from the inventive purpose of the present invention, designs a structure and embodiment similar to the technical solution without inventiveness, they shall fall within the scope of protection of the present invention.
Claims
1. A high heat dissipation intensive bus duct, characterized in that: It includes an aluminum alloy base, an aluminum alloy cover plate and a conductive busbar, the aluminum alloy cover plate is connected to the aluminum alloy base, and the conductive busbar includes a current-carrying copper busbar and a grounding copper busbar; a partition groove is provided on the aluminum alloy base, the width of the partition groove is less than half the width of the aluminum alloy base, current-carrying slots are provided on both lateral sides of the partition groove, and the outer wall of the outer current-carrying slot is provided with a plurality of heat dissipation fins, an opening is provided on the side of the partition groove close to the aluminum alloy cover plate, and a grounding channel is provided on the side of the partition groove away from the aluminum alloy cover plate; the current-carrying copper busbar includes a main body and a power-carrying part, the main body is connected in the current-carrying slot, the power-carrying part extends to the outside of the aluminum alloy base, the power-carrying parts are arranged parallel to each other, the grounding copper busbar is fixedly connected in the grounding channel, and the grounding copper busbar is located below the current-carrying copper busbar.
2. The high heat dissipation intensive bus duct according to claim 1, characterized in that: Two current-carrying slots are provided on each side of the partition slot, and the current-carrying copper bars include A-phase copper bar, B-phase copper bar, C-phase copper bar and N-phase copper bar, and the A-phase copper bar, the B-phase copper bar, the C-phase copper bar and the N-phase copper bar are respectively connected in the current-carrying slots.
3. The high heat dissipation intensive bus duct according to claim 2, characterized in that: The current-carrying trough includes an inner current-carrying trough and an outer current-carrying trough, the inner current-carrying trough is arranged close to the partition trough, and the outer current-carrying trough is arranged away from the partition trough, and a partition wall is provided between the inner current-carrying trough and the outer current-carrying trough, the inner current-carrying troughs on both sides are symmetrically arranged with the partition trough as the center, and the outer current-carrying troughs on both sides are symmetrically arranged with the partition trough as the center.
4. The high heat dissipation intensive bus duct according to claim 1, characterized in that: A positioning groove is provided on one side of the main body close to the aluminum alloy cover plate, and a positioning protrusion is provided on the aluminum alloy cover plate opposite to the positioning groove; when the aluminum alloy cover plate is connected to the aluminum alloy base, the positioning protrusion is snapped into the positioning groove.
5. The high heat dissipation intensive bus duct according to claim 1, characterized in that: A plurality of grooves are provided on the side walls of the partition groove, and the grooves are arranged parallel to the main body.
6. The high heat dissipation intensive bus duct according to any one of claims 1 to 5, characterized in that: A bending portion is provided between the main body and the conducting portion, and the exteriors of the main body and the bending portion are both covered with an insulating layer.
7. The high heat dissipation intensive bus duct according to any one of claims 1 to 5, characterized in that: A through hole is provided on the bottom surface of the partition groove, a positioning hole is provided on the grounding copper busbar, and a conductive fastener is connected to the partition groove. The conductive fastener passes through the through hole and the positioning hole in sequence and is connected to the grounding copper busbar.
8. The high heat dissipation intensive bus duct according to any one of claims 1 to 5, characterized in that: The gap between adjacent conducting parts on the same side is 12 mm to 15 mm.
9. The high heat dissipation intensive bus duct according to any one of claims 1 to 5, characterized in that: The top and bottom of the aluminum alloy cover plate are both provided with convex strips.
Citation Information
Patent Citations
Aluminum alloy bus duct
CN221509074U