Substrate processing equipment and substrate processing system
By driving the machining tool at the set amplitude and frequency, the problem of low accuracy and efficiency of substrate processing equipment when high density or high thickness diameter is solved, higher machining accuracy and efficiency are achieved, and tool life is extended.
Patent Information
- Application Number
- CN202422190703.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-06
- Publication Date
- 2025-09-02
- Estimated Expiration
- 2034-09-06
AI Technical Summary
When existing substrate processing equipment processes high-density or high-thickness ratio substrates, there are problems with low processing accuracy and efficiency.
The machining tool is driven by a pneumatic piezoelectric spindle to vibrate in the first direction with the set amplitude and frequency, so as to realize periodic contact and separation between the machining tool and the substrate, and automatically correct the offset error through slight displacement changes to improve the precise positioning ability.
It improves the accuracy and efficiency of substrate processing, reduces chip blockage, reduces friction and cutting temperature, extends the life of processing tools, and improves processing quality.
Smart Images

Figure CN223297781U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of substrate processing equipment, in particular to substrate processing equipment and a substrate processing system. Background Art
[0002] With the rapid advancement of technology, the trend toward miniaturization and integration of electronic devices is becoming increasingly significant. This places higher demands on the circuit density and aperture density of substrates (such as printed circuit boards). During the manufacturing process, substrates undergo a variety of processing steps, such as drilling, drilling, milling, and cutting, and the quality of these processes directly impacts the electrical performance of the substrate.
[0003] Existing substrate processing equipment primarily improves machining accuracy and efficiency by adjusting the motorized spindle speed and feed rate. However, this approach still suffers from low machining accuracy and efficiency when processing specialized substrates, such as high-density substrates or those with a high aspect ratio. Summary of the Invention
[0004] Based on this, the embodiments of the present invention provide a substrate processing device and a substrate processing system to solve the technical problems of low processing accuracy and efficiency of existing substrate processing equipment.
[0005] In order to solve the above problems, the technical solutions adopted by the present invention are as follows:
[0006] In a first aspect, a substrate processing apparatus is provided, comprising an air-static pressure electric spindle;
[0007] The pneumatic electrostatic spindle is used to drive a high-speed rotating machining tool to vibrate in a first direction at a set amplitude and frequency during machining, so that the machining tool and the substrate form periodic contact and separation to achieve machining of the substrate.
[0008] Optionally, the air static pressure electric spindle includes an air static pressure ultrasonic electric spindle; the air static pressure ultrasonic electric spindle includes an electric spindle that utilizes aerodynamic principles to enable a rotating shaft core arranged inside the electric spindle to vibrate and rotate in a preset direction under a cyclonic floating state.
[0009] Optionally, the pneumatic static pressure electric spindle includes a pneumatic static pressure ultrasonic electric spindle, and the pneumatic static pressure ultrasonic electric spindle includes a spindle body, an air path structure, an air-floating vibration plate, and a rotating shaft core arranged inside the spindle body;
[0010] The air-floating vibration plate is connected to the rotating shaft core;
[0011] The air path structure is arranged at the front end or inside of the spindle body, and is used to guide the air flow to act on both sides of the air-floating vibration plate, thereby driving the air-floating vibration plate to drive the rotating shaft core to vibrate along the first direction, and then drive the processing tool to vibrate synchronously along the first direction.
[0012] Optionally, the substrate processing equipment further comprises a gantry system, a first motion assembly, a second motion assembly and a spindle fixing assembly;
[0013] The pneumatic static pressure electric spindle is detachably connected to one side of the spindle fixing assembly, the other side of the spindle fixing assembly is detachably connected to one end of the first motion assembly, the other end of the first motion assembly is detachably connected to one end of the second motion assembly, and the other end of the second motion assembly is detachably connected to the gantry system;
[0014] The first motion component can drive the spindle fixing component to move along the first direction, so that the spindle fixing component drives the pneumatic electro-spindle to move along the first direction;
[0015] The second motion component can drive the first motion component to move along a second direction, so as to drive the pneumatic static pressure electric spindle to move along the second direction.
[0016] Optionally, the spindle fixing assembly includes a spindle mounting plate, a spindle mounting seat and a flange;
[0017] The spindle mounting seat is provided with a through hole;
[0018] The flange is fixedly sleeved on the main shaft body;
[0019] One end of the first motion assembly is detachably connected to one side of the spindle mounting plate;
[0020] The other side of the spindle mounting plate is fixedly connected to the spindle mounting seat;
[0021] The lower end of the main shaft body passes through the through hole of the main shaft mounting seat, and the flange and the main shaft mounting seat are fixed to each other.
[0022] Optionally, the spindle fixing assembly further includes a spindle positioning sleeve;
[0023] The spindle positioning sleeve is sleeved on the spindle body and is arranged between the flange and the spindle mounting seat, and is used to adjust the vertical installation degree of the spindle body.
[0024] Optionally, the spindle fixing assembly includes a spindle clamp rear seat, a spindle clamp front cover, a spindle clamp rear seat rubber ring, a spindle clamp front cover rubber ring and a spindle washer;
[0025] One end of the first motion assembly is detachably connected to one side of the spindle clamp rear seat;
[0026] The spindle clamp rear seat rubber ring is installed on the other side contact surface of the spindle clamp rear seat, and the spindle clamp front cover rubber ring is installed on one side contact surface of the spindle clamp front cover and corresponds to the other side contact surface of the spindle clamp rear seat;
[0027] The lower end portion of the spindle body is fixedly mounted between the spindle clamp rear seat rubber ring and the spindle clamp front cover rubber ring;
[0028] The spindle washer is arranged between the upper end portion of the spindle body and the spindle clamp front cover.
[0029] Optionally, the substrate processing equipment further comprises a bed, a workbench and a third motion component;
[0030] A passage is formed between the gantry system and the bed;
[0031] One end of the third motion component is detachably connected to the bed, and the other end is detachably connected to the workbench;
[0032] The third motion component can drive the workbench to move along a third direction, so that the workbench moves into or out of the channel.
[0033] Optionally, the processing type of the substrate includes drilling, grooving, milling or cutting, and / or the substrate includes a high aspect ratio substrate, a multi-layer stacked substrate or a high density interconnect substrate.
[0034] In a second aspect, a substrate processing system is provided, wherein the substrate includes a PCB board, a packaging substrate and a glass substrate; the substrate processing system includes at least one substrate processing device described in the first aspect.
[0035] In one of the solutions provided by the embodiments of the present invention, the substrate processing equipment includes an air-pressure electric spindle; the air-pressure electric spindle is used to drive the high-speed rotating processing tool to vibrate in a first direction with a set amplitude and frequency during the processing, so that periodic contact and separation are formed between the processing tool and the substrate to achieve processing of the substrate. In this embodiment, the high-speed rotating processing tool is driven to vibrate in the first direction with a set amplitude and frequency by the air-pressure electric spindle, so that the displacement of the processing tool in each vibration cycle will change slightly, and this change prompts the contact point between the processing tool and the substrate to be fine-tuned in each cycle. Therefore, when the processing tool has errors due to offset or inaccurate positioning, these errors can be automatically corrected in the next vibration cycle, effectively reducing the offset of the processing tool and improving the precise positioning capability of the processing, thereby improving the processing accuracy and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0037] Figure 1 This is a schematic diagram of a substrate processing device in one embodiment of the present invention;
[0038] Figure 2 This is a schematic diagram of a processing of a pneumatic static pressure electric spindle in one embodiment of the present utility model;
[0039] Figure 3 This is a schematic diagram of the installation of a pneumatic static pressure electric spindle in one embodiment of the present utility model;
[0040] Figure 4 This is a planed view of an installation of a pneumatic static pressure electric spindle in one embodiment of the present utility model;
[0041] Figure 5 This is a side view of an installation of a pneumatic static pressure electric spindle in one embodiment of the present utility model;
[0042] Figure 6 This is a schematic diagram of a spindle positioning sleeve in one embodiment of the present utility model;
[0043] Figure 7 This is another side view of the installation of the pneumatic static pressure electric spindle in one embodiment of the present utility model;
[0044] Figure 8 This is another installation plan view of the pneumatic static pressure electric spindle in one embodiment of the present utility model.
[0045] The accompanying drawings are numerals as follows:
[0046] 1. Pneumatic and hydrostatic electric spindle; 2. Workbench;
[0047] 3. Beam base; 31. First base; 32. Second base;
[0048] 4. Beam; 5. Bed; 6. First motion assembly; 7. Second motion assembly; 8. Third motion assembly;
[0049] 9. Spindle fixing assembly; 91. Spindle mounting plate; 92. Spindle mounting seat; 921. Threaded hole; 93. Flange; 931. Countersunk hole; 94. Spindle locating sleeve; 941. Locating hole; 95. Spindle mounting insulating sleeve; 96. Spindle clamp rear seat; 97. Spindle clamp front cover; 98. Spindle clamp rear seat rubber ring; 99. Spindle clamp front cover rubber ring; 910. Spindle washer;
[0050] 10. Screws; 11. Processing tools; 12. Base plate. DETAILED DESCRIPTION
[0051] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
[0052] In the description of the present invention, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.
[0053] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.
[0054] To facilitate understanding of the embodiments of the present invention, the substrate 12 involved in the present invention is explained as follows: The substrate 12 involved in the present invention can include a PCB board, a packaging substrate (IC carrier board), and a glass substrate, which is not limited here. The embodiments provided by the present invention are explained as follows:
[0055] In one embodiment, a first aspect provides a substrate processing device, see Figure 1 and Figure 2 The substrate processing equipment includes an air-static pressure electric spindle 1, which is used to drive a high-speed rotating processing tool 11 to vibrate in a first direction with a set amplitude and frequency during the processing process, so that periodic contact and separation are formed between the processing tool 11 and the substrate 12 to realize processing of the substrate 12.
[0056] In this embodiment, the high-speed rotating tool 11 can be a tool 11 with a rotational speed between 50,000 rpm and 300,000 rpm. Preferably, the rotational speed of the tool 11 can be 100,000 rpm, 150,000 rpm, 200,000 rpm, or 250,000 rpm, without limitation. Of course, the pneumatic electric spindle 1 can use other rotational speeds to drive the tool 11 to vibrate the substrate 12, which is also within the scope of protection of the present invention. Furthermore, the pneumatic electric spindle 1 can have a preset amplitude range of 1 µm to 20 µm, and a preset frequency range of 100 Hz to 80 kHz.
[0057] As an example, by installing an air-pressure electric spindle 1 on substrate processing equipment, the air-pressure electric spindle 1 drives the processing tool 11 to vibrate in a first direction at a set amplitude and frequency during the processing. This pulsed non-continuous drilling process causes periodic contact and separation between the processing tool 11 and the substrate 12, resulting in slight changes in the displacement of the processing tool 11 within each vibration cycle. This change prompts the contact point between the processing tool 11 and the substrate 12 to be fine-tuned within each cycle. Therefore, when the processing tool 11 has errors due to offset or inaccurate positioning, these errors can be automatically corrected within the next vibration cycle, effectively reducing the offset of the processing tool 11 and improving the precise positioning capability of the processing, thereby improving processing accuracy and efficiency.
[0058] For example, during vibration drilling, if the drill bit encounters deflection during penetration, the vibration will cause the drill bit to briefly withdraw and reposition, automatically eliminating the deflection and ensuring that the drill bit can accurately re-enter the target location. This improves the positioning accuracy of the drill hole and enables vibration drilling to demonstrate higher precision and efficiency in substrate processing compared to conventional drilling. This is particularly advantageous when processing difficult-to-process materials such as high aspect ratio substrates, multi-layer stacked substrates, and high-density interconnect substrates.
[0059] Furthermore, the excellent chip-breaking performance generated by vibration facilitates smoother chip removal during machining, reducing scraping of the hole surface by the chips. Furthermore, the reciprocating ironing action of the machining tool 11 on the inner hole surface during vibration machining further reduces the surface roughness of the substrate 12 and the surface quality of the hole wall, thereby improving the machining quality of the substrate 12. Furthermore, the intermittent action between the machining tool 11 and the substrate 12 significantly reduces friction, thus maintaining a stable and normal wear state for the machining tool 11. This results in low cutting temperatures, stable drill performance, and slow wear, thus extending the life of the machining tool 11.
[0060] For example, when processing a 2.5mm high aspect ratio substrate (for example, an FR-4 substrate), the frequency can be set to 30kHz and the amplitude can be set to 1.5 microns, so that when the processing tool 11 contacts the substrate 12, it vibrates slightly at a frequency of 30,000 times per second. This vibration causes periodic contact and separation between the cutting edge of the processing tool 11 and the substrate 12, and the cutting force changes from a continuous force to a pulse force, and continuous cutting changes to intermittent cutting, so that the cutting thickness of the processing tool 11 changes periodically over time. Therefore, the average cutting thickness of the processing tool 11 is smaller than the cutting thickness of high-speed drilling under the same processing parameters, effectively reducing the cutting force borne by the processing tool 11, which not only improves the chip removal effect, reduces chip blockage and processing instability caused by material hardness and wear of the processing tool 11, but also improves processing accuracy and efficiency, and extends the service life of the processing tool 11.
[0061] It should be understood that the periodic contact and separation described above, manifested as the number of times the tool 11 and substrate 12 come into contact and separate during machining, is determined by the vibration frequency of the pneumatic electrospindle 1. For example, a contact and separation cycle is completed every 50µs (1s / 20,000 times). The amplitude of the vibration determines the amount of pressure applied by the tool 11 to the substrate 12 during each contact; the greater the amplitude, the greater the contact force.
[0062] In one embodiment, the aerostatic pressure electric spindle 1 includes an aerostatic pressure ultrasonic electric spindle; the aerostatic pressure ultrasonic electric spindle includes an electric spindle that utilizes aerodynamic principles to enable a rotating shaft core arranged inside the electric spindle to vibrate and rotate in a preset direction under a cyclonic floating state.
[0063] In some embodiments, an air-static ultrasonic electric spindle can be one that integrates aerodynamic principles with ultrasonic technology. Specifically, a rotating shaft core can be disposed within the electric spindle and, driven by ultrasonic waves, causes the rotating shaft core to vibrate at high frequency along a predetermined direction. Simultaneously, high-pressure air is introduced into the electric spindle, forming a static pressure air film around the rotating shaft core, thereby isolating the rotating shaft core from direct contact with the inner wall of the electric spindle. Consequently, the rotating shaft core can simultaneously vibrate and rotate under the action of cyclonic buoyancy.
[0064] In one embodiment, the pneumatic pressure electric spindle 1 includes an pneumatic pressure ultrasonic electric spindle, and the frequency range of the pneumatic pressure ultrasonic electric spindle is above 20kHz. Furthermore, the frequency range of the ultrasonic vibration spindle can be configured within the range of 20kHz~60kHz, preferably, it can be configured to 20kHz, 30kHz or 40kHz, etc.; the pneumatic pressure ultrasonic electric spindle includes a spindle body, an air path structure, an air-floating vibration plate and a rotating shaft core arranged inside the spindle body; one end of the processing tool 11 is detachably connected to the output end of the rotating shaft core; the air-floating vibration plate is connected to the rotating shaft core; the air path structure is arranged at the front end or inside of the spindle body, for guiding the airflow to act on both sides of the air-floating vibration plate, thereby driving the air-floating vibration plate to drive the rotating shaft core to vibrate along the first direction, and then driving the processing tool 11 to vibrate synchronously along the first direction.
[0065] In some embodiments, a rotating shaft core is installed inside the spindle body of the pneumatic pneumatic electric spindle 1. The rotating shaft core is detachably connected to one end of the processing tool 11 through its output end, so that it can transmit ultrasonic vibrations while rotating, causing the processing tool 11 to vibrate synchronously along a preset first direction. Among them, the air-floating vibration plate can be fixedly connected to the rotating shaft core, and its main function is to drive the rotating shaft core to achieve ultrasonic vibration. Specifically, the air flow can be guided to both sides of the air-floating vibration plate by an air path structure provided at the front end or inside the spindle body, thereby forming an air film on both sides of the air-floating vibration plate, thereby generating a pressure difference, and the pressure difference is used to push the air-floating vibration plate to vibrate along the first direction, and then the vibration of the air-floating vibration plate is transmitted to the processing tool 11 through the rotating shaft core, so that the processing tool 11 forms a periodic contact force on the surface of the substrate 12.
[0066] In one embodiment, the substrate processing equipment further includes a gantry system, a first motion assembly 6 , a second motion assembly 7 and a spindle fixing assembly 9 .
[0067] In some embodiments, the gantry system includes a beam base 3 and a beam 4 arranged on the beam base 3. Specifically, the beam base 3 includes a first base 31 and a second base 32 that are spaced apart. One end of the first base 31 and the second base 32 are respectively connected to the beam 4 by fasteners or other means to form a gantry system. Through this connection method, the substrate processing equipment can be quickly disassembled and reassembled when it needs to be moved or adjusted, thereby improving the operating efficiency and flexibility of the substrate processing equipment. The beam 4 can also be made of a material with strong rigidity, such as marble, steel or aluminum alloy, to ensure that it can withstand the weight and load caused by the movement of the pneumatic electric spindle 1 during the processing process to avoid deformation, and the length and strength of the beam 4 can be customized according to the processing area and processing requirements, which is not limited by the present invention.
[0068] Furthermore, the pneumatic electric spindle 1 is detachably connected to one side of the spindle fixing assembly 9, the other side of the spindle fixing assembly 9 is detachably connected to one end of the first motion assembly 6, the other end of the first motion assembly 6 is detachably connected to one end of the second motion assembly 7, and the other end of the second motion assembly 7 is detachably connected to the gantry system; the first motion assembly 6 can drive the spindle fixing assembly 9 to move in the first direction, so that the spindle fixing assembly 9 drives the pneumatic electric spindle 1 to move in the first direction; the second motion assembly 7 can drive the first motion assembly 6 to move in the second direction, so as to drive the pneumatic electric spindle 1 to move in the second direction.
[0069] In some embodiments, one side of the spindle fixing assembly 9 can be connected to the pneumatic electric spindle 1 via a detachable connection (e.g., a bolt or clamp). This connection allows for easy installation and removal of the pneumatic electric spindle 1 when needed. The other side of the spindle fixing assembly 9 is connected to one end of the first motion assembly 6 via a similar detachable connection, ensuring that the first motion assembly 6 can drive the spindle fixing assembly 9 in a first direction, thereby driving the pneumatic electric spindle 1 in the first direction. The other end of the first motion assembly 6 is connected to one end of the second motion assembly 7 via a detachable connection, and the other end of the second motion assembly 7 is connected to the crossbeam 4 via a similar detachable connection. In this way, while the first motion assembly 6 drives the spindle fixing assembly 9 in the first direction, the second motion assembly 7 can simultaneously drive the first motion assembly 6 in the second direction, thereby driving the pneumatic electric spindle 1 to move synchronously in the first and second directions. This improves processing flexibility, meets the requirements of different processing techniques, and simplifies the installation and maintenance of the substrate processing equipment.
[0070] In one embodiment, the first motion component 6 includes a first linear motor, a first rolling guide, a first slider, and a base plate. The first linear motor and the first rolling guide are fixed to the front of the base plate. The first slider is arranged on the first rolling guide and is connected to the first linear motor and one side of the spindle fixing assembly 9, and the pneumatic electric spindle 1 is fixed to the other side of the spindle fixing assembly 9. During operation, the first linear motor is controlled to drive the first slider to move along the first rolling guide in the first direction, thereby driving the spindle fixing assembly 9 to move in the first direction, for example, the Z-axis direction, thereby driving the pneumatic electric spindle 1 to move in the first direction. The first motion component 6 can be made of high-precision and low-friction materials (for example, steel or aluminum alloy) to ensure that the first slider moves smoothly on the first guide rail to avoid vibration or friction affecting the processing accuracy.
[0071] In one embodiment, the second motion assembly 7 includes a second linear motor, a second rolling guide, and a second slider. The second linear motor and the second rolling guide are mounted on the crossbeam 4, and the second slider is disposed on the second rolling guide and connected to the back of the base plate and the second linear motor. During operation, the second linear motor is controlled to drive the second slider to move along the second rolling guide in a second direction, for example, the X-axis direction, thereby driving the first motion assembly 6 to move in the second direction. This, in turn, drives the pneumatic electric spindle 1 on the spindle fixing assembly 9 to move in the second direction via the first motion assembly 6, enabling the pneumatic electric spindle 1 to move in two directions, forming a complete two-dimensional motion plane, for example, the ZX plane. This achieves comprehensive control of the pneumatic electric spindle 1 and meets the precision requirements for processing different substrates.
[0072] In one embodiment, if Figure 3 、 Figure 4 and Figure 5 As shown, the spindle fixing assembly 9 includes a spindle mounting plate 91, a spindle mounting seat 92 and a flange 93; the spindle mounting seat 92 is provided with a through hole (not shown in the figure); the flange 93 is fixedly sleeved on the spindle body; one end of the first motion component 6 is detachably connected to one side of the spindle mounting plate 91; the other side of the spindle mounting plate 91 is fixedly connected to the spindle mounting seat 92; the lower end portion of the spindle body passes through the through hole of the spindle mounting seat 92, and the flange 93 and the spindle mounting seat 92 are fixed to each other.
[0073] In some embodiments, one side of the spindle mounting plate 91 can be connected to one end of the first motion component 6 by a detachable connecting device (such as a bolt or a clamp). This connection method allows the spindle mounting plate 91 to be installed or removed when needed, while providing a stable support structure. The other side of the spindle mounting plate 91 is fixedly connected to the spindle mounting seat 92. This fixed connection can be achieved by bolts, welding or other suitable mechanical connection methods to ensure that the spindle mounting seat 92 is stably fixed on the spindle mounting plate 91. Furthermore, a through hole for the lower end of the spindle body to pass through can be provided on the spindle mounting seat 92. The size and position of the through hole can be pre-set according to the shape of the spindle body to ensure that the spindle body will not be interfered with during the installation process, and the present invention does not limit this. The flange 93 is fixedly sleeved on the middle end of the spindle body. The flange 93 is tightly matched with the outer diameter of the spindle body through its inner diameter, so that it is fixed to the middle end of the spindle body. Then the lower end of the spindle body is passed through the through hole of the spindle mounting seat 92, and the flange 93 sleeved on the middle end of the spindle body and the spindle mounting seat 92 are fixed to each other, thereby ensuring that the pneumatic electrostatic spindle 1 remains stable during the processing without displacement or shaking.
[0074] Furthermore, the flange 93 is provided with a countersunk hole 931, and the spindle mounting seat 92 is provided with a threaded hole 921 corresponding to the countersunk hole 931. In some embodiments, the lower end of the spindle body can be aligned with the through-hole in the spindle mounting seat 92 and slowly passed through the through-hole. The flange 93 is fixedly sleeved on the middle end of the spindle body, ensuring that the countersunk hole 931 on the flange 93 is aligned with the threaded hole 921 on the spindle mounting seat 92. The flange 93 is then connected to the corresponding threaded hole 921 on the spindle mounting seat 92 by screws 10 passing through the countersunk hole 931 of the flange 93. This fixing method helps to disperse the load and stress generated by the pneumatic electric spindle 1 during the machining process, thereby extending the service life of the pneumatic electric spindle 1.
[0075] Furthermore, the spindle fixing assembly 9 may also include a spindle mounting insulating sleeve 95, wherein the main function of the spindle mounting insulating sleeve 95 is to provide electrical isolation. Specifically, when the flange 93 and the spindle mounting seat 92 are fixed to each other. First, the spindle mounting insulating sleeve 95 can be placed in the countersunk hole 931 of the flange 93, and then the screw 10 is passed through the spindle mounting insulating sleeve 95 and connected to the threaded hole 921, thereby preventing electrical contact between the spindle body and the mounting screw 10, thereby avoiding electrical noise from interfering with surrounding components. It should be noted that when selecting the spindle mounting insulating sleeve 95, the spindle mounting insulating sleeve 95 that is compatible with it can be selected based on the relationship between the outer diameter of the countersunk hole 931 and the inner diameter of the spindle mounting insulating sleeve 95. Here, the utility model does not make any limitation.
[0076] Further, if Figure 6 As shown, the spindle fixing assembly 9 further includes a spindle positioning sleeve 94 ; the spindle positioning sleeve 94 is sleeved on the spindle body and is disposed between the flange 93 and the spindle mounting seat 92 for adjusting the vertical installation degree of the spindle body.
[0077] In some embodiments, by further adding a spindle positioning sleeve 94 to the spindle fixing assembly 9 and arranging the spindle positioning sleeve 94 between the flange 93 and the spindle mounting seat 92, it is possible to ensure that the pneumatic pneumatic electric spindle 1 remains vertical during the entire processing process, thereby improving the processing accuracy and the operating stability of the substrate processing equipment. Among them, a positioning hole 941 corresponding to the threaded hole 921 is provided on the outer edge of the spindle positioning sleeve 94, and a plurality of expansion and contraction grooves are opened on the outer surface. As an example, the spindle positioning sleeve 94 can be sleeved on the spindle body below the flange 93, and the screw 10 is passed through the countersunk hole 931 and the positioning hole 941 and connected to the threaded hole 921 at the same time. The deformation of the spindle positioning sleeve 94 can be adjusted by adjusting the locking degree of the screw 10 to adjust the vertical installation degree of the spindle body.
[0078] In another embodiment, Figure 7 and Figure 8As shown, the spindle fixing assembly 9 includes a spindle clamp rear seat 96, a spindle clamp front cover 97, a spindle clamp rear seat rubber ring 98, a spindle clamp front cover rubber ring 99 and a spindle gasket 910; one end of the first motion assembly 6 is detachably connected to one side of the spindle clamp rear seat 96; the spindle clamp rear seat rubber ring 98 is installed on the other side contact surface of the spindle clamp rear seat 96, and the spindle clamp front cover rubber ring 99 is installed on the corresponding contact surface of the spindle clamp front cover 97 and the other side of the spindle clamp rear seat 96; the lower end of the spindle body is fixedly installed between the spindle clamp rear seat rubber ring 98 and the spindle clamp front cover rubber ring 99; the spindle gasket 910 is arranged between the upper end of the spindle body and the spindle clamp front cover 97, for ensuring that the upper end of the spindle body is in close contact with the spindle clamp front cover 97.
[0079] In some embodiments, the spindle clamp back seat 96 and the spindle clamp front cover 97 respectively constitute the primary support components of the spindle body, while the spindle clamp back seat rubber ring 98 and the spindle clamp front cover rubber ring 99 provide radial insulation protection for the spindle body, and the spindle washer 910 ensures the axial positioning of the spindle body. As an example, one side of the spindle clamp back seat 96 can be connected to one end of the first motion assembly 6 via a detachable connection device (such as a bolt or clamp). This arrangement allows the spindle clamp back seat 96 to be flexibly connected and removed from the first motion assembly 6, facilitating installation, adjustment, and maintenance of the spindle body. The other contact surface of the spindle clamp back seat 96 is provided with a spindle clamp back seat rubber ring 98. This spindle clamp back seat rubber ring 98 can be semicircular in shape, with the inner diameter of the arc surface smaller than the outer diameter of the lower end of the spindle body to achieve an interference fit with the spindle body. The function of the spindle clamp rear seat rubber ring 98 is to provide radial positioning support for the spindle body, ensuring the stable position of the spindle body within the spindle clamp assembly and preventing radial deviation. The design of the spindle clamp front cover 97 forms a relative support relationship with the spindle clamp rear seat 96. The spindle clamp front cover rubber ring 99 is installed on the corresponding contact surfaces of the spindle clamp front cover 97 and the spindle clamp rear seat 96, and its design is similar to the spindle clamp rear seat rubber ring 98. In this way, through the cooperation of the spindle clamp rear seat 96 and the spindle clamp front cover 97, the lower end of the spindle body is fixedly installed between the spindle clamp rear seat rubber ring 98 and the spindle clamp front cover rubber ring 99, achieving precise radial positioning of the spindle body.
[0080] In order to ensure the precise axial positioning of the spindle body, a spindle washer 910 is disposed between the upper end of the spindle body and the spindle clamp front cover 97. In some embodiments, because the diameter of the upper end of the spindle body is larger than the diameter of the lower end, by placing the spindle washer 910 between the upper end of the spindle body and the upper end surface of the spindle clamp front cover 97, a close axial contact surface is formed between the upper end of the spindle body and the spindle clamp front cover 97, thereby ensuring the axial positioning accuracy of the spindle body and avoiding axial displacement during the machining process, thereby ensuring the stability and machining accuracy of the pneumatic electric spindle 1. It should be noted that the thickness of the spindle washer 910 can be adjusted according to actual installation requirements to ensure that the upper end of the spindle body is in close contact with the upper end surface of the spindle clamp front cover 97.
[0081] In one embodiment, the substrate processing equipment further includes a bed 5 , a workbench 2 and a third motion component 8 .
[0082] In some embodiments, by further integrating the bed 5 and worktable 2 into the substrate processing equipment, the substrate processing equipment can provide a flexible movement path while ensuring processing stability, thereby improving processing efficiency and operational convenience. Preferably, the worktable 2 can be positioned below the pneumatic electric spindle 1, serving as the primary support platform for the substrate 12. It should be noted that the surface of the worktable 2 can also be designed as a flat surface with adjustable height to accommodate the processing requirements of substrates of varying thicknesses, but this is not a limitation of the present invention.
[0083] Furthermore, a passage is formed between the gantry system and the bed 5 .
[0084] In some embodiments, one end of the beam base 3 can be connected to the bed 5, and the other end of the beam base 3 can be connected to the beam 4 to form a channel for the movement of the workbench 2, so that the workbench 2 can move in the channel during the processing to adapt to different processing requirements, greatly improving the applicability and processing efficiency of the substrate processing equipment, while also reducing the downtime caused by repositioning the substrate 12.
[0085] Furthermore, one end of the third motion component 8 is detachably connected to the bed 5, and the other end is detachably connected to the workbench 2; the third motion component 8 can drive the workbench 2 to move along the third direction, so that the workbench 2 moves in or out of the channel.
[0086] In some embodiments, the third motion assembly 8 can be connected to the bed 5 and the worktable 2, respectively, via a threaded connection, a pin connection, a key connection, or a quick-locking device. This allows for easy removal or adjustment of the third motion assembly 8 when necessary, facilitating maintenance or component replacement. The primary function of the third motion assembly 8 is to drive the worktable 2 in a third direction, such as the Y-axis, thereby flexibly moving the substrate 12 on the worktable 2 into or out of the channel formed between the gantry system and the bed 5.
[0087] For example, when processing a large substrate 12, the workbench 2 can be moved along the third direction through the third motion component 8, which facilitates moving the substrate 12 from outside the substrate processing equipment into the processing area, or moving it out of the processing area after processing is completed, making the operation of the substrate processing equipment more flexible, especially in batch production or complex plate processing, which can significantly improve production efficiency.
[0088] In one embodiment, the third motion assembly 8 includes a third linear motor, a third rolling guide, and a third slider. The third linear motor and third rolling guide are mounted on the bed 5. The third slider is mounted on the third rolling guide and is connected to the worktable 2 and the third linear motor. During operation, the third linear motor is controlled to drive the third slider along the third rolling guide in the third direction, thereby driving the worktable 2 in the third direction. This, in turn, moves the substrate 12 on the worktable 2 in and out of the channel formed between the crossbeam base 3 and the crossbeam 4, forming a complete three-dimensional motion plane, for example, a ZXY plane, meeting the precision requirements for processing different substrates.
[0089] In summary, the first motion assembly 6 and the second motion assembly 7 drive the pneumatic electrostatic spindle 1 to perform precision machining in the first and second directions, respectively. After machining is completed, the third motion assembly 8 drives the worktable 2 out of the machining area in the third direction, allowing the operator to conveniently unload and reload the substrate. This entire process improves the efficiency and operational convenience of the substrate machining equipment.
[0090] In one embodiment, the first, second, and third directions are perpendicular to each other. Specifically, this perpendicular relationship ensures that the first motion component 6, the second motion component 7, and the third motion component 8 do not interfere with each other when operating independently in their respective directions, thereby achieving precise and stable motion control. For example, when the first motion component 6 drives the pneumatic electrospindle 1 to move in the first direction, the second motion component 7 can simultaneously adjust the processing position in the second direction, while the third motion component 8 can flexibly adjust the movement of the worktable 2 in the third direction. Through this design, the substrate processing equipment can be precisely positioned and operated in three-dimensional space, thereby achieving complex processing tasks.
[0091] In one embodiment, the processing types of the substrate 12 include drilling, grooving, milling or cutting. During the processing of the substrate 12, according to different requirements and design specifications, common processing types include drilling, grooving, milling and cutting. Specifically:
[0092] Drilling is a processing method for forming holes in the substrate 12 .
[0093] In some embodiments, when the pneumatic electric spindle 1 is drilling a substrate 12, the drill bit is driven to vibrate at a high frequency in a first direction (e.g., perpendicular to the substrate surface) at a set amplitude and frequency. This vibration creates a periodic contact and separation between the drill bit and the substrate 12, effectively reducing cutting forces and heat, and facilitating the timely removal of chips.
[0094] During the drilling process, the pneumatic electrospindle 1 not only ensures drilling precision—namely, the accuracy of the hole's position, diameter, and depth—but also protects the integrity of the substrate 12 and surrounding circuitry by reducing cutting stress and thermal effects. Ultrasonic vibration also helps remove burrs and debris generated during the drilling process, improving drilled hole quality.
[0095] Gong is a processing method for removing excess material from the substrate 12 to form a specific shape or structure.
[0096] In some embodiments, when the pneumatic electrospindle 1 is gonging the substrate 12, it drives a dedicated tool to vibrate at a set amplitude and frequency, precisely removing excess material from the substrate 12 along a predetermined trajectory. This ultrasonic vibration not only significantly reduces cutting resistance and thermal effects, ensuring the accuracy and integrity of the machining area, but also facilitates smooth chip removal, effectively preventing clogging and wear.
[0097] Milling is a processing method for surface treatment and fine processing of the substrate 12.
[0098] In some embodiments, when the pneumatic electric spindle 1 performs milling operations on the substrate 12, the milling cutter is driven at a set amplitude and frequency to make the cutting process more precise and delicate, thereby reducing the damage to the substrate 12 caused by cutting heat and mechanical stress, and ensuring the smoothness and accuracy of the processed edge.
[0099] Cutting is a processing method for forming the substrate 12 into a desired shape and structure.
[0100] In some embodiments, when the pneumatic electrospindle 1 cuts the substrate 12, it drives the cutting tool at a set amplitude and frequency, causing the tool to vibrate and impact the substrate 12 at high frequencies, thereby achieving precise and efficient cutting. This cutting method not only reduces damage to the substrate 12 and ensures a smooth and flat machined edge, but also significantly improves machining accuracy and production efficiency.
[0101] Furthermore, substrate 12 includes a high aspect ratio substrate, a multi-layer laminated substrate, or a high-density interconnect substrate. Specifically, a high aspect ratio substrate refers to a relatively thick substrate, for example, a substrate with a thickness of 1.0 mm to 10.0 mm. A multi-layer laminated substrate refers to a circuit board composed of multiple laminated substrate layers, each layer having independent circuit patterns and connection structures. For example, a substrate with 4 to 20 layers and a thickness of 1.5 mm to 10.0 mm. A high-density interconnect (HDI) substrate refers to a printed circuit board with a high wiring density.
[0102] Another aspect provides a substrate processing method applicable to the substrate processing device of the first embodiment described above, wherein the substrate processing device includes a pneumatic static pressure electric spindle 1, a control system, a gas source pressure processing system, a gas pressure control system, and a detection system. The substrate processing method includes:
[0103] S10, obtaining processing parameters of the substrate 12;
[0104] In this embodiment, the processing parameters of the substrate 12 include substrate parameters and processing type parameters. Specifically, the substrate parameters include substrate type and substrate inherent parameters; wherein the substrate type includes a high aspect ratio substrate, a multi-layer stacked substrate or a high density interconnect (HDI) substrate, and the substrate inherent parameters include high aspect ratio substrate parameters, multi-layer stacked substrate parameters or high density interconnect substrate parameters.
[0105] As an example, high aspect ratio substrate parameters include:
[0106] Thickness: for example, 1.0mm to 10.0mm;
[0107] Aperture: for example, 0.2mm to 1.0mm;
[0108] Aspect ratio: for example, 5:1 to 10:1 or higher;
[0109] Material type: For example, FR-4 material.
[0110] Multi-layer substrate parameters include:
[0111] Number of layers: for example, 4 to 20 layers or more;
[0112] Total thickness: for example, 1.5mm to 10.0mm;
[0113] Material type: For example, FR-4 material.
[0114] High-density interconnect substrate parameters include:
[0115] Thickness: for example, 0.5mm to 3.0mm;
[0116] Aperture: for example, 0.1mm to 0.3mm;
[0117] Line width and spacing: for example, 50µm to 150µm.
[0118] Material type: For example, low dielectric constant material.
[0119] The processing type parameters include drilling parameters, drilling parameters, milling parameters or cutting parameters.
[0120] Specifically, drilling parameters include: drilling depth, spindle speed and feed speed.
[0121] The gong parameters include: cutting width, gong knife diameter, cutting speed, gong knife speed and feed speed.
[0122] Milling parameters include: milling depth, milling cutter diameter, spindle speed and feed speed.
[0123] Cutting parameters include: cutting depth, cutting speed and cutting accuracy.
[0124] S20, determining target vibration parameters corresponding to the processed substrate 12 according to the processing parameters;
[0125] In this embodiment, the target vibration parameters include amplitude and frequency. Specifically, the amplitude range is 1µm to 20µm, and the frequency range is 2kHz to 40kHz. Preferably, the amplitude can be configured to 5µm, 10µm, 15µm or 18µm, and the frequency can be configured to 5kHz, 10kHz, 20kHz, 30kHz or 35kHz, and the specific details are not limited. The amplitude and frequency suitable for the substrate 12 are determined according to the processing parameters of the substrate 12, in order to optimize the processing effect and ensure the processing quality. Specifically, the corresponding amplitude and frequency can be pre-set according to the processing parameters of the substrate 12, and the corresponding amplitude and frequency can be automatically queried by inputting the processing parameters of the substrate 12. It can also be determined in other ways, which are not limited here.
[0126] As an example, a database of processing parameters for substrate 12 can be pre-established. This database includes the aforementioned processing parameters for substrate 12, the corresponding amplitudes and frequencies, and the processing results. Subsequently, a parameter prediction model is pre-trained based on a large amount of experimental data and theoretical analysis. This parameter prediction model is used to predict the amplitudes and frequencies corresponding to the processing parameters for substrate 12.
[0127] Specifically, once the user enters the processing parameters for substrate 12, the control system immediately initiates an automatic query and matching mechanism to quickly filter similar or similar cases from the historical database based on the input processing parameters for substrate 12. Next, a parameter prediction model intelligently analyzes the amplitude and frequency settings in these cases, taking into account multiple factors such as machining accuracy, machining quality, and tool wear, ultimately recommending the optimal amplitude and frequency.
[0128] For example, a user needs to process a batch of FR-4 substrates with a thickness of 1.6mm, a pore diameter of 0.3mm, and a material type of FR-4. After entering these parameters, the control system uses a pre-trained parameter prediction model to determine the corresponding amplitude and frequency. For example, the amplitude is set to 2.5µm and the frequency is set to 30kHz. It should be noted that the above is only an example, and the specific determination process is not limited here.
[0129] As another example, a relationship table between the processing parameters of the substrate 12 and the amplitude and frequency can be established in advance. When the user inputs the processing parameters of the substrate 12, the control system determines the corresponding amplitude and frequency of the substrate 12 by querying the pre-established relationship table. For example, a high aspect ratio substrate with a thickness of 1.0 mm corresponds to a frequency of 30 kHz and an amplitude of 1.5 µm. A high aspect ratio substrate with a thickness of 2.0 mm corresponds to a frequency of 28 kHz and an amplitude of 2 µm. It should be noted that the above is only an example. Specifically, the processing parameters of the substrate 12, the corresponding amplitude and frequency, can be pre-set according to actual conditions and are not limited here.
[0130] S30 , according to the target vibration parameters, controlling the pneumatic electrostatic spindle 1 to drive the high-speed rotating machining tool 11 to vibrate in a first direction, so that the machining tool 11 and the substrate 12 form periodic contact and separation, so as to realize machining of the substrate 12 .
[0131] In this embodiment, after obtaining the corresponding amplitude and ultrasonic parameters, the pneumatic hydrostatic electric spindle 1 is controlled to drive the high-speed rotating machining tool 11 to vibrate in the first direction with the set amplitude and frequency, so that periodic contact and separation are formed between the machining tool 11 and the substrate 12, thereby realizing the processing of the substrate 12. Through the periodic contact and separation processing method, not only the processing accuracy is improved, but also the material loss and heat impact are reduced, providing strong technical support for the fine processing of the substrate 12.
[0132] For example, using a 5.4mm high aspect ratio substrate, drilling a 0.2mm through hole verifies as follows:
[0133] Table 1
[0134]
[0135] As shown in Table 1, in terms of drilling accuracy, experiments comparing conventional drilling and ultrasonic drilling at the same rotational speed, feed rate, and drilling method revealed that conventional drilling experienced drill bit breakage during processing, preventing the completion of 400 holes and resulting in low accuracy. Ultrasonic drilling, on the other hand, successfully completed 400 holes with a drilling accuracy of CPk = 1.895 (≥1.33), far exceeding the standard value. Furthermore, by adjusting the amplitude, the experiment found that increasing the amplitude significantly improved drilling accuracy, but also resulted in a certain decrease in drill bit life. Specifically, when the amplitude increased from 1µm to 2µm, the accuracy CPk increased from 1.539 to 1.895, and the drill bit life also increased slightly. However, when the amplitude was further increased to 3µm, although the accuracy further improved to 1.995, the drill bit life decreased. Therefore, by determining the amplitude and frequency corresponding to the substrate 12, optimal drilling conditions were achieved. Finally, regarding temperature control, the experiment used an infrared thermal imager to monitor the temperature of the substrate 12 during both conventional and ultrasonic drilling. Under identical parameters, ultrasonic drilling reduced the substrate 12 temperature by approximately 20%, reducing friction and wear between the drill bit and the substrate 12 being drilled. This extended the drill bit's lifespan, improved drilling speed and efficiency, and ensured the accuracy and shape of the drilled hole.
[0136] To sum up, by obtaining the processing parameters of the substrate 12, determining the corresponding amplitude and frequency according to the processing parameters, and using the determined amplitude and frequency, controlling the pneumatic electrostatic spindle 1 to drive the processing tool 11, so that periodic contact and separation are formed between the tool and the substrate 12, thereby achieving precise processing, ensuring that the processing tool 11 can work under the best vibration conditions, and effectively improving the processing efficiency and processing quality.
[0137] In one embodiment, the pneumatic electrospindle 1 includes a pneumatic ultrasonic spindle. In step S30, the pneumatic electrospindle 1 is controlled to drive the machining tool 11 to vibrate in the first direction according to the amplitude and frequency corresponding to the substrate 12, including the following steps:
[0138] S31. Outputting a corresponding current signal according to the target vibration parameter;
[0139] S32 , converting the current signal into an air signal, and controlling the input air pressure of the pneumatic electrostatic spindle 1 according to the air signal, so that the pneumatic electrostatic spindle 1 drives the machining tool 11 to vibrate in the first direction according to the input air pressure.
[0140] In this embodiment, after determining the amplitude and frequency, the control system further outputs a corresponding current signal and sends it to the pneumatic control system. Based on the received current signal, the pneumatic control system controls a dedicated signal conversion device to convert the current signal into a pneumatic signal. For example, the current signal is first converted into a pneumatic signal via an electric-to-pneumatic converter (e.g., an E / P converter) or a proportional solenoid valve. The converted pneumatic signal is then amplified by an air-to-air positioner to precisely control the opening of the pressure regulating valve, thereby precisely controlling the input air pressure of the pneumatic electric spindle 1. This, in turn, achieves precise control of the amplitude and frequency of the pneumatic electric spindle 1, enabling the pneumatic electric spindle 1 to drive the machining tool 11 to vibrate in the first direction based on the input air pressure. The pressure regulating valve has one end connected to the air inlet of the pneumatic electric spindle 1 and the other end connected to the air source pressure processing system. This allows the pneumatic control system to adjust the input air pressure from the air source pressure processing system to the pneumatic electric spindle 1 by controlling the opening of the pressure regulating valve.
[0141] It should be noted that the air supply pressure processing system may include an air dryer, a main line filter, an oil mist separator, and an air tank. The air dryer is used to remove most of the moisture from the compressed air; the main line filter is used to filter impurities from the air; the oil mist separator is used to remove oil mist particles from the air; the air tank is used to stabilize the air pressure and reduce airflow fluctuations; and the ultra-fine oil mist separator is used to deeply purify the air, ensuring the extreme dryness and purity of the input air pressure. Furthermore, one end of the air dryer is connected to the air source, and the other end is connected to one end of the main line filter. The other end of the main line filter is connected to one end of the oil mist separator. The other end of the oil mist separator is connected to one end of the air tank, and the other end of the air tank is connected to one end of the pressure regulating valve. By configuring the above-mentioned air supply pressure processing system, the high-pressure air input into the pneumatic electrostatic spindle 1 is dry and pure compressed air, ensuring the stable performance and reliable operation of the pneumatic electrostatic spindle 1.
[0142] For example, when processing a 2.5mm thick, high-aspect-ratio substrate, the determined frequency is 25kHz and the amplitude is 2µm. The control system then calculates the corresponding current signal, assuming it is 100mA, and converts this current signal into an air signal through an E / P converter. This is further converted into a precise input air pressure, for example, 0.5MPa, via an air-to-air positioner. This precisely controls the opening of the pressure regulating valve, directing compressed air into the spindle body, where it contacts the air-floating vibration plate fixed to the rotating shaft core. This causes the air-floating vibration plate to drive the rotating shaft core to vibrate in a first direction, which in turn causes the rotating shaft core to drive the machining tool 11 to vibrate in the first direction. This precisely controls the vibration of the machining tool 11, effectively reducing stress accumulation and interlayer separation during machining, improving machining efficiency, and reducing defective product rates and material waste. It should be noted that the ultrasonic operating pressure of the aerostatic ultrasonic vibration spindle is 0.55MPa to 0.65MPa, while the minimum operating pressure for non-ultrasonic operation is 0.45MPa to 0.55MPa. The above embodiment solves the problem of continuous noise generated during non-processing or processing by controlling the input pressure within 0.45MPa to 0.55MPa, thereby improving the comfort of the working environment, reducing the impact on the health of the operator, effectively extending the service life of the pneumatic electrostatic spindle 1, and improving the overall performance of the substrate processing equipment.
[0143] In one embodiment, after step S30, that is, after controlling the pneumatic electrostatic spindle 1 to drive the high-speed rotating machining tool 11 to vibrate in the first direction according to the target vibration parameter, the following steps are included:
[0144] S40, obtaining actual vibration parameters of the pneumatic static pressure electric spindle 1;
[0145] S50, comparing the actual vibration parameter with the target vibration parameter to obtain a comparison result;
[0146] S60: If the comparison result is a match, start processing the substrate 12;
[0147] S70 . If the comparison result is mismatch, adjust the input air pressure of the pneumatic static pressure electric spindle 1 until the actual vibration parameters match the target vibration parameters.
[0148] In this embodiment, to ensure that the pneumatic electric spindle 1 achieves the desired ultrasonic parameters when driving the machining tool 11 for efficient and precise machining, the control system acquires the actual vibration parameters of the pneumatic electric spindle 1 as detected in real time by a detection system. These parameters include key data such as amplitude and frequency. The detection system may include a high-precision sensor or detection device. Specifically, a high-precision sensor or detection device may be installed within the pneumatic electric spindle 1 or elsewhere to accurately measure the vibration of the pneumatic electric spindle 1 and transmit the measured actual ultrasonic data to the control system.
[0149] Next, the control system compares the actual vibration parameters with the preset target vibration parameters, generating a comparison result. If the actual vibration parameters fully match the target vibration parameters, the control system confirms that the ultrasonic vibration conditions have been met and allows the processing of substrate 12 to begin. In this case, the pneumatic electrospindle 1 drives the machining tool 11 at the set frequency and amplitude, ensuring high quality and efficiency during the machining process.
[0150] If the comparison results show that there is a difference between the actual vibration parameters and the target vibration parameters, the control system will automatically make adjustments, for example, adjusting the input air pressure of the pneumatic electric spindle 1 to change the vibration characteristics of the pneumatic electric spindle 1 until the actual vibration parameters match the target vibration parameters. The adjustment process may require multiple iterations, and after each adjustment, the system will re-monitor the actual vibration parameters to ensure that the vibration state of the pneumatic electric spindle 1 meets the requirements. Through this process, it is ensured that the pneumatic electric spindle 1 maintains the optimal vibration state during the processing, thereby improving the processing quality and consistency of the substrate 12. It should be noted that the above is only an example and does not constitute a limitation of this application.
[0151] In one embodiment, in step S70, if the comparison result is mismatch, the input air pressure of the pneumatic electrostatic spindle 1 is adjusted until the actual vibration parameters match the target vibration parameters, including the following steps:
[0152] S71, obtaining input air pressure;
[0153] S72, determining whether the input air pressure exceeds a preset range;
[0154] S73. If the input air pressure exceeds the preset range, an alarm is triggered and / or the air-pressure electric spindle 1 is controlled to stop working;
[0155] S74. If the input air pressure does not exceed the preset range, adjust the input air pressure until the actual vibration parameter matches the target vibration parameter.
[0156] In this embodiment, in order to ensure that the pneumatic electric spindle 1 can achieve the expected vibration effect, if the actual vibration parameters do not match the target vibration parameters, the current input air pressure value will be obtained. This step can be achieved through a built-in air pressure sensor to ensure that the control system can monitor air pressure changes in real time. Next, determine whether the current input air pressure exceeds the preset range. The preset range is a safety range set based on equipment specifications and working requirements, which is used to ensure that the pneumatic electric spindle 1 operates within a normal air pressure range, for example, 0.2MPa to 0.8MPa. Preferably, the input air pressure range can be configured to be 0.4MPa to 0.6MPa, and there is no specific limitation.
[0157] If the input air pressure is detected to be outside the preset range, an alarm is immediately triggered. This alarm can be audible or visual, alerting the operator to the abnormal air pressure and / or controlling the pneumatic electrospindle 1 to stop operation, thereby preventing damage to the substrate 12 processing equipment or a decrease in machining accuracy caused by the abnormal air pressure. If the input air pressure is within the preset range, the air pressure is continuously adjusted until the actual vibration parameters match the target vibration parameters, ensuring that the pneumatic electrospindle 1 operates under optimal conditions and achieves high-precision machining results.
[0158] For example, the target vibration parameters are an amplitude of 3µm and a frequency of 25kHz. However, the actual vibration parameters initially measured are an amplitude of 2µm and a frequency of 22kHz. Comparing the actual vibration parameters with the target values reveals that the amplitude is lower than the target value, while the frequency is higher than the target value. At this point, the control system obtains the current input air pressure, assuming it is 0.5MPa. Next, it determines whether this pressure is within the preset safety range. Since 0.5MPa is within this range, no alarm is triggered or operation is stopped, and adjustments continue.
[0159] Then start adjusting the input air pressure. By increasing the air pressure, for example, the input air pressure is adjusted to 0.6MPa. During the adjustment process, the control system continuously monitors the actual vibration parameters to verify the adjustment effect. If the actual vibration parameters are 3µm in amplitude and 25kHz in frequency after adjustment, and these parameters have matched the target vibration parameters, it is confirmed that the new actual vibration parameters have reached the target standard, indicating that the adjustment is successful. After confirming the match, start the processing of the substrate 12. During the processing, the control system will continue to monitor the actual vibration parameters to ensure that they remain within the set range to ensure the quality of the processing and the stability of the equipment. This process not only improves the processing quality and efficiency, but also optimizes the operating stability of the substrate processing equipment, and is suitable for various application scenarios with strict requirements for ultrasonic processing. It should be noted that the above is only an example and does not constitute a limitation.
[0160] The second aspect provides a substrate processing system, wherein the substrate includes a PCB board, a packaging substrate and a glass substrate; the substrate processing system includes at least one substrate processing device described in the embodiment of the first aspect.
[0161] It should be noted that the substrate processing equipment provided in the embodiment of the first aspect of the present invention can also be configured as a substrate processing equipment with two pneumatic electrostatic spindles 1 or six pneumatic electrostatic spindles 1, and the present invention does not make any limitation here.
[0162] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the scope of protection of the present invention.
Claims
1. A substrate processing device, characterized in that: Including pneumatic and hydrostatic electric spindle; The pneumatic static pressure electric spindle includes a pneumatic static pressure ultrasonic electric spindle; The aerostatic pressure ultrasonic electric spindle includes an electric spindle that utilizes aerodynamic principles to enable a rotating shaft core arranged inside the electric spindle to vibrate and rotate in a preset direction under a cyclonic floating state. The aerostatic pressure ultrasonic electric spindle is connected to a processing tool and is used to drive the high-speed rotating processing tool to vibrate in a first direction with a set amplitude and frequency during the processing process, so that periodic contact and separation are formed between the processing tool and the substrate to realize processing of the substrate.
2. The substrate processing equipment according to claim 1, wherein: The pneumatic static pressure electric spindle includes a pneumatic static pressure ultrasonic electric spindle, and the pneumatic static pressure ultrasonic electric spindle includes a spindle body, an air path structure, an air floating vibration plate, and a rotating shaft core arranged inside the spindle body; The air-floating vibration plate is connected to the rotating shaft core; The air path structure is arranged at the front end or inside of the spindle body, and is used to guide the air flow to act on both sides of the air-floating vibration plate, thereby driving the air-floating vibration plate to drive the rotating shaft core to vibrate along the first direction, and then drive the processing tool to vibrate synchronously along the first direction.
3. The substrate processing equipment according to claim 2, wherein: The substrate processing equipment further includes a gantry system, a first motion assembly, a second motion assembly and a spindle fixing assembly; The pneumatic static pressure electric spindle is detachably connected to one side of the spindle fixing assembly, the other side of the spindle fixing assembly is detachably connected to one end of the first motion assembly, the other end of the first motion assembly is detachably connected to one end of the second motion assembly, and the other end of the second motion assembly is detachably connected to the gantry system; The first motion component can drive the spindle fixing component to move along the first direction, so that the spindle fixing component drives the pneumatic electro-spindle to move along the first direction; The second motion component can drive the first motion component to move along a second direction, so as to drive the pneumatic static pressure electric spindle to move along the second direction.
4. The substrate processing equipment according to claim 3, wherein: The spindle fixing assembly includes a spindle mounting plate, a spindle mounting seat and a flange; The spindle mounting seat is provided with a through hole; The flange is fixedly sleeved on the main shaft body; One end of the first motion assembly is detachably connected to one side of the spindle mounting plate; The other side of the spindle mounting plate is fixedly connected to the spindle mounting seat; The lower end of the main shaft body passes through the through hole of the main shaft mounting seat, and the flange and the main shaft mounting seat are fixed to each other.
5. The substrate processing equipment according to claim 4, wherein: The spindle fixing assembly also includes a spindle positioning sleeve; The spindle positioning sleeve is sleeved on the spindle body and is arranged between the flange and the spindle mounting seat, and is used to adjust the vertical installation degree of the spindle body.
6. The substrate processing equipment according to claim 3, wherein: The spindle fixing assembly includes a spindle clamp rear seat, a spindle clamp front cover, a spindle clamp rear seat rubber ring, a spindle clamp front cover rubber ring and a spindle washer; One end of the first motion assembly is detachably connected to one side of the spindle clamp rear seat; The spindle clamp rear seat rubber ring is installed on the other side contact surface of the spindle clamp rear seat, and the spindle clamp front cover rubber ring is installed on one side contact surface of the spindle clamp front cover and corresponds to the other side contact surface of the spindle clamp rear seat; The lower end portion of the spindle body is fixedly mounted between the spindle clamp rear seat rubber ring and the spindle clamp front cover rubber ring; The spindle washer is arranged between the upper end portion of the spindle body and the spindle clamp front cover.
7. The substrate processing equipment according to any one of claims 3 to 6, characterized in that: The substrate processing equipment further includes a bed, a workbench and a third motion component; A passage is formed between the gantry system and the bed; One end of the third motion component is detachably connected to the bed, and the other end is detachably connected to the workbench; The third motion component can drive the workbench to move along a third direction, so that the workbench moves into or out of the channel.
8. The substrate processing equipment according to any one of claims 1 to 6, characterized in that: The processing type of the substrate includes drilling, grooving, milling or cutting, and / or the substrate includes a high aspect ratio substrate, a multi-layered substrate or a high density interconnect substrate.
9. A substrate processing system, characterized in that: The substrate includes a PCB board, a packaging substrate and a glass substrate; the substrate processing system includes at least one substrate processing device according to any one of claims 1 to 8.